TW546810B - Semiconductor device having signal contacts and high current power contacts - Google Patents

Semiconductor device having signal contacts and high current power contacts Download PDF

Info

Publication number
TW546810B
TW546810B TW091102755A TW91102755A TW546810B TW 546810 B TW546810 B TW 546810B TW 091102755 A TW091102755 A TW 091102755A TW 91102755 A TW91102755 A TW 91102755A TW 546810 B TW546810 B TW 546810B
Authority
TW
Taiwan
Prior art keywords
contact
base
item
circuit assembly
semiconductor device
Prior art date
Application number
TW091102755A
Other languages
English (en)
Chinese (zh)
Inventor
Anthony Andric
Ruel Hill
Original Assignee
Advanced Micro Devices Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Advanced Micro Devices Inc filed Critical Advanced Micro Devices Inc
Application granted granted Critical
Publication of TW546810B publication Critical patent/TW546810B/zh

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/02—Arrangements of circuit components or wiring on supporting structure
    • H05K7/10—Plug-in assemblages of components, e.g. IC sockets
    • H05K7/1092—Plug-in assemblages of components, e.g. IC sockets with built-in components, e.g. intelligent sockets
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W78/00—Detachable holders for supporting packaged chips in operation
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/02—Arrangements of circuit components or wiring on supporting structure
    • H05K7/10—Plug-in assemblages of components, e.g. IC sockets
    • H05K7/1007—Plug-in assemblages of components, e.g. IC sockets with means for increasing contact pressure at the end of engagement of coupling parts

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Connecting Device With Holders (AREA)
  • Lead Frames For Integrated Circuits (AREA)
TW091102755A 2001-02-20 2002-02-19 Semiconductor device having signal contacts and high current power contacts TW546810B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US09/789,141 US6551114B2 (en) 2001-02-20 2001-02-20 Semiconductor device having signal contacts and high current power contacts

Publications (1)

Publication Number Publication Date
TW546810B true TW546810B (en) 2003-08-11

Family

ID=25146704

Family Applications (1)

Application Number Title Priority Date Filing Date
TW091102755A TW546810B (en) 2001-02-20 2002-02-19 Semiconductor device having signal contacts and high current power contacts

Country Status (8)

Country Link
US (1) US6551114B2 (https=)
EP (1) EP1368861B1 (https=)
JP (1) JP4698928B2 (https=)
KR (1) KR100819192B1 (https=)
CN (1) CN1251358C (https=)
AU (1) AU2002240290A1 (https=)
TW (1) TW546810B (https=)
WO (1) WO2002067322A2 (https=)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
ATE368017T1 (de) 2000-03-14 2007-08-15 James Hardie Int Finance Bv Faserzementbaumaterialien mit zusatzstoffen niedriger dichte
TW529987B (en) 2001-03-02 2003-05-01 James Hardie Res Pty Ltd Spattering apparatus
US20030164119A1 (en) 2002-03-04 2003-09-04 Basil Naji Additive for dewaterable slurry and slurry incorporating same
US6964584B2 (en) * 2001-12-21 2005-11-15 Intel Corporation Low impedance, high-power socket and method of using
US6752635B1 (en) * 2003-03-31 2004-06-22 Intel Corporation Comb-shaped land grid array (LGA) socket contact for improved power delivery
US8209927B2 (en) 2007-12-20 2012-07-03 James Hardie Technology Limited Structural fiber cement building materials
US9583125B1 (en) * 2009-12-16 2017-02-28 Magnecomp Corporation Low resistance interface metal for disk drive suspension component grounding
US8079849B2 (en) * 2010-05-11 2011-12-20 Tyco Electronics Corporation Socket connector assembly with compressive contacts
CN113410748A (zh) * 2021-06-29 2021-09-17 弘凯光电(江苏)有限公司 镭射光源封装结构

Family Cites Families (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4330163A (en) * 1979-12-05 1982-05-18 E. I. Du Pont De Nemours And Company Zero insertion force connector for LSI circuit package
US5258648A (en) * 1991-06-27 1993-11-02 Motorola, Inc. Composite flip chip semiconductor device with an interposer having test contacts formed along its periphery
JP3302720B2 (ja) * 1992-06-09 2002-07-15 ミネソタ マイニング アンド マニュファクチャリング カンパニー Ｉｃソケット
US5489218A (en) * 1994-03-24 1996-02-06 Hon Hai Precision Industry Co., Ltd. ZIF PGA socket and contact therein
US5483099A (en) 1994-08-31 1996-01-09 Intel Corporation Standardized power and ground design for pin grid array packages
US5528083A (en) * 1994-10-04 1996-06-18 Sun Microsystems, Inc. Thin film chip capacitor for electrical noise reduction in integrated circuits
US5721673A (en) 1995-10-05 1998-02-24 Micron Electronics, Inc. Socket for retaining multiple electronic packages
US5703402A (en) * 1995-11-13 1997-12-30 Acc Microelectronics Corporation Output mapping of die pad bonds in a ball grid array
US6084777A (en) * 1997-04-23 2000-07-04 Texas Instruments Incorporated Ball grid array package
US6020637A (en) * 1997-05-07 2000-02-01 Signetics Kp Co., Ltd. Ball grid array semiconductor package
US6160705A (en) * 1997-05-09 2000-12-12 Texas Instruments Incorporated Ball grid array package and method using enhanced power and ground distribution circuitry
AU1536599A (en) * 1997-11-28 1999-06-16 Pcd, Inc. Manually operated top loading socket for ball grid arrays
US6140581A (en) * 1997-12-03 2000-10-31 Mitsubishi Electronics America, Inc. Grounded packaged semiconductor structure and manufacturing method therefor
US6064113A (en) * 1998-01-13 2000-05-16 Lsi Logic Corporation Semiconductor device package including a substrate having bonding fingers within an electrically conductive ring surrounding a die area and a combined power and ground plane to stabilize signal path impedances
US6075710A (en) * 1998-02-11 2000-06-13 Express Packaging Systems, Inc. Low-cost surface-mount compatible land-grid array (LGA) chip scale package (CSP) for packaging solder-bumped flip chips
US6297550B1 (en) * 1998-04-01 2001-10-02 Lsi Logic Corporation Bondable anodized aluminum heatspreader for semiconductor packages
US5903050A (en) * 1998-04-30 1999-05-11 Lsi Logic Corporation Semiconductor package having capacitive extension spokes and method for making the same
TW421333U (en) * 1999-02-24 2001-02-01 Hung Rung Fang IC socket

Also Published As

Publication number Publication date
EP1368861A2 (en) 2003-12-10
US20020115325A1 (en) 2002-08-22
WO2002067322A3 (en) 2002-12-19
JP2004523864A (ja) 2004-08-05
CN1251358C (zh) 2006-04-12
KR100819192B1 (ko) 2008-04-04
CN1491464A (zh) 2004-04-21
JP4698928B2 (ja) 2011-06-08
US6551114B2 (en) 2003-04-22
KR20040014457A (ko) 2004-02-14
WO2002067322A2 (en) 2002-08-29
AU2002240290A1 (en) 2002-09-04
EP1368861B1 (en) 2011-09-28

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GD4A Issue of patent certificate for granted invention patent
MM4A Annulment or lapse of patent due to non-payment of fees