TW501209B - Connection structure body - Google Patents
Connection structure body Download PDFInfo
- Publication number
- TW501209B TW501209B TW090112611A TW90112611A TW501209B TW 501209 B TW501209 B TW 501209B TW 090112611 A TW090112611 A TW 090112611A TW 90112611 A TW90112611 A TW 90112611A TW 501209 B TW501209 B TW 501209B
- Authority
- TW
- Taiwan
- Prior art keywords
- connection structure
- conductive particles
- electrode
- coating
- coating layer
- Prior art date
Links
- 239000002245 particle Substances 0.000 claims abstract description 52
- 239000000853 adhesive Substances 0.000 claims abstract description 24
- 230000001070 adhesive effect Effects 0.000 claims abstract description 24
- 239000000758 substrate Substances 0.000 claims abstract description 21
- 239000011247 coating layer Substances 0.000 claims description 16
- 239000011248 coating agent Substances 0.000 claims description 15
- 238000000576 coating method Methods 0.000 claims description 15
- 230000035515 penetration Effects 0.000 claims description 14
- 230000002079 cooperative effect Effects 0.000 claims 1
- 239000010410 layer Substances 0.000 description 27
- 239000004973 liquid crystal related substance Substances 0.000 description 8
- 238000005336 cracking Methods 0.000 description 6
- 239000011521 glass Substances 0.000 description 6
- 239000010408 film Substances 0.000 description 5
- 239000011347 resin Substances 0.000 description 5
- 229920005989 resin Polymers 0.000 description 5
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 4
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 description 4
- 238000010586 diagram Methods 0.000 description 4
- 238000011156 evaluation Methods 0.000 description 4
- 229910052751 metal Inorganic materials 0.000 description 4
- 239000002184 metal Substances 0.000 description 4
- 238000007747 plating Methods 0.000 description 3
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 2
- 239000002313 adhesive film Substances 0.000 description 2
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 2
- 239000003822 epoxy resin Substances 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- 229910052759 nickel Inorganic materials 0.000 description 2
- 229920000647 polyepoxide Polymers 0.000 description 2
- 239000003566 sealing material Substances 0.000 description 2
- 239000007779 soft material Substances 0.000 description 2
- 239000004925 Acrylic resin Substances 0.000 description 1
- 229920000178 Acrylic resin Polymers 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- 239000004642 Polyimide Substances 0.000 description 1
- 239000006087 Silane Coupling Agent Substances 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- 229910052768 actinide Inorganic materials 0.000 description 1
- 150000001255 actinides Chemical class 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000002788 crimping Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000013013 elastic material Substances 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000004519 grease Substances 0.000 description 1
- 239000004849 latent hardener Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000002923 metal particle Substances 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 229910052704 radon Inorganic materials 0.000 description 1
- SYUHGPGVQRZVTB-UHFFFAOYSA-N radon atom Chemical compound [Rn] SYUHGPGVQRZVTB-UHFFFAOYSA-N 0.000 description 1
- 235000012239 silicon dioxide Nutrition 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 229920002803 thermoplastic polyurethane Polymers 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
- 229920006337 unsaturated polyester resin Polymers 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/36—Assembling printed circuits with other printed circuits
- H05K3/361—Assembling flexible printed circuits with other printed circuits
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/60—Attaching or detaching leads or other conductive members, to be used for carrying current to or from the device in operation
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/14—Structural association of two or more printed circuits
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/1345—Conductors connecting electrodes to cell terminals
- G02F1/13452—Conductors connecting driver circuitry and terminals of panels
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
- H05K2201/0203—Fillers and particles
- H05K2201/0206—Materials
- H05K2201/023—Hard particles, i.e. particles in conductive adhesive at least partly penetrating an electrode
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/0332—Structure of the conductor
- H05K2201/0364—Conductor shape
- H05K2201/0382—Continuously deformed conductors
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09009—Substrate related
- H05K2201/091—Locally and permanently deformed areas including dielectric material
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
- H05K3/323—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives by applying an anisotropic conductive adhesive layer over an array of pads
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
- H05K3/386—Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Physics & Mathematics (AREA)
- Power Engineering (AREA)
- Liquid Crystal (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Combinations Of Printed Boards (AREA)
- Conductive Materials (AREA)
- Wire Bonding (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
Description
501209 A7 ___B7_____ 五、發明說明(丨) 【發明所屬之技術領域】 本發明係有關於將基板上的覆塗層上形成的ITO等所 構成的電極和其他的電極端子以異向導電性接著劑來連接 之連接構造體。 如圖3所示,STN彩色液晶顯示器等的液晶面板1, 大致上係讓下基板6(於玻璃基板2上形成濾色器3,在濾 色器3上形成覆塗層4而使表面平坦化,並於覆塗層4形 成由ITO所構成的橫條紋的電極5)與上基板9(在其他的玻 璃基板7上形成由ITO所構成的縱條紋的電極8)以雙方基 板的電極5、8成格子狀的方式來重合,周圍部份以密封材 10來密封,成爲下基板6和上基板9之間保持液晶11的 構造。 此液晶面板1的電極5和輸送膠帶封裝體TCP等的電 路基板20的電極端子21以異向導電性接著劑30來連接。 一般而言,異向導電接著劑30係在絕緣性接著劑3〇 中分散導電性粒子32,對導電性粒子32而言,爲了得到 高導通可靠性,乃使用較高彈性的材料。但是,若對於覆 塗層4上的由ITO所構成的電極5使用高彈性的導電性粒 子32,電極5會產生龜裂。因此,在此情況的導電性粒子 32,係使用苯乙烯、丙烯酸等比較柔軟的材料。 【發明所欲解決之課題】 但是’對導電材料32而言’即使使用比較柔軟的材料 ,在覆塗層4的厚度爲3〜7/z m左右之較厚的情況下,根 3 ^張尺度適用中國國家標準(CNS)A4規格(210 X 297公釐) '' 〜 - I---------丨丨i -------訂----------線 (請先閱讀背面之注意事項再填寫本頁) 501209 A7 _ —-— —_B7_ 五、發明說明(V ) 據異向導電性接著劑30,一旦將覆塗層4上的電極5和電 路基板20的電極端子21加以連接時,如圖4所示,導電 性粒子32會陷入覆塗層4,覆塗層上的電極5會發生龜裂 ,而產生連接可靠性降低的問題。 本發明欲解決上述般以往技術的問題點,其目的在於 提供一種連接構造體(係將覆塗層上的電極和其他的電極端 子以異向導電性接著劑來連接);其特徵在於,即使構成異 向導電性接著劑的導電性粒子的彈性率高的情況,又,覆 塗層的厚度厚的情況時,也可以防止覆塗層上的電極產生 龜裂,使得連接可靠性增加。 【用以解決課題之手段】 本發明者們發現,將根據異向導電粒子壓入覆塗層的 量而改變之覆塗層的表面和異向導電性粒子的表面所形成 的角度加以最適當化,可防止覆塗層上電極的龜裂,而可 確保連接可靠性,從而完成了本發明。 亦即,本發明係提供一種連接構造體,係將基板上的 覆塗層上所形成的電極和其他的電極端子以絕緣性接著劑 中分散有導電性粒子之異向導電性接著劑來連接者;其特 徵在於,導電性粒子對覆塗層的深入角爲135°以上。 在此,導電性粒子對覆塗層的深入角如圖1及圖2的 角度A所示般,係在覆塗層4的表面和導電性粒子32相 交的點上,導電性粒子表面的接線和覆塗層4的表面所形 成的交角。又,在本發明中,深入角A並非連接構造體的 4 (請先閱讀背面之注意事項再填寫本頁) i丨^-----訂---------線赢 本紙張尺度適用中國國家標準(CNS)A4規格(210 X 297公釐) 501209 A7 ____B7_____ 五、發明說明(今) 由顯微鏡觀察所測得的實測値,而是在連接構造體中,導 電性粒子32被壓到覆塗層4下面的基板面2的情況,由異 向導電性粒子的粒子徑和覆塗層的厚度所求得之値。 以下,參照圖式來詳細地說明本發明。又,各圖中’ 同一符號表示同一或同等的構成要素。 本發明的連接構造體,如圖3所示,以異向導電性接 著劑30來連接STN彩色液晶顯示器的液晶面板1之玻璃 基板2上的覆塗層4上形成之由ITO所構成的電極5和 TCP的電極端子21,其特徵在於,導電性粒子32對覆塗 層4的深入角爲135°以上。 連接構造體的實際深入角A和導電性粒子32的硬度 、粒徑,覆塗層4的硬度、厚度,電極5的硬度、厚度、 壓接條件等有關,但在本發明中不考慮這些要素,而是以 導電性粒子32的粒徑和覆塗層4的層厚來作圖所求得之値 來特定。由導電性粒子32之粒徑和覆塗層4的層厚算出的 深入角未滿135°時,在覆塗層4上的電極5會產生龜裂 ,使得確保連接可靠性變得困難。深入角A以135°〜180 。爲佳。又,作圖上,深入角爲180°的情況會形成導電 性粒子32和電極5呈點接觸的狀態,但即使在這樣的場合 ,由於實際上導電性粒子32會變形而和電極5呈面接觸, 乃可得到良好的導通可靠性。 再者,深入角A在135°以上時,以導電性粒子的粒 徑爲D,覆塗層的層厚爲L的情況下,係對應於D/L=5/l 以上。 5 本紙張尺度適用中國國家標準(CNS)A4規格(210 X 297公釐) —-----------------訂---------線^^~ (請先閱讀背面之注意事項再填寫本頁) 501209 A7 ____B7 ___ 五、發明說明(午) 本發明的連接構造,除了導電性粒子對覆塗層的深入 角A爲135°以外,不特別限制形成異向導電性接著劑的 絕緣性接著劑和導電性粒子的種類、用異向導電性接著劑 所連接之基板的種類、覆塗層的形成素材等。 例如,形成異向導電性接著劑的絕緣性接著劑可爲環 氧樹脂、聚氨酯樹脂、不飽和聚酯樹脂等的熱固性或光硬 化性樹脂,導電粒子可使用焊料粒子、鎳粒子等金屬粒子 ,及在苯乙烯樹脂等樹脂核心之表面形成金屬鍍膜而形成 的樹脂核心金屬被覆粒子,及樹脂核心的周圍以熱化學附 著上二氧化矽等的無機粉體、再以金屬鍍膜被覆而形成的 複合粒子等。 再者,異向導電性接著劑的形態可爲薄膜狀或糊狀。 覆塗層可和丙烯酸系、聚醯亞胺系等眾所周知的覆塗 層相同。 和覆塗層上的電極連接的其他電極端子,不限於TCP 的電極端子,也可是1C晶片的電極端子等。 【實施例】 實驗例1 讓:在玻璃基板上由丙烯酸樹脂所構成的覆塗層以表 1的六種層厚(a)〜(f)形成,而於各自的覆塗層全面密 實形成之ITO電極(ITO膜厚18/zm),以及在TCP基板 上形成電極端子(端子厚度18/zm,係於銅上鍍敷錫所成 者)之物,以異向導電性接著薄膜來連接(連接條件:溫度 6 本紙張尺度適用中國國家標準(CNS)A4規格(210 X 297公釐) ---------------丨_丨丨—訂· —-------線 (請先閱讀背面之注意事項再填寫本頁) 501209 A7 ___B7____ 五、發明說明(() 170°C、壓力3MPa),而得到連接構造體。在此場合,使 用以下的組成作爲異向導電性接著薄膜。 異向導電性接著薄膜的組成 •潛在性硬化劑(旭· g讼司製、HX3941HP ) : 60 重量份 •雙酚A型環氧樹脂(油化·ν公司製、EP-1009): 36重量份 •環氧矽烷偶合劑(日本·Β·公司製、Α187) :1.9 重量份 •導電性粒子(以爲核、在其上依序形成鎳層及金層 者,粒徑5 /z m) : 2.1重量份 對應各覆塗層的層厚之導電性粒子的深入角如表1所 示,由各覆塗層的層厚和導電性粒子之粒徑所決定的深入 角A的示意圖如圖1所示。又,所得到的連接構造體的導 通可靠性和ITO電極的龜裂發生程度係以下述方式來評價 ,結果示於表1。從表1可得知,深入角在135°以上可確 保十分的連接可靠性。 (1)導通可靠性的評價 測定連接構造體的ITO電極5和相對的電極端子間的 電阻,依據電阻値以下述的基準來評價。 ◎ : 5Ω以下 〇:10Ω以下 △ : 20Ω以下 X :大於20Ω 7 本紙張尺度適用中國國家標準(CNS)A4規格(210 X 297公釐) --------------------^--------- (請先閱讀背面之注意事項再填寫本頁) 501209 A7 _B7 五、發明說明(b ) (2)ΙΤΟ龜裂的評價 由連接構造體來剝離TCP基板,以掃描式電子顯微鏡 觀察ITO龜裂的發生程度,以下述的基準來評價。 ◎:沒有龜裂 〇:幾乎沒有龜裂 △:有一*些龜裂 X :全面有龜裂 【表1】 深入角A粒徑 D(jum) 覆塗層之層厚 L(/zm) D/L 連接可靠性 ITO龜裂 (a)〇° 5 5 1 X X (b)90〇 5 2.5 2 X X (c)120° 5 1.7 3 X X (d)135〇 5 1.25 4 Δ Δ (e)150° 5 1 5 ◎ ◎ (f)175〇 5 0.8 6.25 ◎ ◎ 實驗例2 製作表面氧化層4的層厚定爲2/zm,讓異向導電性接 著薄膜的導電粒子32之粒徑如表2所示做(a)〜(e)之 五種變化,除此之外和實驗例1相同來製作連接構造體。 在此情況的深入角A和其示意圖係如圖2所示。又,所得 到的連接構造體的導通可靠性和ITO電極的龜裂發生程度 8 本紙張尺度適用中國國家標準(CNS)A4規格(210 X 297公釐) ------------------訂---------線 (請先閱讀背面之注意事項再填寫本頁) 501209 【圖式, 圖 圖·
A7 B7 五、發明說明(?) 與實驗例1同樣來評價,其結果示於表2。從表2得知 深入角A在135°以上時,可確保充分的連接可靠性。 【表2】 深入角A粒徑 Ό(μπι) 覆塗層之層厚 L(/m) D/L 連接可靠性 ΙΤΟ龜裂 ⑻〇〇 2 2 1 X X (b)100o 5 2 2.5 X X (c)120° 8 2 4 Δ Δ (d)135〇 10 2 5 〇 〇 (e)150° 15 2 7.5 ◎ ◎ 【發明的效果】 根據本發明,在用異向導電性接著劑來連接覆塗層上 的電極和其他電極的連接構造體中,因爲異向導電性接著 劑的導電性粒子對覆塗層的深入角大於一特定値,乃可確 保高度的連接可靠性。 .說明】 係連接構造體的深入角之示意圖。 ϊΗ系連接構造體的深入角之示意圖。 圖3所示係液晶顯示器的透明電極和TCP的連接構造 體的截面圖。 圖4所示係發生龜裂的以往的連接構造體的截面圖。 -----I----------丨訂·--------線 (請先閱讀背面之注意事項再填寫本頁) 本紙張尺度適用中國國家標準(CNS)A4規格(210 X 297公釐) 501209 A7 _B7 五、發明說明() 【符號說明】 1 液晶面板 2 玻璃基板或基板 3 濾色器 4 覆塗層 5 電極 6 下基板 7 玻璃基板 8 電極 9 上基板 10 密封材 11 液晶 20 電路基板 21 電極端子 30 異向導電性接著劑 31 絕緣性接著劑 32 導電性粒子 I-------------------訂---II---線^^ (請先閱讀背面之注意事項再填寫本頁) 本紙張尺度適用中國國家標準(CNS)A4規格(210 X 297公釐)
Claims (1)
- 501209 i C8 D8 六、申請專利範圍 1. 一種連接構造體,係將基板上的覆塗層上所形成的 電極和其他的電極端子,以絕緣性接著劑中分散有導電性 粒子之異向導電性接著劑來連接;其特徵在於,導電性粒 子對覆塗層的深入角爲135°以上。 2. 如申請專利範圍第1項之連接構造體,其中,導電 性粒子對覆塗層之深入角爲135°〜180°。 3. 如申請專利範圍第1項或第2項之連接構造體,其 中,導電性粒子的粒徑爲覆塗層層厚的5倍以上。 4. 如申請專利範圍第1項或第2項之連接構造體,其 中,覆塗層上的電極係由ΓΓΟ所構成。 5. 如申請專利範圍第3項之連接構造體,其中,覆塗 層上的電極係由ITO所構成。 (請先閱讀背面之注意事項再填寫本頁) 訂-----------線! 經濟部智慧財產局員工消費合作社印製 1 本紙張尺度適用中國國家標準(CNS)A4規格(210 X 297公釐)
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