511424 A7 B7 經濟部中央標準局員工消費合作社印製 五、發明説明（1 ) 本發明係與印刷電路板之製法有關，特別是指一種能 實際有效增加單位面積上電子部品搭载率的印刷電路板之 製造方法者。 如第-圖及第二圖所示，目前的印刷電路板10在製作 5上均是探用多層的結構設計，並利職數個施有電鍍處理 的通孔11，來導通各層的電氣迴路12，然而，在電子產品 功能曰趨複雜的今日，該印刷電路板10上電氣迴路12的複 雜性不僅有增無減，且導通各層電氣迴路12的通孔u更是 倍數地增加，使欲搭載於該印刷電路板10上的電子部品 ίο 13，必需選擇無通孔Η的位置(如第二圖所示)搭載於該印 刷電路板ίο之電氣迴路12上，但實際上隨著通孔η數目的 增加，該印刷電路板10上適合搭载該電子部品13的位置就 多 會相對減少，而此對於需搭載數十個至數百個的電子部品 13之印刷電路板10而言，勢必需增加整體的面積，方能滿 15足搭載所有電子部品13的需求？但此卻與現今之電氣產品 均朝向輕、薄及短小的設計及製作方向相反。 本發明之主要目的是在提供一種「高電子部品搭載率 之印刷電路板製法」，其係於該印刷電路板上的通孔及其 上下面板上先施以第一次電鍍處理，並以介質填充封閉該 2〇通孔後，行第一次電鍍處理於該第一次電锻處理之電锻層 及該介質上，再施以照像曝光及蝕刻液腐蝕等光學蝕刻製 程後，於該上下面板及通孔上形成一電氣迴路，使該電子 部品能直接搭载於該通孔上方的電氣迴路上，完全不受通 孔位置的限制，實際有效地增加印刷電路板上單位面積電 -------I — (請先閲讀背面之注意事項再填寫本頁) 訂 Φ 本紙張尺度適用中國國家標準（CNS ) Μ規格（210X：297公釐） 83· 3. !0,〇〇〇 511424 A7 經濟部中央標準局員工消費合作社印製 五、發明説明（2 ) 子部品的搭載數量及密度，完全改善昔日電子部品需尋竟 印刷電路板各通孔間位置的各項困擾外，亦能以較小的面 積搭載相同數量及功能的電子部品，實符合現今小型、輕 量化及高機能等電子設備的需求者。 5 本發明又一目的乃在提供一種「高電子部品搭载率之 印刷電路板製法」，其能有效地縮短各電子部品間距離之 印刷電路板的製法，藉以提高傳輸速率、品質及減少雜音 與雜訊等多重效益者。 圖式說明： 10 第一圖：係目前印刷電路板之立體示意圖。 第二圖：係目前印刷電路板之通孔間搭載電子部品之 示意圖。 係本發明製法步騾示意圖之一。 係本發明製法步驟示意圖之二。 係本發明製法步驟示意圖之三。 係本發明製法步驟示意圖之四。 係本發明製法步騾示意圖之五。 係本發明所製成印刷電路板上搭載電子部品 之示意圖。 20圖號說明： 10、20-印刷電路板 12、26’-電氣迴路 22-上面板 24、26=電鍍層 15 笫二圖 第四圖 第五圖 第六圖 第七圖511424 A7 B7 Printed by the Consumer Cooperatives of the Central Standards Bureau of the Ministry of Economic Affairs 5. Description of the Invention (1) The present invention relates to the manufacturing method of printed circuit boards, and particularly refers to a printed circuit board that can effectively effectively increase the rate of electronic parts per unit area. Manufacturing method. As shown in the first figure and the second figure, the current printed circuit board 10 has a multi-layer structural design on the production 5 and uses several through-holes 11 that are plated to facilitate the electrical circuit of each layer. 12. However, in today's day when electronic product functions are becoming more complex, the complexity of the electrical circuit 12 on the printed circuit board 10 is not only increasing, but also the through-holes u that lead to the electrical circuit 12 in each layer are multiplied. The electronic components 13 mounted on the printed circuit board 10 must be selected to have a position without a through hole (as shown in the second figure) and mounted on the electrical circuit 12 of the printed circuit board. As the number of η increases, the number of positions on the printed circuit board 10 suitable for mounting the electronic component 13 will be relatively reduced, and for printed circuit boards 10 that need to carry tens to hundreds of electronic components 13, Need to increase the overall area to meet the demand for 15 full-size electronic components 13? However, this is the opposite of the current design and manufacturing of electrical products that are light, thin and short. The main object of the present invention is to provide a "printed circuit board manufacturing method with a high electronic component loading rate", which is a first plating process on the through holes on the printed circuit board and the upper and lower surfaces thereof, and uses a medium After filling and closing the 20 through-holes, the first electroplating process is performed on the electro-forged layer and the medium of the first electro-forging process, and after applying optical etching processes such as photo exposure and etching solution etching, An electrical circuit is formed on the upper and lower panels and the through hole, so that the electronic component can be directly mounted on the electrical circuit above the through hole, which is completely independent of the position of the through hole, and effectively increases the unit area of electricity on the printed circuit board- ----- I — (Please read the precautions on the back before filling this page) Order Φ This paper size is applicable to China National Standard (CNS) M specifications (210X: 297 mm) 83 · 3.! 0, 〇〇 〇511424 A7 Printed by the Consumer Cooperatives of the Central Bureau of Standards of the Ministry of Economic Affairs 5. Description of the invention (2) The number and density of sub-components are completely improved. In addition to the previous problems of electronic components, it was necessary to find the positions between the through holes of printed circuit boards. Also Equipped with the same number and functions of electronic components in a small area, it is indeed suitable for today's demand for small, lightweight, and high-performance electronic equipment. 5 Another object of the present invention is to provide a "printed circuit board manufacturing method with high electronic component loading rate", which can effectively shorten the printed circuit board manufacturing method of the distance between electronic components, so as to improve the transmission rate, quality, and reduce noise and Multiple benefits such as noise. Description of the drawings: 10 The first picture: a perspective view of a current printed circuit board. The second picture: It is a schematic diagram of electronic components mounted between through holes of a printed circuit board at present. It is one of the steps of the manufacturing method of the present invention. It is the second schematic diagram of the steps of the method of the present invention. It is the third schematic diagram of the steps of the method of the present invention. It is the fourth schematic diagram of the steps of the method of the present invention. It is the fifth schematic diagram of the steps of the manufacturing method of the present invention. It is a schematic diagram of electronic components mounted on a printed circuit board made by the present invention. Explanation of 20 drawing numbers: 10, 20-printed circuit board 12, 26’-electrical circuit 22-upper panel 24, 26 = plating layer 15 second drawing fourth drawing fifth drawing sixth drawing seventh drawing
(請先閱讀背面之注意事項再填寫本頁) #v Λ N 11、21-通孔 13、27-電子部品 23-下面板 25-介質 本紙張尺度適用中國國家標準（CNS ) A4規格（210X297公釐） 83.3· 10,000 511424 A7 B7 五、發明説明（3 ) 經濟部中央標準局員工消費合作社印製 如第二圖至第七圖所示，本發明「高電子部品搭载率 之印刷電路板製法」之步驟為： (1)·如第三圖所示，於_印刷電路板2〇適當位置上穿 設有複數個通孔21 ; 5 (2)·如第四圖所示，於該通孔21之孔緣及上下面板 22、23上施以第—次電鍍處理，且令該印刷電路板2〇之通 孔21之孔緣及上、下面板22與23上形成一電鍍層％ ; (3)·如第五圖所示，填充一介質25如油墨等於該通孔 21中，並封閉該通孔21後，以14〇t的溫度加熱乾燥3〇分 10鐘，再研磨削平凸伸出該通孔21的介質25 ; ⑷·如第六圖所示，行第二次電鍍處理於該第-電鍍 處理之電鍍層24上，並於該第-次電鍵處理之電鍍層24上 形成另一電鍍層26 ;及 （5).如第七圖所示，於該第二次電鈹處理之電鍍層％ 15行塗佈感光膜、照像曝光及蝕刻液腐蝕等光學蝕刻製程 後，在該印刷電路板2〇上、下面板22及23上形成所需的電 氣迴路26’，此即完成本發明「高電子部品搭载率之印刷 電路板」之製法者。 由上述得知，該印刷電路20之通孔21在被該介質25填 20充封閉後，即予加熱乾燥處理，使該介質25本身具有一定 的強度後，再施以步騾(4)之第二次電鍍處理時，該電鍍層 26方能直接電鍍附著於該介質25上，而無坍塌變形之虞， 使電子部品27能直接搭載於該通孔21上方的電氣迴路26， 上(如第八圖所示），所以本發明所製成的印刷電路板2〇在 -5- 本紙張尺度適用中國國家標準（CNS )八4祕（21〇χ297公後） 83. 3. !0,〇〇〇 (請先閲讀背面之注意事項再填寫本頁) ，裝- 511424 A7 B7 五、發明説明（4 ) ^ ^子邮27時，根林受通孔21健及數量的限 難計算，本侧所製成_刷電路板㈤ 子部品27的數量及密度，確實較目前之印刷電路 板向出百分之三十以上，且又因搭載電子部品π的密度 5增加’使電子部品27間的間距縮短，因而能增加電氣働 的速度，且同時能降低雜音與雜頻的產生，進而提昇電氣 的傳輸品質；再者，若搭餘目及功能相同的電子部品 27，本發明所需的面積係可較目前印刷電路板1〇為小，而 此一功效實符合現今小型、輕量化及高機能等電子設備的 1〇產業需求者。 (請先閲讀背面之注意事項再填寫本頁) 經濟部中央標準局貝工消費合作社印製 -6- 本紙張尺度適用中國國家標準（CNS ) A4規格（21〇Χ297公釐） 83. 3. !〇,〇〇〇(Please read the precautions on the back before filling this page) #v Λ N 11, 21-through hole 13, 27-electronic parts 23-lower panel 25-media This paper size applies to Chinese National Standard (CNS) A4 specifications (210X297 (Mm) 83.3 · 10,000 511424 A7 B7 V. Description of the invention (3) Printed by the Consumer Cooperatives of the Central Bureau of Standards of the Ministry of Economic Affairs As shown in the second to seventh figures, the present invention "the printed circuit board manufacturing method with a high electronic component loading rate" The steps are as follows: (1) · As shown in the third figure, a plurality of through holes 21 are provided at appropriate positions on the printed circuit board 20; 5 (2) · As shown in the fourth figure, The hole edge of the hole 21 and the upper and lower panels 22 and 23 are subjected to the first plating treatment, and the hole edge of the through hole 21 of the printed circuit board 20 and the upper and lower panels 22 and 23 form a plating layer%; (3) · As shown in the fifth figure, a medium 25 such as ink is filled in the through hole 21, and the through hole 21 is closed, and then heated and dried at a temperature of 14t for 30 minutes and 10 minutes, and then ground and flattened. The medium 25 protruding from the through hole 21; ⑷ · As shown in the sixth figure, a second plating process is performed on the plating layer 24 of the first-plating process And forming another electroplated layer 26 on the electroplated layer 24 of the first electrical key treatment; and (5). As shown in FIG. After optical etching processes such as film, photo exposure, and etching solution etching, the required electrical circuits 26 'are formed on the printed circuit board 20 upper and lower panels 22 and 23, thereby completing the present invention "high electronic component loading rate" "Printed circuit boards". It is known from the above that after the through hole 21 of the printed circuit 20 is filled and closed by the medium 25, it is preheated and dried, so that the medium 25 itself has a certain strength, and then the step (4) is applied. During the second plating process, the plating layer 26 can be directly plated and adhered to the medium 25 without the risk of collapse and deformation, so that the electronic component 27 can be directly mounted on the electrical circuit 26 above the through hole 21 (such as (Shown in the eighth figure), so the printed circuit board 20 manufactured by the present invention is -5- this paper size applies to the Chinese National Standard (CNS) Eighty-fourth secret (21〇χ297 after) 83. 3.! 0, 〇〇〇 (Please read the notes on the back before filling out this page), loading-511424 A7 B7 V. Description of the invention (4) ^ ^ When the sub-post is 27, it is difficult to calculate the number of holes and the number of holes in the root. The number and density of _ brush circuit board ㈤ sub-component 27 made on this side are indeed more than 30% higher than the current printed circuit board, and because the density 5 of the electronic component π is increased, the electronic component 27 is increased. The distance between them is shortened, which can increase the speed of electrical chirp, and at the same time reduce the production of noise and frequency. And further improve the transmission quality of electrics; furthermore, if the electronic parts 27 with the same function and the same function are used, the area required by the present invention can be smaller than the current printed circuit board 10, and this effect is actually in line with the current small, 10 industrial demanders of electronic equipment such as lightweight and high performance. (Please read the notes on the back before filling out this page) Printed by the Sheller Consumer Cooperative of the Central Bureau of Standards of the Ministry of Economic Affairs -6- This paper size applies to the Chinese National Standard (CNS) A4 specification (21 × 297 mm) 83. 3. ! 〇, 〇〇〇