SE0002850D0 - Method of securing solder balls and any components fixed to one and the same side of a substrate - Google Patents

Method of securing solder balls and any components fixed to one and the same side of a substrate

Info

Publication number
SE0002850D0
SE0002850D0 SE0002850A SE0002850A SE0002850D0 SE 0002850 D0 SE0002850 D0 SE 0002850D0 SE 0002850 A SE0002850 A SE 0002850A SE 0002850 A SE0002850 A SE 0002850A SE 0002850 D0 SE0002850 D0 SE 0002850D0
Authority
SE
Sweden
Prior art keywords
solder balls
substrate
same side
components
components fixed
Prior art date
Application number
SE0002850A
Other languages
English (en)
Other versions
SE517086C2 (sv
SE0002850L (sv
Inventor
Lars-Anders Olofsson
Ivan Jonas
Original Assignee
Ericsson Telefon Ab L M
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ericsson Telefon Ab L M filed Critical Ericsson Telefon Ab L M
Priority to SE0002850A priority Critical patent/SE517086C2/sv
Publication of SE0002850D0 publication Critical patent/SE0002850D0/sv
Priority to TW089116626A priority patent/TW507336B/zh
Priority to EP01958750A priority patent/EP1320881B1/en
Priority to DE60140812T priority patent/DE60140812D1/de
Priority to AT01958750T priority patent/ATE452423T1/de
Priority to AU2001280371A priority patent/AU2001280371A1/en
Priority to US09/922,921 priority patent/US20020024137A1/en
Priority to PCT/SE2001/001718 priority patent/WO2002013256A1/en
Publication of SE0002850L publication Critical patent/SE0002850L/sv
Publication of SE517086C2 publication Critical patent/SE517086C2/sv

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3457—Solder materials or compositions; Methods of application thereof
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • H01L21/565—Moulds
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
    • H05K2203/0278—Flat pressure, e.g. for connecting terminals with anisotropic conductive adhesive
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/13—Moulding and encapsulation; Deposition techniques; Protective layers
    • H05K2203/1305—Moulding and encapsulation
    • H05K2203/1316—Moulded encapsulation of mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/284—Applying non-metallic protective coatings for encapsulating mounted components

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Wire Bonding (AREA)
SE0002850A 2000-08-08 2000-08-08 Förfarande för säkring av lodkulor och eventuella komponenter, vilka är fästa på en och samma sida av ett substrat SE517086C2 (sv)

Priority Applications (8)

Application Number Priority Date Filing Date Title
SE0002850A SE517086C2 (sv) 2000-08-08 2000-08-08 Förfarande för säkring av lodkulor och eventuella komponenter, vilka är fästa på en och samma sida av ett substrat
TW089116626A TW507336B (en) 2000-08-08 2000-08-17 Method of securing solder balls and any components fixed to one and the same side of a substrate, semiconductor component, and molding tool
EP01958750A EP1320881B1 (en) 2000-08-08 2001-08-07 Method of securing solder balls and any components fixed to one and the same side of a substrate
DE60140812T DE60140812D1 (de) 2000-08-08 2001-08-07 Verfahren zum befestigen von lotkugeln und etwaigen bauelementen, die an ein und derselben seite eines substrats angebracht sind
AT01958750T ATE452423T1 (de) 2000-08-08 2001-08-07 Verfahren zum befestigen von lotkugeln und etwaigen bauelementen, die an ein und derselben seite eines substrats angebracht sind
AU2001280371A AU2001280371A1 (en) 2000-08-08 2001-08-07 Method of securing solder balls and any components fixed to one and the same side of a substrate
US09/922,921 US20020024137A1 (en) 2000-08-08 2001-08-07 Method of securing solder balls and any components fixed to one and the same side of a substrate
PCT/SE2001/001718 WO2002013256A1 (en) 2000-08-08 2001-08-07 Method of securing solder balls and any components fixed to one and the same side of a substrate

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
SE0002850A SE517086C2 (sv) 2000-08-08 2000-08-08 Förfarande för säkring av lodkulor och eventuella komponenter, vilka är fästa på en och samma sida av ett substrat

Publications (3)

Publication Number Publication Date
SE0002850D0 true SE0002850D0 (sv) 2000-08-08
SE0002850L SE0002850L (sv) 2002-02-09
SE517086C2 SE517086C2 (sv) 2002-04-09

Family

ID=20280647

Family Applications (1)

Application Number Title Priority Date Filing Date
SE0002850A SE517086C2 (sv) 2000-08-08 2000-08-08 Förfarande för säkring av lodkulor och eventuella komponenter, vilka är fästa på en och samma sida av ett substrat

Country Status (8)

Country Link
US (1) US20020024137A1 (sv)
EP (1) EP1320881B1 (sv)
AT (1) ATE452423T1 (sv)
AU (1) AU2001280371A1 (sv)
DE (1) DE60140812D1 (sv)
SE (1) SE517086C2 (sv)
TW (1) TW507336B (sv)
WO (1) WO2002013256A1 (sv)

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DE10250621B4 (de) * 2002-10-30 2004-09-02 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Verfahren zum Erzeugen verkapselter Chips und zum Erzeugen eines Stapels aus den verkapselten Chips
DE10259835B4 (de) * 2002-12-19 2005-02-03 Siemens Ag Vorrichtung und Verfahren zum Transport einer Komponente
KR101313391B1 (ko) 2004-11-03 2013-10-01 테세라, 인코포레이티드 적층형 패키징
US7582951B2 (en) * 2005-10-20 2009-09-01 Broadcom Corporation Methods and apparatus for improved thermal performance and electromagnetic interference (EMI) shielding in leadframe integrated circuit (IC) packages
US8058101B2 (en) * 2005-12-23 2011-11-15 Tessera, Inc. Microelectronic packages and methods therefor
US7714453B2 (en) * 2006-05-12 2010-05-11 Broadcom Corporation Interconnect structure and formation for package stacking of molded plastic area array package
US7808087B2 (en) * 2006-06-01 2010-10-05 Broadcom Corporation Leadframe IC packages having top and bottom integrated heat spreaders
US8581381B2 (en) 2006-06-20 2013-11-12 Broadcom Corporation Integrated circuit (IC) package stacking and IC packages formed by same
US8183687B2 (en) * 2007-02-16 2012-05-22 Broadcom Corporation Interposer for die stacking in semiconductor packages and the method of making the same
US7872335B2 (en) * 2007-06-08 2011-01-18 Broadcom Corporation Lead frame-BGA package with enhanced thermal performance and I/O counts
US8258019B2 (en) * 2008-06-30 2012-09-04 Intel Corporation Flip chip assembly process for ultra thin substrate and package on package assembly
US9159708B2 (en) 2010-07-19 2015-10-13 Tessera, Inc. Stackable molded microelectronic packages with area array unit connectors
US8482111B2 (en) 2010-07-19 2013-07-09 Tessera, Inc. Stackable molded microelectronic packages
KR101075241B1 (ko) 2010-11-15 2011-11-01 테세라, 인코포레이티드 유전체 부재에 단자를 구비하는 마이크로전자 패키지
US20120146206A1 (en) 2010-12-13 2012-06-14 Tessera Research Llc Pin attachment
US8618659B2 (en) 2011-05-03 2013-12-31 Tessera, Inc. Package-on-package assembly with wire bonds to encapsulation surface
KR101128063B1 (ko) 2011-05-03 2012-04-23 테세라, 인코포레이티드 캡슐화 층의 표면에 와이어 본드를 구비하는 패키지 적층형 어셈블리
US8404520B1 (en) 2011-10-17 2013-03-26 Invensas Corporation Package-on-package assembly with wire bond vias
US8946757B2 (en) 2012-02-17 2015-02-03 Invensas Corporation Heat spreading substrate with embedded interconnects
US9349706B2 (en) 2012-02-24 2016-05-24 Invensas Corporation Method for package-on-package assembly with wire bonds to encapsulation surface
US8372741B1 (en) 2012-02-24 2013-02-12 Invensas Corporation Method for package-on-package assembly with wire bonds to encapsulation surface
US8835228B2 (en) 2012-05-22 2014-09-16 Invensas Corporation Substrate-less stackable package with wire-bond interconnect
US9391008B2 (en) 2012-07-31 2016-07-12 Invensas Corporation Reconstituted wafer-level package DRAM
US9502390B2 (en) 2012-08-03 2016-11-22 Invensas Corporation BVA interposer
US8975738B2 (en) 2012-11-12 2015-03-10 Invensas Corporation Structure for microelectronic packaging with terminals on dielectric mass
US8878353B2 (en) 2012-12-20 2014-11-04 Invensas Corporation Structure for microelectronic packaging with bond elements to encapsulation surface
US9136254B2 (en) 2013-02-01 2015-09-15 Invensas Corporation Microelectronic package having wire bond vias and stiffening layer
US9034696B2 (en) 2013-07-15 2015-05-19 Invensas Corporation Microelectronic assemblies having reinforcing collars on connectors extending through encapsulation
US8883563B1 (en) 2013-07-15 2014-11-11 Invensas Corporation Fabrication of microelectronic assemblies having stack terminals coupled by connectors extending through encapsulation
US9023691B2 (en) 2013-07-15 2015-05-05 Invensas Corporation Microelectronic assemblies with stack terminals coupled by connectors extending through encapsulation
US9167710B2 (en) 2013-08-07 2015-10-20 Invensas Corporation Embedded packaging with preformed vias
US9685365B2 (en) 2013-08-08 2017-06-20 Invensas Corporation Method of forming a wire bond having a free end
US20150076714A1 (en) 2013-09-16 2015-03-19 Invensas Corporation Microelectronic element with bond elements to encapsulation surface
US9087815B2 (en) 2013-11-12 2015-07-21 Invensas Corporation Off substrate kinking of bond wire
US9082753B2 (en) 2013-11-12 2015-07-14 Invensas Corporation Severing bond wire by kinking and twisting
US9583456B2 (en) 2013-11-22 2017-02-28 Invensas Corporation Multiple bond via arrays of different wire heights on a same substrate
US9263394B2 (en) 2013-11-22 2016-02-16 Invensas Corporation Multiple bond via arrays of different wire heights on a same substrate
US9379074B2 (en) 2013-11-22 2016-06-28 Invensas Corporation Die stacks with one or more bond via arrays of wire bond wires and with one or more arrays of bump interconnects
US9583411B2 (en) 2014-01-17 2017-02-28 Invensas Corporation Fine pitch BVA using reconstituted wafer with area array accessible for testing
US9214454B2 (en) 2014-03-31 2015-12-15 Invensas Corporation Batch process fabrication of package-on-package microelectronic assemblies
US10381326B2 (en) 2014-05-28 2019-08-13 Invensas Corporation Structure and method for integrated circuits packaging with increased density
US9646917B2 (en) 2014-05-29 2017-05-09 Invensas Corporation Low CTE component with wire bond interconnects
US9412714B2 (en) 2014-05-30 2016-08-09 Invensas Corporation Wire bond support structure and microelectronic package including wire bonds therefrom
US9735084B2 (en) 2014-12-11 2017-08-15 Invensas Corporation Bond via array for thermal conductivity
US9888579B2 (en) 2015-03-05 2018-02-06 Invensas Corporation Pressing of wire bond wire tips to provide bent-over tips
US9502372B1 (en) 2015-04-30 2016-11-22 Invensas Corporation Wafer-level packaging using wire bond wires in place of a redistribution layer
US9761554B2 (en) 2015-05-07 2017-09-12 Invensas Corporation Ball bonding metal wire bond wires to metal pads
US10490528B2 (en) 2015-10-12 2019-11-26 Invensas Corporation Embedded wire bond wires
US9490222B1 (en) 2015-10-12 2016-11-08 Invensas Corporation Wire bond wires for interference shielding
US10332854B2 (en) 2015-10-23 2019-06-25 Invensas Corporation Anchoring structure of fine pitch bva
US10181457B2 (en) 2015-10-26 2019-01-15 Invensas Corporation Microelectronic package for wafer-level chip scale packaging with fan-out
US9911718B2 (en) 2015-11-17 2018-03-06 Invensas Corporation ‘RDL-First’ packaged microelectronic device for a package-on-package device
US9659848B1 (en) 2015-11-18 2017-05-23 Invensas Corporation Stiffened wires for offset BVA
US9984992B2 (en) 2015-12-30 2018-05-29 Invensas Corporation Embedded wire bond wires for vertical integration with separate surface mount and wire bond mounting surfaces
US9935075B2 (en) 2016-07-29 2018-04-03 Invensas Corporation Wire bonding method and apparatus for electromagnetic interference shielding
US10299368B2 (en) 2016-12-21 2019-05-21 Invensas Corporation Surface integrated waveguides and circuit structures therefor

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US6407461B1 (en) * 1997-06-27 2002-06-18 International Business Machines Corporation Injection molded integrated circuit chip assembly
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US5984164A (en) * 1997-10-31 1999-11-16 Micron Technology, Inc. Method of using an electrically conductive elevation shaping tool

Also Published As

Publication number Publication date
SE517086C2 (sv) 2002-04-09
DE60140812D1 (de) 2010-01-28
TW507336B (en) 2002-10-21
WO2002013256A1 (en) 2002-02-14
AU2001280371A1 (en) 2002-02-18
ATE452423T1 (de) 2010-01-15
US20020024137A1 (en) 2002-02-28
SE0002850L (sv) 2002-02-09
EP1320881A1 (en) 2003-06-25
EP1320881B1 (en) 2009-12-16

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