CN1193382C - Laser regulating method and the device therefor - Google Patents
Laser regulating method and the device therefor Download PDFInfo
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- CN1193382C CN1193382C CNB011161329A CN01116132A CN1193382C CN 1193382 C CN1193382 C CN 1193382C CN B011161329 A CNB011161329 A CN B011161329A CN 01116132 A CN01116132 A CN 01116132A CN 1193382 C CN1193382 C CN 1193382C
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Abstract
In a laser trimming method which laser pulses are intermittently irradiated on a resistor, and trimming of the resistor is performed while an electrical resistance of the resistor is measured. At this time, in the case where a difference between the final target value and the measured value during laser trimming of the electrical resistance is defined as [Delta]Rfm, the change of the measured electrical resistance per one laser pulse irradiation is defined as [Delta]R, and an initial setting of the pause time is defined as T, when [Delta]Rfm is greater than [Delta]R, the pause time is defined as T, and when the pause time between laser pulse irradiation is equal to or smaller than [Delta]R, the pause time Tend between the next laser pulse irradiation is determined by the formula below.
Description
Technical field
The present invention relates to a kind of laser method of adjustment and device thereof that is used to adjust fine resistors chip or like.More particularly, the present invention relates to a kind of laser method of adjustment and device thereof that is used to carry out adjustment at a high speed and high accuracy adjustment.
Background technology
In the past, there has been the multiple method of adjusting resistance (for example resistance on the printed circuit in the electronic unit) of processing by the laser adjustment.Wherein a kind of method is called as the method for adjusting of following the tracks of, in real-time measuring resistance resistance or when flowing through the dc voltage drop that electric current produced of resistance, to the pulse of resistance irradiating laser, carry out the laser adjustment of resistance in mode intermittently, till resistance arrives desired value.In this method, need obtain high-speed and stable in the phase I of adjusting processing.Need adjust resistance with high accuracy in the final stage of adjusting processing.
In recent years, along with reducing cost and the needs of electronic unit microminiaturization, also need to obtain high-speed and high accuracy in the laser adjustment processing.For example, the size of chip-resistance changes to 0603 by 1005.Yet littler even the size of chip-resistance becomes, the film thickness of resistance is compared with film thickness in the past and is remained unchanged, because film thickness is to determine according to the amount of resistance soldering paste (paste).In addition, the condition that laser is adjusted, for example, the distance (calling byte size in the following text) between the adjacent laser pulses irradiate position remains unchanged basically.Described byte size is to determine according to the time out between during process velocity and the laser pulses irradiate.Therefore, if the size of resistance is done forr a short time, the resistance varying-ratio of every byte size will increase, thereby is difficult to control laser adjustment processing with high accuracy.
Below a kind of known method of adjustment is described.Fig. 1 is a plan view, shows in this known laser method of adjustment laser pulse at ohmically irradiation position.In this known laser method of adjustment, as shown in Figure 1, laser pulse relatively moves with the fixed speed that weighs by an optical beam scanner (not shown) at ohmically irradiation position 52, and the time out between the laser pulses irradiate is certain.Consequently: laser pulse forms straight line at ohmically irradiation position, has certain interval L.Byte size is steady state value L in other words.Resistance is removed on the irradiation position 52 of laser pulse, thereby its resistance is adjusted.By the laser pulses irradiate that repeats, forming on the resistance through the groove 51 after the laser adjustment processing.After this, when the measured value such as resistance value surpasses predetermined target value, then stop laser pulses irradiate, stop adjusting.
Under resistance was situation by the formed thick-film resistor of method for printing screen, the thickness of film was approximately the 10-20 micron.In addition, the diameter of laser beam is the 30-50 micron.At this moment, in order to improve the processed state by the formed laser adjustment processing of laser pulse groove 51, byte size need be the 5-10 micron.When the laser beam diameter is 30 microns, when byte size is 5 microns, produce 6 overlapping number of times of laser pulse on the optional position of the groove 51 of process laser adjustment processing.If overlapping number of times is too much, resistance will sustain damage, thereby reduces its performance.
Yet there are following two problems in this known method.First problem is that the error of resistance can increase after adjusting termination.Fig. 2 is a curve chart, shows in known laser method of adjustment as shown in Figure 1, and the relation between laser pulses irradiate time and the resistance variable quantity, wherein resistance and laser power are as the longitudinal axis as transverse axis the time.In Fig. 2, when 3 resistance R 4 with different initial resistances, R5, when R6 accepts laser processing, the variation of resistance is respectively shown in curve 41,42,43.In addition, curve 44 has shown and has been used to carry out the laser power that laser is adjusted that curve 45 has shown laser pulses irradiate.In this known method, byte size is defined as steady state value R, when the measured value of resistance surpasses predetermined target value Rf, just stops adjusting.
Under these circumstances, as shown in Figure 2, when the variable quantity of a resistance measured value that laser pulses irradiate produced is defined as Δ R, adjust resistance after stopping in Rf variation to the scope of (Rf+ Δ R).Scope 46 shown in Figure 2 has been represented the size of this variation.For example in Fig. 2, the resistance of resistance R 6 (curve 43) is lower than desired value Rf slightly after (n-1) individual pulse irradiation.Yet in this known method, carry out n pulse irradiation, it is identical with (n-1) individual pulse irradiation, and resistance R 6 just increases to slightly less than (Rf+ Δ R) like this.In other words, the resistance of resistance R 6 has surpassed desired value Rf.
Second problem is that laser is difficult to improve process velocity.In order to improve the speed of laser high-speed processing, need to improve the laser pulse sweep speed, and the time out between shortening in the laser arteries and veins between the light period, this is that to improve process velocity necessary.Yet,, the measurement of resistance is not just caught up with the variation of resistance if improve process velocity.Like this, the measure error of resistance will increase.Will reduce the precision of adjustment like this.Owing to this reason, the known method that is adopted is: when adjusting with high accuracy, just process velocity is reduced to enough degree, perhaps under the situation that improves process velocity, just temporarily stop to adjust,, and then restart to adjust with the high-acruracy survey resistance.Yet any one in these methods all reduced operating efficiency.
In order to address the above problem, adopted following known method.At first problem recited above, solution is to reduce byte size, and reduces the adjustment amount of each laser pulse, adjusts precision to improve.Adopt this method can reduce Δ R, reduce the error of last resistance value.
As the method that solves above-mentioned second problem, disclose a kind of method, two or more resistance comparison circuits are provided in the laser adjusting device for Japanese Patent Application Publication No.59 (1984)-No. 171103.Adopt this method, improve process velocity, alternately switch to low velocity then, thereby take into account High-speed machining efficient and good machining accuracy in the starting stage of adjusting processing.
Yet these solutions have problem as described below.Reduce byte size, thereby the existing problem of method that reduces error is:, adjust at laser and will produce too many laser pulse crosspoint in the formed groove if byte size is too little.Like this, resistance and will be suffered damage by the substrate that pottery or similar material constituted consequently has a strong impact on the reliability of resistance.For example, when beam diameter is 30 microns, when byte size is 1 micron, will obtain 30 crosspoints.Like this, will damage resistance and baseplate material, reduce resistive performance.
On the other hand, in Japanese Patent Application Publication No.59 (1984)-No. 171103 disclosed method,, can not solve first problem recited above although can improve operating efficiency to a certain extent.In addition, in this method,, yet process velocity alternately need be switched to low velocity although improved process velocity in the starting stage of the course of processing.Therefore, the improvement to operating efficiency has produced certain limitation.In addition, when switching process velocity, need to move the XY platform of placing resistance, perhaps need the beam position device of a control laser pulse beam path.Described beam position device has polytype, galvanometer type or the like for example, and the XY platform also has polytype, for example by XY platform model that line motor drove or the like.Carry out the path of mechanically actuated operation in above-mentioned all the needs in any case,, after the instruction of input switching process velocity, will produce a time of delay, till reality changes process velocity owing to this reason with control beam.In addition, the length of above-mentioned time of delay changes along with various conditions.In order to improve the adjustment precision, process velocity must be set at low speed in the terminal stage of adjusting.Consider time of delay recited above and variation thereof, just need be at enough phasic change process velocities early.Therefore, can during processing at a high speed, be very restricted.
Summary of the invention
An object of the present invention is to provide a kind of laser method of adjustment and device thereof, can under the situation of not damaging resistance, improve and adjust precision, and at full speed effectively process.
The invention provides a kind of laser method of adjustment of resistance, comprise the steps: described resistance to be carried out laser pulses irradiate, when move with respect to described resistance the position of described laser pulses irradiate, described resistance is adjusted with intermittent mode; Adjustment to described resistance comprises the step of measuring described resistance; When adjusting, according to the difference between the measured value of described resistance after final goal value and the described laser pulses irradiate, and according to before the described laser pulses irradiate and the variable quantity of the resistance measured value that is produced afterwards, determine the time out between the laser pulses irradiate, wherein the irradiation position of laser pulse moves with respect to described resistance with constant speed, determine the time out between the laser pulses irradiate, difference between the resistance measurement value after laser pulses irradiate described in the final goal value of described resistance and the laser adjustment process is defined as Δ Rfm, by before the described laser pulses irradiate and the variable quantity of the resistance measurement value that is produced afterwards be defined as Δ R, the initial set value of time out is defined as under the situation of T, as difference DELTA Rfm during greater than variation delta R, time out is confirmed as described initial set value, when difference DELTA Rfm was equal to or less than variation delta R, next-door neighbour's previous laser pulses irradiate and the time out Tend between the next laser pulses irradiate can determine according to following formula:
In this way, just can eliminate the overshoot that produces by last laser pulses irradiate, and this point is inevitable in known method.So just improved the precision that laser is adjusted, made the last resistance of resistance consistent with the final goal value.Comparing with time out, be very short during the laser pulses irradiate, so time out is substantially equal to the cycle of laser pulses irradiate.
In the present invention, along with the time out of the carrying out of adjusting processing between changing during the laser pulses irradiate in the best way, and described time out is constant in known method, thereby can obtain high-precision laser adjustment, and the last resistance of resistance can be near the final objective value.
In addition, described laser pulse is preferably the Q switching laser pulse.
A kind of laser adjusting device of the present invention comprises: laser oscillation apparatus is used for producing laser pulse with the intermittent mode vibration; Optical system controller is used to control the path of described laser pulse; Measurement mechanism is used for the resistance of the resistance on the measuring workpieces; Operating control device is used to control described laser oscillation apparatus, described optical system controller, measurement mechanism; Computing unit, be used to calculate before the described laser pulses irradiate and the variable quantity of the resistance value that is produced afterwards, and according to the variable quantity of described resistance value and resistance final goal value and described laser pulses irradiate afterwards the difference between the resistance measurement value determine time out between the described laser pulses irradiate; Wherein, the irradiation position of laser pulse moves with respect to resistance with constant speed, determine the time out between the laser pulses irradiate, difference between the measured value of resistance value after the laser pulses irradiate described in the final goal value of described resistance value and the laser adjustment process is defined as Δ Rfm, by before the described laser pulses irradiate and the variable quantity of the resistance measured value that is produced afterwards be defined as Δ R, the initial set value of time out is defined as under the situation of T, as difference DELTA Rfm during greater than variation delta R, time out is confirmed as described initial set value, when difference DELTA Rfm was equal to or less than variation delta R, next-door neighbour's previous laser pulses irradiate and the time out Tend between the next laser pulses irradiate can determine according to following formula:
Another kind of laser adjusting device of the present invention comprises: laser oscillation apparatus is used for producing laser pulse with the intermittent mode vibration; Conveyer is used to load a workpiece, and controls the position of described workpiece; Measurement mechanism is used to be positioned at the resistance of the resistance on the workpiece; Operating control device is used to control described laser oscillation apparatus, conveyer, measurement mechanism; Computing unit, be used to calculate before the described laser pulses irradiate and the variable quantity of the resistance that is produced afterwards, and according to the variable quantity of described resistance and resistance final goal value and described laser pulses irradiate afterwards the difference between the resistance measurement value determine time out between the laser pulses irradiate; Wherein the irradiation position of laser pulse moves with respect to resistance with constant speed, determine the time out between the laser pulses irradiate, difference between the measured value of resistance value after the laser pulses irradiate described in the final goal value of described resistance value and the laser adjustment process is defined as Δ Rfm, by before the described laser pulses irradiate and the variable quantity of the resistance measured value that is produced afterwards be defined as Δ R, the initial set value of time out is defined as under the situation of T, as difference DELTA Rfm during greater than variation delta R, time out is confirmed as described initial set value, when difference DELTA Rfm was equal to or less than variation delta R, next-door neighbour's previous laser pulses irradiate and the time out Tend between the next laser pulses irradiate can determine according to following formula:
In addition, in described laser adjusting device, described laser pulse is preferably the Q switching laser pulse, and described computing unit is preferably digital signal processor.
According to the present invention, limited the overshoot that produces by last laser pulses irradiate, do not reduce working (machining) efficiency simultaneously because reduce process velocity, do not have owing to excessive laser radiation damages resistance yet.Like this, just can improve the adjustment precision of resistance.Therefore, in the electronic unit such as the fine resistors chip, in the high process velocity of maintenance, can obtain high-precision laser adjustment.Consequently improved the productive rate of electronic unit.
Description of drawings
Fig. 1 is a plan view, shows in known method of adjustment, and laser pulse is at an ohmically irradiation position;
Fig. 2 is a curve chart, show in known method of adjustment, the relation between laser pulses irradiate time and the resistance variable quantity, wherein with the time as transverse axis, with resistance and laser power as the longitudinal axis;
Fig. 3 is a block diagram, shows the structure according to the laser adjusting device of the embodiment of the invention;
Fig. 4 is a curve chart, show in an embodiment of the present invention, the relation between laser pulses irradiate time and the resistance variable quantity, wherein with the time as transverse axis, with resistance and laser power as the longitudinal axis;
Fig. 5 A to 5C is a plan view, shows in the laser method of adjustment of the embodiment of the invention laser pulses irradiate position on the resistance R 1 to R3 respectively.
Embodiment
Below in conjunction with accompanying drawing embodiments of the invention are described.
Fig. 3 is a block diagram, shows the structure according to the laser adjusting device of the embodiment of the invention.As shown in Figure 3, in laser adjusting device, provide a LASER Light Source 2, be used for producing vibration Q-switched pulse laser (calling QSW pulse laser 17 in the following text) according to the embodiment of the invention.In addition, the output signal that is used to control the laser generation control circuit 16 of LASER Light Source 2 is imported into LASER Light Source 2.In addition, provide the laser beam scanner 3 of a galvanometer type, be used to control path by the LASER Light Source 2 living QSW pulse laser 17 of adopting at the outlet side of LASER Light Source 2.
In the laser beam scanner 3 of galvanometer type, provide along the path of QSW pulse laser 17: optical beam expander 4 is used to expand the QSW pulse laser 17 that is produced by LASER Light Source 2; Two scanner speculums 7 are used for going up in any direction the QSW pulse laser 17 of reflection by optical beam expander 4; F-θ lens 8 are used to focus on the QSW pulse laser 17 that is reflected by two scanner speculums 7; Speculum 9 is used for the QSW pulse laser 17 by f-θ camera lens 8 is reflected in workpiece 10.In addition, in the laser beam scanner 3 of galvanometer type, provide two galvanometer 6, be used for controlling respectively the angle of two scanner speculums 7; Optical beam scanner control circuit 5 is used to control described galvanometer 6.Signal by 5 outputs of beam flying circuit is imported into 6, two galvanometer 6 of galvanometer according to these signals difference gated sweep device speculums 7.
In addition, workpiece 10 is placed on the objective table 11, and this objective table 11 is positioned on the XY platform 14, and this XY platform 14 is used for moving described objective table 11 and workpiece 10 on the XY direction.
On the other hand, the probe 12 that is used for the measuring resistance resistance is connected workpiece 10, is input to resistance measurement mechanism 13 by probe 12 signals that detected by a probe hoisting mechanism 18 that is used for regulating probe 12 positions.
The resistance of resistance measurement mechanism 13 measuring workpieces 10 is converted to the signal of telecommunication with measured value, and this signal of telecommunication is outputed to measurement variation amount calculating and laser pulse interval control device 15.Described measurement variation amount calculate and laser pulse interval control device 15 by calculating the variable quantity of acquisition resistance measurement value, the time out between determining during the laser pulses irradiate according to the variable quantity of resistance value, and the result outputed to operating control device 1.
Described operating control device 1 is used to control laser generation control circuit 16, optical beam scanner control circuit 5, XY platform 14, resistance measurement mechanism 13, probe hoisting mechanism 18, the measurement variation amount is calculated and the laser beam work of control device 15 at interval.The control signal of operating control device 1 output is imported in each of these devices.
Working method to laser adjusting device illustrated in fig. 3 describes below.Workpiece 10 (electronic unit that for example has resistance) is placed on the objective table 11.Then workpiece 10 and objective table 11 are installed on the XY platform 14.To pop one's head in again and 12 be connected on the resistance of workpiece 10.
After this, control signal of operating control device 1 output is to XY platform 14 and probe hoisting mechanism 18.According to this control signal, drive XY platform 14 and workpiece 10 is moved to an optimum position with probe hoisting mechanism 18.In addition, operating control device 1 control signal is outputed to that resistance measurement mechanism 13, measurement variation amount calculate and laser pulse interval control device 15 in each, and handle them.
Next, operating control device 1 outputs to laser generation control circuit 16 with control signal, and handles this laser generation control circuit 16.The signal of laser generation control circuit 16 outputs is imported into LASER Light Source 2, and these LASER Light Source 2 vibrations produce QSW pulse laser 17.On the other hand, operating control device 1 is handled optical beam scanner control circuit 5.Adopt this mode, optical beam scanner control circuit 5 outputs a control signal to galvanometer 6, and handles these galvanometer.The angle of galvanometer 6 gated sweep device speculums 7, and the irradiation position of control QSW pulse laser 17.
The beam diameter of the QSW pulse laser 17 that LASER Light Source 2 vibrations produce is expanded by optical beam expander 4, reflects towards predetermined direction by two scanner speculums 7 then, is focused on by f-θ lens 8 again.After this, the laser beam that is focused is reflected by speculum 9, is radiated on the workpiece 10.
In the resistance of workpiece 10, the resistance that is positioned on QSW pulse laser 17 irradiation positions is evaporated.Carry out the adjustment processing of workpiece 10 in this way.
On the other hand, by 12 resistances of coming measuring resistance of popping one's head in.Detection signal is input to resistance measurement mechanism 13, the resistance of resistance measurement mechanism 13 calculated resistance.Resistance measurement mechanism 13 is input to calculating of measurement variation amount and laser pulse interval control device 15 in the mode of the signal of telecommunication with resistance.The measurement variation amount calculate and laser pulse interval control device 15 calculated resistance resistances before laser radiation and variation afterwards.According to this calculated value, the best time out between calculating during the laser pulse outputs to result calculated operating control device 1 then.When operating control device 1 receives described result of calculation, control signal is outputed to laser generation circuit 16, the timing of the next laser pulse of control irradiation.Adopt this mode, the resistance of the resistance of workpiece 10 is reflected as the irradiation timing of laser pulse.
Laser method of adjustment to the embodiment of the invention describes below.The laser adjusting device that is adopted in laser method of adjustment embodiment of the present invention is a device shown in Figure 3.In the laser method of adjustment embodiment of the embodiment of the invention, the path of QSW pulse laser is changed by the optical beam scanner 3 of galvanometer type, and before a pulse adjusting terminal point, the time out between process velocity and the laser pulses irradiate is constant.In other words, under the constant situation of byte size, laser pulses irradiate to resistance, and is carried out laser adjustment processing.At this moment, calculate before carrying out each laser pulses irradiate and resistance change amount Δ R afterwards and the difference DELTA Rfm between desired value and the resistance measured value.When difference DELTA Rfm is equal to or less than variation delta R, then change the irradiation time of last laser pulse.In this case, difference DELTA Rfm deducts resistance measurement to be worth resulting numerical value from desired value, and variation delta R is that the resistance measurement value after the laser radiation deducts the numerical value that laser radiation resistance measurement value is before obtained.
The initial set value of the time out between during the laser pulses irradiate is defined as T, when difference DELTA Rfm is equal to or less than variation delta R, the numerical value of Δ Rfm is defined as Δ Rend, that laser pulses irradiate before last laser pulses irradiate is defined as Tend to the time out between the last laser pulses irradiate, and described Tend determines according to foregoing formula (1).
In this case, calculate the needed time of Δ R less than Tend, therefore preferably adopt quick calculation element to calculate Δ R owing to need make.In laser adjusting device as shown in Figure 3, because variation delta R calculates in calculating of measurement variation amount and laser pulse interval control device 15, therefore be preferably in calculating of measurement variation amount and the laser pulse interval control device 15 and adopt the digital signal processor that can calculate fast.
Advantage to the embodiment of the invention describes below.Fig. 4 is a curve chart, shows the relation between laser pulses irradiate time and the resistance variable quantity, wherein with the time as transverse axis, with the power of the resistance of resistance and irradiating laser as the longitudinal axis.In Fig. 4, three resistance R 1 that initial resistance is different, the Δ Rend value of R2, R3 are respectively defined as Δ Rend1, Δ Rend2, Δ Rend3, and the Tend numerical value of resistance R 1, R2, R3 is defined as Tend1, Tend2, Tend3 respectively.In addition, curve 21 to 23 is represented the resistance change amount of resistance R 1 to R3 respectively, and curve 24 to 26 is represented laser power that resistance R 1 to R3 is carried out laser radiation respectively, and pulse 27 expressions are used for laser pulse that resistance R 1 to R3 is processed.As Fig. 4 and shown in Figure 2, when the method that adopts the embodiment of the invention is carried out the laser adjustment to resistance R 1, R2, the R3 with different initial resistances, with the employing known method resistance R 4, R5, the R6 with different initial resistances being carried out the laser adjustment compares, the variation of last resistance is very little, can both obtain to equal the resistance of desired value basically.
Below its reason is described.Fig. 5 A to Fig. 5 C is a floor map, shows the irradiation position of laser pulse on resistance R 1 to R3 respectively.In Fig. 5 A to Fig. 5 C, L represents the byte size of a pulse irradiation that laser pulses irradiate before to the last, the byte size till (n-1) individual laser pulses irradiate just, Lend1, Lend2, Lend3 represent the byte size between (n-1) individual laser pulses irradiate and n the laser pulses irradiate (last laser pulses irradiate just) respectively.By laser pulse 27 (referring to Fig. 4), resistance R 1 to R3 is evaporated on laser pulses irradiate position 34.In this way, forming respectively on the resistance R 1 to R3 through the groove 31 to 33 after the laser adjustment processing.
In this embodiment, adjust the numerical value of Tend according to the numerical value of Δ Rend, thereby adjust byte size Lend1, Lend2, the Lend3 of last laser pulses irradiate.Adopt this mode, just can carry out the best adjustment to the resistance variation delta R that last laser pulses irradiate produced, the resistance after control adjustment is finished makes it to be substantially equal to desired value Rf.
For example, shown in Fig. 4 and Fig. 5 B, for resistance R 2, when the desired value Rf of resistance and the difference DELTA Rfm between the measured value (curve 22) were Δ Rend2 less than the variation delta R after (n-1) individual pulse irradiation, the time out Tend2 between (n-1) individual pulse irradiation and n the pulse irradiation was calculated according to foregoing formula (1):
At this moment, when being defined V when regulating the speed, the relation between the byte size L between during time out T and the laser pulses irradiate is represented by following formula (2):
L＝V×T (2)
Therefore, last byte size Lend2 of resistance 2 is provided by following formula (3):
When the coefficient correlation between measurement variation amount Δ R and the byte size L is defined as k, following formula (4) is arranged:
ΔR＝k×L (4)
Therefore, the change in resistance amount Δ Rn2 by the resistance R 2 that last pulse irradiation produced is provided by formula described below (5):
In this way, the change in resistance amount Δ Rn2 by the resistance 2 that last pulse irradiation produced equals the desired value Rf of resistance and the difference DELTA Rend2 between the resistance before last pulse irradiation.Therefore,, just can prevent to adjust overshoot, make the resistance after adjusting consistent with desired value basically according to the method for the embodiment of the invention.
Simultaneously, the variation delta R of actual central resistance is not constant, but increases along with the increase of adjusting distance.Like this, be exactly the function of adjusting distance according to the coefficient correlation k between determined resistance variable quantity of foregoing formula (4) and the byte size L, rather than a constant.Therefore, coefficient k in last laser pulses irradiate is in the end estimated according to the mathematics approximatioss before a laser pulses irradiate, the for example method of moving average or least square method, and the variation delta Rn of the resistance that last laser pulses irradiate produced in the end estimates before a laser pulses irradiate.In this case, provide time out Tend according to following formula (6):
In this embodiment, adopted such method, promptly change the path of QSW pulse laser 17, thereby the irradiation position of laser pulse is moved with respect to workpiece 10 by the optical beam scanner 3 of galvanometer type.Yet in the present invention, for example when driving XY platform 14, workpiece 10 is moved, thereby the irradiation position of laser pulse is moved with respect to processed resistance.
As mentioned above, in the method for adjustment of the embodiment of the invention, the last resistance of resistance is to control by the time out between regulating during the laser pulses irradiate.Therefore, it all is constant regulating the speed up to finishing, adjust the time reduce can not lower efficiency.In addition, above-mentioned adjusting to time out does not need to carry out mechanically actuated operation, thereby can not delay by generation time because of mechanically actuated operation.
In addition, in this embodiment of the invention, adopt digital processing unit to come the variation of calculated resistance resistance with high computational speed.Therefore, the problem of adjusting precision can not occur reducing, because the calculating that resistance is changed can be caught up with the variation of resistance, the error of the variation of the resistance that calculates can not increase.
In addition, according to the method for adjustment of the embodiment of the invention, can reach very high precision and adjust.Like this, adjust, just do not need to carry out repeatedly laser pulses irradiate, through forming processing groove in good condition after the laser adjustment for last resistance.
Claims (5)
1. the laser method of adjustment of a resistance comprises the steps:
With intermittent mode described resistance is carried out laser pulses irradiate, when move with respect to described resistance the position of described laser pulses irradiate, described resistance is adjusted;
Adjustment to described resistance comprises the step of measuring described resistance;
When adjusting, according to the difference between the measured value of described resistance after final goal value and the described laser pulses irradiate, and according to before the described laser pulses irradiate and the variable quantity of the resistance measured value that is produced afterwards, determine the time out between the laser pulses irradiate, wherein the irradiation position of laser pulse moves with respect to described resistance with constant speed, determine the time out between the laser pulses irradiate, difference between the resistance measurement value after laser pulses irradiate described in the final goal value of described resistance and the laser adjustment process is defined as Δ Rfm, by before the described laser pulses irradiate and the variable quantity of the resistance measurement value that is produced afterwards be defined as Δ R, the initial set value of time out is defined as under the situation of T, as difference DELTA Rfm during greater than variation delta R, time out is confirmed as described initial set value, when difference DELTA Rfm was equal to or less than variation delta R, next-door neighbour's previous laser pulses irradiate and the time out Tend between the next laser pulses irradiate can determine according to following formula:
2. method of adjustment as claimed in claim 1, wherein said laser pulse are the Q switching laser pulse.
3. laser adjusting device comprises:
Laser oscillation apparatus is used for producing laser pulse with the intermittent mode vibration;
Optical system controller is used to control the path of described laser pulse;
Measurement mechanism is used for the resistance of the resistance on the measuring workpieces;
Operating control device is used to control described laser oscillation apparatus, described optical system controller, measurement mechanism;
Computing unit, be used to calculate before the described laser pulses irradiate and the variable quantity of the resistance value that is produced afterwards, and according to the variable quantity of described resistance value and resistance final goal value and described laser pulses irradiate afterwards the difference between the resistance measurement value determine time out between the described laser pulses irradiate;
Wherein, the irradiation position of laser pulse moves with respect to resistance with constant speed, determine the time out between the laser pulses irradiate, difference between the measured value of resistance value after the laser pulses irradiate described in the final goal value of described resistance value and the laser adjustment process is defined as Δ Rfm, by before the described laser pulses irradiate and the variable quantity of the resistance measured value that is produced afterwards be defined as Δ R, the initial set value of time out is defined as under the situation of T, as difference DELTA Rfm during greater than variation delta R, time out is confirmed as described initial set value, when difference DELTA Rfm was equal to or less than variation delta R, next-door neighbour's previous laser pulses irradiate and the time out Tend between the next laser pulses irradiate can determine according to following formula:
4. laser adjusting device comprises:
Laser oscillation apparatus is used for producing laser pulse with the intermittent mode vibration;
Conveyer is used to load a workpiece, and controls the position of described workpiece;
Measurement mechanism is used to be positioned at the resistance of the resistance on the workpiece;
Operating control device is used to control described laser oscillation apparatus, conveyer, measurement mechanism;
Computing unit, be used to calculate before the described laser pulses irradiate and the variable quantity of the resistance that is produced afterwards, and determine time out between the laser pulses irradiate according to the difference between the resistance measurement value after the variable quantity of described resistance and resistance final goal value and the described laser pulses irradiate, wherein
The irradiation position of laser pulse moves with respect to resistance with constant speed, determine the time out between the laser pulses irradiate, difference between the measured value of resistance value after the laser pulses irradiate described in the final goal value of described resistance value and the laser adjustment process is defined as Δ Rfm, by before the described laser pulses irradiate and the variable quantity of the resistance measured value that is produced afterwards be defined as Δ R, the initial set value of time out is defined as under the situation of T, as difference DELTA Rfm during greater than variation delta R, time out is confirmed as described initial set value, when difference DELTA Rfm was equal to or less than variation delta R, next-door neighbour's previous laser pulses irradiate and the time out Tend between the next laser pulses irradiate can determine according to following formula:
5. as claim 3 or 4 described laser adjusting devices, wherein said laser pulse is the Q switching laser pulse.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2000141311A JP3543731B2 (en) | 2000-05-15 | 2000-05-15 | Laser trimming method and laser trimming apparatus |
| JP141311/2000 | 2000-05-15 |
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| Publication Number | Publication Date |
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| CN1324079A CN1324079A (en) | 2001-11-28 |
| CN1193382C true CN1193382C (en) | 2005-03-16 |
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| JP (1) | JP3543731B2 (en) |
| CN (1) | CN1193382C (en) |
| MY (1) | MY131491A (en) |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006013262A (en) * | 2004-06-28 | 2006-01-12 | Kyocera Corp | Heater and manufacturing method thereof, and wafer heating apparatus using it |
| JP5760322B2 (en) * | 2009-03-11 | 2015-08-05 | オムロン株式会社 | Laser processing equipment |
| JP5310452B2 (en) * | 2009-09-30 | 2013-10-09 | オムロン株式会社 | Laser processing apparatus and laser processing method |
| CN101923356A (en) * | 2010-03-16 | 2010-12-22 | 江苏和利普激光科技有限公司 | Fast and accurate locating method of laser resistance trimming substrate |
| KR101273689B1 (en) | 2011-04-26 | 2013-06-12 | 강남대학교 산학협력단 | Laser trimming method of resistance |
| KR101304389B1 (en) * | 2011-09-07 | 2013-09-11 | 주식회사 에이에스티젯텍 | Laser trimming method |
| CN104616851B (en) * | 2015-01-23 | 2017-09-29 | 洛阳冰岩激光设备有限公司 | A kind of laser resistance adjuster |
| CN107017068B (en) * | 2017-03-24 | 2018-09-11 | 深圳市杰普特光电股份有限公司 | Method and device, the laser resistor trimming system of laser resistor trimming |
| CN109903943B (en) * | 2019-04-29 | 2021-06-22 | 深圳市杰普特光电股份有限公司 | Resistance value adjusting method and device, storage medium and equipment |
| CN110070971A (en) * | 2019-05-13 | 2019-07-30 | 深圳市杰普特光电股份有限公司 | Laser resistor trimming system |
-
2000
- 2000-05-15 JP JP2000141311A patent/JP3543731B2/en not_active Expired - Lifetime
-
2001
- 2001-05-14 MY MYPI20012244A patent/MY131491A/en unknown
- 2001-05-15 TW TW090111665A patent/TW496806B/en not_active IP Right Cessation
- 2001-05-15 CN CNB011161329A patent/CN1193382C/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| TW496806B (en) | 2002-08-01 |
| CN1324079A (en) | 2001-11-28 |
| JP3543731B2 (en) | 2004-07-21 |
| MY131491A (en) | 2007-08-30 |
| JP2001326112A (en) | 2001-11-22 |
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