AU2001280371A1 - Method of securing solder balls and any components fixed to one and the same side of a substrate - Google Patents

Method of securing solder balls and any components fixed to one and the same side of a substrate

Info

Publication number
AU2001280371A1
AU2001280371A1 AU2001280371A AU8037101A AU2001280371A1 AU 2001280371 A1 AU2001280371 A1 AU 2001280371A1 AU 2001280371 A AU2001280371 A AU 2001280371A AU 8037101 A AU8037101 A AU 8037101A AU 2001280371 A1 AU2001280371 A1 AU 2001280371A1
Authority
AU
Australia
Prior art keywords
solder balls
substrate
same side
components
components fixed
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU2001280371A
Inventor
Ivan Jonas
Lars-Anders Olofsson
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Telefonaktiebolaget LM Ericsson AB
Original Assignee
Telefonaktiebolaget LM Ericsson AB
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Telefonaktiebolaget LM Ericsson AB filed Critical Telefonaktiebolaget LM Ericsson AB
Publication of AU2001280371A1 publication Critical patent/AU2001280371A1/en
Abandoned legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3457—Solder materials or compositions; Methods of application thereof
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • H01L21/565—Moulds
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
    • H05K2203/0278—Flat pressure, e.g. for connecting terminals with anisotropic conductive adhesive
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/13—Moulding and encapsulation; Deposition techniques; Protective layers
    • H05K2203/1305—Moulding and encapsulation
    • H05K2203/1316—Moulded encapsulation of mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/284—Applying non-metallic protective coatings for encapsulating mounted components

Abstract

To transfer mold a transfer molding compound on a substrate having discrete components (2) and solder balls (3) on one and the same side, the discrete components (2) having a height that is less than the diameter of the solder balls (3), the substrate is placed on one part (6) of an transfer molding tool with the components (2) and the solder balls (3) facing the other part (7). When the parts (6, 7) of the transfer molding tool are pressed together, that other part (7) is adapted to receive the components (2) and the solder balls (3) and comprises flat-bottomed cavities (8) for individually receiving a top portion of each solder ball (3) and for flattening the top portion of each solder ball (3).
AU2001280371A 2000-08-08 2001-08-07 Method of securing solder balls and any components fixed to one and the same side of a substrate Abandoned AU2001280371A1 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
SE0002850 2000-08-08
SE0002850A SE517086C2 (en) 2000-08-08 2000-08-08 Method for securing solder beads and any components attached to one and the same side of a substrate
PCT/SE2001/001718 WO2002013256A1 (en) 2000-08-08 2001-08-07 Method of securing solder balls and any components fixed to one and the same side of a substrate

Publications (1)

Publication Number Publication Date
AU2001280371A1 true AU2001280371A1 (en) 2002-02-18

Family

ID=20280647

Family Applications (1)

Application Number Title Priority Date Filing Date
AU2001280371A Abandoned AU2001280371A1 (en) 2000-08-08 2001-08-07 Method of securing solder balls and any components fixed to one and the same side of a substrate

Country Status (8)

Country Link
US (1) US20020024137A1 (en)
EP (1) EP1320881B1 (en)
AT (1) ATE452423T1 (en)
AU (1) AU2001280371A1 (en)
DE (1) DE60140812D1 (en)
SE (1) SE517086C2 (en)
TW (1) TW507336B (en)
WO (1) WO2002013256A1 (en)

Families Citing this family (56)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE10250621B4 (en) 2002-10-30 2004-09-02 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. A method of producing encapsulated chips and generating a stack of the encapsulated chips
DE10259835B4 (en) * 2002-12-19 2005-02-03 Siemens Ag Device and method for transporting a component
KR101313391B1 (en) 2004-11-03 2013-10-01 테세라, 인코포레이티드 Stacked packaging improvements
US7582951B2 (en) 2005-10-20 2009-09-01 Broadcom Corporation Methods and apparatus for improved thermal performance and electromagnetic interference (EMI) shielding in leadframe integrated circuit (IC) packages
US8058101B2 (en) * 2005-12-23 2011-11-15 Tessera, Inc. Microelectronic packages and methods therefor
US7714453B2 (en) * 2006-05-12 2010-05-11 Broadcom Corporation Interconnect structure and formation for package stacking of molded plastic area array package
US7808087B2 (en) * 2006-06-01 2010-10-05 Broadcom Corporation Leadframe IC packages having top and bottom integrated heat spreaders
US8581381B2 (en) 2006-06-20 2013-11-12 Broadcom Corporation Integrated circuit (IC) package stacking and IC packages formed by same
US8183687B2 (en) * 2007-02-16 2012-05-22 Broadcom Corporation Interposer for die stacking in semiconductor packages and the method of making the same
US7872335B2 (en) * 2007-06-08 2011-01-18 Broadcom Corporation Lead frame-BGA package with enhanced thermal performance and I/O counts
US8258019B2 (en) * 2008-06-30 2012-09-04 Intel Corporation Flip chip assembly process for ultra thin substrate and package on package assembly
US8482111B2 (en) 2010-07-19 2013-07-09 Tessera, Inc. Stackable molded microelectronic packages
US9159708B2 (en) 2010-07-19 2015-10-13 Tessera, Inc. Stackable molded microelectronic packages with area array unit connectors
KR101075241B1 (en) 2010-11-15 2011-11-01 테세라, 인코포레이티드 Microelectronic package with terminals on dielectric mass
US20120146206A1 (en) 2010-12-13 2012-06-14 Tessera Research Llc Pin attachment
KR101128063B1 (en) 2011-05-03 2012-04-23 테세라, 인코포레이티드 Package-on-package assembly with wire bonds to encapsulation surface
US8618659B2 (en) 2011-05-03 2013-12-31 Tessera, Inc. Package-on-package assembly with wire bonds to encapsulation surface
US9105483B2 (en) 2011-10-17 2015-08-11 Invensas Corporation Package-on-package assembly with wire bond vias
US8946757B2 (en) 2012-02-17 2015-02-03 Invensas Corporation Heat spreading substrate with embedded interconnects
US8372741B1 (en) 2012-02-24 2013-02-12 Invensas Corporation Method for package-on-package assembly with wire bonds to encapsulation surface
US9349706B2 (en) 2012-02-24 2016-05-24 Invensas Corporation Method for package-on-package assembly with wire bonds to encapsulation surface
US8835228B2 (en) 2012-05-22 2014-09-16 Invensas Corporation Substrate-less stackable package with wire-bond interconnect
US9391008B2 (en) 2012-07-31 2016-07-12 Invensas Corporation Reconstituted wafer-level package DRAM
US9502390B2 (en) 2012-08-03 2016-11-22 Invensas Corporation BVA interposer
US8975738B2 (en) 2012-11-12 2015-03-10 Invensas Corporation Structure for microelectronic packaging with terminals on dielectric mass
US8878353B2 (en) 2012-12-20 2014-11-04 Invensas Corporation Structure for microelectronic packaging with bond elements to encapsulation surface
US9136254B2 (en) 2013-02-01 2015-09-15 Invensas Corporation Microelectronic package having wire bond vias and stiffening layer
US9034696B2 (en) 2013-07-15 2015-05-19 Invensas Corporation Microelectronic assemblies having reinforcing collars on connectors extending through encapsulation
US9023691B2 (en) 2013-07-15 2015-05-05 Invensas Corporation Microelectronic assemblies with stack terminals coupled by connectors extending through encapsulation
US8883563B1 (en) 2013-07-15 2014-11-11 Invensas Corporation Fabrication of microelectronic assemblies having stack terminals coupled by connectors extending through encapsulation
US9167710B2 (en) 2013-08-07 2015-10-20 Invensas Corporation Embedded packaging with preformed vias
US9685365B2 (en) 2013-08-08 2017-06-20 Invensas Corporation Method of forming a wire bond having a free end
US20150076714A1 (en) 2013-09-16 2015-03-19 Invensas Corporation Microelectronic element with bond elements to encapsulation surface
US9082753B2 (en) 2013-11-12 2015-07-14 Invensas Corporation Severing bond wire by kinking and twisting
US9087815B2 (en) 2013-11-12 2015-07-21 Invensas Corporation Off substrate kinking of bond wire
US9263394B2 (en) 2013-11-22 2016-02-16 Invensas Corporation Multiple bond via arrays of different wire heights on a same substrate
US9583456B2 (en) 2013-11-22 2017-02-28 Invensas Corporation Multiple bond via arrays of different wire heights on a same substrate
US9379074B2 (en) 2013-11-22 2016-06-28 Invensas Corporation Die stacks with one or more bond via arrays of wire bond wires and with one or more arrays of bump interconnects
US9583411B2 (en) 2014-01-17 2017-02-28 Invensas Corporation Fine pitch BVA using reconstituted wafer with area array accessible for testing
US9214454B2 (en) 2014-03-31 2015-12-15 Invensas Corporation Batch process fabrication of package-on-package microelectronic assemblies
US10381326B2 (en) 2014-05-28 2019-08-13 Invensas Corporation Structure and method for integrated circuits packaging with increased density
US9646917B2 (en) 2014-05-29 2017-05-09 Invensas Corporation Low CTE component with wire bond interconnects
US9412714B2 (en) 2014-05-30 2016-08-09 Invensas Corporation Wire bond support structure and microelectronic package including wire bonds therefrom
US9735084B2 (en) 2014-12-11 2017-08-15 Invensas Corporation Bond via array for thermal conductivity
US9888579B2 (en) 2015-03-05 2018-02-06 Invensas Corporation Pressing of wire bond wire tips to provide bent-over tips
US9502372B1 (en) 2015-04-30 2016-11-22 Invensas Corporation Wafer-level packaging using wire bond wires in place of a redistribution layer
US9761554B2 (en) 2015-05-07 2017-09-12 Invensas Corporation Ball bonding metal wire bond wires to metal pads
US10490528B2 (en) 2015-10-12 2019-11-26 Invensas Corporation Embedded wire bond wires
US9490222B1 (en) 2015-10-12 2016-11-08 Invensas Corporation Wire bond wires for interference shielding
US10332854B2 (en) 2015-10-23 2019-06-25 Invensas Corporation Anchoring structure of fine pitch bva
US10181457B2 (en) 2015-10-26 2019-01-15 Invensas Corporation Microelectronic package for wafer-level chip scale packaging with fan-out
US9911718B2 (en) 2015-11-17 2018-03-06 Invensas Corporation ‘RDL-First’ packaged microelectronic device for a package-on-package device
US9659848B1 (en) 2015-11-18 2017-05-23 Invensas Corporation Stiffened wires for offset BVA
US9984992B2 (en) 2015-12-30 2018-05-29 Invensas Corporation Embedded wire bond wires for vertical integration with separate surface mount and wire bond mounting surfaces
US9935075B2 (en) 2016-07-29 2018-04-03 Invensas Corporation Wire bonding method and apparatus for electromagnetic interference shielding
US10299368B2 (en) 2016-12-21 2019-05-21 Invensas Corporation Surface integrated waveguides and circuit structures therefor

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3258764B2 (en) * 1993-06-01 2002-02-18 三菱電機株式会社 Method for manufacturing resin-encapsulated semiconductor device, external lead-out electrode and method for manufacturing the same
US5895229A (en) * 1997-05-19 1999-04-20 Motorola, Inc. Microelectronic package including a polymer encapsulated die, and method for forming same
US6407461B1 (en) * 1997-06-27 2002-06-18 International Business Machines Corporation Injection molded integrated circuit chip assembly
US6038136A (en) * 1997-10-29 2000-03-14 Hestia Technologies, Inc. Chip package with molded underfill
US5984164A (en) * 1997-10-31 1999-11-16 Micron Technology, Inc. Method of using an electrically conductive elevation shaping tool

Also Published As

Publication number Publication date
SE0002850D0 (en) 2000-08-08
EP1320881A1 (en) 2003-06-25
SE517086C2 (en) 2002-04-09
ATE452423T1 (en) 2010-01-15
TW507336B (en) 2002-10-21
US20020024137A1 (en) 2002-02-28
SE0002850L (en) 2002-02-09
EP1320881B1 (en) 2009-12-16
WO2002013256A1 (en) 2002-02-14
DE60140812D1 (en) 2010-01-28

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