TW496806B - Laser trimming method and apparatus - Google Patents

Abstract

In a laser trimming method which laser pulses are intermittently irradiated on a resistor, a laser pulse irradiation position is moved with a constant speed relevantly to the resistor, and trimming of the resistor is performed while an electrical resistance of the resistor is measured. At this time, in the case where a difference between the final target value and the measured value during laser trimming of the electrical resistance is defined as ΔRfm, the change of the measured electrical resistance per one laser pulse irradiation is defined as ΔR, and an initial setting of the pause time is defined as T, when ΔRfm is greater than ΔR, the pause time is defined as T, and when ΔRfm is equal to or smaller than ΔR, the pause time Tend between the immediately preceding laser pulse irradiation and the next laser pulse irradiation is determined by the formula below Tend=ΔRfm/ΔR x T.

Description

496806 V. Description of the invention (1) — ^ '[Field of the Invention] The present invention relates to a laser trimming method and equipment for trimming tiny resistance wafers and the like; in particular, it relates to a method for high-speed trimming and high accuracy trimming. Laser trimming method and equipment. [Background of the Invention] Conventional methods for adjusting the resistance of a resistor such as a printed circuit in an electronic part by a laser trimming operation have been used. One of them is the method of tracking trimming. This method is to measure the resistance of the resistor or the DC voltage of the current passing through the resistor, and at the same time, irradiate the resistor with laser pulses intermittently and perform the laser of the resistor. Trim until its resistance reaches a target value. In this method, the high speed and the stability of the maneuver must be required when trimming the first stage of the maneuver. At the final stage of the trimming operation, it is required to adjust the resistance with high accuracy. Recently, in order to meet the needs for cost reduction and miniaturization of electronic components, high-speed and high-accuracy are also required in laser trimming operations. For example, the size of the chip resistor will change from 1 0 05 to 0 603. However, even if the size of the chip resistor becomes smaller, the film thickness of the resistor is still smaller than the conventional film thickness because the determined film thickness depends on the characteristics of the resistor paste. In addition, the laser trimming conditions such as the distance between the irradiation positions of adjacent laser pulses (hereinafter referred to as the size of the information packet) are basically unchanged. The size of the determined packet depends on the speed of operation and the laser. Shot pulse ", the pulse time within the shot period. Therefore, if the size of the resistor is made smaller, the resistance change rate of each block size will increase, and then change

Page 6 496806 V. Description of the invention (2)

It is more difficult to control the laser dressing operation Q with high accuracy. A conventional dressing method will be described below. Figure 丨 is a plan view showing the laser pulse irradiation position on the resistor in the laser trimming method. In the conventional laser trimming method, as shown in Figure 丨, a Xia Zhibei scanner (not shown) is used to allow the laser pulse on the resistor to irradiate the position ^ at a certain speed and move the laser relatively. Pulse time constant between pulses. As a result, the laser pulse irradiation position 52 on the resistor was set in a U-shaped linear towel at two intervals. In other words, let the information group have a large value L. Next, the resistance shifted to the laser pulse irradiation position 52 is trimmed. As for the laser trimming control groove 51 in the resistor, a complex laser pulse is irradiated. However, when the electric pulse is irradiated and the repair is stopped; Γ, the thickness of the thick film resistor formed by the screen printing is about 10 to 20 况. In addition :: 30 to 50 ... At this time, in order to improve the manipulation of the vertical groove 51 by the laser pulse trimming, the size of the information block is 2 ^ ° when the laser beam diameter is 30 ° and the laser beam is Trimming the vertical μ 5 彳 cup standing your baby & two b // m ¥, in the red. Bias; ΐ = 6 overlapping laser pulse levels will be obtained at the position. If the temperature is too high, the resistor will be damaged and its characteristics will be reduced. However, this conventional method will contain the first two problems described in the trimming action. 9-After the end of the action, the resistance error will increase. 2 Does not show the relationship between the conventional laser repair shown in Figure 1 and the resistance of Lei Yang, who is crying, and the resistance of the laser pulse irradiance meter, which is crying. 496806 3) The vertical axis is the resistance and laser intensity of the resistor. Among the three resistors R4 and R5 θ with different initial resistances, when the electric resistance is equal to the target T, the electric lines are represented by lines 41, 42 and 43:? In addition to the dressing operation, line 44 shows the laser moxibustion green used for laser dressing. The second shows the irradiation of the laser pulse. In this customary formula: the center is centered, and the size is defined as the fixed value L, and the trimming operation is terminated when the resistance measurement value is the value Rf. In this case, when the pre-triggering target of super-t is defined as ^ shown in Fig. 2 due to the laser pulse, then "second post = indicates the size of the variable. For example, Fig. 2 The resistance of the resistor ^ 43 in the middle is slightly smaller than the (n— 丨) th pulse =

Rf '"In the conventional method, it will perform the nth pulse irradiation as the first shot, so the lightning strike ..., the resistance less than [Rf + + 疋 resistance ^ R6 will increase to a slightly standard value Rf. That is to say that the resistance of the resistor R6 will exceed the speed of the mesh 2 repair. The second problem is that it is difficult to increase the speed of the operation. Time, which makes it necessary to increase = = change = advance speed 就, can not be measured with this electrical ° ° resistance 1. This will increase the η of the resistance; and then reduce the accuracy of trimming. Because of this relationship, driving The method in which the trimming speed is sufficiently reduced when trimming is performed with a high degree of accuracy, or when the trimming speed is increased, temporarily suspending the operation on page 8 496806 V. Description of the invention (4) Stop trimming operations with high accuracy Once the trimming action is missing and the X method is used to measure the s resistance, then restart the bird. M = 2 and I. Any one of the methods will reduce the operating efficiency. Method. For the problem π: description of the problem 'so use the following custom Fangdu, the first question In order to improve the accuracy of the trimming, the method of the quantity is the same as the method of reducing the size of the block and the correction number of each laser pulse. By using the error of the final resistance, k methods can reduce ⑽ and reduce it as a solution. A method of Japanese 59 (198 ^ 1711_), the first method of Japanese Laid-Open Patent Gazette > φ Tiger Reveals a method of providing a two-resistance comparison circuit in a laser trimming device. This will increase during the initial stage. T 孓 1 Shaozheng oak is selected as low speed, this :: Two.? Speed 'and switch it intermittently for compatibility. S Same speed knowing vertical efficiency and good trimming accuracy can be solved by the following methods. In the laser trimming control sample, if there is + f, there will be too small information group size. This will damage the resistor. 蛊: Count the eve of the call. For example, the reliability of the resistor is significant: the material consisting of $ 2 4 Xiao. Result It will make the electric power and the size of the information group unreasonable, and it will damage the resistance =: Vv level II, and the characteristics of the resistor will be reduced. It is disclosed in Law Bulletin No. 59 (1 984) ~ 1711 ° 3 The first one cannot be solved; Efficiency, but in extinct methods, although increased manipulation

$ 9 pages 5. Description of the invention (5) In the initial stage of the process, the speed is switched to low speed. good. In addition, when switching the XY stage or controlling the laser pulse positioning device, there can be various types. For example, in order to control the input to switch the operation until it has actually changed, it must be changed according to various conditions. The previously mentioned delay changes the operating speed. Time 0: The operation efficiency will be changed by the resistor. As for the light beam, the XY stage can also be used at any time: Because of this, the time gate is delayed and the period can be manipulated. [Invention Summary] One of the objects of the present invention is to provide one or two methods and equipment for improving the accuracy of field shooting. ; Degree without damaging the ability to perform manipulation. 'Ya Yishang is an effective laser trimming method for resistors. One irradiation position of the laser pulse on the dragon resistor is included. The three steps are: at this time, the laser is irradiated intermittently to the resistor. A trimming action for the resistor mover. The resistor is trimmed to perform a resistance of the resistor; and in accordance with the final:? The steps include measuring the electrical value and

Page 10 496806 V. Description of the invention (6) One-to-one push between the resistance measurement value of the resistor. The resistance measurement caused by ::: change; value 2 is a pause time between laser pulse irradiation. In the present invention, the laser pulse irradiation period is determined. In the present invention, the laser period is _1: μ γ 夂 # σ ㈣ The pause period is adjusted by the most ". = When this can achieve a high accuracy value, the resistance is close to the final target. In addition, in the laser trimming method, the irradiation position is moved relative to the resistor, and a laser is pulsed and pulsed. The time-of-day pause method determines the target value of the laser and the measured heart value during the trimming period = electrical: the final resistance of the device _, the difference between the m and the laser pulse is defined as △, and the pause time is initially Set the definition of the variable-if the variable is owed, the pause time Tend between the instantaneous execution and the field pulse irradiation is: from the following formula (1), ΐΐΠΐ: m due to the final laser pulse over-exposure The quasi-r inevitably produces errors ... to improve the trimming. And: Secondly, the final resistance of the resistance gain and the final target value-is temporary; i :: ΐ Compared to: 'Stomach, laser pulse irradiation period is very Short, on, / only equal to the laser pulse cycle.

V. Description of the invention (7) The better case of laser it is to use a laser exchange pulse as the "-type laser trimming equipment" which includes: a laser for intermittently oscillating laser pulses; one, :::: rr rushed-path; -measured by = to control the laser shock M f ί -resistance; an operation control device for controlling the measuring instrument; and, calculate I set, use 2 k A break time between the burst and the laser pulse irradiation time. The laser trimming device of the present invention includes: a device for intermittently generating laser pulses; and a transmission device for = Dan = Gongwuya controls a position of the processed object; a measuring instrument @ is used to measure a resistance of a resistor in a processed object; an operation control device is used to control the impact and the irradiation to determine the This laser replacement takes root and damages the laser pulse caused by the electric laser measuring instrument at the longitudinal velocity. The external pulse is decelerated and blocked by the user according to this tutorial. Oscillating device benefits, and the resistance is irradiated when the laser is irradiated. Trimming and the calculation clearly shows that there is no way to reduce the manipulation of the method In a device that calculates a variable period, a good device table can limit the efficiency caused by avoidance, and in this way, the system control device can be improved and used according to the pause time. The laser pulse is preferably one Q-cut is a digital signal processor. The pulsed radiation is adjusted without the relevant trimming accurate device due to the pulsed radiation of the operation. The transmission device calculates the final laser overshoot due to the variable of the laser pulse and the resistance. Repair will not be caused by

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degree. So, for example, when the laser is manipulated for trimming. As a result, the benefits. When maintaining the speed of tiny resistance chips and other electronic components at high speeds, for example, in the production of electronic parts, high accuracy can be achieved. [Detailed description of the preferred embodiment] A ^ will refer to the attached The drawings are used to describe one embodiment of the present invention. Figure 1. Block diagram of laser trimming equipment in the example. As shown in Fig. 3, the laser trimming device in the embodiment of "I °°" is provided with a laser light source 2 for oscillating Q switching 2 and field emission (hereinafter referred to as Qsw pulse laser 17). The laser vibration control circuit 16 for controlling the operation of the laser light source 2 by Yu Shanyu is input into the laser light source 2. In addition, on the output side of the laser light source 2, a two-t-type laser beam scanner 3 is hit. The galvanometer type of the clear #r + T-scanner 3 is used to control the QSW from the laser light source 2 Pulse laser 17 paths. AM 7 ^ ΐMotor gauge type laser beam scanner 3, along the QSf pulse laser ^ + t sequentially not: beam diffuser 4 for diffusing Qsw oscillating from laser light source 2; for Two scanning mirrors 7 reflecting the QSW pulsed laser 17 that has passed through the diffuser 4 in any direction; used to gather ::: I mirror 7 reflected from _f-β lens 8 of pulsed laser 17; ίο The QSW pulsed laser 17 which has passed through the chirped lens 8 is reflected to the processing machine 5. In addition, in the laser beam scanner 3 of the galvanometer type, there is also a pre-scanning control circuit 5 of a motor meter 6. Will then be output from the beam

Explanation of the invention (9) The signals of the scanning circuit 5 are respectively input into the galvanometer 6, and the galvanometer 6 will control the scanning mirror 7 according to this purpose. The workpiece 10 is placed on the 1 in the Xγ direction, and the stage 11 is placed on the stage. The type is carried at 10 for moving the stage 11 and the processed object 10. Then: Pass two: Connect the probe 12 for measuring the resistance to the processed object. The probe lifting mechanism 18 and the resistance measuring instrument 13in placed in the resistance measuring instrument 13 are detected by the probe 12. Transform into electronic signal; Mouth: the resistance of the object 'put this measured value; the radio pulse interval control device input value calculation and radio pulse interval control device 15 middle 2 ::, the value calculation and the lightning resistance measurement value get the electric distance ㈢ Through the differentiating process, the radio pulse is irradiated from time to time: fixed; the lightning device 1 according to the resistance change. After J, the result is output to the operation control. The operation control device 1 is controlled by the cool batch scanning control circuit 5. Two t control: mine_control㈣ mechanism 18 and measurement value calculation and lightning resistance measurement 篁 instrument 13, probe lift operation -The variable number in the second device is entered into each of these devices. The control letter output by the wave wave will now be described for the laser shown in Figure 3. On the stage η, for example, there is an electric two-piece work for drawing: ι〇. Next, the processed object 10 is fixed to the stage}. :: Adding the pieces Then connect the probe 12 to the resistor of the processed object 10. On χΥ D14. 496806

Next, the operation control device 1 is input to the probe lifting mechanism 18. Then, the probe U lifting mechanism 18 is suppressed based on the control signal, and the processed object 10 is moved to drive the platform U and the outside. The operation control device i will output a control signal to take the ideal position. Move them. Variables in device 15 and prompt operation control device 1 to output the next output signal to laser money 2

QSff pulse laser 17. Another ancient source, Tianye Xianyuan 2, oscillates the control circuit 5. The in-process device 1 will actuate the beam control signal to the current ^ The control circuit 5 will output ^ t6 to actuate them. As for the galvanometer 6, the QSW pulse laser 17 diffuser oscillated from the laser light source 2 diffuses in the beam diameter, and two scanning mirrors are edited. And: = reflects to t, and then will be reflected by t f_ 0 lens 8 is converged. Then, the collected laser beam is reflected by the mirror 9f and irradiated to the resistor 0 of the workpiece 10 and the angle of the mirror 7 and the irradiation position of the QSW pulse laser 17. In the resistor of the work 10, the resistor at the position irradiated by the QSW pulse laser 17 will evaporate. In this way, the trimming operation of the processed object 10 is completed. On the other hand, the resistance of the resistor is detected using the probe 丨 2. Then the signal measured by the debt is turned into a resistance measuring instrument 13, and the resistance measuring instrument 1513 is used to calculate the resistance of the resistor. Among them resistance measuring instrument 1 3 will

Page 15 496806 V. Description of the invention (11) The resistance of the sub-signal type is supplied to the variable in the measured value device 15. And the measurement value calculation and pulse interval control in the "# will calculate ^ 脉冲 脉冲 pulse after 1 interval control device variable. After that, according to this calculated value :; the best pause time in the resistor resistance, and the fruit will be free: the most light between the field pulse period ° Hehe out to the operation control 桊 罟 .. ^ : Control device! According to the received operation mode, the second resistor of the processed object 10, so the timing is right. Irradiation of θ-jiu-kuta field pulses-The laser trimming method of this embodiment will now be described. Figure 3 = Laser trimming used in the laser trimming method of the embodiment; and /: In the laser trimming method of the embodiment, the path of the QSW pulse laser is changed by using the beam of the galvanometer type, and usually Before the end of trimming = 2, the pause time between the manipulation speed and the laser pulse irradiation is fixed, that is, when the size of the information group is fixed, the laser pulse is shot to the resistor, and the laser trimming operation will be performed. At this time, the difference between the variable AR of each laser pulse before and after the laser pulse irradiation and the target value of the resistance and the measured value are calculated. Then, when the difference ΔMm equals f is smaller than the variable, the final laser irradiation is changed The timing of the pulse. In this case, the difference ARf ffl is obtained by subtracting the measured value from the target value, and the variable AR is obtained by subtracting the measured value before the laser pulse from the measured value after the laser pulse. The initial setting of the pause time during the time of laser pulse irradiation is defined as T ′ when the difference ARf m is equal to or less than the variable ar, and the value of ARf ^ is defined as △

Page 16 496806 V. Description of the invention (12)

Rend, and when the pause time from the immediate execution of the laser pulse irradiation to the next final laser pulse is defined as Tend, then Tend can be determined by the following public five ...敉 "彡 In this case, because the time required to calculate the variable is less than Tend, it is best to use a fast calculation device. In the laser trimming equipment shown in Figure 3, although the measurement The value calculation and the laser pulse interval control device 15 calculate the variables within the variables. It is best to have the ability to perform fast calculations on the measured value calculation and the laser pulse interval control device ^ 5 to perform the fast calculation. Digital signal processor. «The advantageous effects of this embodiment will now be described. Figure 4 is a graph showing the relationship between the timing of laser pulse irradiation and the change in resistor resistance, where time is the horizontal axis and the resistor resistance and the irradiation The laser intensity is the vertical axis. In Figure 4, R1, R2, and 0 with different initial resistance values are defined as ARendl, △ Rend, and △ RenM, and Tend is defined as Tendl, Tend2, and Tend3 In addition, the lines 21 to 23 indicate the resistance changes of the resistors R1 to R3, the lines 24 to 26 indicate the laser intensity of the resistors R1 to R3, and the pulse 27 indicates the resistors R1 to R3. As shown in FIGS. 4 and 2, in the method of this embodiment, compared with the case where the resistors R4 to R6 having different initial resistances from each other due to the conventional method are applied to the laser trimming. When laser trimming is applied to resistors R1 to R3 with different initial resistances, the final resistance change is small and can reach a value that is substantially equal to the target value. The reason will be described below. Figures 5A to Fig. 5C is a plan view showing the laser pulse irradiation positions respectively located in the resistors R1 to R3.

Page 17 496806 V. Description of the invention (13) 5 〇 中 L # means that immediately before the final laser pulse irradiation, the laser pulse irradiation is added, that is, the (η-1) th laser pulse irradiation is added. The information group on the large =, where Lendl, Lend2, and Lend3 each indicate the size of the information group between the (n -d laser pulse irradiation and the final nth laser pulse irradiation. With the laser pulse 27 ( (Refer to FIG. 4) The resistors ^ to ”can be evaporated at the irradiation positions of laser and punch 34. In this method, laser trimming control grooves 3 are formed on resistors R1 to R 3, respectively. 3 3. ^ In this embodiment, the Tend value is adjusted according to the ARend value, so as to adjust the size of the block Lendl, Lend2 and ^ nd3 + in the final laser pulse irradiation. In the stomach method, the final laser The envelope change caused by pulse irradiation 照射 AR is optimized and controlled, and the resistance after trimming is adjusted so that it is substantially equal to the target value Rf. For example, as shown in FIG. 4 and FIG. 5β, for Resistance target value (Rf) ^ = The difference between the inner value (line 22) is less than the (η-1) th pulse irradiance △ ^ In the case of the resistor R2 in the case of 11 (12, we can obtain the pause between the (n — 1) th and the nth pulse irradiation by the formula (1) at the time Ter ^ 2. 2 =, when trimming When the speed is defined as V, the relationship between the pause time τ and the size of the packet L in the month indicated by the laser pulse is as follows (2) (2) Therefore, the size of the last packet in the resistor R2 can be determined by Formula (3) while

496806 V. Description of the invention (14) 恋 Lianlian ^ wf ^ \ > ^ > ίΡ X ί > w ^ ^ oSL ^ Λ V / Λ, secret! (3)

When eight R is related to the size L of the information block, the following formula is derived: The measured coefficient of Δ 'is measured as k humility (4). Therefore, the resistance △ Rn2 caused by the final pulse irradiation can be expressed by the following formula (5) Coming. 1: Inversion of resistance «⑸ 1 In this method, the resistance caused by the final pulse irradiation is equal to the difference between the resistance yoke and the resistance of ° before the final pulse irradiation. Therefore, according to this = resistance is substantially the same as the target value. It can cause the trimmed electricity to actually increase the resistance variable ^ at this time. In this way, the following is related to the resistance change related to the above formula 2: =: interest group: small L:: 4: close to the person, according to the moving average ^, the coefficient k at the time of irradiation, and in the most estimated final thunder The resistor caused by the pulse of the pulse is improved by the final laser to improve the laser trimming accuracy. ,, "', li η, so you can enter a cow

(6) 496806 V. Description of the invention (15)

TrndmMB The method shown in this embodiment, the beam scanner 3 to change the QSW pulse laser} 7 punch fe, the shooting position 3 4 in the resistance relative to the processed product 10, for example, it is to drive χγ stage j Equation 4 is used to control the laser pulse irradiation position relative to the pause time during the trimming irradiation of the embodiment as described above to control the electricity. The final trimming speed is constant and has low efficiency. In addition, such a pause time adjustment does not occur due to mechanical operation. N = In this embodiment, the t 旒 processor is used to calculate the error in the resistor, which can be calculated as the resistance changes. Therefore, no trimming action will be performed outside the trimming accuracy according to the trimming example of the Shaiguan embodiment. In this way, the ::; method of firing pulses 鼾 gp -r ^ Γ does not require electricity ′ ,,, and radio to form a path that has a good condition and is used for movement. With the move-plus-resistor shift method, the resistor does not end up with a high resistance change due to unwanted delays in trimming. It does not increase the problem of the laser, which can adjust the laser current meter with a high precision to the final tuning. This allows the laser pulse to move in the direction of the workpiece of the invention. By adjusting the resistance of the laser pulse. This slows down the full speed and passes through the mechanical operation. Digit of nasal speed This is the case because the calculated resistance changes. Confirm the way to perform the repetitive lightning trimming operation. »

Page 20 Η · ^ Οόυ〇

A simple illustration of a laser located in a resistor Figure 1 is a plan view of the pulse irradiation position in a conventional laser trimming method. Figure 2 shows the relationship between the timing and the electrical resistance of a resistor in the conventional laser trimming method, and the electrical resistance of a resistor and the resistor ks. The resistance and laser intensity of Zhishen Liangdian 1 and Yiyi. Figure 3 is a block diagram of the present invention ~ police & rh 丨. Figure 4 shows the structure of a laser trimming device in the example. Figure 4 shows the laser trimming timing and the resistance of a resistor in the embodiment. The field pulse is time, and the vertical axis is the resistance and system of the resistor. Figures, where horizontal axis figures 5A to 5C each show the Gong L intensity in the embodiment. In the laser trimming method of the laser pulses of the devices R1 to R3, the resistance surface is shown. [Symbol description] 1 Operation control device 2 Laser light source

Galvanometer type laser beam scanning beam spreading beam scanning control circuit galvanometer scanning mirror 8 f-0 lens 9 mirror 10 work

496806 Brief description of drawings 11 Stage 12 Probe 13 Resistance measuring instrument 14 XY stage 15 Measurement value calculation and laser pulse interval control device 16 Laser oscillation control device 17 QSW pulse laser 18 Probe lifting mechanism 3 1, 3 2, 3 3, 5 1 Laser trimming control slot 34, 52 Laser pulse irradiation position

Page 22

Claims (1)

1. The scope of the patent application is for a laser trimming method for the W device, which includes the following steps: TVB = resistance =: laser pulse-relative to the irradiation position "perform" the resistor to irradiate the laser pulse, " 'Then 1 is a resistance of the resistor; and, measurement = the final target value and the electrical group of the resistor in the trimming action. The value of-change 篁' determines a pause during the laser pulse irradiation. In claim 2, please apply the laser trimming method for the resistor in the first item of the patent scope, and send the laser pulse irradiation position relative to the resistor at a constant speed. Resistance = the final target resistance value of the resistor and A difference of ^ from the amount of stiffness during the trimming period is defined as the resistance measurement variable due to a laser pulse irradiation is defined as M, and the suspension time is determined at the beginning of the time 2 = Shiyi is T During the period of J two minutes during the time of the pulse pulse irradiation; when the difference ΔRfffl is greater than the variable AR, the suspension day / ^ is defined as T; when the difference ARf ω is equal to or less than the variable AR, the interval The pause time Tend between the fixed J and the next laser pulse irradiation is given by the following formula ^ 3. The laser trimming method for the resistor of the first scope of the patent application, which, in the scope of the patent application, uses a Q-switched laser pulse as the laser pulse 4. A laser trimming equipment, including: Radio-oscillation device, used for intermittent vibrating-optical system control device, used to control the road-measuring instrument, used to measure an electrical wire of a resistor in the processing: as a control device, used for Controlling the laser oscillator, optical system control, and the measuring instrument; and, the predecessor's resistance, K:, ::: ί temporarily caused by the laser pulse irradiation ; The variable of this resistance determines the laser pulse irradiation 5. A laser trimming device comprising: two 1-pulse oscillating devices 'for intermittent shocks to emit laser pulses; position; set' for load-processed objects And control the processed object-a measuring instrument for measuring an electrical path resistance of the resistor in the processed object; an operation control device for the device and the measuring instrument; and, controlling the laser oscillation device , The transfer 496806 6 · If the laser trimming equipment in the 4th scope of the patent application is applied, the laser pulse irradiation position is shifted relative to the resistor at a double speed, with the final target resistance value of the fixed resistor and the value measured during the trimming , And the laser pulse irradiation is determined when the electrical difference value is defined as AR fm, the limit value caused by a laser pulse irradiation is defined as AR, and the pause time is initially set when the resistance is just one month. When the pause during the time period is defined as the value ΔRfm is greater than the variable AR, the pause time is defined as / · When the difference ΛΚίπι is equal to or less than the variable ar, the immediate execution is performed with the next a when the difference pulse is illuminated The pause time Tend is determined by the following formula. Second and third laser crystal planes 1¾ 7 · As the laser trimming equipment for patent application No. 4, the _ pulse is a Q-switched laser pulse. The laser Page 25