TW492132B - Semiconductor manufacturing apparatus with an improved wafer cassette - Google Patents

Abstract

The first present invention provides a wafer cassette mechanism comprising: a plurality of wafer tray sets, each set storing a single semiconductor wafer; a supporting mechanism for mechanically supporting the wafer tray sets which are laminated together with each other, and so that adjacent two of the wafer tray sets are in contact directly with each other, the supporting mechanism adjusting level of the laminated wafer trays; and a locking mechanism for locking selected ones of the wafer tray sets so that a target one of the wafer trays is distanced from adjacent underlying and overlying ones of the wafer tray sets.

Description

I _492132 V. Description of the invention 0) [Background of the invention J. The present invention is related to semiconductor edge processing for processing semiconductor crystal patterns, and is particularly useful as a wafer transfer unit for transferring semiconductor wafers. For 0 m yen. For ρ Wang 1 & 円 and ；; Lan Ren +1, wafer transfer 龛 1, 22, wafer lining, wafer carrier: mounting table 21-semiconductor wafer work. And one of the transfer chambers 4/31 is responsible for transferring 15, which is used to transfer semiconductor wafers between the carrier interlocking vacuum chamber 12 and the processing chamber 3g circular transfer robot arms. The load interlocking vacuum chamber is equipped with a first gate at the boundary where the processing chamber 13 and the arm 31 are in contact with each other, and a second gate valve at the boundary of the end of the round conveying machine chamber 14 respectively. ^ A schematic plan view of a conventional guide ship manufacturing facility for processing conductor wafers separately and in turn is shown in FIG. 1. In the conventional semiconductor manufacturing equipment, two include a main body 11 for processing semiconductor devices, a transport box mounting table 21 on which a wafer transport box 22 for storing semiconductor wafers is placed, and semiconductor wafers on the main body 11. A wafer transfer robot arm 31 is transferred between the wafer transfer platform and the cassette mounting table. In addition, the main body 11 further includes a two-load interlocking vacuum chamber 12 that is connected to the carousel box via a wafer transfer robot arm 31 and has a function of isolating the main body 11 from outside air, and five processing chambers that perform semiconductor device manufacturing. 13 and a single delivery chamber 14 which is adjacent to the two loading vertical lock vacuums to 12 and is separated from the conveying box mounting table 21 and is filled with a 13-phase speed, thereby allowing the processing chamber 13 to be cleaned by the two interlocking vacuum chambers 12 The conveyance chambers 14 communicate with each other. A wafer carousel 1 is provided in each of the two-load-locking vacuum chambers 12 to facilitate the loading of the inter-wafer wafer. It is located between the inner wheel of the two loading interlocking vacuum chambers 12 and the storage semiconducting boxes 1, 22 by the wafer wheel; on the benefit mounting table 21 5. Description of the invention (2) Sealing each loading interlocking directly * . … 2 The work of the processing chamber 13 and the transfer chamber 14 Next, the above-mentioned processing flow of the custom wafer is used. A “manufacturing equipment” to explain the wafer conveyance inside the wafer conveyance box 22 on the two semiconducting tables 21 placed on the conveyance box carrying conveying box placing table 21 The lock really does two: the wafers in the "Semiconductor wafer transfer chamber" will be rotated; set 15: = in the round transport box 1. Then the semiconducting X of the wafer transport box in transit will be located in the loading interlock vacuum The chamber 12 allows the semiconductor wafer to be moved to the inside / inside chamber 13 such as 7ΛθθΛ. This process is then performed by the wafer conveying robot 7-phase deposition and other processing chambers 13 of a predetermined manufacturing process: = guide = circular transfer to another After the feeding device 15 passes the inside of the carousel 14, the wafer conveying device 3 is centered on the wafer conveying box 1 in ΐ 2. Then the wafer conveying is described as "Yuanyou", ^ ί ^ ,, & lock vacuum chamber 12 In the wafer transfer box 1 in the middle, the semiconductor = box — =. = 迗 is placed in the wafer transfer box 22 on the cassette mounting table 21. Before entering the “I” process, the interlocking vacuum chamber 12 and the processing chamber will be loaded. The gate valve of 13 is closed so that the conveying chamber 14, the loading interlocking vacuum chamber 12, and the processing chamber 13 can be in separate vacuum states. After the process is completed, the addition is canceled. Load the interlock to the vacuum state of 12 to facilitate the transfer of the fully processed semiconductor wafers from the wafer transfer box 丨 in the load interlock vacuum chamber 12 to the transfer stage 21 Among the wafer transfer boxes 22. As shown in the half of FIG. 1, in the manufacturing equipment, a schematic diagram of a conventional wafer transfer box located in the load-locking vacuum chamber 12 is shown in FIG. 2A. And FIG. 2B is In Figure 2A, the ellipse V. Description of the invention (3)

A partial enlarged view of the feeding of the "A-groove of the wafer transport box" indicated by the dotted line, in which conventional semiconductor wafers are stored as the second one. ☆-Pairs in the wafer conveyance box lb The drive motor 4 can be used to have a plurality of storage grooves 9 on the tray 8. The storage groove 9 can be reached; lifting, so-to take out the predetermined height position in pairs, 'body day a circle 41 stored inside or from inside ^ ^. ..Ο „^ ^ ^ ^., U, , ^ 1 jm is lined with ". And the wafer is] t: w t t-pitch" P2 "is deliberately designed to be wide, in order to avoid = when the semiconductor wafers are transferred by 5 and 31 yen transport machinery = Certainty, which causes the semiconductor wafer 41 to collide with the wafer transfer box lb and cause machine lift and sexual damage. However, such a design must increase the size of the wafer transfer box 丨 b =, and at the same time, the loading interlocking vacuum chamber must be allowed丨 2 increases in volume. Therefore, it will take longer to reach the vacuum state and the wafer batch process. If you want to avoid the above problems to reach the wafer carousel 丨 b shrink, load the interlocking vacuum chamber 1 The reduction of the volume of 2 and the narrowing of the distance "P2" in the wafer transfer box lb for the purpose of shortening the evacuation time will make the wafer transfer robot arms 15 and 31 acceptable in positioning accuracy. The scope is also narrowing. Due to the above situation, it is necessary to develop Novel semiconductor manufacturing equipment of the improved wafer transfer cassette described above.

Summary of Numing] Therefore, one of the objectives of the improvement ^ Θ is to provide a novel semiconductor manufacturing equipment with a round conveying box that eliminates the above problems. Receptacle: One purpose is to provide a device with small size and narrow pitch. / The structure of the improved wafer transfer box is a novel semiconductor manufacturing error + another invention of the transfer box. In addition, the wafer wheel of the present invention is a storage groove. The present invention can be used to lift each other in each group so that the support machine can be used to lock the selected upper and lower adjacent ones. The purpose of subsequent description is to provide a The new first structure with the structure that eliminates the above problems is a single stack. A neighbour can structure an adjustment layer. Wafer tray. The wafer tray mentioned above is about direct. Fold the crystal group so that the group leaves the present invention. The round trays of wafers provided by the round transport are connected to each other. The round trays have a small size and a box for the purpose of one pin. The wafer transfer box mechanism includes a plurality of wafer tray groups, a support mechanism that is mechanized / touched, a height position, and a wafer tray lock mechanism that is shown. , Features, and advantages will use the new Ψ 含 含 # 擭 to communicate with I

V. Description of the invention (5) Support b) A supporting mechanism for connecting the wafers stacked on top of each other Ξ Supported by mechanization, 俾 Adjacent two wafer tray groups can straighten out Position, touch, and use the support mechanism to adjust the XH position of the stacked wafer trays; and Yu He 2 4 a latch mechanism to lock the selected wafer tray group, so that the open wafer tray can communicate with The wafer tray group adjacent to the top and bottom is separated from a driving motor b) the lock i ^. In the case, the wafer conveying box mechanism is arranged under a loading condition. The supporting mechanism further includes: — lifting The rod is connected to the drive motor; the driver is connected to the drive unit and the stacker is placed on the stacking platform. L7 β d)-a guide mechanism for * on the battle opening, and The wafer tray and the stacker are lifted and / or the round tray and the stacker are placed and raised. In addition, the driving force of the driving motor on which the oral text is placed is more preferably: ^ at least two sets of locking members $, the structure further includes: at different height positions, and J less two sets of locking members are in two phases at the first pitch The distance between adjacent stacked wafer tray-like doors is larger than the second distance defined by the distance between ▲ in direct contact with each other. C6 and the more preferred full-lock members each include a bolt. In the case, each wafer tray contains:

And the better case 9 492132 V. Description of the invention (6) a)-the main body 'has a flat top surface and a flat bottom surface and a thickness' and has a lock hole capable of receiving the lock pin insertion; b)-contact The portion extends inward from the main body and allows an edge of a semiconductor wafer to contact the upper surface of the contact portion. Further preferably, one end of the contact portion is tapered gradually. A second embodiment of the present invention provides a wafer transport box mechanism including: a) a plurality of wafer tray groups, each of which stores a single semiconductor wafer; b) a supporting mechanism for stacking each other The wafer tray group is mechanically supported, so that two adjacent wafer tray groups can directly contact each other, and the support mechanism is used to adjust the height position of the stacked wafer trays; and, c) a latch mechanism , Used to lock the selected wafer tray group, so that the first distance defined by the distance between a target wafer tray and an adjacent wafer tray above it is adjacent to the target wafer tray next to it The second distance defined by the distance between two wafer trays is larger than the third distance defined by the distance between two stacked and adjacent wafer trays. It is also preferable that the wafer transfer cassette mechanism is provided in a load-locking vacuum chamber. Preferably, the supporting mechanism further comprises: a) a driving motor; b) a lifting rod connected to the driving motor; c) a stacking platform connected to the driving horse via the lifting rod;

Page 10 492132 V. Description of the invention (7) to allow stacking of wafer tray groups on the stacking stage; and d) a guide mechanism for supporting the wafer tray and the stacking stage so that The wafer tray and the stacking stage are raised and lowered by the driving force of the driving motor. Further preferably, the latching mechanism further includes: at least two sets of latching members, and the latching members are arranged at different height positions at a first interval. Preferably, each of the latch members includes a latch pin. Further preferably, the wafer trays each include: a) a body having a flat top surface and a flat bottom surface, and a thickness capable of accommodating the latch pin into a latch hole; b) a contact portion, The main body extends inwardly to allow an edge of a semiconductor wafer to contact the upper surface of the contact portion. It is also preferable that one end of the contact portion is gradually tapered. 15. A third embodiment of the present invention provides a semiconductor manufacturing equipment including: a) a plurality of processing chambers; b) at least one loading interlocking vacuum chamber having a first type of wafer transfer box, c) a The transfer chamber is connected to all processing chambers and loading interlocking vacuum chambers, and has a first transfer robot arm; d) a wafer mounting table, with a plurality of wafer transfer boxes of the second type;

492132 V. Description of the invention (8) '~ e) — The second conveying robot arm is disposed between the conveying box mounting table and the at least one loading interlocking vacuum chamber; wherein the wafer conveying box further includes: f 1 ) A plurality of wafer tray groups for storing a single semiconductor wafer in each group; f 2)-a supporting mechanism for mechanizingly supporting the wafer tray groups stacked on each other, 俾Adjacent two wafer tray groups can directly contact each other, and use the support mechanism to adjust the height position of the stacked wafer trays; and f 3)-a latching mechanism for locking the selected wafer tray group in order to facilitate A target wafer tray can be separated from the wafer tray groups adjacent to each other. Lock the vacuum chamber. Moon brother 疋 Japanese yen transport is a mechanism. It is also better to set it under a load. The support mechanism further includes: a) a drive motor; one liter, a rod, connected to the drive motor;

^ ^ ^ ^ ^ # ^ # ^ ^ ^ cn — α ^ π stacked on the stacking platform; a stone platform is used to support the wafer tray and the stacking platform.

: Lifting. The pan and the stacking platform are driven by the drive motor S and preferably, there are at least two sets of latching members. The pick-up mechanism further includes: 'The at least two sets of latching members are at a first pitch of 492132. 5. Description of the invention (9 ) " Also placed at different height positions, the first pitch is greater than the second pitch defined by the distance between two adjacent stacked wafer trays that are in direct contact with each other. Preferably, each of the lock detecting members includes a lock detecting pin. Further preferably, the wafer trays each include: a) a main body having a flat top surface and a flat bottom surface and a thick locking hole capable of accommodating the insertion of the locking pin; b) a contact The portion extends inward from the main body and allows a half of the rounded edge to contact the upper surface of the contact portion. It is also preferable that one end of the contact portion is gradually tapered. Containing 22, a fourth embodiment of the present invention provides a semiconductor manufacturing equipment package a) a plurality of processing chambers; b) at least one loading interlocking vacuum chamber having a first type of wafer carousel; ~ ^ c) a conveying chamber, which is connected to all processing chambers and loading interlocking vacuum chambers 'and has a first conveying robotic arm; masonry d) aa round loading port' has a plurality of wafer wheels &Amp; ^ A second conveying robot arm is disposed between the conveying box mounting table and the at least one loading interlocking vacuum chamber; wherein the wafer conveying box further includes: f 1) a plurality of wafer trays Group, used to place a single semiconductor wafer in each group; mouth from f 2)-a support mechanism, used to stack the wafers on top of each other

Page 13 492132 V. Description of the invention (ίο) The tray group is supported in a mechanized manner, two adjacent wafer tray groups can directly contact each other, and the support mechanism is used to adjust the height position of the stacked wafer trays; and f 3) — a latching mechanism for latching a selected wafer tray group such that a first distance defined by a distance between a target wafer tray and a wafer tray adjacent to the target The second distance defined by the distance between the wafer tray and an adjacent one of the wafer trays below it is greater than the third distance defined by the distance between the stacked and adjacent two wafer circular trays. It is also preferable that the wafer transfer cassette mechanism is provided in a load-locking vacuum chamber. 2 4 In a better case, the branch mechanism further includes: a) a driving motor; b) a lifting rod connected to the driving motor; c) a stacking platform connected to the driving motor via the lifting rod To allow the wafer tray group to be stacked on the stacking stage; and, d) a guide mechanism for supporting the wafer tray and the stacking stage so that the wafer tray and the stacking stage are driven by the driving The driving force of the motor rises and falls. In addition, it is also preferable that the latching mechanism further includes at least two sets of latching members, and the latching members are arranged at different height positions at a first interval. It is also preferred that the latch members each include a latch pin. It is also preferable that the wafer trays each include: a) a main body having a flat top surface and a flat bottom surface and a thickness, and having a latching hole capable of receiving the insertion of the latching pin;

Page 14 492132

V. Description of the invention (11) b) —The contact part The edge of the body wafer can be better. It extends from the main body inward and allows half of the guide to contact the upper surface of the contact part. In other words, one end of the contact portion is gradually tapered. [Detailed description of the preferred embodiment J p The following table e illustrates the first embodiment of the present invention in detail. A schematic plan view of a semiconductor manufacturing apparatus according to one embodiment of the present invention is shown in FIG. Since the present invention focuses on improving the structure of the wafer carousel in the semiconductor manufacturing equipment and is located in the load lock vacuum chamber, the general equipment of the semiconductor manufacturing equipment is the same as in the aforementioned prior art. The semiconductor manufacturing equipment includes a main body 11 for processing semiconductor devices, a round cassette placing table 21 on which a wafer transport box 22 for storing semiconductor wafers is placed, and semiconductor wafers on the main body 11 and the transport box. A wafer transfer robot arm 31 is transferred between the mounting tables. In addition, the main body 11 further includes: two loading interlocking vacuum chambers 12 connected by a wafer transfer robot arm 3, and a box mounting table 21 to isolate the body 11 from the outside air; Semiconductor device processing; and a single transfer chamber and two-load interlocking vacuum chamber 12 connected to the carousel mounting table 21, and connected to processing 1 to 3.蕻 此 # 得 虚 理当〗 The chambers 12 can communicate with each other via the conveying chamber 14 = "two loading interlocking vacuum 12" # 詈 一 曰 4. In each loading interlocking vacuum chamber ° and the yen transport box 1 to facilitate Temporary storage of semiconductor wafers. = The round work of placing the upper body on the interlocking two-in-one interlocking true and the transport box. And the robot arm 31 is responsible for transferring the semiconductor wafers 14 to 14. The other wafer transfer robot 15 is

492132 V. Description of the invention (12) Perform loading interlocking vacuum chamber j 2. Processing chamber n Semiconductor wafer transfer. The load interlocking vacuum chamber = a first gate is installed at the boundary between each other, and a second gate valve is also provided at the boundary of the end of the round wheel robot arm 3 1. And there is also a gate valve at the boundary between the outside and the delivery room 14 and the delivery room 14. This difference = the processing room 1 3 is connected to each loading interlocking vacuum chamber] 2, the processing room 3, the second, f, the second has a tightly sealed, and then by the above-mentioned conventional semiconductor "first-use two-body wafer processing First, the semiconductor wafer is used to explain the inside of the wafer transfer box 22 on the semi-conducting stage 21. Then, the wafer transfer box 22 placed on the transfer box-mounted transfer box mount table 21 is described as follows: The arm 31 is moved from the wafer conductor wafer transferred to the load-locking vacuum chamber 12 to the wafer transfer device 15 in the J-chamber " again. Inside. Directly, the wafer transfer box being transported! Circularly transferred to the processing carrier, the vacuum chamber 12 is locked to allow semiconductor wafers to perform processes such as sputtering etching or chemistry. Subsequently, the wafer transfer robot 15 further places the semi-conducting process chamber 13 in the process. ', The robot arm 15 will transfer the completed circle in the transfer chamber 14 to the wafer transfer box 1 located in the load-locking interlocking semiconductor wafer 7 wins W Γ 2. Autumn Day Said «the conveyance device 31 then interlocked from loading ..., and then transferred the semiconductor wafer to each of the transportation w In the RiRi® carousel 1. The valve between the wafer carousel 22 with the predetermined process force is closed to allow the second one? Lock the vacuum chamber 12 and the processing chamber 13 Ligong transport room 14, load Interlocking vacuum chamber 12 trays = 13 This is enough to be in a separate vacuum state. After the process is completed, f

The vacuum state of the loading interlocking vacuum chamber 12 is released, so that the wafer carousel in the vacuum chamber 12 which is located in uploading J 492132 V. Description of the invention (13) is transferred to the conveying box mounting table after the semi-circular guide is completely processed. The wafer transfer box on 21 is shown in Figure ^. In the semiconductor manufacturing equipment shown in Figure ^, the schematic diagram of the new diseased wafer transfer box located in the interlocking interlocking direct line * = is shown in Figure 4. . And the drawing worker = the receipt in the novel wafer transfer box shown in Fig. 4! The ^ -day enlargement ^ fa provided in each loading interlocking vacuum chamber 12 has a crystal semiconductor mother day for the purpose of storing the semiconductor wafer 41 = day η. In addition, the extension portion 2 of each wafer tray 2 (1 has the feature that the inner side = the central area extends and gradually becomes tapered. The #middle "edge portion is the upper surface of the extension portion of each wafer tray 2 ~ At the same time, it is novel. The wafer transfer box lat = the extended wafer tray 2 in the vertical direction also has a separate one. The open side is: the outer edge of the wafer tray 2 will be guided with a pair of straight edges. Piece 6 is the one where the paired wafer trays 2 can be moved in two directions. In addition, the novel wafer transfer box is provided with a stack of loading platforms 5 to allow the paired wafer trays 2 to be weighed by their own weight. : The worms are abundant on it. And this stacking table 5 has a laterally extending shape. Moreover, the two opposite edges of the table 5 will also form a pair of straight lines. Among them, the stacking table 5 can be guided along a straight line. 6 pieces in the direction of cattle and J ^. In addition, the bottom surface of the stacking platform I is mechanically connected to a lifting mechanism 4A. This lifting mechanism 4A allows the stacking platform a to be shaped as a guide 6, that is, to lift vertically. Lowering mechanism. Dagger 3-drive motor 4-1, and connected to the stacking stage 5 and drive Up to 492132 V. Description of the invention (14) 4-1-Lifting bar 4-2. Each wafer tray 2 has a concave dragon set extending from the outer edge of the wafer tray 2 to the inside and used as a fixing part. A pair of latching mechanisms 7 is used to latch the selected round tray 2. Each latching mechanism 7 includes a cylindrical portion or several, aB and a bolt. Latching_Insert into the tray: Use the groove 3 'to achieve the purpose of picking up the wafer tray 2. —Tuo Yue tray locking machine also picks up and locks the second crystal solid blood flute tray 2'wafer tray 2 That is, it becomes impossible to move. = The first and second pairs of latching mechanisms 7 are inserted into the wafer tray 2 from the outer wall of the loading interlocking vacuum via the linear guides 6. Also, the height is greater than == 2 thickness The two sets of latching mechanisms 7 are assembled in different :: μ ΐ 2 Suppose that the following latching mechanisms 7 ′ of the upper group will be stacked first: the round tray group is locked, and the stacking platform 5 is stacked f ^ The wafer tray group below the one hundred selected first 'and the wafer tray group above the second selected. The first & the second difference The difference in the angle is the set between the two latching mechanisms of the upper and lower groups 7: :: is greater than the thickness of the wafer tray group. In addition, the next is the 0 tray group, which is located below it and stacked on the stacking stage. 5. The height difference between the wafer tray groups at the end is also larger than the thickness of the wafer tray group. Operation: How to store or remove wafers to or from the wafer transport box 1 The mounting table 5 is moved or moved up and down along a straight line, so that the stacking table 5 can be stacked on the stack: upper: the selected person in the round tray group 2A f week rectification 'Select or call Μ Standard; ^ 晶 ^ 托

492132 V. Description of the invention (15) ⑼Pick up and lock 'Among them, the lock of the lock detection mechanism 7' β-Japanese yen tray set 2B is inside. The one above the wafer tray group 2B is: Γ = ΐΛ. Those who are willing to be left in the wafer tray group 2 ”are stacked on the stacker and the loading port 5. Among them, the uppermost one located below the wafer tray group 2β is 2A. Then 'start the drive motor 4] to make the stack Place the 2 ^ linear guides 6 vertically down so that the target can be adjusted: The disk set 2A is adjusted to the predetermined height position of the lower group of the latching mechanism. Hold it down, and the target wafer is lowered by the lower group of the latching mechanism 7A. Tray group 2A is locked. It is: when the latch pin 7C of the latch mechanism 7A is inserted into the wafer tray group 4 inside, the one left under the wafer tray group 2A is stacked on the stacking table 5 ^ Start the drive motor 4-1 again so that the stacking table 5 descends vertically to a lower position along the straight line = 6, so as to be able to allow the remaining ones below the wafer: group 2A to lower together with the stacking table 5. Therefore That is, the wafer tray group% located at the uppermost end of the stacker loading platform 5 and the target are divided by T. In addition, the first distance "pU" of the stacked wafer tray group 2 is each ". The distance between the target wafer tray group 2A and the one directly above it is denoted by the second pitch "plb". The distance between the sub-labeled wafer tray group 2A and the directly below 2C is represented by a third pitch "plc". Here, the second interval "Plb" is wider than the first interval "Pla", and the third interval "1" is also wider than the first interval "pla". That is, the surface 'of the target wafer tray group is separated from the surfaces of 2B and 2C. The transfer arm 16 of the wafer transfer robot arm 31 is connected to a semi-circular blade 17 to be moved. And start the transfer # 16 'of the wafer transfer robot arm 31 in order to be able to move the semiconductor wafer 41 from the wafer transfer box 22 to 492132 V. Description of the invention (16) Load the wafer transfer box in the interlocking vacuum chamber 12 In 1, the semiconductor wafer 41 is stored in the storage tray 2d portion of the wafer tray group 2A. The conveying arm 16 extending out of the wafer conveying robot arm 15 picks up the semiconductor wafer 41 stored in the storage tray 2 d portion of the wafer tray group 2A, so that the semiconductor wafer 41 can be moved to a predetermined position again. Processing room 丨 3. The semiconductor wafer 41 is transferred to the wafer tray group 2A 'in the load-locking vacuum chamber 12 by the wafer transfer robot arm in the same manner as the wafer transfer arm 16 for transferring the semiconductor wafer 41. After that, the drive motor 4-1 is started to raise the stacking stage 5 so that the wafer tray group 2C and 2A are brought into contact. And release the lower group 7A of the latch mechanism from the wafer tray f2A, so that the wafer tray group 2A is in a non-latched state ', so that the wafer tray group 2A can be directly stacked on the wafer tray group 2C. It is located above the stacking stage 5.

In addition, the wafer tray group 2B is brought into a state, so that the stacker is placed on the stack and the storage is located in the vicinity of a single selection. The drive motor 4-1 is reduced to raise the stacker table 5 to facilitate the trays 2A and 2B. contact. Furthermore, the upper group 7β of the latch mechanism is released from the wafer, so that the wafer tray group 2B has a non-latched shape. The wafer tray group 2A can be directly stacked on the wafer tray group 2A and above the mounting table 5. As a result, all the wafer tray groups are stacked above the stage 5. The wafer transfer box in the loading interlocking vacuum chamber includes a plurality of wafer tray groups that can be used for each group of semiconductor wafers. Among them, the round tray group is held by the wafer tray group lock mechanism in the bathroom. Distance and thereby avoiding the problem of the size of the small wafer transfer box in the prior art, all the other wafer carriers

492132 V. Description of the invention (17) The disk sets are stacked on top of each other. In view of the fact that a person skilled in the related art can modify the present invention, it should be understood that the embodiments shown and explained in this patent specification are only for illustrative purposes and should not be interpreted as a limitation. Therefore, all modification cases that follow the spirit and scope of the present invention should be said to be covered by the scope of patent application. (

Page 21 492132 Brief description of the drawings According to a preferred embodiment of the present invention, it will be explained with reference to the following drawings. FIG. 1 is a schematic plan view showing a conventional semiconductor manufacturing equipment for processing semiconductor wafers. Fig. 2A is a schematic view of a conventional wafer transfer box in a semiconductor manufacturing equipment shown in Fig. 1 and located in a load-locking vacuum chamber. Fig. 2B is a partial enlarged view of the portion "A" indicated by an oval dashed line in Fig. 2A, in which a storage groove of the conventional wafer transfer box is explained. Fig. 3 is a schematic plan view showing a semiconductor manufacturing apparatus for processing a semiconductor wafer according to a first embodiment of the present invention. FIG. 4 is a schematic diagram of a novel wafer transfer box located in a load-locking vacuum chamber in the semiconductor manufacturing equipment shown in FIG. 3. FIG. Fig. 5 is a partial enlarged view of a receiving groove portion of the novel wafer transfer cassette shown in Fig. 4. [Symbol description] 1. la, lb ~ wafer transport box 2, 2A, 2B, 2C ~ wafer tray set 2d ~ wafer tray set storage tray part 3 ~ groove part 4 A ~ lifting mechanism 4, 4 -1 ~ Drive motor 4-2 ~ Lift

Page 492132 Brief description of the drawings 5 ~ Stacking stage 6 ~ Linear guides 7, 7A, 7B ~ Latch mechanism 7C ~ Latch pin 8 ~ Storage tray 9 ~ Storage groove 11 ~ Semiconductor manufacturing equipment body 1 2 ~ Loading interlocking vacuum chamber 1 3 ~ Processing chamber 14 ~ Transfer chamber 1 5, 3 1 ~ Wafer transfer robot 1 16 ~ Robot 17 ~ Blade 21 ~ Transfer mounting table 22 ~ Wafer transfer box 4 semiconductor wafer pla, plb, plc, p2 ~ pitch

Page 23

Claims (1)

VI. Application Please apply for the scope of patents a) wafers; b) the trays are connected to each other; c) they are opened. 2. · In 3., the a) b) c) is reached, and d) is raised and lowered 4 ·, the to one of the wafer transport box mechanisms includes: a plurality of wafer tray-like phase dishes, And a single semiconductor-supporting mechanism is stored in each group to support the field in a mechanized manner, b, layers, the wafers in contact with each other, and the two adjacent wafer tray groups can be placed upright using the stand; and, > a mechanism for adjusting a latching mechanism of the stacked wafer trays, using The target wafer tray can be locked, and the selected wafer tray group Λ is locked so that the wafer tray group adjacent to the upper and lower sides is separated from the wafer. The wafer transport box mechanism of the first item is set at one Load the interlocking direct mediator in the chamber. One of the drive motors supporting the wafer conveyance box mechanism of item 1 is connected to the drive motor; the VI is allowed to stack 3 units, and is connected to the drive horse 1 through the landing gear. Said ^^^ trays are stacked on the stacking stage; and # > a structure for supporting the wafer tray and the stacking placement such that the wafer tray and the wafer tray are placed at /%. The driving force of the teaching loading port and the driving force of the Hai drive motor is recognized. The wafer conveying machine of the patent application No. 51 is the first. The latching mechanism further includes: W, Phoenix mechanism, which has two sets of latching structures # ^ ^ N ^, L cattle, the two sets of locking members to V are at a first distance Page 24 492132 VI. Scope of patent application Set at different height positions, the first distance is larger than the second distance defined by the distance between two adjacent stacked wafer trays in direct contact with each other. 5. For the wafer and cassette mechanism of item 4 of the patent application, wherein the latch members each include a latch pin. 6 · If the wafer conveyance cassette mechanism of the fifth item of the patent application, each of the wafer trays further includes: a) a main body, which has a flat top surface, a flat bottom surface and a thickness, and has a capacity to accommodate the bolt; The locking pin is inserted into one of the locking holes; b) the contact portion extends inward from the main body and allows an edge of a semiconductor wafer to contact the upper surface of the contact portion. 7. For the wafer transfer cassette mechanism according to item 6 of the patent application, wherein one end of the contact portion is gradually tapered. 8. A wafer transport box mechanism, comprising: a) a plurality of wafer tray groups storing a single semiconductor wafer in each group; b) a support mechanism for stacking the wafer tray groups on each other It is mechanized, and two adjacent wafer tray groups can directly contact each other, and the supporting mechanism is used to adjust the height position of the stacked wafer trays; and, c) a latching mechanism is used to latch the selected The wafer tray group includes a first distance defined by a distance between a target wafer tray and a wafer tray adjacent to the target wafer tray, and a distance between the target wafer tray and a wafer tray adjacent thereto below. The second distance defined by the distance is greater than the third distance defined by the distance between two stacked and adjacent wafer trays. Page 25 492132 6. Scope of patent application 9. For example, the wafer conveyance cassette mechanism of the eighth patent application scope, wherein the wafer conveyance cassette mechanism is arranged in a loading interlocking vacuum chamber. 10. The wafer conveyance cassette mechanism according to item 8 of the patent application scope, wherein the supporting mechanism further includes: a) a driving motor; b) a lifting rod connected to the driving motor; c) a stacking stage, Is connected to the drive motor via the take-off and landing lever to allow stacking of the wafer tray group on the stacking stage; and d) a guide mechanism for supporting the wafer tray and the stacking stage so that the The wafer tray and the stacking stage are lifted by the driving force of the driving motor. 11. The wafer transport cassette mechanism according to item 8 of the patent application scope, wherein the latching mechanism further includes: at least two sets of latching members, and the two latching members are set at different height positions with the first pitch. . 12. The wafer transfer cassette mechanism of claim 11 in which the latch members each include a latch pin. 13. For example, the wafer transfer cassette mechanism of the patent application No. 12 range, wherein each of the wafer trays further includes: a) a body having a flat top surface and a flat bottom surface, and capable of accommodating the insertion of the latch pin A thickness of a latch hole; b) a contact portion extending inward from the main body to allow an edge of a semiconductor wafer to contact the upper surface of the contact portion. 14. If the wafer transfer box mechanism of item 13 of the patent application scope, Page 26 492132 6. In the scope of patent application, one end of the contact part is gradually sharp and thin. 15. A semiconductor manufacturing equipment comprising: a) a plurality of processing chambers; b) at least one loading interlocking vacuum chamber having a first type of wafer transfer box; c) a transfer chamber connected to all processes The chamber and the loading interlocking vacuum chamber have a first transfer robot arm; d) a wafer mounting table with a plurality of wafer transfer boxes of the second type; e) a second transfer robot arm, which is provided at The transfer box mounting table and the at least one loading interlocking vacuum chamber; wherein the wafer transfer box further includes: f 1) a plurality of wafer tray groups for storing a single semiconductor wafer in each group; f 2) a supporting mechanism for mechanizingly supporting the wafer tray groups stacked on each other, so that two adjacent wafer tray groups can directly contact each other, and the supporting mechanism is used to adjust the stacking position, The height position of the wafer tray; and f 3)-a latching mechanism for locking the selected wafer tray group, so that a target wafer tray can be separated from the wafer tray group adjacent to each other. 16. The semiconductor manufacturing equipment according to item 15 of the patent application scope, wherein the wafer transfer cassette mechanism is provided in a load-locking vacuum chamber. 17. For the semiconductor manufacturing equipment with the scope of patent application No. 15 which Page 27 492132 VI. In the scope of the patent application, 'the support mechanism further includes: a) — a driving motor; b) — a lifting rod connected to the driving motor; ^ τ Μ χ 芏 芏 驱 drove the drive; / stacked The mounting table is connected to the driving horse through the take-off and landing lever to allow stacking of the wafer tray group on the stacking table a, and, while raising the wafer tray and the stacking table to the driving motor. Driving force 18. As described in the scope of the patent application, the latching mechanism further includes: t body 1 is prepared to have at least two sets of latching members, Xi + set at different height positions, two, two, and * The lock member has a first pitch of two adjacent stacked wafer trays, and a distance of 19. * patented by direct contact with each other. = The second distance defined is large. The latching members each contain a semiconductor manufacturing equipment of 、 and 20, as claimed in the patent. The second scope: scale two. The wafer trays each include semiconductor manufacturing equipment of 、, ′. A) a main body, which has a flat surface and a flat bottom surface capable of accommodating the latch pin and a thick b) a contact portion, which is a latch hole formed by the main slot; the edge of the body wafer It can extend inwardly with the contact part, and allows half v 21 · As in the scope of patent application No. 20 :: contact. In the focusing, one end of the contact portion is gradually tapered. V body manufacturing δ is also available, 2. 2. A semiconductor manufacturing equipment, including · Taichung Moderate 492132 6. Patent application scope a) Multiple processing chambers; b) At least one loading interlocking vacuum chamber with a first Various types of wafer transfer boxes; c) a transfer room, which is connected to all processing chambers and loading interlocking vacuum chambers, and has a first transfer robot arm; d)-a wafer mounting table, with a plurality of second types A type of wafer transfer box; e) a second transfer robot arm disposed between the transfer box mounting table and the at least one loading interlocking vacuum chamber; wherein the wafer transfer box further includes: f 1) a plurality of F wafer tray groups, used to store a single semiconductor wafer in each group; f 2)-a support mechanism, used to mechanically support the wafer tray groups stacked on each other, adjacent to each other The two wafer tray groups can directly contact each other, and use the support mechanism to adjust the height position of the stacked wafer trays; and f 3)-a latching mechanism for locking the selected wafer tray group, Subject crystal The first gap defined by the distance between the tray and an adjacent wafer tray above it, and the second gap defined by the distance between the target wafer tray and an adjacent wafer tray below it are both larger than the stack A third distance defined by the distance between two adjacent and adjacent wafer trays. 23. The semiconductor manufacturing equipment of claim 22, wherein the wafer transfer cassette mechanism is provided in a load-locking vacuum chamber. 24. If the semiconductor manufacturing equipment of the 22nd scope of the patent application, Page 492132 6. In the scope of the patent application, the support mechanism further includes: a) a driving motor; b) a lifting rod connected to the driving motor; c) a stacking platform connected to the lifting rod via The driving motor to allow the wafer tray group to be stacked on the stacking stage; and, d) a guide mechanism for supporting the wafer tray and the stacking stage so that the wafer tray and the stacking stage Lifted by the driving force of the drive motor. 25. The semiconductor manufacturing equipment according to item 22 of the scope of patent application, wherein the latching mechanism further includes: 'At least two sets of latching members, and the two latching members are set at different height positions with the first pitch. . 26. The semiconductor manufacturing apparatus of claim 25, wherein the latch members each include a latch pin. 2 7. The semiconductor manufacturing equipment according to item 26 of the patent application scope, wherein each of the wafer trays further includes: a) a main body having a flat top surface, a flat bottom surface and a thickness, and having a capacity capable of accommodating the bolt The locking pin is inserted into one of the locking holes; b) the contact portion extends inward from the main body and allows an edge of a semiconductor wafer to contact the upper surface of the contact portion. 28. The semiconductor manufacturing apparatus according to claim 27, wherein one end of the contact portion is gradually tapered. Page 30