CN110211909B - Silicon wafer basket capable of bearing silicon wafer - Google Patents

Silicon wafer basket capable of bearing silicon wafer Download PDF

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Publication number
CN110211909B
CN110211909B CN201910606466.9A CN201910606466A CN110211909B CN 110211909 B CN110211909 B CN 110211909B CN 201910606466 A CN201910606466 A CN 201910606466A CN 110211909 B CN110211909 B CN 110211909B
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CN
China
Prior art keywords
silicon wafer
pair
separation rod
end plates
basket according
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Application number
CN201910606466.9A
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Chinese (zh)
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CN110211909A (en
Inventor
孟祥熙
潘维
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Changzhou Shichuang Energy Co Ltd
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Changzhou Shichuang Energy Co Ltd
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Priority to CN201910606466.9A priority Critical patent/CN110211909B/en
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    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/67326Horizontal carrier comprising wall type elements whereby the substrates are vertically supported, e.g. comprising sidewalls
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/18Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof
    • H01L31/1876Particular processes or apparatus for batch treatment of the devices
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02PCLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50Manufacturing or production processes characterised by the final manufactured product

Abstract

The invention discloses a silicon wafer flower basket capable of bearing silicon wafers, which comprises a side wall and a bottom frame, wherein the side wall is formed by a pair of side frames arranged left and right and a pair of end plates arranged front and back; and a separation rod is further arranged between the pair of side frames and is perpendicular to the pair of end plates, the pair of end plates are respectively provided with a guide groove for guiding the end parts of the separation rod to slide, and two ends of the separation rod are respectively detachably connected with the guide grooves on the pair of end plates. The separation rod is detachable; when the separation rod is detached, a row of vertically arranged silicon wafers can be inserted into the silicon wafer flower basket; when the separation rod is arranged, the internal space of the silicon wafer flower basket can be separated, and then two rows of vertically arranged silicon wafers can be inserted, and the two rows of silicon wafers can be arranged up and down or left and right. In order to facilitate the adjustment of the mounting position of the separation rod in the inner space of the silicon wafer flower basket, guide grooves are formed in the pair of end plates, two ends of the separation rod can slide along the guide grooves, and the mounting position of the separation rod can be adjusted in the left-right direction and/or the vertical direction so as to adapt to silicon wafers with different sizes.

Description

Silicon wafer basket capable of bearing silicon wafer
Technical Field
The invention relates to a silicon wafer basket capable of bearing silicon wafers.
Background
The silicon wafer flower basket is an appliance for bearing silicon wafers, the internal space of the appliance is used for inserting and placing the vertical silicon wafers, the appliance comprises a main frame body, the main frame body comprises a side wall and a bottom frame, the side wall is formed by surrounding a pair of side frames which are arranged left and right and a pair of end plates which are arranged front and back, the pair of end plates are vertically arranged and are parallel to each other, the pair of side frames are respectively provided with a vertical slot for inserting and placing the side edges of the silicon wafers, and the pair of side frames are mutually matched.
The side frames of the existing silicon wafer flower basket mainly have two forms:
1) The side frame adopts a slot plate; the slot board includes: a row of vertical slots arranged on one side surface of the plate-shaped main body; the row of slots are sequentially arranged along the transverse direction of the plate-shaped main body;
2) The side frame consists of a plurality of toothed bars, and all the toothed bars in the same side frame are positioned on the same vertical surface; the rack bar includes: a rod-shaped main body and at least one row of slots arranged on the rod-shaped main body; the slots in the same row are sequentially arranged along the axial direction of the rod-shaped main body; if two rows of slots are arranged on the rod-shaped main body, the two rows of slots are arranged in a back-to-back manner.
With the development of solar cell technology, the whole silicon wafer is divided into at least two fragments, so that the efficiency of the solar module can be improved. However, the existing silicon wafer basket is designed according to the shape of the whole silicon wafer, so that the silicon wafer basket is required to be independently designed in a slicing way, and the production cost of enterprises is increased.
Disclosure of Invention
In order to solve the defects in the prior art, the invention provides a silicon wafer flower basket capable of bearing silicon wafers, wherein the inner space of the silicon wafer flower basket is used for inserting and vertically placing the silicon wafers, the silicon wafer flower basket comprises a main frame body, the main frame body comprises a side wall and a bottom frame, the side wall is formed by surrounding a pair of side frames which are arranged left and right and a pair of end plates which are arranged front and back, the pair of end plates are vertically arranged and are parallel to each other, the pair of side frames are respectively provided with a vertical slot for inserting and placing the side edges of the silicon wafers, and the pair of side frames are mutually matched;
and a separation rod is further arranged between the pair of side frames, the separation rod is perpendicular to the pair of end plates, the pair of end plates are respectively provided with guide grooves for guiding the end parts of the separation rod to slide, the guide grooves on the pair of end plates are symmetrically arranged, and two ends of the separation rod are respectively detachably connected with the guide grooves on the pair of end plates.
The invention provides a detachable separation rod for the existing silicon wafer basket; when the separation rod is detached, a row of vertically arranged silicon wafers (can be whole wafers) can be inserted into the silicon wafer flower basket; when the separation rod is arranged, the internal space of the silicon wafer flower basket can be separated, and then two rows of vertically arranged silicon wafers (which can be divided into slices) can be inserted, and the two rows of silicon wafers can be arranged up and down or left and right.
In order to facilitate the adjustment of the installation position of the separation rod in the internal space of the silicon wafer flower basket, a pair of end plates are provided with guide grooves, two ends of the separation rod can slide along the guide grooves, and the installation position of the separation rod can be adjusted in the left-right direction and/or the vertical direction so as to adapt to silicon wafers with different sizes; when the separation rod is installed, the installation position of the separation rod is adjusted to be in place, and then the separation rod is fixed (detachably).
Preferably, the separation rod is a toothed bar, and a slot for inserting and placing the silicon wafer is arranged on the toothed bar, so that the silicon wafer can be placed more stably.
Preferably, the guide groove is arranged in the left-right direction, two ends of the separation rod can slide left and right along the guide groove, and the installation position of the separation rod can be adjusted in the left-right direction so as to adapt to silicon wafers with different sizes.
Preferably, the guide groove is vertically arranged, two ends of the separation rod can vertically slide along the guide groove, and the installation position of the separation rod can be vertically adjusted so as to adapt to silicon wafers with different sizes.
Preferably, the top end of the guide groove is open, so that the end of the separation rod can be conveniently inserted into the guide groove.
Preferably, the guide grooves are obliquely arranged, and the two ends of the separation rod can slide obliquely along the guide grooves, so that the installation positions of the separation rod can be adjusted in the left-right direction and the vertical direction at the same time, and the silicon wafer with different sizes can be adapted.
Preferably, the guide groove is cross, and both ends of the separation rod can slide left and right or vertically along the guide groove, and the installation position of the separation rod can be adjusted in the left and right direction or vertically so as to adapt to silicon wafers with different sizes.
Preferably, the guide groove is X-shaped, and two ends of the separation rod can slide along the guide groove in an inclined manner, so that the installation position of the separation rod can be adjusted in the left-right direction and the vertical direction at the same time, and the separation rod is suitable for silicon wafers with different sizes.
Preferably, the guide groove is L-shaped, and the two ends of the separation rod can slide left and right or vertically along the guide groove, so that the installation position of the separation rod can be adjusted in the left and right direction or vertically to adapt to silicon wafers with different sizes.
Preferably, the top end of the guide groove is open, so that the end of the separation rod is conveniently inserted into the guide groove
Preferably, the pair of side frames are slot plates; is a side frame structure of the existing silicon wafer flower basket.
Preferably, the pair of side frames are respectively composed of a plurality of toothed bars, and each toothed bar in the same side frame is positioned on the same vertical surface; is a side frame structure of the existing silicon wafer flower basket.
Preferably, at least two separation rods are assembled in a single guide groove, so that the storage layout of the silicon wafers is more selected.
Drawings
FIGS. 1 and 2 are schematic views of example 1;
FIG. 3 is a schematic diagram of example 2;
FIG. 4 is a schematic diagram of example 3;
FIG. 5 is a schematic diagram of example 4;
FIG. 6 is a schematic diagram of example 5;
FIG. 7 is a schematic diagram of example 6;
FIG. 8 is a schematic diagram of example 7;
FIG. 9 is a schematic diagram of example 8.
Detailed Description
The following describes the embodiments of the present invention further with reference to the drawings and examples. The following examples are only for more clearly illustrating the technical aspects of the present invention, and are not intended to limit the scope of the present invention.
Example 1
As shown in fig. 1 and 2, the invention provides a silicon wafer flower basket capable of bearing silicon wafers, the internal space of the silicon wafer flower basket is used for inserting and placing vertical silicon wafers, the silicon wafer flower basket comprises a main frame body, the main frame body comprises a side wall 10 and a bottom frame 20, the side wall 10 is surrounded by a pair of side frames 11 which are arranged left and right and a pair of end plates 12 which are arranged front and back, the pair of end plates 12 are vertically arranged and are parallel to each other, the pair of side frames 11 are respectively provided with a vertical slot for inserting and placing the side edges of the silicon wafers, and the pair of side frames 11 are mutually matched;
a separation rod 30 is further arranged between the pair of side frames 11, the separation rod 30 is perpendicular to the pair of end plates 12, the pair of end plates 12 are respectively provided with a guide groove 40 for guiding the end parts of the separation rod 30 to slide, the guide grooves 40 on the pair of end plates 12 are symmetrically arranged, and two ends of the separation rod 30 are respectively detachably connected with the guide grooves 40 on the pair of end plates 12;
the guide grooves 40 are provided in the left-right direction.
The partition lever 30 is detachable; when the separation rod 30 is detached, a row of vertically arranged silicon wafers (which can be whole wafers) can be inserted into the silicon wafer flower basket; when the separation rod 30 is installed, the internal space of the silicon wafer basket can be separated, and then two rows of vertically arranged silicon wafers 50 (which can be divided into slices) can be inserted, and the two rows of silicon wafers 50 can be arranged up and down (as shown in fig. 1) or left and right (as shown in fig. 2).
In order to facilitate the adjustment of the mounting position of the separation rod 30 in the internal space of the silicon wafer flower basket, a guide groove 40 is arranged on the pair of end plates 12, the two ends of the separation rod 30 can slide left and right along the guide groove 40, and the mounting position of the separation rod 30 can be adjusted along the left and right directions so as to adapt to silicon wafers with different sizes; when the partition lever 30 is mounted, the mounting position of the partition lever 30 is adjusted to be in place, and then the partition lever 30 is (detachably) fixed.
The separation rod 30 can be a toothed rod, and a slot for inserting and placing the silicon wafer is arranged on the toothed rod, so that the silicon wafer can be placed more stably.
The pair of side frames 11 may have a conventional structure, and each of the pair of side frames 11 may be formed of a plurality of bars, and the bars in the same side frame 11 may be positioned on the same vertical plane. In addition, the pair of side frames 11 may be slot boards (the slot boards are not shown).
Example 2
As shown in fig. 3, on the basis of example 1, the difference is that:
the guide groove 40 is vertically arranged, two ends of the separation rod 30 can vertically slide along the guide groove 40, and the installation position of the separation rod 30 can be vertically adjusted to adapt to silicon wafers with different sizes.
Example 3
As shown in fig. 4, on the basis of example 2, the difference is that:
the guide groove 40 is open at the top end to facilitate insertion of the end of the partition bar 30 into the guide groove 40.
Example 4
As shown in fig. 5, on the basis of example 1, the difference is that:
the guide grooves 40 are obliquely arranged, and two ends of the separation rod 30 can slide obliquely along the guide grooves 40, so that the installation position of the separation rod 30 can be adjusted in the left-right direction and the vertical direction at the same time, and the silicon wafer with different sizes can be adapted.
Example 5
As shown in fig. 6, on the basis of example 1, the difference is that:
the guide groove 40 is cross-shaped, two ends of the separation rod 30 can slide left and right or vertically along the guide groove 40, and the installation position of the separation rod 30 can be adjusted in the left and right direction or vertically so as to adapt to silicon wafers with different sizes.
Example 6
As shown in fig. 7, on the basis of example 1, the difference is that:
the guide groove 40 is in an X shape, two ends of the separation rod 30 can slide along the guide groove 40 in an inclined manner, and the installation position of the separation rod 30 can be adjusted in the left-right direction and the vertical direction at the same time so as to adapt to silicon wafers with different sizes.
Example 7
As shown in fig. 8, on the basis of example 1, the difference is that:
the guide groove 40 is L-shaped, two ends of the separation rod 30 can slide left and right or vertically along the guide groove 40, and the installation position of the separation rod 30 can be adjusted in the left and right direction or vertically so as to adapt to silicon wafers with different sizes.
Example 8
As shown in fig. 9, on the basis of example 7, the difference is that:
the guide groove 40 is open at the top end to facilitate insertion of the end of the partition bar 30 into the guide groove 40.
Preferably, in embodiments 1 to 8, at least two dividing bars are assembled in a single guide groove 40, so that the storage layout of the silicon wafer is more selected.
As in embodiment 1, at least two partition rods are assembled in a single guide groove 40; two rows of silicon wafers can be inserted and arranged up and down; or a plurality of rows of silicon wafers are inserted and placed, and the plurality of rows of silicon wafers are sequentially arranged along the left-right direction.
As in embodiment 2 and embodiment 3, at least two partition rods are assembled in a single guide groove 40; multiple rows of silicon wafers can be inserted, and the multiple rows of silicon wafers are sequentially arranged along the vertical direction; or two rows of silicon wafers are inserted and placed, and the two rows of silicon wafers are arranged left and right.
As in embodiment 4, at least two partition rods are assembled in a single guide groove 40; multiple rows of silicon wafers can be inserted, and the multiple rows of silicon wafers are sequentially arranged along the vertical direction or the multiple rows of silicon wafers are sequentially arranged along the left-right direction.
The foregoing is merely a preferred embodiment of the present invention, and it should be noted that it will be apparent to those skilled in the art that several modifications and variations can be made without departing from the technical principle of the present invention, and these modifications and variations should also be regarded as the scope of the invention.

Claims (13)

1. The silicon wafer flower basket capable of bearing silicon wafers is characterized in that the internal space of the silicon wafer flower basket is used for inserting and placing vertical silicon wafers, the silicon wafer flower basket comprises a main frame body, the main frame body comprises a side wall and a bottom frame, the side wall is formed by a pair of side frames arranged left and right and a pair of end plates arranged front and back, the pair of end plates are vertically arranged and parallel to each other, the pair of side frames are respectively provided with a vertical slot for inserting and placing the side edges of the silicon wafers, and the pair of side frames are mutually matched; the method is characterized in that:
and a separation rod is further arranged between the pair of side frames, the separation rod is perpendicular to the pair of end plates, the pair of end plates are respectively provided with guide grooves for guiding the end parts of the separation rod to slide, the guide grooves on the pair of end plates are symmetrically arranged, and two ends of the separation rod are respectively detachably connected with the guide grooves on the pair of end plates.
2. The silicon wafer basket according to claim 1, wherein the guide grooves are provided in the left-right direction.
3. The silicon wafer basket according to claim 1, wherein the guide grooves are vertically disposed.
4. A silicon wafer basket according to claim 3 wherein the guide slot is open at the top.
5. The silicon wafer basket according to claim 1, wherein the guide grooves are inclined.
6. The silicon wafer basket according to claim 1, wherein the guide groove is cross-shaped.
7. The silicon wafer basket according to claim 1, wherein the guide groove is X-shaped.
8. The silicon wafer basket according to claim 1, wherein the guide groove is L-shaped.
9. The silicon wafer basket according to claim 8, wherein the top end of the guide groove is open.
10. The silicon wafer basket of claim 1 wherein the spacer bar is a toothed bar.
11. The silicon wafer basket according to claim 1, wherein the pair of side frames are slot plates.
12. The silicon wafer basket according to claim 1, wherein the pair of side frames are each composed of a plurality of rack bars, and each rack bar in the same side frame is located on the same vertical plane.
13. Silicon wafer basket according to any one of claims 1 to 12, characterized in that at least two dividing bars are fitted in a single guide slot.
CN201910606466.9A 2019-07-05 2019-07-05 Silicon wafer basket capable of bearing silicon wafer Active CN110211909B (en)

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Application Number Priority Date Filing Date Title
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CN110211909B true CN110211909B (en) 2023-08-18

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