TW507336B - Method of securing solder balls and any components fixed to one and the same side of a substrate, semiconductor component, and molding tool - Google Patents

Method of securing solder balls and any components fixed to one and the same side of a substrate, semiconductor component, and molding tool Download PDF

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Publication number
TW507336B
TW507336B TW089116626A TW89116626A TW507336B TW 507336 B TW507336 B TW 507336B TW 089116626 A TW089116626 A TW 089116626A TW 89116626 A TW89116626 A TW 89116626A TW 507336 B TW507336 B TW 507336B
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TW
Taiwan
Prior art keywords
mold
solder balls
substrate
solder
solder ball
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Application number
TW089116626A
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English (en)
Inventor
Lars-Anders Olofsson
Ivan Jonas
Original Assignee
Ericsson Telefon Ab L M
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Publication of TW507336B publication Critical patent/TW507336B/zh

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3457—Solder materials or compositions; Methods of application thereof
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • H01L21/565—Moulds
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
    • H05K2203/0278—Flat pressure, e.g. for connecting terminals with anisotropic conductive adhesive
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/13—Moulding and encapsulation; Deposition techniques; Protective layers
    • H05K2203/1305—Moulding and encapsulation
    • H05K2203/1316—Moulded encapsulation of mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/284—Applying non-metallic protective coatings for encapsulating mounted components

Description

A7 B7 1 五、發明説明（ 技術領域 本發明係有關於確保焊錫球及任何不連續元件固定到一 側及同側基材。 發明背景 實作中，球格陣列（ball grid array , BGA)模組上的焊錫 球及:在阳片級封裝（chip scaie packages，CSPs)中模子及 基材之烊錫均暴露於熱機械應力（therm〇mechanical stress)中。所有與焊錫球或焊錫點同側之不連續元件亦 Π此外這些不連續元件亦暴露於濕氣、污·染物、腐|虫 f生物貝（aggressive substances)、擠壓、撞擊等··· 中。 例π藉焊接焊錫球於基材之接合墊，使一球格陣列模組 固定於基材上之後，所知為以一未填滿物質填充於球格陣 列模組與基材間之縫隙，俾防護球格陣列模組中之焊錫球 及所有與焊錫球同側之不連續元件。 除了以未填滿物質填充於缝隙時，費時的因素外，此類 未填滿物質因可改變元件週遭之介電常數（dieiectde constant)，繼而影響球格陣列模組上不連續元件之· 性。 i 發明概要 本發明係為引進對焊錫球及所有固定於與焊錫球同侧之 基材上之不連續元件之防護，同時改善焊錫球之可焊接性 及與熱機械應力有關之可靠性。 藉由以一模具成形化合物層覆蓋不連續元件及壓平焊錫 -4- 張尺度適用中國a家標準(CNS) A4規格(210; 297公釐） ⑴6
求並以該模具成形化合物環繞 以此方式，可得一機械上較 焊接性。 可達上述目標。 穩定單元，並同時改善其可 圖示簡述 卜列對本發明之詳述部份， 為依本發明之轉換式模具於 :圖’其中圖1所开 球格陣列模组具體實施例之；::置二'經轉換式模具々 式模具於閉合位置，圖3為依二圖2所示為圖1之轉接 實施例透視圖。 發月《球格陣列模組具體 元件符號說明 7 可移動部件 8 凹洞 9 縫隙 10 熱固性化合物層 11 熱固性化合物層 1 基材 1 基材 2 不連續元件 3 焊錫球 4，5 焊接點 6 固定部件 發明描述 圖1為含基材丄在内之球格陣㈣組橫仙，所示僅具一 不連續元件2及兩個焊錫球3，|分藉焊接點枝5固定於 基材1 〇 一般已知固定於基材1之不連續元件2與沿基材丨的四邊 之焊錫球3均有數個。然而，已知本發明亦適用於僅具焊 錫球，而不具固定於基材上之不連績元件的情況。 焊錫球3的直徑大於不連續元件2之高度。 507336 五、發明説明（3 、^中，基材i與元件2及焊錫豹位於依本發明之 =轉換式模具之具體實施例中，包含_位於下方之固 7與-位於上方用以向固定部件6下恩之可移動部件 應可瞭解者為下方部件亦可為 可為固定式。動式而上万邵件亦 一於圖1之具體實施例中，基材丨位於固定部件6之上，盥 元件2及焊錫球3向上面向可移動部件7。 "、 依本發听，轉換式模具之可移動部件7面向元件2及 球3的側邊’對應所有料錫球3均具平底凹洞8，每 洞8可為截頭圓錐形。 當模具受壓縮時’亦即’可移動部件7壓向靜止部件6 時，所有焊錫球3均可納於相應之凹洞8。經可移動部件7 (壓縮力’焊料3頂端填人相應之凹洞8並具以成型，焊 錫球3頂端因而遭凹洞8之平底壓平。烊錫球 ^ 此獲得改善。 τ妖I·王猎 '已知用以納入焊錫球之平底凹洞位於模具的下方之效果 亦佳。 圖2所示為轉換式模具之可移動部件7完全壓合於固定部 件6。由圖2顯而易見，焊錫球3頂端填充於相應之凹洞 8 ,並被壓平。 在轉換式模具之固定部件6與可移動部件7間形成縫隙 9。縫隙9延伸於焊錫球3週邊。 依據本創作，將一轉換式模具成形化合物，亦一瓿 -6 本紙張尺度適用中國國家標準(CNS) A4規格(210X297公釐） 裝 訂 線 507336 A7 B7 五、發明説明（4 ) 固性化合物（thermosetting compound)充入轉換式模 具之固定部件6與可移動部件7間之缝隙9中。化合物填充 於缝隙9中，形成一覆蓋於元件2並環繞焊鍚球3之層。 熱固性化合物層可增強基材1與元件2及焊錫球3之抗熱 機械應力能力。熱固性化合物層亦可使基材1與元件2及焊 錫球3更為堅固。被壓平的焊錫球3可大幅改善球格陣列模 組之焊錫球3與接合墊如印刷電路板之可焊接性。 可以使用熱塑性化合物之射出模造替代使用熱固性化合 物之轉換式模具。 已知模造熱固性或熱塑性化合物層之高度不需均勾分布 於轉換式模具之固定部件6與可移動部件7間之縫隙9中。 轉換式模具之可移動部件7可設計成，環繞焊錫球3之熱固 性化合物層較覆蓋元件2之熱固性化合物層為低。焊錫球 在與熱機械應力有關的特性上因而可獲致更大的改善。 圖3 4此球格陣列模組之具體實施例透視圖。沿基材j， 週邊配置了一些圓錐形焊錫球3,。如有未圖示之元件，均 覆蓋予熱固性化合物層丨〇，環繞於焊錫球3，之熱固性化 合物層1 1較層1 〇為低。 由上文可清楚地瞭解到，依本發明之半導體元件或模組 可承受較大的熱機械應力，且為所知類似元件中最堅固 的。同時，亦可改善元件或模組之可焊接性。 -7- 本紙汝尺度適用中國國家標準(CNS) Α4Λ格(21G X 297公釐)— --— -— -----—
裝 訂
k

Claims (1)

  1. 507336 ABCD 六、申請專利範圍 1 · 一種確保焊錫球及任何元件固定到一側及同侧基材之方 法’如具任何元件，其高度均較焊鍚球之直徑為小，其 特徵在於 -放置基材於一可壓縮的模具内，該模具具有平底凹洞 可分別納入所有焊錫球之頂端， -壓縮模具以使納於該凹洞之焊錫球頂端形成一平頂， 以及 -將一模具成形化合物充入模具内，以模造該化合物， 使其覆盍所有元件並環繞於每一焊錫球之至少一部份。 2.如申請專利範圍第丨項之方法，其特徵在於將焊錫球形 成截頭圓錐形。 3 · —種半導體元件，包含不連續元件（2)及固定到一側及 同侧半導體元件的焊錫球（3)，其特徵在於焊錫球（3)具 平頂，以及模具成形化合物（10，u)係覆蓋於不連續^ 件（2 )並環繞於焊錫球（3 )。 4·如申請專利範圍第3項之元件，其特徵在於焊錫球㈠）係 形成截頭圓錐（3，）。 5·如申請專利範圍第3或第4項之元件，其特徵在於環绩於 坪錫球(3，）之模具成形化合物（11)較所有覆蓋不連續=件 (2)之模具成形化合物（10)為低。 6. —種包含被壓合之兩部件（6，7)以模造—模塑化合物之 模具，該模塑化合物係成形於具有不連續元件（&與= 錫球（3 )之基材的一侧及同侧，不連續 ，”卞 貝几仟（2 ) <高度小 於焊錫球⑴的直徑’其特徵在於部件(6)係調整為可納 -8-
    A8 B8 C8
TW089116626A 2000-08-08 2000-08-17 Method of securing solder balls and any components fixed to one and the same side of a substrate, semiconductor component, and molding tool TW507336B (en)

Applications Claiming Priority (1)

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SE0002850A SE517086C2 (sv) 2000-08-08 2000-08-08 Förfarande för säkring av lodkulor och eventuella komponenter, vilka är fästa på en och samma sida av ett substrat

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US (1) US20020024137A1 (zh)
EP (1) EP1320881B1 (zh)
AT (1) ATE452423T1 (zh)
AU (1) AU2001280371A1 (zh)
DE (1) DE60140812D1 (zh)
SE (1) SE517086C2 (zh)
TW (1) TW507336B (zh)
WO (1) WO2002013256A1 (zh)

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SE0002850L (sv) 2002-02-09
AU2001280371A1 (en) 2002-02-18
EP1320881B1 (en) 2009-12-16
WO2002013256A1 (en) 2002-02-14
EP1320881A1 (en) 2003-06-25
DE60140812D1 (de) 2010-01-28
ATE452423T1 (de) 2010-01-15
SE0002850D0 (sv) 2000-08-08
SE517086C2 (sv) 2002-04-09
US20020024137A1 (en) 2002-02-28

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