TW578215B - Method to produce components or its inter-products, vacuum-processing equipment and ultra-high-vacuum CVD-reactor - Google Patents
Method to produce components or its inter-products, vacuum-processing equipment and ultra-high-vacuum CVD-reactor Download PDFInfo
- Publication number
- TW578215B TW578215B TW91123272A TW91123272A TW578215B TW 578215 B TW578215 B TW 578215B TW 91123272 A TW91123272 A TW 91123272A TW 91123272 A TW91123272 A TW 91123272A TW 578215 B TW578215 B TW 578215B
- Authority
- TW
- Taiwan
- Prior art keywords
- cvd
- reactor
- vacuum
- patent application
- component
- Prior art date
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/458—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for supporting substrates in the reaction chamber
- C23C16/4582—Rigid and flat substrates, e.g. plates or discs
- C23C16/4583—Rigid and flat substrates, e.g. plates or discs the substrate being supported substantially horizontally
- C23C16/4586—Elements in the interior of the support, e.g. electrodes, heating or cooling devices
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/54—Apparatus specially adapted for continuous coating
-
- C—CHEMISTRY; METALLURGY
- C30—CRYSTAL GROWTH
- C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
- C30B25/00—Single-crystal growth by chemical reaction of reactive gases, e.g. chemical vapour-deposition growth
- C30B25/02—Epitaxial-layer growth
- C30B25/08—Reaction chambers; Selection of materials therefor
Landscapes
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Mechanical Engineering (AREA)
- Crystallography & Structural Chemistry (AREA)
- Chemical Vapour Deposition (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CH18892001 | 2001-10-12 |
Publications (1)
Publication Number | Publication Date |
---|---|
TW578215B true TW578215B (en) | 2004-03-01 |
Family
ID=4566660
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW91123272A TW578215B (en) | 2001-10-12 | 2002-10-09 | Method to produce components or its inter-products, vacuum-processing equipment and ultra-high-vacuum CVD-reactor |
Country Status (5)
Country | Link |
---|---|
EP (1) | EP1434898A1 (de) |
JP (1) | JP2005505146A (de) |
CN (1) | CN1568379A (de) |
TW (1) | TW578215B (de) |
WO (1) | WO2003031680A1 (de) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI582888B (zh) * | 2014-09-19 | 2017-05-11 | Nissin Ion Equipment Co Ltd | Substrate processing device |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US8182608B2 (en) * | 2007-09-26 | 2012-05-22 | Eastman Kodak Company | Deposition system for thin film formation |
JP2011168881A (ja) * | 2010-01-25 | 2011-09-01 | Hitachi Kokusai Electric Inc | 半導体装置の製造方法及び基板処理装置 |
CN102001650B (zh) * | 2010-12-28 | 2013-05-29 | 上海师范大学 | 冷腔壁条件下化学气相沉积制备石墨烯的方法 |
CN111530118B (zh) * | 2020-05-21 | 2021-12-10 | 郑州大学 | 一种超高真空设备 |
CN111876752A (zh) * | 2020-08-03 | 2020-11-03 | 中国科学院长春光学精密机械与物理研究所 | 一种mocvd装置及半导体材料生产设备 |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5607511A (en) * | 1992-02-21 | 1997-03-04 | International Business Machines Corporation | Method and apparatus for low temperature, low pressure chemical vapor deposition of epitaxial silicon layers |
US5230925A (en) * | 1990-06-25 | 1993-07-27 | Kabushiki Kaisha Toshiba | Gas-phase growing method and apparatus for the method |
JP2642849B2 (ja) * | 1993-08-24 | 1997-08-20 | 株式会社フロンテック | 薄膜の製造方法および製造装置 |
US6013134A (en) * | 1998-02-18 | 2000-01-11 | International Business Machines Corporation | Advance integrated chemical vapor deposition (AICVD) for semiconductor devices |
JPH11297705A (ja) * | 1998-04-07 | 1999-10-29 | Kokusai Electric Co Ltd | 基板加熱装置 |
JP3263383B2 (ja) * | 1999-09-29 | 2002-03-04 | 助川電気工業株式会社 | 縦型加熱装置 |
-
2002
- 2002-08-28 EP EP02754096A patent/EP1434898A1/de not_active Withdrawn
- 2002-08-28 WO PCT/CH2002/000467 patent/WO2003031680A1/de not_active Application Discontinuation
- 2002-08-28 JP JP2003534648A patent/JP2005505146A/ja active Pending
- 2002-08-28 CN CN 02820218 patent/CN1568379A/zh active Pending
- 2002-10-09 TW TW91123272A patent/TW578215B/zh not_active IP Right Cessation
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI582888B (zh) * | 2014-09-19 | 2017-05-11 | Nissin Ion Equipment Co Ltd | Substrate processing device |
Also Published As
Publication number | Publication date |
---|---|
WO2003031680A1 (de) | 2003-04-17 |
JP2005505146A (ja) | 2005-02-17 |
EP1434898A1 (de) | 2004-07-07 |
CN1568379A (zh) | 2005-01-19 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
KR102360082B1 (ko) | 고 선택비 산화물 제거 및 고온 오염물 제거가 통합된 에피택시 시스템 | |
TWI335618B (en) | Substrate processing apparatus using a batch processing chamber | |
CN101379214B (zh) | 外延沉积工艺及装置 | |
EP1159465B1 (de) | Verfahren zum Abscheiden von Atomschichten | |
KR100415475B1 (ko) | 기판 상에 박막을 성장시키는 장치 | |
US20190062904A1 (en) | Integrated epitaxy system high temperature contaminant removal | |
US20100154711A1 (en) | Substrate processing apparatus | |
KR20180038577A (ko) | 복수 챔버의 화학 기상 증착 시스템 | |
US20110290175A1 (en) | Multi-Chamber CVD Processing System | |
US20120076936A1 (en) | Substrate processing apparatus, gas nozzle and method of processing substrate | |
EP0818807A2 (de) | Senkrechte Doppelofen zur Wärmebehandlung | |
US20100275848A1 (en) | Heat treatment apparatus | |
JP2002541657A (ja) | 垂直にスタックされた処理チャンバーおよび単一軸二重ウエハー搬送システムを備えた半導体ウエハー処理システム | |
KR20160006630A (ko) | 프로세스 챔버의 기판 업스트림 프리-베이킹 장치 및 방법 | |
US20120052203A1 (en) | Substrate processing apparatus and method of processing substrate | |
WO2003038145A2 (en) | Chemical vapor deposition system | |
JP2012023073A (ja) | 基板処理装置および基板の製造方法 | |
EP4189732A1 (de) | Batch-wärmeprozesskammer | |
TW578215B (en) | Method to produce components or its inter-products, vacuum-processing equipment and ultra-high-vacuum CVD-reactor | |
US8771416B2 (en) | Substrate processing apparatus with an insulator disposed in the reaction chamber | |
TW202221825A (zh) | 在批次熱處理腔室中的晶圓邊緣溫度校正 | |
JP2012069831A (ja) | 基板処理装置および半導体装置の製造方法 | |
US20110217852A1 (en) | Substrate processing apparatus and method of manufacturing semiconductor device | |
US20030175426A1 (en) | Heat treatment apparatus and method for processing substrates | |
US20030070608A1 (en) | Method for producing components and ultrahigh vacuum CVD reactor |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
MM4A | Annulment or lapse of patent due to non-payment of fees |