TW543130B - Bonding tool, bonding stage, front part of bonding tool, and stage of bonding stage - Google Patents

Bonding tool, bonding stage, front part of bonding tool, and stage of bonding stage Download PDF

Info

Publication number
TW543130B
TW543130B TW091106810A TW91106810A TW543130B TW 543130 B TW543130 B TW 543130B TW 091106810 A TW091106810 A TW 091106810A TW 91106810 A TW91106810 A TW 91106810A TW 543130 B TW543130 B TW 543130B
Authority
TW
Taiwan
Prior art keywords
tool
wire
patent application
scope
item
Prior art date
Application number
TW091106810A
Other languages
English (en)
Chinese (zh)
Inventor
Naoki Sakata
Koichiro Maemura
Hiroshi Kawachi
Tetsuo Yashiki
Toshiya Takahashi
Original Assignee
Sumitomo Electric Industries
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sumitomo Electric Industries filed Critical Sumitomo Electric Industries
Application granted granted Critical
Publication of TW543130B publication Critical patent/TW543130B/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H01L2224/787—Means for aligning
    • H01L2224/78743—Suction holding means
    • H01L2224/78745—Suction holding means in the upper part of the bonding apparatus, e.g. in the capillary or wedge
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H01L2224/78981—Apparatus chuck
    • H01L2224/78985—Material
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/79—Apparatus for Tape Automated Bonding [TAB]
    • H01L2224/797—Means for aligning
    • H01L2224/79743—Suction holding means
    • H01L2224/79745—Suction holding means in the upper part of the bonding apparatus, e.g. in the pressing head
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/79—Apparatus for Tape Automated Bonding [TAB]
    • H01L2224/79981—Apparatus chuck
    • H01L2224/79985—Material
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H01L2224/859—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector involving monitoring, e.g. feedback loop

Landscapes

  • Wire Bonding (AREA)
TW091106810A 2001-04-25 2002-04-04 Bonding tool, bonding stage, front part of bonding tool, and stage of bonding stage TW543130B (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2001127511 2001-04-25
JP2002056989A JP2003017532A (ja) 2001-04-25 2002-03-04 ボンディングツール並びにボンディングステージ及びボンディングツール用先端部並びにボンディングステージ用ステージ部

Publications (1)

Publication Number Publication Date
TW543130B true TW543130B (en) 2003-07-21

Family

ID=26614176

Family Applications (1)

Application Number Title Priority Date Filing Date
TW091106810A TW543130B (en) 2001-04-25 2002-04-04 Bonding tool, bonding stage, front part of bonding tool, and stage of bonding stage

Country Status (3)

Country Link
JP (1) JP2003017532A (OSRAM)
KR (1) KR20020082786A (OSRAM)
TW (1) TW543130B (OSRAM)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007123413A (ja) * 2005-10-26 2007-05-17 Elpida Memory Inc 半導体装置の製造方法
WO2014065199A1 (ja) * 2012-10-23 2014-05-01 東レエンジニアリング株式会社 ボンディングツール冷却装置およびボンディングツール冷却方法
WO2022211370A1 (ko) * 2021-04-02 2022-10-06 일진다이아몬드(주) 초경 몸체에 일체화 된 다결정 다이아몬드 팁을 구비하는 고평탄 본딩 공구

Also Published As

Publication number Publication date
KR20020082786A (ko) 2002-10-31
JP2003017532A (ja) 2003-01-17

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Legal Events

Date Code Title Description
GD4A Issue of patent certificate for granted invention patent
MM4A Annulment or lapse of patent due to non-payment of fees