TW558915B - Copper foil with carrier and printed circuit board using the same - Google Patents

Copper foil with carrier and printed circuit board using the same Download PDF

Info

Publication number
TW558915B
TW558915B TW91121127A TW91121127A TW558915B TW 558915 B TW558915 B TW 558915B TW 91121127 A TW91121127 A TW 91121127A TW 91121127 A TW91121127 A TW 91121127A TW 558915 B TW558915 B TW 558915B
Authority
TW
Taiwan
Prior art keywords
copper foil
carrier
resin layer
patent application
scope
Prior art date
Application number
TW91121127A
Other languages
English (en)
Chinese (zh)
Inventor
Atsushi Okuno
Takashi Natsume
Original Assignee
Nikko Materials Co Ltd
Japan Rec Company Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nikko Materials Co Ltd, Japan Rec Company Ltd filed Critical Nikko Materials Co Ltd
Application granted granted Critical
Publication of TW558915B publication Critical patent/TW558915B/zh

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/022—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates
    • H05K3/025—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates by transfer of thin metal foil formed on a temporary carrier, e.g. peel-apart copper
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Laminated Bodies (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
TW91121127A 2001-09-26 2002-09-16 Copper foil with carrier and printed circuit board using the same TW558915B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2001292768A JP2003101189A (ja) 2001-09-26 2001-09-26 キャリア付銅箔及び該銅箔を使用したプリント基板

Publications (1)

Publication Number Publication Date
TW558915B true TW558915B (en) 2003-10-21

Family

ID=19114669

Family Applications (1)

Application Number Title Priority Date Filing Date
TW91121127A TW558915B (en) 2001-09-26 2002-09-16 Copper foil with carrier and printed circuit board using the same

Country Status (3)

Country Link
JP (1) JP2003101189A (ja)
TW (1) TW558915B (ja)
WO (1) WO2003030599A1 (ja)

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6596391B2 (en) * 1997-05-14 2003-07-22 Honeywell International Inc. Very ultra thin conductor layers for printed wiring boards
JP3612594B2 (ja) * 1998-05-29 2005-01-19 三井金属鉱業株式会社 樹脂付複合箔およびその製造方法並びに該複合箔を用いた多層銅張り積層板および多層プリント配線板の製造方法

Also Published As

Publication number Publication date
WO2003030599A1 (fr) 2003-04-10
JP2003101189A (ja) 2003-04-04

Similar Documents

Publication Publication Date Title
TW566061B (en) Copper foil with carrier and printed circuit board using the same
TW526691B (en) Copper coated polyimide with metallic protective layer
US5948526A (en) Protected sheet laminate
JP2004344962A (ja) 熱プレス用シート
JPH02307296A (ja) 保護された伝導フオイル及び処理中の電着金属フオイルを保護するための処理方法
TW558915B (en) Copper foil with carrier and printed circuit board using the same
TW573079B (en) Composite copper foil with copper or copper alloy support body, and printed circuit board using the composite copper foil
KR200491436Y1 (ko) 보호테이프가 구비된 pcb기판 프레스 적층 공정용 이형필름
US20120207972A1 (en) Insulating film structure and manufacturing method thereof
JP2003069173A (ja) 水溶性樹脂キャリア付銅箔及び該銅箔を使用したプリント基板
JP4916057B2 (ja) Ｆｐｃ用保護フィルム、ｆｐｃ用保護フィルム付樹脂導体箔積層体およびそれを用いたフレキシブルプリント配線基板の製造方法
TWI339550B (en) Methode for attaching adhesive on flexible printed circuited board
JP2005303126A (ja) 半導体ウェハの保護シート
JP2002246711A (ja) アルミニウムキャリア付銅箔及び該銅箔を使用したプリント基板
TW200303823A (en) Film laminating method and laminating apparatus
JP2004103681A (ja) 銅又は銅合金の支持体を備えた複合銅箔及び該複合銅箔を使用したプリント基板
JP2002326309A (ja) 耐熱性フレキシブル積層板
EP0857111B1 (en) Sheet laminate comprising a protective film releasably attached to a substrate by a radiation cured adhesive layer and another protective film attached to the other surface of the substrate
JP4522578B2 (ja) 供給方法と供給装置
JP2010176477A (ja) 非接触ｉｃカード及びその製造方法
CN1283144A (zh) 印刷电路板的组件
JP2001225341A (ja) 樹脂ベース基板製造用中間板
JP2001225340A (ja) 樹脂ベース基板製造用離型紙
JP5189726B2 (ja) 被着体の加工方法及びこれに用いられる粘着シート
WO1996001605A1 (en) Sheets with high temperature stable protective coating