TW499439B - Underfill encapsulants prepared from allylated amide compounds - Google Patents

Underfill encapsulants prepared from allylated amide compounds Download PDF

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Publication number
TW499439B
TW499439B TW088111216A TW88111216A TW499439B TW 499439 B TW499439 B TW 499439B TW 088111216 A TW088111216 A TW 088111216A TW 88111216 A TW88111216 A TW 88111216A TW 499439 B TW499439 B TW 499439B
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TW
Taiwan
Prior art keywords
chain
group
independently
alkyl
aryl
Prior art date
Application number
TW088111216A
Other languages
English (en)
Chinese (zh)
Inventor
Rose Ann Schultz
Donald Herr
Chaodong Xiao
Original Assignee
Nat Starch Chem Invest
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nat Starch Chem Invest filed Critical Nat Starch Chem Invest
Application granted granted Critical
Publication of TW499439B publication Critical patent/TW499439B/zh

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L101/00—Compositions of unspecified macromolecular compounds
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H01L23/293—Organic, e.g. plastic
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F290/00—Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups
    • C08F290/02—Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups on to polymers modified by introduction of unsaturated end groups
    • C08F290/06—Polymers provided for in subclass C08G
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F290/00—Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups
    • C08F290/02—Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups on to polymers modified by introduction of unsaturated end groups
    • C08F290/06—Polymers provided for in subclass C08G
    • C08F290/065—Polyamides; Polyesteramides; Polyimides
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G18/00—Polymeric products of isocyanates or isothiocyanates
    • C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
    • C08G18/28—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the compounds used containing active hydrogen
    • C08G18/2805—Compounds having only one group containing active hydrogen
    • C08G18/285—Nitrogen containing compounds
    • C08G18/2875—Monohydroxy compounds containing tertiary amino groups
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J4/00—Adhesives based on organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond ; adhesives, based on monomers of macromolecular compounds of groups C09J183/00 - C09J183/16
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
TW088111216A 1998-07-02 1999-07-01 Underfill encapsulants prepared from allylated amide compounds TW499439B (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US9150798P 1998-07-02 1998-07-02
US09/336,633 US6350840B1 (en) 1998-07-02 1999-06-18 Underfill encapsulants prepared from allylated amide compounds

Publications (1)

Publication Number Publication Date
TW499439B true TW499439B (en) 2002-08-21

Family

ID=26784028

Family Applications (1)

Application Number Title Priority Date Filing Date
TW088111216A TW499439B (en) 1998-07-02 1999-07-01 Underfill encapsulants prepared from allylated amide compounds

Country Status (7)

Country Link
US (2) US6350840B1 (US06350841-20020226-C00052.png)
EP (1) EP0969061A3 (US06350841-20020226-C00052.png)
JP (1) JP2000095828A (US06350841-20020226-C00052.png)
KR (1) KR100591976B1 (US06350841-20020226-C00052.png)
CN (1) CN1245194A (US06350841-20020226-C00052.png)
SG (1) SG85119A1 (US06350841-20020226-C00052.png)
TW (1) TW499439B (US06350841-20020226-C00052.png)

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US7166491B2 (en) * 2003-06-11 2007-01-23 Fry's Metals, Inc. Thermoplastic fluxing underfill composition and method
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US7160946B2 (en) * 2004-04-01 2007-01-09 National Starch And Chemical Investment Holding Corporation Method to improve high temperature cohesive strength with adhesive having multi-phase system
US7247683B2 (en) * 2004-08-05 2007-07-24 Fry's Metals, Inc. Low voiding no flow fluxing underfill for electronic devices
JP2013083958A (ja) * 2011-09-26 2013-05-09 Nippon Steel & Sumikin Chemical Co Ltd 感光性樹脂組成物、それを用いた硬化物及び半導体素子
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US9431274B2 (en) * 2012-12-20 2016-08-30 Intel Corporation Method for reducing underfill filler settling in integrated circuit packages
CN109735280B (zh) * 2019-01-04 2020-06-09 中国科学技术大学 紫外光响应性聚合物粘合剂及其制备方法和用途

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Also Published As

Publication number Publication date
SG85119A1 (en) 2001-12-19
EP0969061A2 (en) 2000-01-05
US6350840B1 (en) 2002-02-26
KR100591976B1 (ko) 2006-06-20
KR20000011444A (ko) 2000-02-25
CN1245194A (zh) 2000-02-23
EP0969061A3 (en) 2000-02-23
JP2000095828A (ja) 2000-04-04
US6350841B1 (en) 2002-02-26

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GD4A Issue of patent certificate for granted invention patent
MM4A Annulment or lapse of patent due to non-payment of fees