TW558778B - Ultra fine pitch capillary - Google Patents

Ultra fine pitch capillary Download PDF

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Publication number
TW558778B
TW558778B TW91107086A TW91107086A TW558778B TW 558778 B TW558778 B TW 558778B TW 91107086 A TW91107086 A TW 91107086A TW 91107086 A TW91107086 A TW 91107086A TW 558778 B TW558778 B TW 558778B
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TW
Taiwan
Prior art keywords
tool
patent application
scope
section
bonding
Prior art date
Application number
TW91107086A
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English (en)
Inventor
Gil Perlberg
Ziv Atzmon
Benjamin Sonnenreich
Arie Bahalul
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Kulicke & Soffa Investments
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Publication of TW558778B publication Critical patent/TW558778B/zh

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
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    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
    • B23K20/002—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating specially adapted for particular articles or work
    • B23K20/004—Wire welding
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    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the groups H01L21/18 - H01L21/326 or H10D48/04 - H10D48/07 e.g. sealing of a cap to a base of a container
    • H01L21/60—Attaching or detaching leads or other conductive members, to be used for carrying current to or from the device in operation
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    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
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Description

A7 B7 558778 五、發明説明（ 發明背景 本&明大致上係關於一種用於接合線至半導體裝置之工 具且，較特別的是關於一種以極細間距接合細線至接合墊 塊之接合工具。 相關技藝說明 現代電子設備極度依賴安裝有半導體晶片或積體電路 (ICs)之印刷電路板，晶片與基板之間之機械式與電氣性連 接已成為晶片設計人員之挑戰。三種將I C互連至基板之習 知技術為：線接合、膠帶自動接合（TAB)及倒裝晶片。 诸氣私之取普遍者為線接合，在線接合中， 八 塊係位於基板頂表面上之一圖樣中，，晶片安 塊〜圖樣中央，且晶片頂表面背對基板頂表面。細線（可 為鋁或金線）連接於晶片頂表面上之接點與基板頂表面上 之接之間特別疋，連接線係透過一毛細管以供給及接 合於晶片與基板，一接合工具將進一步說明於後。 毛細管（接合工具）係以球形接合線至電子裝置，特別口 半導體裝置之接合墊塊，此毛細管大體上係由陶質材料; 成，主要為氧化鋁、碳化鎢、紅寶石、锆韌化氧化鋁 (ΖΤΑ)、氧化銘韌化锆（ΑΤΖ)。大致為大约！密爾金、鋼= 鋁線之極細線係穿過毛細管中之一軸向通道， ^ ^ 且 小球珠 形成於線之末端’球珠位於毛細管頂端外。初期目標為产 球珠接合於半導體裝置上之一墊塊，及隨後接合於^， 更遠S —線框或類似物部分。在接合循環期間，毛細=泉 行一項以上功能。 ”’田&執
裝 訂
-4- A7 A7 2 五、發明説明（ 球珠 管内以 接合於 塊上之 係由鋁 為了形 出鋁表 氧化物 毛細管 縮，而 塊，快 一有效 供拄：毛’、’田㊁而先將球珠局部地中心定位於毛細 塊定為目標。藉由_卜接合步驟，球珠 :體裝置上之-墊塊，當毛細管觸及落在接合墊 ^珠時’球珠將遭擠壓及變爲。由於接合塾塊通常 故—薄氧化物即形成於接合整塊之表面上。 成適當 < 接合，較佳為破壞氧化物之表面及曝露 、 種破&氧化物之有效方式為利用線球"刮拭，， =表面、，線球係置於氧化銘之表面上且毛細管根據 欲接^之超音波角内所設之一壓電元件之膨脹與收 在、、泉性方向中快速移動。除了熱施加通過接合墊 速和動亦I皆由轉移分子於線與接合墊塊之間而形成 之接合。 毛細管接著在繞圈、滑順進給接合線伸出毛細管外及退 回毛細官内期間操作線，毛細管隨後形成一，，針，，接及一，，釘 "或π嵌”接。 目4 ’熱音波線接合為選用於連接半導體裝置至其支持 基板之方法’熱音波接合法係一部分取決於自轉換器之超 骨波能量轉移、透過例如毛細管或楔形件等工具而將一可 動式接頭接附於欲焊接至半導體裝置或支持基板之球珠或 線0 在習知毛細管（接合工具）中，接合工具及所形成之自由 空氣球珠（FAB)係使接合工具僅可將線接至具有大於6 0微 米（0·060 nim ; 15.34*1〇-4吋）墊塊間隙（間距）之接合墊塊， 因而使其不適於將線接至符合半導體工業較高密度要求之 本紙張尺度適用中國國家棵準(CNS) A4規格(210X 297公釐) 558778 A7 B7 五、發明説明（3 裝f °諸先前技藝接合工具亦不適於操作使用小至〇.4密雨、 (1 0 U米）直徑之線接合。本發明之發明人已研發出〜種= σ工具’其符合這些高密度裝置之要求，同時可維待接八 工具之結構完整性。 圖1 Α說明一習知先前技藝微間距接合工具1 0 0，接合工 具1 〇 〇具有一筒形部1 0 1 ,及一聯結於筒形部[〇 1與工 崎1 0 4足間之錐形部1 0 2，工作端1 0 4 (即接合工具丨〇 〇之 一端）具有一相對於接合工具1 〇 〇縱軸線之1 5度頂端角^ 易舌工作端104具有30度之全角1〇6。相對於茼形部 1 〇 i之工作端1 04縮小寬度可容許球珠接合於具有y : 0.0032叶間隙〈整塊上，且工作端1〇4不接觸於一接合線 乂 一相都圈’如5,558,27〇號美國專利所述。 圖說明工作端1〇4之放大截面圖，如圖1B所示，工 ，面111具有4度之面角1〇8，且錐形部1〇2具有度之^ 角1 1 8。此外，相鄰之工作面丨丨丨為第—内倒角丨^ ^ 相鄰於第二内倒角112，第一内倒角丨1〇具有9〇度之倒角 1 1 4，且連接或接續於具有一大於6 〇度之第二内倒角Η〕 。諸倒角係設計以將一細線（圖中未示）導入具有一直徑 1 〇 6之線孔1 1 6中，以容納大約！密爾直徑之線。 工 丰二^前技藝接合工具有其瑕戚’即其設計無法容納 +導姐14工業要求之超微間距（30微米或以下）接么執塊 。此外，諸接合工具之構成材料無法受力及符么提二接 合工具且工作端應符合半導體工業要求所需之彈性規定。 發明概要 -6 - 4 五、發明説明（ 為j解决習知接合工具之前述 一直徑小於39微米之工作端。 砧，本發明係關於具有 接合工具包含-工作端於接合工且末“ -錐形段，具有一相關於第一筒形段:工作'包括。 -工作面’具有一第一環形倒角之=…⑴ 。第一及第二—=角’設於工作端之末端之-内側部 弟及弟一確形倒角係彼&_ 軸向通道係聯結於第二環形倒角之—上部：貝上王㈣之 全：本發明之另一觀點所示’第二環形倒角具有—小於9。。 4 桃姑町不，接合工具係由一選自 丫2〇^及u) Al2〇3+ Zr〇2+ Υ2〇3組成族群之材料製成。 本叙明 < 上述及其他觀點係參考於圖式及本發明舉例 施例之說明而載明於後。 依本發明之又一觀點所示 面角。 依本發明之再一觀點所示 重1 % Zr〇2之材料製成。 依本發明之另一觀點所示 第一環形倒角具有一大於8 接合工具係由一含有至少8 接合工具係由一選自i) Zr〇 圖式簡單說明 了似：以下洋細說明並審謂相關圖式而徹底瞭解， 而強凋的疋，依據一般實施而言，圖中之多項元件並未依 比例输不。反之，多項元件之尺寸係做任意放大或縮小， 以求清楚明瞭，圖中所含者即以下圖式： 圖1 A、1 Β係一習知接合工具之不同側視圖； 本紙張尺歧財國國家標準規格(21〇 — 558778 五、發明説明（5 A7 B7 圖2 A至2 E係本發明第〜 墘例貫袍例之— 同視圖；及 接合工且之 不 圖3係本發明吊二舉例會 丰W貝、施例（一接合 知崩而m。 口丄具 詳細截面圖 之工作端之 詳細說明 本發明係藉由提供一接合工具以 具之瑕疵，其具有一工作 自子、毛細管接合工 ’且包括I)—錐形以 關於第一筒形段之預定角，i i ) 一工作 又，具有一相 倒角於工作端之末端之-外惻部，及：有：第一環形 設於工作端之末端之一内側却，宝_ a _弟—壤形倒角， 此相鄰；及一實質上呈H开/ 弟二環形倒角係彼 … 軸向通道，係聯結於第二環 / 1用 s 。生成义接合工具可施加小至1 0彳气米之接 合線於具有30微米或以下間距之接合塾塊。0…接 圖2 A係本發明第一舉例實施例之接合工具⑽側視圖， 如圖2A所示，接合工具2〇〇具有一筒形主體部2〇丨、一聯 結於筒形主體部20丨末端之錐形部2〇2、及一聯結於錐形 部2 0 2末端之工作端204。在一較佳實施例中，接合工具 2 0 0係由單件式材料構成，而用於構成接合工具之材料特 性則詳細說明於後。 圖2 B係接合工具2 〇 〇之側視截面圖，如圖2 b所示，接 合工具2 0 0具有一在大約L5與1.6毫米之間之直徑2 2 7且較 佳為大約1 · 5 8 8毫米。此外，接合工具2 〇 〇具有一在大約 9.5與11.1¾米之間之長度。錐形部202具有一始於其與筒 形段2 0 1接合處且在大約1 8。與2 2。之間之一實質上固定 __ · 8 - 本紙張尺度適用中國國家樣準(CNS) A4規格(210 X 297公釐)
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558778 A7 B7 五、發明説明（6 度U，在—舉例之實施例中，錐度是在大約19。與21。 ^間且較佳為2〇。。軸向通道2 2 0係自接合工具2〇〇之上 而-一 2延伸至工作端2 〇 4，在一舉例之實施例中，軸向通 迢2 2 0具有一實質上呈連續之錐形，且在其一部分長度上 有大約13 ±1。預定角226。當軸向通道220趨近於工作 端2 0 4時，此錐度即過渡至大約6。土丨。，惟，本發明並不 限方；此，且其預期軸向通道220可以具有一實質上固定之 直徑或者僅在接合工具200之一部分長度上呈錐形，後者 ^較為所需’以利於線嵌入接合工具2 0 〇之上端2 2 2。此 變換之軸向通道實例係揭述於圖2 D及2 E中。 如圖2D所示，軸向通道220具有一沿著接合工具200之 長度而實質上固定之直徑230，在圖2E中，軸向通道220 具有一沿著接合工具2 〇 〇之一部分長度而實質上固定之直 & 240 ’且具有一錐度242鄰近於接合工具200之上端222。 圖2 C係接合工具2 〇 〇之工作端2 0 4細部截面圖，如圖2 C 所示，工作端2〇4具有一環形工作面211且具有一在8與 1 5度之間之面角2 〇 8。在一舉例之實施例中，面角2 0 8至 少為1 1度，較佳為在1 1與1 2度之間，且最佳為1 1度，以 利由接合工具提供一強力之第二接合（楔形接合）。相鄰於 工作面2 1 1者為一環形倒角2 1 3且其具有一小於9 0度之全 角2 1 4。在一實施例中，倒角2 1 4是6 0與9 0度之間，且最 佳為大約6 0度，以利提供一符合剪力與拉力試驗規定之第 一接合（球形接合）。此外，環形倒角2 1 3具有一在1與4微 米之間之寬度。筒形通道2 2 4聯結於倒角2 1 3之上部與軸 -9 - 本紙張尺度適用中國國家標準(CNS) A4規格(210X 297公釐)
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558778
3通道220之間，在一舉例之實施例中，筒形通道224具 有-大約丨4微米之直徑2〇6 ’以容納_接合線(圖中未示) 且：角2丨3具有—大約18微米之外徑2丨2，及工作端204 ;有-大約33微米之直徑216。筒形通道⑴之直徑2〇6 依接合線直加4微米而決定。此外，如圖Μ所示，工 作端2 04具有一在大約〇與1 〇度之間之實質上固定之錐度 2 19，、且較佳為大約7度以藉由接合工具2〇〇避免相鄰之接 3線接觸，及一在大約6 〇與9 〇微米之 較佳實施例中長度210為大約76·2微米广210在 由於錐形部2 0 2與工作端2 04二者之錐形角218、2丨9各 不相同，一過渡區2 2 5可設於錐形部2〇2與工作端2〇4| 間、。^在一較佳實施例中，過渡區2 2 5具有一大約3·8微米 <半炫。此外，為了避免接合工具2〇〇破碎，一具有半徑 在大、4與6¼米之間之過渡區3丨5可設於工作端2〇4之下 部與工作面2 1 1之間。 圖3係本發明另一舉例實施例之工作端3 〇 4細部截面圖 ，由於此舉例實施例中之接合工具之筒形主體部、錐形部 及軸向通道基本上皆相同於第一舉例實施例者，故不予以 贅述。 如圖3所示，工作端3 0 4具有一工作面3 u且具有一在8 與1 5度之間之面角3 〇 8。在一舉例之實施例中，面角3 〇 8 係在大约1 0與1 2度之間’較佳為丨丨度。相鄰於工作面 3 1 1者為一環形倒角3 ! 3且其具有一小於9 〇度之全角3 1 * •’在一貫拖例中，倒角3 1 4是6 0與9 0度之間，且最佳為大 -10 - 本紙張尺度適用中s 8家料(CNS) A4規格(21GX 297公釐） 558778 A7 _B7_ 五、發明説明（8~^"" 約6 0度。此外，環形倒角3 1 3具有一在1與3微米之間之寬 度。筒形通道324聯結於倒角313之上部與軸向通道220 之間，在一舉例之實施例中，筒形通道3 2 4具有一在大約 1 4與1 6微米之間之直徑3 0 6，且較佳為大約1 5微米，以 容納一接合線（圖中未示），倒角3 1 3具有一在大約1 7與1 9 微米之間之外徑3 1 2且較佳為大約1 8微米，及工作端3 〇 4 具有一在大約3 7與3 9微米之間之外徑3 1 6且較佳為大約 38微米。筒形通道324之直徑306可依接合線直徑加2微 米而決定。此外，如圖3所示，工作端304具有一在大約〇 與10度之間之實質上固定之錐度319，且較佳為大約7度 以藉由接合工具2 0 0避免相鄰之接合線接觸，及一在大約 117與137微米之間之長度310，在一較佳實施例中長度 3 1 0為大約1 2 7微米。 提供一如上所述之接合工具僅為符合半導體工業需求之 一半，重要的是構成接合工具之材料，其需有足夠強度以 承受接合期間施加於工具上之力，另需有足夠彈度以依需 要撓曲而不斷裂。本發明人已決定藉由以至少8〇重量％氧 化锆（Zr〇2)製成接合工具以符合諸需求。 在本發明之一實施例中，氧化釔穩定性氧化锆用於製成 接合工具’在此實施例中，大約9 5重量〇/❶氧化銓組合於大 約5重量％氧化纪（丫2〇3)。本發明人已決定在熱處理期間 將純氧化锆進行一相態轉變，純氧化錘在室溫下為單斜晶 型而在大約lOOOt時則呈較濃密之四方晶型，此在大约 1350與1500。(：溫度之間之燒結製程期間牽涉到大量變化且 __ -11 - 本紙張尺度適财S S家標準(CNS) A4規格(210 X 297公董) 558778 A7 B7 五、發明説明（9 產生裂痕於其結構内。 丫2〇3之添加量係在低溫時產生立方體相態與單斜晶型相 態之混合物，例如低於90CTC，因為立方體相態出現而發生 且牽涉到極小量變化之此相態轉變過程即可減小熱應力及 減小微裂痕生成至最少。此材料比習知氧化鋁基材料更具 有一高彎曲強度，且因而，其即增進接合工具之製造力。 在另一舉例之實施例中，高達2 0重量％之ai2〇3添加至氧 化纪穩定性氧化锆，此材料具有一相似於習知氧化鋁基材 料者之消音作用。 儘管本發明已參考舉例之實施例說明於上，惟其並不限 於此，反而，文後之申請專利範圍應视為包括在^脫離本 發明之其實精神範_下可由習於此技者達成之本發明其他 變換型式與實施例。 -12 -

Claims (1)

  1. 558778 A8 B8 C8 D8 第091107086號專利申請案 中文申請專利範圍替換本(92单8·月） ---------- 申請專利範圍 種用於將一細線接合至一基板之接合工具，接合工 具包含： ^ 一工作端設於接合工具之末端，包括： i) 一錐形段，具有一相關於接合工具縱軸線之預 定角， 11) 一工作面，具有一第一環形倒角設於工作端之末 端之一外側部，及 iii) 一第二環形倒角，設於工 ，第一及第二環形倒角係 一實質上呈筒形之軸向通道 角之一上部。 2 .如申請專利範圍第1項之接合工 具有一小於90。全角。 3 ·如申請專利範圍第2項之接合工 具有一大於8。面角。 4 ·如申請專利範圍第1項之接合工 具有一 6 0 °全角。 5 ·如申請專利範圍第4項之接合工 具有一在10°與12。之間之面角 6 ·如申請專利範圍第1項之接合工 一小於1 6微米直徑。 7 ·如申請專利範圍第1項之接合工 小於1 3 7微米長度。 8 ·如申請專利範圍第7項之接合工 作端之末端之一内側部 彼此相鄰；及 • ，係聯結於第二環形倒 具，其中第二環形倒角 具’其中第一環形倒角 ij 具，其中第二環形倒角 具，其中第一環形倒角 〇 • 具’其中軸向通道具有 具，其中錐形段具有一 具’其中錐形段具有一
    小於3 9微米外 9.如申請專利範圍第丨項之接合工具，其中接合工具係由 一含有至少8 0重量％ Zr〇2之材料製成。 ' 10· =申請專利範圍第}項之接合工具，其中接合工具係由 -:自 0 Zr〇2 + Υ2〇3及n) Al2〇3 + Zr〇2 + 組成族 义材料製成。 f 11. 如申凊專利範圍第1項之接合， /、 /、甲接合工具係由 一含有95重量％ Zr〇2及5重量％ Y2〇3之材料製成。 12. 如申請專利範圍第"項之接合工具，其中高達2〇重量 %之Α12〇3添加至該材料。 13·如申請專利範圍第9_12項任—項之接合工具，其中材 料係以至少1350°C溫度燒結。 从如申請專利範圍第！項之接合工具，其中接合工具係由 單件式材料製成。 15·如申請專利範圍第丨項之接合工具，其中錐形段之一全 角係小於1 〇。。 16.如申請專利範圍第1項之接合工具，其中錐形段之一全 角小於7。。 17· 一種用於將一細線接合至一基板之接合工具，接合工 具包含： u / 一筒形段，具有一直徑； 一第一錐形段，係聯結於筒形段之末端，及具有一 相關於筒形段縱軸線之第一預定角； 一第二錐形段，具有丨）一相關於筒形段縱軸線之第 -2- 本紙張尺度適用中國g家標準(CNS) A4規格(21〇 X 297公釐） 、申請專利範園 預足角，ii) 一第一倒角，+ 及出)-第二心⑼、 其末端之-外側部， 段聯蛀^ & β又於其末端之—内側部，第二錐形 %〜&罘一錐形段之末端；及 角了轴向通道’係自筒形段之第-末端延伸至第二倒 18’==利範圍第”項之接合工具，進—步包含一第 …设於第一錐形段與第二錐形段之間。 .如申請專利範圍第17項之接合 有—小於9〇。角。 其中弟一倒角具 其中第二倒角具 其中第一倒角具 2〇·如申請專利範圍第1 7項之接合工具 有一 6 〇。角。 21.如申請專利範圍第1 7項之接合工具 有一在10。與12。之間之面角。 其中軸向通道具 22·如申請專利範圍第1 7項之接合工且 ::第-直徑在第-筒形段之第二末端及：；：：： 在罘—錐形段之頂端，第一直徑大於第二直徑。 23·如申請專利範圍第17項之接合工具，纟中接合工具係 由^有至少80重：!：％ Zr〇2之材料製成。 、 24·如申請專利範圍第17項之接合工具 由-選 W〇2+Y似相2〇3+ΖΓ〇2+Υ2〇3 組成: 群之材料製成。 Α如=請專利範圍第17項之接合工具，其中第一錐形段 之第一預定角係在19。與21。之間。 26·如申請專利範圍第1 7項之接合工具，其中第一預定角 -3- 本紙張尺度適用中國國家標準(CNS) Α4規格(210 X 297公釐) 558778 A8 B8 C8 D8 申请專利範圍 為 2 0 0 〇 27·如申請專利範圍第1 7項之接八 ^ 之笛& ”艾接合工具，其中第 义罘一預疋角為7。。 28·如申請專利範圍第丨7項之 > m ^ ^ 工具，其中第 <弟一預疋角係小於1 〇。。 29· —種用於將一細線接一 具包含： 基板（接合工具 錐形段 二錐形段 接合工 荀形段，具有一直徑； 第一錐形段，係聯結於筒 ^ t同形段之末端，及具有一 相關於筒形段縱軸線之第一預定角，及 π 一第二錐形段，係聯蛀认 錐形段具有：^於^錐形段之末端，第二 0 一在117與丨37微米之間之長度， u) 一相關於筒形段縱軸線之7。角二及 出）一60°之環形倒角，設於 π , . ^ 弟一錐形段之一内側部 且相鄰於其一端。 30·如申請專利範圍第2 9項之接合 由一選自 i) Zr02 + Υ2〇3及n) Al2 Τ 较，、係 群之材料製成。 扣〕+ Y2〇3組成族 31. 如中請專利範圍第2 9項之接合工 係由-含有至少8〇重量％抓之材料製其中該接合工具 32. -種製造一接合工具以接合一線 成。 ，其包含以下步驟： 接合墊塊之方法 形成一工作端於接合工具之末端； -4 - 558778 S 8 8 8 A B c D 六、申請專利範圍 形成一錐形段於工作端上，其具有一相關於接合工 具縱軸線之預定角； 形成一工作面於工作端之末端； 形成一第一環形倒角，其具有一至少8 °面角於工作 端之末端之一外側部； 形成一第二環形倒角，其具有一小於9 0 °全角於工作 端之末端之一内側部且相鄰於第一環形倒角；及 形成一實質上呈筒形之軸向通道於第二環形倒角之 一上端。 本紙張尺度適用中國國家標準(CNS) A4規格(210 X 297公釐）
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