AU2001241425A1 - Precision electroplated solder bumps and method for manufacturing thereof - Google Patents

Precision electroplated solder bumps and method for manufacturing thereof

Info

Publication number
AU2001241425A1
AU2001241425A1 AU2001241425A AU4142501A AU2001241425A1 AU 2001241425 A1 AU2001241425 A1 AU 2001241425A1 AU 2001241425 A AU2001241425 A AU 2001241425A AU 4142501 A AU4142501 A AU 4142501A AU 2001241425 A1 AU2001241425 A1 AU 2001241425A1
Authority
AU
Australia
Prior art keywords
manufacturing
solder bumps
electroplated solder
precision
precision electroplated
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU2001241425A
Inventor
Phillip H. Lawyer
Daniel Yap
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
HRL Laboratories LLC
Original Assignee
HRL Laboratories LLC
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by HRL Laboratories LLC filed Critical HRL Laboratories LLC
Publication of AU2001241425A1 publication Critical patent/AU2001241425A1/en
Abandoned legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
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    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/02—Bonding areas ; Manufacturing methods related thereto
    • H01L24/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L24/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
    • H—ELECTRICITY
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    • H01L24/10—Bump connectors ; Manufacturing methods related thereto
    • H01L24/11—Manufacturing methods
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    • H01L24/10—Bump connectors ; Manufacturing methods related thereto
    • H01L24/12—Structure, shape, material or disposition of the bump connectors prior to the connecting process
    • H01L24/13—Structure, shape, material or disposition of the bump connectors prior to the connecting process of an individual bump connector
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    • H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L2224/0401—Bonding areas specifically adapted for bump connectors, e.g. under bump metallisation [UBM]
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    • H01L2224/131—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof
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    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/14—Integrated circuits
    • H01L2924/141—Analog devices
    • H01L2924/1423—Monolithic Microwave Integrated Circuit [MMIC]
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    • H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
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    • H01L2924/19042—Component type being an inductor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3457—Solder materials or compositions; Methods of application thereof
    • H05K3/3473—Plating of solder
AU2001241425A 2000-03-09 2001-01-23 Precision electroplated solder bumps and method for manufacturing thereof Abandoned AU2001241425A1 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US09/522,803 US6387793B1 (en) 2000-03-09 2000-03-09 Method for manufacturing precision electroplated solder bumps
US09522803 2000-03-09
PCT/US2001/002100 WO2001067494A2 (en) 2000-03-09 2001-01-23 Precision electroplated solder bumps and method for manufacturing thereof

Publications (1)

Publication Number Publication Date
AU2001241425A1 true AU2001241425A1 (en) 2001-09-17

Family

ID=24082411

Family Applications (1)

Application Number Title Priority Date Filing Date
AU2001241425A Abandoned AU2001241425A1 (en) 2000-03-09 2001-01-23 Precision electroplated solder bumps and method for manufacturing thereof

Country Status (5)

Country Link
US (2) US6387793B1 (en)
EP (1) EP1266397A2 (en)
JP (1) JP2004502294A (en)
AU (1) AU2001241425A1 (en)
WO (1) WO2001067494A2 (en)

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US6828677B2 (en) 2004-12-07
US6387793B1 (en) 2002-05-14
US20020090805A1 (en) 2002-07-11
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JP2004502294A (en) 2004-01-22
WO2001067494A2 (en) 2001-09-13

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