CN110739278B - Flexible packaging structure and wearable equipment - Google Patents
Flexible packaging structure and wearable equipment Download PDFInfo
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- CN110739278B CN110739278B CN201810806451.2A CN201810806451A CN110739278B CN 110739278 B CN110739278 B CN 110739278B CN 201810806451 A CN201810806451 A CN 201810806451A CN 110739278 B CN110739278 B CN 110739278B
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
- H01L21/563—Encapsulation of active face of flip-chip device, e.g. underfilling or underencapsulation of flip-chip, encapsulation preform on chip or mounting substrate
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
- H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
- H01L23/3114—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed the device being a chip scale package, e.g. CSP
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/49—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions wire-like arrangements or pins or rods
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L24/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/18—High density interconnect [HDI] connectors; Manufacturing methods related thereto
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
- H01L2224/85986—Specific sequence of steps, e.g. repetition of manufacturing steps, time sequence
Abstract
The invention provides a flexible packaging structure and wearable equipment, wherein the flexible packaging structure comprises a packaging film and a functional structure fixed on the packaging film, the functional structure comprises functional modules and flexible flat cables connected between the functional modules, each functional module comprises a functional component and a coating layer coated outside the functional component, a containing groove is formed in the packaging film, and when the functional structure is fixed on the packaging film, the functional module is arranged in the containing groove. The flexible packaging structure can be applied to large-scale production, and has the advantages of good flexibility, low cost, strong reliability and low manufacturing difficulty.
Description
Technical Field
The invention relates to the field of semiconductor system-in-package, in particular to a flexible packaging structure and wearable equipment with the same.
Background
In recent years, wearable equipment is more and more popular, and the wearable equipment is more and more applied to soldier field battle or training, athlete training, physical monitoring of exercisers, health monitoring and the like. In order to collect information more accurately, how to make the wearable device flexible so as to be closer to the curve of the human body when in use becomes a content of major concern for various large manufacturers and laboratories. The flexibility of the wearable device is mainly limited by the flexibility of the component packaging architecture on the wearable device.
At present, in the technical field of flexible electronics, the manufacturing process technology of flexible electronic devices (such as IC devices, resistance-capacitance elements, batteries and sensors) is not mature, and the flexible electronic devices cannot be applied to commercial industrialization and can be manufactured into flexible electronic products in an integrated mode. The existing system integration packaging manufacturing technology based on SMD components on the flexible FPC has relatively complex manufacturing process and is not easy to control quality and yield. The method comprises the following specific steps: for products with ultra-small elements and ultra-small pin pitches, the process requirement for printing solder paste is high in the process of manufacturing the product patches; warping, deformation and the like of the flexible substrate have caused poor problems such as insufficient soldering of a pin pad of a device. In addition, the manufacturing cost of the flexible FPC is high, and the difficulty of the injection molding and packaging process of the flexible substrate after the surface component patch is assembled is high due to the problems of warping, uneven surface, assembly precision and the like.
Disclosure of Invention
In view of the above, the present invention provides a flexible packaging structure and a wearable device having the same. The flexible packaging structure can be applied to large-scale production, and has the advantages of good flexibility, low cost, strong reliability and low manufacturing difficulty.
The invention provides a flexible packaging structure, which comprises a packaging film and a functional structure fixed on the packaging film, wherein the functional structure comprises functional modules and flexible flat cables connected between the functional modules, each functional module comprises a functional component and a coating layer coated outside the functional component, a containing groove is formed in the packaging film, when the functional structure is fixed on the packaging film, the functional modules are arranged in the containing grooves, the functional structure and the packaging film are manufactured separately and then assembled into a whole, the flexible flat cables comprise flat cable carriers and conductive interconnection layers arranged on the flat cable carriers, and when the flexible flat cables are connected between the functional modules, the conductive interconnection layers are arranged on one sides, close to the functional modules, of the flat cable carriers.
Furthermore, one or more functional components are arranged in the same functional module.
Furthermore, an adhesive layer is arranged between the accommodating groove and the surface of the functional module, and the functional module is fixed in the accommodating groove through the adhesive layer.
Furthermore, each of the functional modules is disposed on the same side of the flexible flat cable, and the flexible flat cable is further covered with an encapsulation layer formed by another encapsulation film on the side away from the functional module.
Further, a concave portion is formed on the surface of the packaging film in a downward concave manner, the accommodating groove is formed at the bottom of the concave portion, and the packaging layer is arranged in the concave portion.
The invention also provides a wearable device which comprises the flexible packaging structure provided by the invention.
As described above, in the present invention, the functional components can be hard-packaged by forming the functional modules by coating the coating layer on the functional components, and then connected between the functional modules by the flexible flat cable, which eliminates the substrate for fixing the functional modules in terms of functional structure, and meanwhile, the functional components, such as IC Devices, resistance-capacitance elements, batteries, sensors, etc., do not need to be Mounted on the flexible substrate together according to the existing SMD (Surface Mounted Devices). This can greatly improve the flexible substrate warpage, the deformation scheduling problem, reduce cost. Meanwhile, as the functional components are externally provided with the coating layers, the functional modules are connected through the flexible flat cables, the reliability of connection among the functional modules is improved, and the connection difficulty is reduced. Further, since the functional structure and the encapsulation film are separately manufactured and then assembled together, it reduces the control of precision during encapsulation and is also advantageous to solve the problem of bubbles generated during injection molding encapsulation. In addition, in this embodiment, functional components and parts are after increasing the coating, are favorable to functional module's modularization, and the improvement of flexible winding displacement connected mode of rethread to and with the improvement of encapsulation membrane assembled mode, this volume that can significantly reduce flexible packaging structure makes flexible packaging structure have better flexibility simultaneously. In conclusion, the flexible packaging structure can be applied to large-scale production, and is good in flexibility, low in cost, high in reliability and low in manufacturing difficulty.
The foregoing description is only an overview of the technical solutions of the present invention, and in order to make the technical means of the present invention more clearly understood, the present invention may be implemented in accordance with the content of the description, and in order to make the above and other objects, features, and advantages of the present invention more clearly understood, the following preferred embodiments are described in detail with reference to the accompanying drawings.
Drawings
Fig. 1 is a schematic cross-sectional view of a flexible packaging structure according to an embodiment of the present invention.
Fig. 2 is a schematic cross-sectional structure diagram of the functional structure of fig. 1.
Fig. 3 is a schematic top view of the functional structure of fig. 1.
Fig. 4 is a schematic cross-sectional structure diagram of the encapsulation film in fig. 1.
Fig. 5a to fig. 5e are schematic cross-sectional structures of steps in the manufacturing method of the flexible packaging structure provided by the present invention.
Detailed Description
To further explain the technical means and effects of the present invention adopted to achieve the predetermined objects, the following detailed description is given with reference to the accompanying drawings and preferred embodiments.
The invention provides a flexible packaging structure and wearable equipment with the same. The flexible packaging structure can be applied to large-scale production, and has the advantages of good flexibility, low cost, strong reliability and low manufacturing difficulty.
Fig. 1 is a schematic cross-sectional structure of a flexible package structure according to an embodiment of the present invention, fig. 2 is a schematic cross-sectional structure of the functional structure in fig. 1, fig. 3 is a schematic top-view structure of the functional structure in fig. 1, and fig. 4 is a schematic cross-sectional structure of the package film in fig. 1. The flexible packaging structure provided by the invention comprises a functional structure 10 and a packaging film 21, wherein the functional structure 10 is fixed on the packaging film 21, the functional structure 10 comprises a functional module 11 and a flexible flat cable 12 connected between the functional modules 11, the functional module 11 comprises a functional component 111 and a coating layer 112, the coating layer 112 is coated outside the functional component 111, a containing groove 211 is formed on the packaging film 21, and when the functional structure 10 is fixed on the packaging film 21, the functional module 11 is arranged in the containing groove 211.
In this embodiment, the functional components 111 can be hard-packaged by forming the functional modules 11 by coating the coating layer 112 outside the functional components 111, and then connecting the functional components 111 between the functional modules 11 through the flexible flat cable 12, which eliminates a substrate for fixing the functional modules 11 on the functional structure 10, and meanwhile, the functional components 111, such as IC Devices, resistance-capacitance elements, batteries, sensors, etc., do not need to be Mounted on the flexible substrate together according to the existing SMD (Surface Mounted Devices). This can greatly reduce the emergence probability of flexible substrate warpage, deformation scheduling problem, reduce cost. Meanwhile, the coating layer 112 is arranged outside the functional component 111, and the functional modules 11 are connected through the flexible flat cable 12, so that the reliability of connection between the functional modules 11 is improved, and the connection difficulty is reduced. Further, since the functional structure 10 and the encapsulation film 21 are manufactured separately and then assembled together, this reduces the control of precision in encapsulation and also facilitates the solution of the problem of bubbles generated during injection molding of the encapsulation. In addition, in this embodiment, after the coating layer 112 is added to the functional component 111, the modularization of the functional module 11 is facilitated, and then the connection mode of the flexible flat cable 12 is improved, and the assembly mode of the flexible flat cable and the packaging film 21 is improved, so that the volume of the flexible packaging structure can be greatly reduced, and meanwhile, the flexible packaging structure has better flexibility. In conclusion, the flexible packaging structure can be applied to large-scale production, and is good in flexibility, low in cost, high in reliability and low in manufacturing difficulty.
Further, in the present embodiment, one functional component 111 may be provided in the same functional module 11, and it is understood that in other embodiments, a plurality of functional components 111 may be provided in the same functional module 11. In order to facilitate the connection between the flexible flat cable 12 and the functional module 11, an I/O port 113 for connecting the flexible flat cable 12 and the functional component 111 inside the coating layer 112 is further formed on the coating layer 112.
The flexible flat cable 12 includes a flat cable carrier 121 and a conductive interconnection layer 122 disposed on the flat cable carrier 121, wherein when the flexible flat cable 12 is connected between the functional modules 11, the conductive interconnection layer 122 is closer to the functional modules 11 than the flat cable carrier 121, so as to facilitate connection and protection of the conductive interconnection layer 122.
In this embodiment, the flat cable carrier 121 may be a conventional flat cable carrier 121 made of flexible materials such as PI or PET, or may be a flat cable carrier 121 made of flexible materials such as PDMS and silicone with a certain ductility. The conductive interconnection layer 122 needs to have a certain flexibility and stretch extensibility so as to make the flexible package structure more flexible. Preferably, the conductive interconnect layer 122 is stretchable in the range of 20% -350%.
The conductive interconnection layer 122 can be connected to the I/O ports 113 of the functional modules 11 by hot-pressing soldering, conductive adhesive bonding, ACF adhesive die pressing bonding, or the like by a Hotbat soldering machine, so as to interconnect the functional modules 11.
In order to facilitate the fixing of each functional module 11 in the receiving groove 211 of the packaging film 21, in the embodiment, an adhesive layer 212 is further disposed between the receiving groove 211 and the surface of the functional module 11, and the functional module 11 is fixed in the corresponding receiving groove 211 through the adhesive layer 212. The adhesive layer 212 may be disposed on the surface of the functional module 11 and/or on the inner wall, such as the bottom surface, of the receiving cavity 211 in advance through coating, dispensing, and the like. It can be understood that, the adhesive layer 212 may be a single-component adhesive or a two-component adhesive, and when the adhesive is a two-component adhesive, one of the two-component adhesives is coated on the inner side walls of the functional module 11 and the receiving groove 211, respectively, so as to bond the two.
Further, in the present embodiment, each of the functional modules 11 is disposed on the same side of the flexible flat cable 12, when the functional structure 10 is fixed on the encapsulation film 21, the flexible flat cable 12 is further covered with another encapsulation layer 22 formed by another encapsulation film on the side away from the functional module 11, and the encapsulation layer 22 and the encapsulation film 21 together seal the functional structure 10. In order to facilitate the sensing of the sensing elements in the functional module 11 to the outside, openings are also provided in the encapsulation layer 22 through which the sensors and/or electrodes protrude.
In order to facilitate the installation of the encapsulation layer 22, a recess 213 is formed on the surface of the encapsulation film 21 and is recessed downward, the receiving groove 211 is formed at the bottom of the recess 213, and when the encapsulation layer 22 is covered on the functional structure 10, the encapsulation layer 22 is installed in the recess 213.
In the embodiment, the encapsulation layer 22 may be attached to the side of the flexible flat cable 12 away from the functional module 11 by a mounting process to complete the encapsulation of the functional structure 10. In other embodiments of the present invention, the encapsulation layer 22 may also be formed directly on the side of the flexible flat cable 12 away from the functional module 11 by injection molding, coating, or the like.
In summary, in the present embodiment, through the structure of the functional modules 11, the connection manner between the functional modules 11, and the improvement of the packaging form, the flexible packaging structure can be applied to mass production, and has better flexibility, lower cost, stronger reliability, and low manufacturing difficulty.
Fig. 5a to fig. 5e are schematic cross-sectional structures of steps in the manufacturing method of the flexible packaging structure provided by the present invention. As shown in fig. 5a to 5e, the present invention further provides a method for manufacturing a flexible package structure, which includes the following steps:
coating a coating layer 112 outside the functional component 111 to form a functional module 11; (see FIG. 5 a)
The electrical connection among the functional modules 11 is realized through the flexible flat cable 12 to form a functional structure 10; (see FIG. 5 b)
Providing an encapsulation film 21, wherein a plurality of accommodating grooves 211 which are matched with the functional modules 11 in shape are formed on the encapsulation film 21; (see FIG. 5 c)
The functional structure 10 is fixed on the packaging film 21, so that the functional module 11 is disposed in the receiving cavity 211. (see FIG. 5 d)
By the method, a substrate for fixing the functional module 11 can be omitted from the functional structure 10, and the functional component 111 is not required to be attached to the flexible substrate, but is connected by the flexible flat cable 12 and then combined with the packaging film 21 on which the accommodating groove 211 is formed, so that the problems of warping, deformation and the like of the flexible substrate can be greatly improved, and the cost is reduced. Meanwhile, the coating layer 112 is arranged outside the functional component 111, and the functional modules 11 are connected through the flexible flat cable 12, so that the reliability of connection between the functional modules 11 is improved, and the connection difficulty is reduced. Further, since the functional structure 10 and the flexible substrate are separately manufactured and then assembled together, it reduces the control of precision in packaging and is also advantageous to solve the problem of bubbles generated in injection molding packaging. In addition, in this embodiment, after the coating layer 112 is added to the functional component 111, the modularization of the functional module 11 is facilitated, and then the connection mode of the flexible flat cable 12 is improved, and the assembly mode of the flexible flat cable and the flexible substrate is improved, so that the volume of the flexible packaging structure can be greatly reduced, and meanwhile, the flexible packaging structure has better flexibility.
Further, in the present embodiment, each of the functional modules 11 is disposed on the same side of the flexible flat cable 12, and after the functional structure 10 is fixed on the encapsulation film 21, the method further includes covering the flexible flat cable 12 with an encapsulation layer 22 formed by another encapsulation film on a side thereof away from the functional module 11. (see FIG. 5 e)
In the present embodiment, the encapsulation layer 22 is pre-formed, and then the encapsulation layer 22 is attached and fixed on the side of the flexible flat cable 12 away from the functional module 11, which can improve the assembly efficiency. In another embodiment, the encapsulation layer 22 may also be directly formed on the side of the flexible flat cable 12 away from the functional module 11 by injection molding, coating, dispensing, and the like, so as to improve the sealing effect and the adhesion performance.
The method further includes providing an adhesive layer 212 on an inner sidewall of the receiving groove 211 and/or a surface of the functional module 11, and fixing the functional module 11 to the encapsulation film 21 through the adhesive layer 212.
The present invention also provides a wearable device, which includes the flexible packaging structure provided by the present invention, and please refer to the prior art for other technical features of the wearable device, which is not described herein again.
Although the present invention has been described with reference to a preferred embodiment, it should be understood that various changes, substitutions and alterations can be made herein without departing from the spirit and scope of the invention as defined by the appended claims.
Claims (6)
1. A flexible packaging structure, characterized in that: the packaging film comprises a packaging film and a functional structure fixed on the packaging film, wherein the functional structure comprises functional modules and flexible flat cables connected between the functional modules, each functional module comprises a functional component and a coating layer coated outside the functional component, a containing groove is formed in the packaging film, when the functional structure is fixed on the packaging film, the functional modules are arranged in the containing groove, the functional structure and the packaging film are manufactured separately and then assembled into a whole, the flexible flat cables comprise flat cable carriers and conductive interconnection layers arranged on the flat cable carriers, and when the flexible flat cables are connected between the functional modules, the conductive interconnection layers are arranged on one sides, close to the functional modules, of the flat cable carriers.
2. The flexible packaging structure of claim 1, wherein: one or more functional components are arranged in the same functional module.
3. The flexible packaging structure of claim 1, wherein: an adhesive layer is arranged between the accommodating groove and the surface of the functional module, and the functional module is fixed in the accommodating groove through the adhesive layer.
4. The flexible packaging structure of claim 1, wherein: each functional module is arranged on the same side of the flexible flat cable, and the side of the flexible flat cable, which is far away from the functional module, is also covered with an encapsulation layer formed by another encapsulation film.
5. The flexible packaging structure of claim 4, wherein: a concave part is formed on the surface of the packaging film in a downward concave mode, the accommodating groove is formed at the bottom of the concave part, and the packaging layer is arranged in the concave part.
6. A wearable device, characterized by: comprising the flexible packaging structure of any one of claims 1 to 5.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810806451.2A CN110739278B (en) | 2018-07-20 | 2018-07-20 | Flexible packaging structure and wearable equipment |
| CN201811126371.9A CN110739232B (en) | 2018-07-20 | 2018-07-20 | Flexible packaging structure, manufacturing method and wearable device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810806451.2A CN110739278B (en) | 2018-07-20 | 2018-07-20 | Flexible packaging structure and wearable equipment |
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| CN201811126371.9A Division CN110739232B (en) | 2018-07-20 | 2018-07-20 | Flexible packaging structure, manufacturing method and wearable device |
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| CN110739278A CN110739278A (en) | 2020-01-31 |
| CN110739278B true CN110739278B (en) | 2022-02-08 |
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| CN201811126371.9A Active CN110739232B (en) | 2018-07-20 | 2018-07-20 | Flexible packaging structure, manufacturing method and wearable device |
| CN201810806451.2A Active CN110739278B (en) | 2018-07-20 | 2018-07-20 | Flexible packaging structure and wearable equipment |
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Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101505575A (en) * | 2008-12-26 | 2009-08-12 | 深圳大学 | Flexible circuit based on PDMS biological compatibility |
| CN107123641A (en) * | 2015-12-19 | 2017-09-01 | 嘉兴山蒲照明电器有限公司 | LEDbulb lamp and its LED filament |
| CN108022887A (en) * | 2016-11-01 | 2018-05-11 | 深圳市中兴微电子技术有限公司 | A kind of flexible package structure and preparation method thereof, wearable device |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5983594A (en) * | 1997-08-22 | 1999-11-16 | Forman; Harold M | Adhesively resealable package, method and apparatus |
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- 2018-07-20 CN CN201811126371.9A patent/CN110739232B/en active Active
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Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101505575A (en) * | 2008-12-26 | 2009-08-12 | 深圳大学 | Flexible circuit based on PDMS biological compatibility |
| CN107123641A (en) * | 2015-12-19 | 2017-09-01 | 嘉兴山蒲照明电器有限公司 | LEDbulb lamp and its LED filament |
| CN108022887A (en) * | 2016-11-01 | 2018-05-11 | 深圳市中兴微电子技术有限公司 | A kind of flexible package structure and preparation method thereof, wearable device |
Also Published As
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| CN110739232A (en) | 2020-01-31 |
| CN110739232B (en) | 2022-02-01 |
| CN110739278A (en) | 2020-01-31 |
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