TW535184B - Method of actuating a high power micromachined switch - Google Patents
Method of actuating a high power micromachined switch Download PDFInfo
- Publication number
- TW535184B TW535184B TW091110525A TW91110525A TW535184B TW 535184 B TW535184 B TW 535184B TW 091110525 A TW091110525 A TW 091110525A TW 91110525 A TW91110525 A TW 91110525A TW 535184 B TW535184 B TW 535184B
- Authority
- TW
- Taiwan
- Prior art keywords
- switch
- signal path
- mems
- micro
- electromechanical system
- Prior art date
Links
- 238000000034 method Methods 0.000 title claims abstract description 11
- 239000007787 solid Substances 0.000 claims abstract description 14
- 238000001179 sorption measurement Methods 0.000 claims description 5
- 239000000758 substrate Substances 0.000 claims description 5
- 230000008878 coupling Effects 0.000 claims description 4
- 238000010168 coupling process Methods 0.000 claims description 4
- 238000005859 coupling reaction Methods 0.000 claims description 4
- 230000008054 signal transmission Effects 0.000 abstract description 6
- 239000002184 metal Substances 0.000 description 3
- 230000005611 electricity Effects 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 230000005484 gravity Effects 0.000 description 2
- 238000003466 welding Methods 0.000 description 2
- 241000282376 Panthera tigris Species 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000012811 non-conductive material Substances 0.000 description 1
- 238000012856 packing Methods 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 230000003068 static effect Effects 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
- B81B3/00—Devices comprising flexible or deformable elements, e.g. comprising elastic tongues or membranes
- B81B3/0018—Structures acting upon the moving or flexible element for transforming energy into mechanical movement or vice versa, i.e. actuators, sensors, generators
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
- B81B7/00—Microstructural systems; Auxiliary parts of microstructural devices or systems
- B81B7/02—Microstructural systems; Auxiliary parts of microstructural devices or systems containing distinct electrical or optical devices of particular relevance for their function, e.g. microelectro-mechanical systems [MEMS]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G5/00—Capacitors in which the capacitance is varied by mechanical means, e.g. by turning a shaft; Processes of their manufacture
- H01G5/16—Capacitors in which the capacitance is varied by mechanical means, e.g. by turning a shaft; Processes of their manufacture using variation of distance between electrodes
- H01G5/18—Capacitors in which the capacitance is varied by mechanical means, e.g. by turning a shaft; Processes of their manufacture using variation of distance between electrodes due to change in inclination, e.g. by flexing, by spiral wrapping
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
- H01H59/00—Electrostatic relays; Electro-adhesion relays
- H01H59/0009—Electrostatic relays; Electro-adhesion relays making use of micromechanics
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
- H01H9/00—Details of switching devices, not covered by groups H01H1/00 - H01H7/00
- H01H9/54—Circuit arrangements not adapted to a particular application of the switching device and for which no provision exists elsewhere
- H01H9/541—Contacts shunted by semiconductor devices
- H01H9/542—Contacts shunted by static switch means
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Computer Hardware Design (AREA)
- Chemical & Material Sciences (AREA)
- Analytical Chemistry (AREA)
- Micromachines (AREA)
- Waveguide Switches, Polarizers, And Phase Shifters (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US10/004,034 US20040031670A1 (en) | 2001-10-31 | 2001-10-31 | Method of actuating a high power micromachined switch |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| TW535184B true TW535184B (en) | 2003-06-01 |
Family
ID=21708803
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW091110525A TW535184B (en) | 2001-10-31 | 2002-05-20 | Method of actuating a high power micromachined switch |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US20040031670A1 (enExample) |
| JP (1) | JP2003217423A (enExample) |
| DE (1) | DE10232927A1 (enExample) |
| GB (1) | GB2384363B (enExample) |
| TW (1) | TW535184B (enExample) |
Families Citing this family (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20050225412A1 (en) * | 2004-03-31 | 2005-10-13 | Limcangco Naomi O | Microelectromechanical switch with an arc reduction environment |
| CN100373516C (zh) * | 2004-09-15 | 2008-03-05 | 中国科学院上海微系统与信息技术研究所 | 翘曲膜结构的单刀双掷射频和微波微机械开关及制作方法 |
| CN1295728C (zh) * | 2004-09-20 | 2007-01-17 | 东南大学 | 低阈值直交流可分的微电子机械开关及其制造方法 |
| US7429864B2 (en) | 2004-12-17 | 2008-09-30 | Hewlett-Packard Development Company, L.P. | Systems and methods for rectifying and detecting signals |
| US7521784B2 (en) | 2004-12-17 | 2009-04-21 | Hewlett-Packard Development Company, L.P. | System for coupling wire to semiconductor region |
| US7391090B2 (en) | 2004-12-17 | 2008-06-24 | Hewlett-Packard Development Company, L.P. | Systems and methods for electrically coupling wires and conductors |
| US7503989B2 (en) | 2004-12-17 | 2009-03-17 | Hewlett-Packard Development Company, L.P. | Methods and systems for aligning and coupling devices |
| JP5202236B2 (ja) * | 2007-11-13 | 2013-06-05 | 株式会社半導体エネルギー研究所 | 微小電気機械スイッチ及びその作製方法 |
| WO2009063627A1 (ja) * | 2007-11-14 | 2009-05-22 | Panasonic Corporation | 電気機械素子およびそれを用いた電気機器 |
| JP5210901B2 (ja) * | 2008-02-06 | 2013-06-12 | 株式会社半導体エネルギー研究所 | 液晶表示装置 |
| JP5877992B2 (ja) | 2010-10-25 | 2016-03-08 | 株式会社半導体エネルギー研究所 | 表示装置 |
| US8953120B2 (en) | 2011-01-07 | 2015-02-10 | Semiconductor Energy Laboratory Co., Ltd. | Display device |
Family Cites Families (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5578976A (en) * | 1995-06-22 | 1996-11-26 | Rockwell International Corporation | Micro electromechanical RF switch |
| US6100477A (en) * | 1998-07-17 | 2000-08-08 | Texas Instruments Incorporated | Recessed etch RF micro-electro-mechanical switch |
| JP3119255B2 (ja) * | 1998-12-22 | 2000-12-18 | 日本電気株式会社 | マイクロマシンスイッチおよびその製造方法 |
| US6323447B1 (en) * | 1998-12-30 | 2001-11-27 | Agilent Technologies, Inc. | Electrical contact breaker switch, integrated electrical contact breaker switch, and electrical contact switching method |
| US6058027A (en) * | 1999-02-16 | 2000-05-02 | Maxim Integrated Products, Inc. | Micromachined circuit elements driven by micromachined DC-to-DC converter on a common substrate |
| US6160230A (en) * | 1999-03-01 | 2000-12-12 | Raytheon Company | Method and apparatus for an improved single pole double throw micro-electrical mechanical switch |
| JP3137112B2 (ja) * | 1999-04-27 | 2001-02-19 | 日本電気株式会社 | マイクロマシンスイッチおよびその製造方法 |
| US6373356B1 (en) * | 1999-05-21 | 2002-04-16 | Interscience, Inc. | Microelectromechanical liquid metal current carrying system, apparatus and method |
| US6143997A (en) * | 1999-06-04 | 2000-11-07 | The Board Of Trustees Of The University Of Illinois | Low actuation voltage microelectromechanical device and method of manufacture |
| US6307452B1 (en) * | 1999-09-16 | 2001-10-23 | Motorola, Inc. | Folded spring based micro electromechanical (MEM) RF switch |
| US6529093B2 (en) * | 2001-07-06 | 2003-03-04 | Intel Corporation | Microelectromechanical (MEMS) switch using stepped actuation electrodes |
| US6512322B1 (en) * | 2001-10-31 | 2003-01-28 | Agilent Technologies, Inc. | Longitudinal piezoelectric latching relay |
| US6515404B1 (en) * | 2002-02-14 | 2003-02-04 | Agilent Technologies, Inc. | Bending piezoelectrically actuated liquid metal switch |
| US6657525B1 (en) * | 2002-05-31 | 2003-12-02 | Northrop Grumman Corporation | Microelectromechanical RF switch |
-
2001
- 2001-10-31 US US10/004,034 patent/US20040031670A1/en not_active Abandoned
-
2002
- 2002-05-20 TW TW091110525A patent/TW535184B/zh active
- 2002-07-19 DE DE10232927A patent/DE10232927A1/de not_active Withdrawn
- 2002-10-08 GB GB0223353A patent/GB2384363B/en not_active Expired - Fee Related
- 2002-10-18 JP JP2002304590A patent/JP2003217423A/ja active Pending
Also Published As
| Publication number | Publication date |
|---|---|
| GB2384363A (en) | 2003-07-23 |
| GB0223353D0 (en) | 2002-11-13 |
| US20040031670A1 (en) | 2004-02-19 |
| JP2003217423A (ja) | 2003-07-31 |
| DE10232927A1 (de) | 2003-05-22 |
| GB2384363B (en) | 2006-05-24 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GD4A | Issue of patent certificate for granted invention patent |