TW551712U - Socket for semiconductor package - Google Patents

Socket for semiconductor package

Info

Publication number
TW551712U
TW551712U TW91209098U TW91209098U TW551712U TW 551712 U TW551712 U TW 551712U TW 91209098 U TW91209098 U TW 91209098U TW 91209098 U TW91209098 U TW 91209098U TW 551712 U TW551712 U TW 551712U
Authority
TW
Taiwan
Prior art keywords
socket
semiconductor package
package
semiconductor
Prior art date
Application number
TW91209098U
Other languages
English (en)
Chinese (zh)
Inventor
Tomohiro Nakano
Kiyoshi Adachi
Akira Kaneshige
Original Assignee
Molex Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Molex Inc filed Critical Molex Inc
Publication of TW551712U publication Critical patent/TW551712U/zh

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/04—Housings; Supporting members; Arrangements of terminals
    • G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
    • G01R1/0433—Sockets for IC's or transistors
    • G01R1/0483—Sockets for un-leaded IC's having matrix type contact fields, e.g. BGA or PGA devices; Sockets for unpackaged, naked chips
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/04—Housings; Supporting members; Arrangements of terminals
    • G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
    • G01R1/0433—Sockets for IC's or transistors
    • G01R1/0441—Details
    • G01R1/0466—Details concerning contact pieces or mechanical details, e.g. hinges or cams; Shielding

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
  • Measuring Leads Or Probes (AREA)
  • Connecting Device With Holders (AREA)
TW91209098U 2001-06-19 2002-06-18 Socket for semiconductor package TW551712U (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2001185322A JP4615151B2 (ja) 2001-06-19 2001-06-19 半導体パッケージ用ソケット

Publications (1)

Publication Number Publication Date
TW551712U true TW551712U (en) 2003-09-01

Family

ID=19024922

Family Applications (1)

Application Number Title Priority Date Filing Date
TW91209098U TW551712U (en) 2001-06-19 2002-06-18 Socket for semiconductor package

Country Status (4)

Country Link
JP (1) JP4615151B2 (ja)
CN (1) CN1244147C (ja)
TW (1) TW551712U (ja)
WO (1) WO2002103372A1 (ja)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3942936B2 (ja) * 2002-04-09 2007-07-11 株式会社エンプラス 電気部品用ソケット
CN100427225C (zh) * 2005-04-07 2008-10-22 力成科技股份有限公司 球格阵列封装测试分类机的通用变更套件
US7172450B1 (en) * 2006-01-11 2007-02-06 Qualitau, Inc. High temperature open ended zero insertion force (ZIF) test socket
JP2012109081A (ja) * 2010-11-16 2012-06-07 Yamaichi Electronics Co Ltd 半導体装置用ソケット
US8808010B2 (en) * 2011-06-06 2014-08-19 Interconnect Devices, Inc. Insulated metal socket
KR101585182B1 (ko) * 2014-04-28 2016-01-14 황동원 반도체 소자 테스트용 소켓장치
US9832899B1 (en) * 2016-04-27 2017-11-28 Alcatel Lucent Side clamping BGA socket

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5419710A (en) * 1994-06-10 1995-05-30 Pfaff; Wayne K. Mounting apparatus for ball grid array device
US6069481A (en) * 1995-10-31 2000-05-30 Advantest Corporation Socket for measuring a ball grid array semiconductor
JP3745060B2 (ja) * 1996-12-09 2006-02-15 日本テキサス・インスツルメンツ株式会社 ソケット
JPH10293158A (ja) * 1997-04-18 1998-11-04 Advantest Corp Ｉｃ試験装置
TW421333U (en) * 1999-02-24 2001-02-01 Hung Rung Fang IC socket
JP3257994B2 (ja) * 1999-08-30 2002-02-18 日本テキサス・インスツルメンツ株式会社 ソケット
JP3619413B2 (ja) * 2000-01-18 2005-02-09 株式会社エンプラス 電気部品用ソケット

Also Published As

Publication number Publication date
JP4615151B2 (ja) 2011-01-19
CN1529817A (zh) 2004-09-15
JP2003007415A (ja) 2003-01-10
WO2002103372A1 (en) 2002-12-27
CN1244147C (zh) 2006-03-01

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Legal Events

Date Code Title Description
GD4K Issue of patent certificate for granted utility model filed before june 30, 2004
MM4K Annulment or lapse of a utility model due to non-payment of fees