CN110164824B - Flexible packaging structure, manufacturing method and wearable device with flexible packaging structure - Google Patents
Flexible packaging structure, manufacturing method and wearable device with flexible packaging structure Download PDFInfo
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- CN110164824B CN110164824B CN201810151656.1A CN201810151656A CN110164824B CN 110164824 B CN110164824 B CN 110164824B CN 201810151656 A CN201810151656 A CN 201810151656A CN 110164824 B CN110164824 B CN 110164824B
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/52—Mounting semiconductor bodies in containers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/12—Mountings, e.g. non-detachable insulating substrates
- H01L23/13—Mountings, e.g. non-detachable insulating substrates characterised by the shape
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
- H01L23/49838—Geometry or layout
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
- H05K1/185—Components encapsulated in the insulating substrate of the printed circuit or incorporated in internal layers of a multilayer circuit
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/18—High density interconnect [HDI] connectors; Manufacturing methods related thereto
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Geometry (AREA)
- Structure Of Printed Boards (AREA)
Abstract
The invention provides a flexible packaging structure, a manufacturing method of the flexible packaging structure and wearable equipment with the flexible packaging structure. The flexible packaging structure can realize ultrathin packaging and can have better flexibility.
Description
Technical Field
The invention relates to the field of semiconductor system-in-package, in particular to a flexible packaging structure, a manufacturing method of the flexible packaging structure and wearable equipment with the flexible packaging structure.
Background
In recent years, wearable equipment is more and more popular, and the wearable equipment is more and more applied to soldier field battle or training, athlete training, physical monitoring of exercisers, health monitoring and the like. In order to collect information more accurately, how to make the wearable device flexible so as to be closer to the curve of the human body when in use becomes a content of major concern for various large manufacturers and laboratories. The flexibility of the wearable device is mainly limited by the flexibility of the component packaging architecture on the wearable device.
In the existing semiconductor packaging technology, a hard substrate (or called a support) is mainly used as a carrier, and sealing protection of devices is realized through an injection molding process, but the characteristic requirements of flexible electronic products cannot be met.
The flexible substrate is used as a carrier for packaging, but the substrate is flexible, so that the injection molding process is difficult to control, and most of the prior applications mainly realize the packaging protection of local chip devices through COB packaging and dispensing processes or encapsulation and other processes. The application requirements of wearable flexible electronic products cannot be met.
For a flexible ultrathin package of a large-outline-size semiconductor system level, an injection molding process cannot be realized. In addition, the injection molding process has low efficiency and high mold opening cost, and a forming mold is required to be manufactured for each product. And after the product is packaged, the thickness of the product is generally larger than 1mm, some products are even more than two or three millimeters, the product cannot be well attached to the skin of a person, and the flexibility is poor.
Disclosure of Invention
In view of this, the present invention provides a flexible packaging structure, a manufacturing method of the flexible packaging structure, and a wearable device having the flexible packaging structure. The flexible packaging structure can realize ultrathin packaging and can have better flexibility.
The invention provides a flexible packaging structure, which comprises a flexible substrate, a functional component and a flexible packaging film, a groove is arranged on the surface of the flexible substrate, the functional component is arranged in the groove, the flexible packaging film is coated outside the flexible substrate and the functional component, when the functional component is arranged in the groove, the surface of one side of the functional component, which is far away from the flexible substrate, is flush with the surface of the flexible substrate, the flexible packaging structure also comprises a connecting circuit, the connecting circuit is arranged on the surface of the flexible substrate, and the flexible substrate is connected between the functional components, the functional components are fixed in the grooves through bonding layers, the bonding layers are filled in gaps between the functional components and the grooves, and the hardness of the bonding layers is greater than or equal to that of the flexible substrate material.
Further, the flexible packaging film part covers the surface of the flexible substrate provided with the functional component.
Furthermore, the flexible packaging film is of a multilayer structure, and the flexible packaging films of all layers are made of materials with the same or similar mechanical properties.
Further, from the side close to the flexible substrate to the side far away from the flexible substrate, the mechanical properties of the multilayer flexible packaging film are gradually submitted or gradually increased layer by layer.
Furthermore, an opening is formed in the flexible packaging film at a position corresponding to the functional component, and a sensor and/or an electrode are/is arranged in the opening.
Further, the connecting circuit is covered with a functional insulating layer.
The invention also provides a manufacturing method of the flexible packaging structure, which comprises the following steps:
providing a flexible substrate (10) and a flexible packaging film, wherein a groove is formed on the flexible substrate;
coating a bonding agent in the groove (11) in a dispensing or printing mode to form a bonding layer, arranging a functional component in the groove and fixing the functional component in the groove through the bonding layer, wherein the bonding layer is filled in a gap between the functional component and the groove, the hardness of the bonding layer is greater than or equal to that of the flexible substrate material, and the surface of one side, away from the flexible substrate, of the functional component is flush with the surface of the flexible substrate;
the manufacturing method further comprises the steps of manufacturing a connecting circuit on the surface of the flexible substrate, and enabling the connecting circuit to be connected between the functional components;
and coating the flexible packaging film outside the flexible substrate, the connecting circuit and the functional component.
Furthermore, the manufacturing method further comprises the step of manufacturing a connecting circuit on the flexible substrate, and enabling the connecting circuit to be connected between the functional components.
Furthermore, the manufacturing method further comprises the step of manufacturing a functional insulating layer on the connecting circuit, wherein the functional insulating layer is arranged on one side, far away from the flexible substrate, of the connecting circuit.
Furthermore, after the functional insulating layer is manufactured, the manufacturing method further includes laying the connection circuit on the functional insulating layer, and manufacturing the functional insulating layer on the connection circuit.
Further, the method also comprises the steps of arranging a plurality of functional components required by the flexible packaging structure on the flexible substrate;
coating the flexible packaging film outside the flexible substrate and the functional component;
and cutting the flexible substrate and the flexible packaging film to form a plurality of flexible packaging structures.
The invention also provides a wearable device which comprises the flexible packaging structure provided by the invention.
In summary, the groove is formed on the flexible substrate, the functional component is arranged in the groove, when the flexible structure is bent, the flexible substrate can protect the functional component, meanwhile, due to the arrangement of the groove, the volume of the functional component exposed out of the flexible substrate is smaller, even the functional component is not exposed out of the flexible substrate, and when the flexible packaging film is coated outside the flexible substrate, the functional component, the connecting circuit and the functional insulating layer, the flexible packaging film can be tightly attached to the surface of the flexible substrate, so the flexible packaging structure can realize ultrathin packaging and has better flexibility.
Furthermore, a flexible packaging film is used for packaging during packaging, so that when the packaging layer is manufactured, an injection molding process is not needed, and the flexible packaging film is only needed to be attached to the flexible substrate. In industrial production, various components and parts required by a plurality of flexible packaging structures can be arranged on a whole flexible substrate, then the flexible packaging structure is packaged by a whole flexible packaging film, and finally the flexible substrate is cut to form a plurality of flexible packaging structures. The manufacturing process of the flexible packaging structure is changed, the manufacturing cost is obviously reduced, and the packaging structure is very suitable for packaging and manufacturing roll-to-roll flexible electronic products.
The foregoing description is only an overview of the technical solutions of the present invention, and in order to make the technical means of the present invention more clearly understood, the present invention may be implemented in accordance with the content of the description, and in order to make the above and other objects, features, and advantages of the present invention more clearly understood, the following preferred embodiments are described in detail with reference to the accompanying drawings.
Drawings
Fig. 1 is a schematic cross-sectional view of a flexible package structure according to a first embodiment of the present invention.
Fig. 2 is an enlarged schematic view of a part of the structure at the circle in fig. 1.
Fig. 3 is a system block diagram of a flexible packaging structure.
Fig. 4 is a schematic structural diagram of the IC chip in fig. 1.
Fig. 5 is a schematic cross-sectional structure diagram of a flexible packaging structure according to a second embodiment of the present invention.
Fig. 6 is a schematic cross-sectional structure diagram of a flexible packaging structure according to a third embodiment of the present invention.
Fig. 7 is a schematic flow chart of a manufacturing method of a flexible package structure provided in the present invention.
Fig. 8A-8C are schematic cross-sectional views of steps in a method for manufacturing a flexible package structure according to the present invention.
Detailed Description
To further explain the technical means and effects of the present invention adopted to achieve the predetermined objects, the following detailed description is given with reference to the accompanying drawings and preferred embodiments.
The invention provides a flexible packaging structure, a manufacturing method of the flexible packaging structure and wearable equipment with the flexible packaging structure. The flexible packaging structure can realize ultrathin packaging and can have better flexibility.
Fig. 1 is a schematic cross-sectional view of a flexible package structure according to a first embodiment of the present invention. As shown in fig. 1, a flexible package structure provided in a first embodiment of the present invention includes a flexible substrate 10, a functional component 20, and a flexible packaging film 30, wherein a groove 11 (see fig. 8A) is formed on a surface of the flexible substrate 10, the functional component 20 is disposed in the groove 11, and the flexible packaging film 30 covers the flexible substrate 10 and the functional component 20.
In this embodiment, through forming recess 11 on flexible substrate 10, and set up functional components 20 in recess 11, when flexible structure buckles, flexible substrate 10 can protect functional components 20, simultaneously, because the setting of recess 11, functional components 20 expose the outer volume of flexible substrate 10 less, do not expose outside flexible substrate 10 even, when flexible encapsulation film 30 cladding in flexible substrate 10, functional components 20, when interconnecting link and functional insulation layer were outside, flexible encapsulation film 30 can closely laminate on the surface of flexible substrate 10, therefore, this flexible encapsulation structure can realize ultra-thin encapsulation, and can have better flexibility.
In the present embodiment, the material of the flexible substrate 10 is a flexible polymer material such as polyimide, polyethylene terephthalate, polyethylene naphthalate, polycarbonate, or Polyester (PET). The grooves 11 may be formed on the flexible substrate 10 by laser sintering or photolithography and etching processes.
The depth of the groove 11 is greater than the depth of the functional component 20, preferably, when the functional component 20 is disposed in the groove 11, the surface of the side of the functional component 20 away from the flexible substrate 10 is flush with the surface of the flexible substrate 10, that is, in this embodiment, only the connection circuit and the functional insulating layer are exposed on the surface of the flexible substrate 10, which is more beneficial to the encapsulation of the flexible encapsulation structure by the flexible encapsulation film 30.
Further, in the flexible packaging structure provided in this embodiment, the functional component 20 is fixed in the groove 11 through the adhesive layer 111, and the adhesive layer 111 is filled in a gap between the functional component 20 and the groove 11, that is, the adhesive layer 111 is filled in the bottom surface of the functional component 20 and the bottom surface of the groove 11, and between the side surface of the functional component 20 and the side surface of the groove 11. The sum of the volumes of the functional component 20 and the adhesive layer 111 is equal to the volume of the groove 11.
The adhesive in the adhesive layer 111 may be a flexible material such as Polydimethylsiloxane (PDMS) or polyimide, or another flexible material with low hardness and low stress, and the hardness of the adhesive layer 111 is greater than or equal to the hardness of the material of the flexible substrate 10. When the functional component 20 is fixed by the adhesive layer 111, the amount of the adhesive used in the adhesive layer 111 is precisely controlled, and the adhesive can be applied to the bottom surface and the side wall of the groove 11 by dispensing or printing, and then the functional component 20 is placed in the groove 11.
In this embodiment, the flexible package structure further includes a connection line 40, the connection line 40 is disposed on the surface of the flexible substrate 10 and connected between the functional components 20, and since the upper surface of the functional component 20 is flush with the surface of the flexible substrate 10, the connection line 40 can be easily connected between the functional components 20 when connected, and is not easily broken when bent.
More specifically, the connection line 40 may be a connection line 40 made of conductive ink to improve the flexibility of the flexible package structure, and preferably, the connection line 40 is formed by performing an aerosol jet printing process or a printing process on nanoscale conductive ink, which may be conductive ink containing one or more of Ag, Gu, Au, and C materials, or an alloy of at least two of Ag, Gu, and Au materials. The width of the connection line 40 may be adjusted according to the process requirements.
In other embodiments, the connection lines 40 may be formed between the functional components 20 by copper plating or gold plating.
The connection line 40 is further provided with a functional insulation layer 50, the functional insulation layer 50 covers the connection line 40 on the flexible substrate 10 from a side of the connection line 40 away from the flexible substrate 10, so as to protect the connection line 40 from stress during bending and prevent the connection line 40 from being oxidized or vulcanized. The stress of the material of the functional insulating layer 50 should be greater than or equal to the stress of the material of which the connection line 40 is made.
Due to the existence of the functional insulation layer 50, the connection lines 40 can be stacked in multiple layers, and the connection lines 40 on each layer are covered with the functional insulation layer 50, so that the connection lines 40 on each layer are not in contact with each other, the difficulty of the interconnection process of the multi-I/O port device is reduced, the cost of the packaging process is further reduced, and the interconnection reliability is improved.
In this embodiment, the material of the flexible packaging film 30 may be silica gel, polyethylene terephthalate (PET), Polyimide (PI), polyester, etc., and the flexible packaging film 30 may encapsulate the flexible substrate 10, the functional component 20, the connection line 40 and the functional insulating layer 50 in a pressing manner. The flexible encapsulation film 30 may be coated on the surface of the flexible substrate 10 on which the functional gas device 20 is disposed, or may be coated on both surfaces of the flexible substrate 10.
Fig. 2 is an enlarged schematic view of a partial structure at a circle in fig. 1, as shown in fig. 2, in order to enhance the buffering of stress and enhance the air tightness, so as to better achieve the flexibility of the flexible packaging structure, the flexible packaging film 30 may be a multi-layer structure, and the materials of the flexible packaging films 30 may be the same or different, but each layer needs to be a material with the same or similar mechanical property, preferably, in the multi-layer flexible packaging film 30, the mechanical properties, such as hardness and bending stress, of the multi-layer flexible packaging film gradually decrease or gradually increase from one side close to the flexible substrate 10 to one side away from the flexible substrate 10, so as to achieve the purpose of optimizing the properties, such as bending resistance and fatigue resistance, of the flexible packaging structure.
Fig. 3 is a system block diagram of a flexible package structure, and fig. 4 is a schematic structural diagram of an IC chip. As shown in fig. 3 and 4, in the present embodiment, the functional component 20 mainly includes an IC chip 21, a sensor 22, a display 23, an energy device 24, an antenna 25, and the like, and the IC chip 21 may include storage control elements such as a CPU, a RAM, a ROM, and the like, and may also include a wireless communication device such as bluetooth; the sensor 22 may include a piezoelectric sensor 22, a piezoresistive sensor 22, a photoelectric sensor 22, etc., and the energy device 24 may include a lithium battery, a thin film solar cell, etc. The functional components 20 are connected by connection lines 40.
In order to further enhance the flexibility of the flexible package structure, in this embodiment, the silicon substrate of the IC chip 21 may be a thinned silicon substrate, and the thickness of the silicon substrate is 0.1-10 μm, and preferably 0.1- μm, so that the IC chip 21 itself has a certain flexibility, in order to prevent the IC chip 21 from being damaged, and at the same time, reduce the difficulty of the ultra-thin IC device mounting process. As shown in fig. 3, a chip protection layer is further coated outside the IC chip 21, and the thickness of the chip protection layer is 10 to 100 μm, so that the whole IC chip 211 has certain flexibility.
In order to make the resistance device and the capacitance device themselves have a certain flexibility, the resistance and capacitance devices included in the IC chip 21, the sensor 22, the display 23, and the antenna 25 may be directly printed on the flexible substrate 10 by a 3D printing technique.
Fig. 5 is a schematic cross-sectional structure diagram of a flexible package structure according to a second embodiment of the present invention, and as shown in fig. 5, the flexible package structure according to the second embodiment of the present invention is substantially the same as the flexible package structure according to the first embodiment, except that a functional component 20, a connection line 40, and a functional insulating layer 50 are disposed on both surfaces of a flexible substrate 10. In order to realize electrical connection on both surfaces of the flexible substrate 10, connection holes 12 communicating both surfaces of the flexible substrate 10 are also provided on the flexible substrate 10.
Fig. 6 is a schematic cross-sectional structure diagram of a flexible package structure according to a third embodiment of the present invention, and as shown in fig. 6, the flexible package structure according to the third embodiment of the present invention is substantially the same as the flexible package structure according to the first embodiment, except that, in the third embodiment of the present invention, the flexible substrates 10 may be disposed in multiple layers, two flexible substrates 10 are bonded by a glue, and similarly, if an electrical connection between two flexible substrates is required, connection holes 12 penetrating through two surfaces of the flexible substrates 10 may also be disposed on the flexible substrates 10.
In summary, according to the present invention, the groove 11 is formed on the flexible substrate 10, and the functional component 20 is disposed in the groove 11, when the flexible structure is bent, the flexible substrate 10 can protect the functional component 20, meanwhile, due to the disposition of the groove 11, the volume of the functional component 20 exposed outside the flexible substrate 10 is small, even not exposed outside the flexible substrate 10, and when the flexible encapsulation film 30 covers the flexible substrate 10, the functional component 20, the connection line 40, and the functional insulation layer 50, the flexible encapsulation film 30 can be tightly attached to the surface of the flexible substrate 10, so that the flexible encapsulation structure can realize ultra-thin encapsulation and can have better flexibility.
Further, the flexible encapsulation film 30 is used for encapsulation during encapsulation, so that the injection molding process is not needed during the manufacturing of the encapsulation layer, and the flexible encapsulation film 30 only needs to be attached to the flexible substrate 10. In the industrial production, various components required by a plurality of flexible packaging structures can be firstly arranged on a whole flexible substrate 10, then a whole flexible packaging film 30 is used for packaging the components, and finally the flexible substrate 10 is cut to form a plurality of flexible packaging structures. The manufacturing process of the flexible packaging structure is changed, the manufacturing cost is obviously reduced, and the packaging structure is very suitable for packaging and manufacturing roll-to-roll flexible electronic products.
Fig. 7 is a schematic flow chart of a manufacturing method of a flexible package structure provided by the present invention, and fig. 8A to 8C are schematic cross-sectional structures of steps in the manufacturing method of the flexible package structure provided by the present invention. As shown in fig. 7 and fig. 8A to 8C, the present invention further provides a manufacturing method for manufacturing the flexible package structure, which includes the following steps:
providing a flexible substrate 10 and a flexible packaging film 30, wherein the flexible substrate 10 is provided with a groove 11;
arranging the functional component 20 in the groove 11;
the flexible encapsulation film 30 is coated outside the flexible substrate 10 and the functional component 20.
In this embodiment, the groove 11 on the flexible substrate 10 may be formed by a laser sintering process with the use of a mask plate, or may be formed by a photolithography and etching process.
Further, in the step of disposing the functional component 20 in the groove 11, an adhesive may be applied to the bottom surface and the sidewall of the groove 11 by dispensing or printing, etc., to form the adhesive layer 111 in the groove 11, and then the functional component 20 is fixed in the groove 11 through the adhesive layer 111.
Further, the method for manufacturing the flexible package structure further includes manufacturing a connection line 40 on the flexible substrate 10, and connecting the connection line 40 between the functional components 20. More specifically, the connection line 40 may be formed of a conductive ink through an aerosol jet printing process or a printing process.
Further, the method further includes manufacturing a functional insulation layer 50 on the connection line 40, and the functional insulation layer 50 covers the connection line 40 on the flexible substrate 10 from a side of the connection line 40 away from the flexible substrate 10. More specifically, it is also possible to lay the connection wiring 40 made of the conductive ink again on the functional insulating layer 50, and to make the functional insulating layer 50 again on the connection wiring 40.
Further, the flexible encapsulation film 30 is coated on the flexible substrate 10 and the functional component 20 through a pressing process to seal the flexible substrate 10 and the functional component 20.
Further, in mass production, functional components 20 required by a plurality of flexible packaging structures can be arranged on the substrate in the same process, and after the flexible packaging film 30 is packaged, the method further includes cutting and molding to form a plurality of flexible packaging structures at one time.
The invention also provides wearable equipment comprising the flexible packaging structure provided by the invention. For other technical features of the wearable device, please refer to the prior art, which is not described herein.
Although the present invention has been described with reference to a preferred embodiment, it should be understood that various changes, substitutions and alterations can be made herein without departing from the spirit and scope of the invention as defined by the appended claims.
Claims (13)
1. A flexible packaging structure, characterized in that: the flexible packaging structure comprises a flexible substrate (10), functional components (20) and a flexible packaging film (30), wherein a groove (11) is formed in the surface of the flexible substrate (10), the functional components (20) are arranged in the groove (11), the flexible packaging film (30) covers the flexible substrate (10) and the outside of the functional components (20), when the functional components (20) are arranged in the groove (11), the surface of one side of the flexible substrate (10) and the surface of the flexible substrate (10) are flush, the flexible packaging structure further comprises a connecting circuit (40), the connecting circuit (40) is arranged on the surface of the flexible substrate (10) and connected between the functional components (20), and the functional components (20) are fixed in the groove (11) through a bonding layer (111), the bonding layer (111) is filled in a gap between the functional component (20) and the groove (11), and the hardness of the bonding layer (111) is greater than or equal to that of the flexible substrate (10) material.
2. The flexible packaging structure of claim 1, wherein: the flexible packaging film (30) is partially coated on the surface of the flexible substrate (10) provided with the functional component (20).
3. The flexible packaging structure of claim 1, wherein: the grooves (11) are formed in the two surfaces of the flexible substrate (10), and the flexible packaging film (30) is wrapped on the two surfaces of the flexible substrate (10).
4. The flexible packaging structure of claim 1, wherein: a plurality of flexible substrates (10) are arranged in the flexible packaging structure, and the flexible substrates (10) are arranged in a stacked mode.
5. The flexible packaging structure of claim 1, wherein: the flexible packaging film (30) is of a multilayer structure, and the flexible packaging films (30) of all layers are made of materials with the same or similar mechanical properties.
6. The flexible packaging structure of claim 5, wherein: the mechanical property of the multilayer flexible packaging film (30) is gradually decreased layer by layer or gradually increased layer by layer from the side close to the flexible substrate (10) to the side far away from the flexible substrate (10).
7. The flexible packaging structure of claim 2, wherein: an opening (31) is formed in the flexible packaging film (30) corresponding to the functional component (20), and a sensor and/or an electrode are arranged in the opening (31).
8. The flexible packaging structure of claim 1, wherein: the connecting lines (40) are covered with a functional insulation layer (50).
9. A manufacturing method of a flexible packaging structure is characterized by comprising the following steps: comprises the following steps of (a) carrying out,
providing a flexible substrate (10) and a flexible packaging film (30), wherein a groove (11) is formed on the flexible substrate (10);
coating an adhesive in the groove (11) by means of dispensing or printing to form an adhesive layer (111), arranging a functional component (20) in the groove (11) and fixing the functional component in the groove (11) through the adhesive layer (111), wherein the adhesive layer (111) is filled in a gap between the functional component (20) and the groove (11), the hardness of the adhesive layer (111) is greater than or equal to that of the material of the flexible substrate (10), and the surface of one side, away from the flexible substrate (10), of the functional component (20) is flush with the surface of the flexible substrate (10);
the manufacturing method further comprises the steps of manufacturing connecting lines (40) on the surface of the flexible substrate (10) and enabling the connecting lines (40) to be connected between the functional components (20);
and coating the flexible packaging film (30) outside the flexible substrate (10), the connecting circuit and the functional component (20).
10. The method of manufacturing a flexible package structure of claim 9, wherein: the manufacturing method further comprises the step of manufacturing a functional insulating layer (50) on the connecting line (40), wherein the functional insulating layer (50) is arranged on one side, away from the flexible substrate (10), of the connecting line (40).
11. The method of manufacturing a flexible package structure of claim 10, wherein: after the functional insulating layer (50) is manufactured, the manufacturing method further comprises the steps of laying the connecting line (40) on the functional insulating layer (50) and manufacturing the functional insulating layer (50) on the connecting line (40).
12. The method of manufacturing a flexible package structure of claim 9, wherein: the method further comprises the steps of arranging a plurality of functional components (20) required by the flexible packaging structure on the flexible substrate (10);
wrapping the flexible packaging film (30) outside the flexible substrate (10) and the functional component (20);
and cutting the flexible substrate (10) and the flexible packaging film (30) to form a plurality of flexible packaging structures.
13. A wearable device, characterized by: comprising the flexible packaging structure of any one of claims 1 to 8.
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| CN110571200A (en) * | 2019-09-20 | 2019-12-13 | 清华大学 | Sunken flexible circuit integrated device and manufacturing method thereof |
| CN110931985A (en) * | 2019-11-29 | 2020-03-27 | 中国人民解放军空军工程大学 | Preparation method of flexible electromagnetic wave absorbing metamaterial film |
| CN115565890B (en) * | 2022-12-07 | 2023-04-18 | 西北工业大学 | Folding type multi-chip flexible integrated packaging method and flexible integrated packaging chip |
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