CN110060951A - One kind is silicon chip film-coated to use graphite boat - Google Patents

One kind is silicon chip film-coated to use graphite boat Download PDF

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Publication number
CN110060951A
CN110060951A CN201910421035.5A CN201910421035A CN110060951A CN 110060951 A CN110060951 A CN 110060951A CN 201910421035 A CN201910421035 A CN 201910421035A CN 110060951 A CN110060951 A CN 110060951A
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CN
China
Prior art keywords
stuck point
graphite boat
boat piece
piece
hole
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
CN201910421035.5A
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Chinese (zh)
Other versions
CN110060951B (en
Inventor
王博文
孟祥熙
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Changzhou Shichuang Energy Technology Co Ltd
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Changzhou Shichuang Energy Technology Co Ltd
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Priority to CN201910421035.5A priority Critical patent/CN110060951B/en
Publication of CN110060951A publication Critical patent/CN110060951A/en
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Classifications

    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/44Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
    • C23C16/54Apparatus specially adapted for continuous coating
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/67346Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders characterized by being specially adapted for supporting a single substrate or by comprising a stack of such individual supports
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02PCLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50Manufacturing or production processes characterised by the final manufactured product

Abstract

The invention discloses a kind of silicon chip film-coated graphite boats, comprising: is vertically arranged graphite boat piece by the row that ceramic rod is serially connected;Graphite boat piece is equipped with: can carry the stuck point group for being individually vertically arranged silicon wafer;Graphite boat piece is additionally provided with three for installing the hole of stuck point;Three holes penetrate through the both side surface of graphite boat piece respectively, three holes also all being laterally extended along graphite boat piece, and three holes all extend to the lateral other end by lateral one end of graphite boat piece.The present invention is silicon chip film-coated to use graphite boat, and stuck point and graphite boat piece are clamped, and installation site of the stuck point in corresponding hole can freely be arranged, and can carry silicon wafer full wafer and carry the fragment that the silicon wafer full wafer is partitioned into.

Description

One kind is silicon chip film-coated to use graphite boat
Technical field
Silicon chip film-coated graphite boat is used the present invention relates to a kind of.
Background technique
Silicon wafer used in solar battery needs to carry out plated film, and silicon wafer needs are carried by graphite boat when plated film, graphite boat Stuck point for carrying silicon wafer is set including the row's graphite boat piece being serially connected by ceramic rod, and in graphite boat piece.
With the development of solar battery technology, silicon wafer full wafer equal part is divided at least two fragments, the sun can be improved The efficiency of component.But the position of existing graphite boat stuck point is to be designed according to the shape of silicon wafer full wafer, therefore in addition fragment needs Independent design graphite boat increases the production cost of enterprise.
Summary of the invention
The purpose of the present invention is to provide a kind of silicon chip film-coated graphite boat, stuck point and graphite boat piece are clamped, and can be certainly By installation site of the setting stuck point in corresponding hole, silicon wafer full wafer can be carried and carry the silicon wafer full wafer it is partitioned into Fragment.
To achieve the above object, the present invention provides a kind of silicon chip film-coated graphite boat, comprising: is serially connected in one by ceramic rod The row risen is vertically arranged graphite boat piece;Graphite boat piece is equipped with: can carry the stuck point group for being individually vertically arranged silicon wafer;
The graphite boat piece is additionally provided with three for installing the hole of stuck point: positioned at the bottom strip hole of graphite boat piece bottom, being located at The middle strip hole at the vertical middle part of graphite boat piece, and the upper strips hole positioned at graphite boat piece top;Three holes penetrate through respectively The both side surface of graphite boat piece, three holes also all being laterally extended along graphite boat piece, and three holes are all by graphite boat Lateral one end of piece extends to the lateral other end;
Stuck point in same stuck point group includes: a bottom stuck point being connected in bottom strip hole, and one is connected in middle strip hole Middle part stuck point and one it is connected in top stuck point in upper strips hole;Bottom stuck point, middle part stuck point in same stuck point group and on Portion's stuck point, middle part stuck point therein, top stuck point are divided into the two sides of bottom stuck point.
Preferably, the bottom stuck point, middle part stuck point and top stuck point, they respectively include: through corresponding Kong Bingyu The support column of this hole clamping;Support column is vertical with graphite boat piece, and support column is equipped with a pair of ring for the insertion of silicon wafer sideline Shape slot, this is to the annular groove heart coaxial with support column, and this is divided into the two sides of graphite boat piece to annular groove.
Preferably, the stuck point group is multiple, and multiple stuck point group is arranged successively at equal intervals along the transverse direction of graphite boat piece.
Preferably, the ceramic rod is two pairs, and each ceramic rod is parallel to each other;Each graphite boat piece is parallel to each other, and each stone Black boat piece is arranged successively at equal intervals along the extending direction of ceramic rod;Single graphite boat piece is run through by above-mentioned two pairs of ceramic rods, wherein A pair of of ceramic rod is divided into the top both lateral sides of the graphite boat piece, and the bottom end that another pair ceramic rod is divided into the graphite boat piece is horizontal To two sides.
Advantages and advantages of the present invention are to provide a kind of silicon chip film-coated graphite boat, stuck point and graphite boat piece Clamping, and installation site of the stuck point in corresponding hole can be freely set, silicon wafer full wafer can be carried and carry the silicon wafer is whole The fragment that piece is partitioned into.
Stuck point is clamped with corresponding hole, when needing to adjust the position of stuck point, can be extracted stuck point from hole, then will card Suitable position in point insertion hole, therefore installation site of the stuck point in corresponding hole can be freely arranged.
Since the installation site of bottom stuck point, middle part stuck point, top stuck point in corresponding hole all can be freely arranged, so Graphite boat of the invention can carry silicon wafer full wafer and carry the fragment that the silicon wafer full wafer is partitioned into;Full wafer is square, And the width of full wafer is greater than the vertical interval in bottom strip hole and middle strip hole;Fragment are as follows: along full wafer width direction by full wafer N equal part Fragment made of cutting, N are integer, N >=2;Fragment is rectangle, and the length of fragment is the width of full wafer.
When being vertically arranged silicon wafer full wafer with graphite boat carrying, bottom stuck point, middle part stuck point, top are first determined according to the size of full wafer The installation site of stuck point makes middle part stuck point, top stuck point be divided into the two sides of bottom stuck point, and middle part stuck point, top stuck point The width of horizontal space and full wafer is adapted, and the horizontal space of bottom stuck point and middle part stuck point is made to be equal to bottom stuck point and top The horizontal space of stuck point;After bottom stuck point, middle part stuck point, top stuck point all install, silicon wafer full wafer, that is, standing is inserted, and is made whole A pair of of vertical edge of piece is assembled with middle part stuck point, top stuck point respectively, and the bottom edge of silicon wafer full wafer is supported by bottom stuck point.
When being vertically arranged fragment with graphite boat carrying, bottom stuck point, middle part stuck point, top stuck point are first determined according to the size of fragment Installation site, so that middle part stuck point, top stuck point is divided into the two sides of bottom stuck point, and the level of middle part stuck point, top stuck point The width of spacing and fragment is adapted, and the horizontal space of bottom stuck point and middle part stuck point is made to be equal to bottom stuck point and top stuck point Horizontal space;After bottom stuck point, middle part stuck point, top stuck point all install, fragment, that is, standing is inserted, and makes a pair of fragment Vertical edge (i.e. a pair of of long side of fragment) is assembled with middle part stuck point, top stuck point respectively, and (i.e. fragment is one wide on the bottom edge of fragment Side) it is supported by bottom stuck point.
Detailed description of the invention
Fig. 1 is schematic diagram of the invention.
Specific embodiment
With reference to the accompanying drawings and examples, further description of the specific embodiments of the present invention.Following embodiment is only For clearly illustrating technical solution of the present invention, and not intended to limit the protection scope of the present invention.
As shown in Figure 1, the present invention provides a kind of silicon chip film-coated graphite boat, comprising: pass through two pairs of horizontal ceramic rods 11,12 The row being serially connected is vertically arranged graphite boat piece 2;Each ceramic rod is parallel to each other;Each graphite boat piece 2 is parallel to each other, and each graphite boat Piece 2 is arranged successively at equal intervals along the extending direction of ceramic rod;Single graphite boat piece 2 is run through by above-mentioned two pairs of ceramic rods 11,12, Middle a pair of ceramic rod 11 is divided into the top both lateral sides of the graphite boat piece 2, and another pair ceramic rod 12 is divided into the graphite boat piece 2 Bottom end both lateral sides;Graphite boat piece 2 is equipped with: can carry the stuck point group for being individually vertically arranged silicon wafer;
The graphite boat piece 2 is additionally provided with three for installing the holes of stuck point: positioned at the bottom strip hole 31 of 2 bottom of graphite boat piece, Positioned at the middle strip hole 32 at the vertical middle part of graphite boat piece 2, and the upper strips hole 33 positioned at 2 top of graphite boat piece;Three items Hole penetrates through the both side surface of graphite boat piece 2 respectively, three holes also all being laterally extended along graphite boat piece 2, and three items Hole all extends to the lateral other end by lateral one end of graphite boat piece 2;
Stuck point in same stuck point group includes: a bottom stuck point 41 being connected in bottom strip hole 31, and one is connected in middle strip hole Middle part stuck point 42 and one in 32 are connected in the top stuck point 43 in upper strips hole 33;Bottom stuck point in same stuck point group 41, middle part stuck point 42 and top stuck point 43, middle part stuck point 42 therein, top stuck point 43 are divided into the two sides of bottom stuck point 41;
The bottom stuck point 41, middle part stuck point 42 and top stuck point 43, they respectively include: through corresponding this of Kong Bingyu hole The support column of clamping;Support column is vertical with graphite boat piece 2, and support column is equipped with a pair of annular groove for the insertion of silicon wafer sideline, This is to the annular groove heart coaxial with support column, and this is divided into the two sides of graphite boat piece 2 to annular groove;
The stuck point group is multiple, and multiple stuck point group is arranged successively at equal intervals along the transverse direction of graphite boat piece 2.
Stuck point is clamped with corresponding hole, when needing to adjust the position of stuck point, can be extracted stuck point from hole, then will card Suitable position in point insertion hole, therefore installation site of the stuck point in corresponding hole can be freely arranged.
Since the installation site of bottom stuck point 41, middle part stuck point 42, top stuck point 43 in corresponding hole all can freely be set It sets, so graphite boat of the invention can carry silicon wafer full wafer 5 and carry the fragment that the silicon wafer full wafer 5 is partitioned into;Full wafer 5 are square, and the width of full wafer 5 is greater than the vertical interval in bottom strip hole 31 and middle strip hole 32;Fragment are as follows: wide along full wafer 5 Direction is spent by fragment made of full wafer 5N etc. points of cuttings, and N is integer, N >=2;Fragment is rectangle, and the length of fragment is full wafer 5 width.
When being vertically arranged silicon wafer full wafer 5 with graphite boat carrying, bottom stuck point 41, middle part stuck point are first determined according to the size of full wafer 5 42, the installation site of top stuck point 43 makes middle part stuck point 42, top stuck point 43 be divided into the two sides of bottom stuck point 41, and middle part The width of stuck point 42, the horizontal space of top stuck point 43 and full wafer 5 is adapted, and makes the water of bottom stuck point 41 Yu middle part stuck point 42 Flat spacing is equal to the horizontal space of bottom stuck point 41 and top stuck point 43;Bottom stuck point 41, middle part stuck point 42, top stuck point 43 are all After installing, silicon wafer full wafer 5 is i.e. standing to be inserted, and a pair of of vertical edge of silicon wafer full wafer 5 is inserted into middle part stuck point 42, top stuck point respectively 43 annular groove, the annular groove of the bottom edge insertion bottom stuck point 41 of silicon wafer full wafer 5, and the bottom edge of silicon wafer full wafer 5 is by bottom stuck point 31 Bearing.
When being vertically arranged fragment with graphite boat carrying, bottom stuck point 41, middle part stuck point 42, top are first determined according to the size of fragment The installation site of stuck point 43 makes middle part stuck point 42, top stuck point 43 be divided into the two sides of bottom stuck point 41, and middle part stuck point 42, The horizontal space of top stuck point 43 and the width of fragment are adapted, and make the horizontal space etc. of bottom stuck point 41 Yu middle part stuck point 42 In the horizontal space of bottom stuck point 41 and top stuck point 43;Bottom stuck point 41, middle part stuck point 42, top stuck point 43 all install Afterwards, fragment, that is, standing inserts, and a pair of of vertical edge (i.e. a pair of of long side of fragment) of fragment is inserted into middle part stuck point 42, top card respectively The annular groove of point 43, the annular groove of bottom edge (i.e. a broadside of fragment) the insertion bottom stuck point 41 of fragment, and silicon wafer full wafer 5 Bottom edge is supported by bottom stuck point 31.Fragment can be two equal part fragments 51, the trisection fragment 52, four that silicon wafer full wafer 5 is partitioned into Equal part fragment 53.
The above is only a preferred embodiment of the present invention, it is noted that for the ordinary skill people of the art For member, without departing from the technical principles of the invention, several improvements and modifications can also be made, these improvements and modifications Also it should be regarded as protection scope of the present invention.

Claims (4)

1. a kind of silicon chip film-coated graphite boat, comprising: be vertically arranged graphite boat piece by the row that ceramic rod is serially connected;Graphite boat On piece is equipped with: can carry the stuck point group for being individually vertically arranged silicon wafer;It is characterized by:
The graphite boat piece is additionally provided with three for installing the hole of stuck point: positioned at the bottom strip hole of graphite boat piece bottom, being located at The middle strip hole at the vertical middle part of graphite boat piece, and the upper strips hole positioned at graphite boat piece top;Three holes penetrate through respectively The both side surface of graphite boat piece, three holes also all being laterally extended along graphite boat piece, and three holes are all by graphite boat Lateral one end of piece extends to the lateral other end;
Stuck point in same stuck point group includes: a bottom stuck point being connected in bottom strip hole, and one is connected in middle strip hole Middle part stuck point and one it is connected in top stuck point in upper strips hole;Bottom stuck point, middle part stuck point in same stuck point group and on Portion's stuck point, middle part stuck point therein, top stuck point are divided into the two sides of bottom stuck point.
2. it is according to claim 1 it is silicon chip film-coated use graphite boat, which is characterized in that the bottom stuck point, middle part stuck point and Top stuck point, they respectively include: through the support column of corresponding this of Kong Bingyu hole clamping;Support column and graphite boat piece are hung down Directly, support column is equipped with a pair of annular groove for the insertion of silicon wafer sideline, this is to the annular groove heart coaxial with support column, and this is to ring Shape slot is divided into the two sides of graphite boat piece.
3. silicon chip film-coated graphite boat according to claim 1, which is characterized in that the stuck point group is multiple, and this is more A stuck point group is arranged successively at equal intervals along the transverse direction of graphite boat piece.
4. silicon chip film-coated graphite boat according to claim 1, which is characterized in that the ceramic rod is two pairs, and each pottery Porcelain stick is parallel to each other;Each graphite boat piece is parallel to each other, and each graphite boat piece is arranged successively at equal intervals along the extending direction of ceramic rod; Single graphite boat piece is run through by above-mentioned two pairs of ceramic rods, and one pair of them ceramic rod is divided into the top lateral two of the graphite boat piece Side, another pair ceramic rod are divided into the bottom end both lateral sides of the graphite boat piece.
CN201910421035.5A 2019-05-21 2019-05-21 Graphite boat for silicon wafer coating Active CN110060951B (en)

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110323165A (en) * 2019-07-31 2019-10-11 常州时创能源科技有限公司 It is a kind of for carrying the graphite frame of silicon wafer

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CN208240631U (en) * 2018-01-10 2018-12-14 安徽继远检验检测技术有限公司 A kind of graphite boat of photovoltaic production
CN109082649A (en) * 2018-09-06 2018-12-25 深圳市捷佳伟创新能源装备股份有限公司 A kind of loading device of stable plated film
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CN109449252A (en) * 2018-11-15 2019-03-08 浙江艾能聚光伏科技股份有限公司 The manufacture craft of half multicrystalline solar cells
CN109747055A (en) * 2019-03-04 2019-05-14 常州时创能源科技有限公司 The preparation method and application of monocrystalline silicon piece
CN209607715U (en) * 2019-05-21 2019-11-08 常州时创能源科技有限公司 It is silicon chip film-coated to use graphite boat

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CN103862584A (en) * 2014-04-04 2014-06-18 常州时创能源科技有限公司 Squaring process and application of monocrystal silicon round bar for solar cells
CN204857689U (en) * 2015-08-20 2015-12-09 浙江艾能聚光伏科技股份有限公司 Novel structure graphite boat of solar cell
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CN206505899U (en) * 2017-02-22 2017-09-19 广东爱康太阳能科技有限公司 A kind of tubular film plating Horizontal graphite boat
CN207409466U (en) * 2017-10-16 2018-05-25 四川英发太阳能科技有限公司 A kind of graphite boat piece and graphite boat
CN208240631U (en) * 2018-01-10 2018-12-14 安徽继远检验检测技术有限公司 A kind of graphite boat of photovoltaic production
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CN109449252A (en) * 2018-11-15 2019-03-08 浙江艾能聚光伏科技股份有限公司 The manufacture craft of half multicrystalline solar cells
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CN209607715U (en) * 2019-05-21 2019-11-08 常州时创能源科技有限公司 It is silicon chip film-coated to use graphite boat

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110323165A (en) * 2019-07-31 2019-10-11 常州时创能源科技有限公司 It is a kind of for carrying the graphite frame of silicon wafer

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