CN210640202U

CN210640202U - Silicon chip guide device

Info

Publication number: CN210640202U
Application number: CN201921503826.4U
Authority: CN
Inventors: 张学强; 戴军; 张建伟; 罗银兵; 张巍
Original assignee: RoboTechnik Intelligent Technology Co Ltd
Current assignee: RoboTechnik Intelligent Technology Co Ltd
Priority date: 2019-09-10
Filing date: 2019-09-10
Publication date: 2020-05-29
Anticipated expiration: 2029-09-10

Abstract

The utility model discloses a silicon chip leads carries device, including broach piece and picture peg, the equidistance is provided with a plurality of slots on the picture peg, broach piece one end is inserted in the slot, form the groove of stepping down between the adjacent broach piece, a picture peg side is equipped with and link up the locking screw hole of slot, locking screw pass through locking screw hole butt broach piece, in order to fix the broach piece, the jack groove of extending along vertical direction is seted up to the broach piece other end, makes the convenient dismantlement of broach piece when guaranteeing broach piece thickness, improves and changes efficiency, reduces the influence that the broach piece damaged and bring.

Description

Silicon chip guide device

Technical Field

The utility model relates to a semiconductor element manufacture equipment technical field, concretely relates to silicon chip leads carries device.

Background

The solar cell industry has developed rapidly in recent years, and equipment used for solar cell manufacturing has therefore also exhibited a rapid trend of development. One of the silicon wafer transfer devices used in the solar cell manufacturing process is a silicon wafer transfer device.

In order to form a PN junction in a solar cell, phosphorus diffusion is generally performed on a P-type silicon wafer doped with a trivalent element such as boron (B). At present, a common phosphorus diffusion process is performed in a diffusion furnace containing phosphorus elements, and in order to improve the efficiency of phosphorus diffusion of silicon wafers, a plurality of silicon wafers are usually inserted into a quartz boat, and then the quartz boat is placed into the diffusion furnace for phosphorus diffusion.

In the prior art, a silicon wafer transfer device is used for transferring silicon wafers from a bearing box to a quartz boat. The silicon wafer transshipment equipment transships the silicon wafer from the bearing box to the quartz boat through the silicon wafer guide device, the silicon wafer guide device is provided with tooth parts distributed at equal intervals, the silicon wafer is clamped in tooth gaps of the tooth parts, and the guide device moves up and down to guide the silicon wafer to be loaded into slots of the quartz boat. The tooth parts of the guide and load device are integrally arranged, and when the individual tooth parts damage the whole guide and load device, the whole guide and load device needs to be integrally disassembled or completely replaced, so that the operation is complex and the cost is high.

Disclosure of Invention

The to-be-solved technical problem of the utility model is to provide a convenient to detach changes a tooth, improves life's silicon chip and leads and carry device.

In order to solve the technical problem, the utility model provides a silicon chip leads carries device, including broach piece and picture peg, the equidistance is provided with a plurality of slots on the picture peg, broach piece one end is inserted in the slot, form the groove of stepping down between the adjacent broach piece, a picture peg side is equipped with and link up the locking screw hole of slot, locking screw pass through locking screw hole butt broach piece, in order to fix the broach piece, the jacking groove of extending along vertical direction is seted up to the broach piece other end.

Furthermore, the slot penetrates through the inserting plate, a bottom plate is arranged at one end of the slot, and the bottom plate is fixedly connected with the inserting plate through a fastening screw.

Furthermore, the cross section of the bottom plate is convex, and the bottom surface of the inserting plate is concave matched with the bottom plate.

Further, the bottom of the jacking groove is provided with a placing inclined plane inclined towards one side of the comb tooth piece, and the included angle between the placing inclined plane and the horizontal plane is 30-60 degrees.

Further, the depth of the jacking groove is not more than that of the yielding groove.

Further, the width of the jacking groove is smaller than that of the abdicating groove.

Further, a guide inclined plane which enables the top opening to gradually expand outwards is arranged at the top opening of the jacking groove.

Furthermore, the included angle between the guide inclined plane and the vertical direction is 5-15 degrees.

The utility model discloses a silicon chip is led and is carried device beneficial effect compared with prior art is, makes the convenient dismantlement of broach piece when guaranteeing broach piece thickness, improves and changes efficiency, reduces the influence that the broach piece damaged and bring.

Drawings

Fig. 1 is a schematic view of the overall structure of the present invention;

fig. 2 is a front view of an embodiment of the present invention;

FIG. 3 is an enlarged view of the structure of region A in FIG. 2;

fig. 4 is a schematic diagram of a second working structure according to the embodiment of the present invention.

Detailed Description

The present invention is further described with reference to the following drawings and specific embodiments so that those skilled in the art can better understand the present invention and can implement the present invention, but the embodiments are not to be construed as limiting the present invention.

Referring to fig. 1, the utility model discloses a silicon chip leads embodiment a schematic diagram that carries device, this device include broach piece 10 and picture peg 20, and every broach piece 10 inserts the picture peg 20 alone in, can take off certain broach piece 10 alone when consequently dismantling, need not to lead to carry the whole dismouting change that carries on of device, convenient operation improves the life who leads the device, reduces the replacement cost. In order to install the comb teeth sheets 10, a plurality of slots 21 are arranged on the inserting plate 20 at equal distances, one end of the comb teeth sheet 10 is inserted into the slots 21, the number of the comb teeth sheets 10 corresponds to the number of the slots 21, therefore, the adjacent comb teeth sheets 10 are arranged at equal intervals, in this embodiment, for fixing the comb teeth sheets 10, one side surface of the insert plate 20 is provided with a locking threaded hole 22 penetrating through the slot 21, i.e. the locking screw 23 can extend into the slot 21, when the comb plate 10 is inserted into the slot 21, one end of the locking screw 23 is screwed into the slot 21 through the locking threaded hole 22, so that the locking screw 23 is abutted against the comb teeth sheet 10 to press the comb teeth sheet 10 in the slot 21, thereby preventing the comb teeth sheet 10 from shaking in the slot 21 or falling off due to loose caused by weak fixation, and in order to ensure the stability of the comb teeth sheet 10, two locking screws 23 are provided, and two locking threaded holes 22 are arranged at intervals along the length direction of the comb teeth sheet 10. In this embodiment, interval between the adjacent broach piece 10 is for stepping down groove 11, the jacking groove 12 that extends along vertical direction is still seted up to broach piece 10 other end, and the during operation, the silicon chip card is established in jacking groove 12, and when leading the silicon chip and carry to the mounting groove of quartz boat in, the silicon chip in jacking groove 12 inserts in the quartz boat, steps down the existing silicon chip in the quartz boat that groove 11 can be avoided for the thickness of broach piece 10 can increase, thereby increases its bulk rigidity and structural strength.

Referring to fig. 2, which is a front view of the embodiment, the depth of the jacking groove 12 is not greater than the depth of the abdicating groove 11, so as to ensure that the abdicating groove 11 has a sufficient depth to avoid the silicon wafers 30 already placed in the quartz boat. The width of jacking groove 12 is less than the width of abdicating groove 11, because the silicon chip 30 that is led and carries is placed in jacking groove 12, the less jacking groove 12 of width can reduce the range that silicon chip 30 rocked on the one hand, and the broach piece 10 thickness of on the other hand jacking groove 12 both sides is thicker to non-deformable or rupture. Referring to fig. 3, which is an enlarged view of the structure of the area a in fig. 2, a guide inclined plane 13 is disposed at the top opening of the jacking groove 12 to gradually expand the top opening, so that the top opening of the jacking groove 12 has a width greater than that of the bottom thereof, and the silicon wafer 30 is conveniently inserted into the jacking groove 12. The included angle between the guide inclined plane 13 and the vertical direction is 5 degrees to 15 degrees, and in the embodiment, the included angle between the guide inclined plane 13 and the vertical direction is 10 degrees.

Referring to fig. 4, do the utility model discloses a two working structure side views of embodiment and cross-sectional view, in this embodiment, for convenient processing slot 21, set up slot 21 runs through picture peg 20, slot 21 one end is provided with bottom plate 24, supports broach piece 10 through bottom plate 24, and this kind of method can guarantee that the depth that broach piece 10 inserted picture peg 20 is the same, and is further, when leading the year to silicon chip 30, guarantees silicon chip 30's uniformity. The bottom plate 24 is fixedly connected with the inserting plate 20 through fastening screws. By arranging the inserting plate 20, the guide loading device is conveniently connected with other mechanisms. Furthermore, in another preferred embodiment of the present invention, the cross section of the bottom plate 24 is a convex shape, and the bottom surface of the insert plate 20 is a concave shape matched with the bottom plate 24, so as to facilitate the matching installation of the bottom plate 24 and the insert plate 20.

Further, the utility model discloses because the width is narrower, when using, for supporting silicon chip 30, adopt two to lead and carry device complex forms, silicon chip 30 is supported two and is led and carry between the device, for the shape of cooperation silicon chip 30 and place the angle, the bottom in jacking groove 12 is equipped with the inclined plane 14 of laying to broach piece 10 lopsidedness, the contained angle of laying inclined plane 14 and horizontal plane is 30 ~ 60, makes silicon chip 30 lead by two and carries the device and can stabilize the centre gripping in its left and right directions, prevents to rock or skew central point puts jacking in silicon chip 30 production. In this embodiment, the inclined surface 14 is preferably disposed at an angle of 45 ° to the horizontal.

The working principle of the utility model is as follows: because the interval that is used for on the quartz boat to lay between the mounting groove of silicon chip 30 is less, only 2 ~ 3 mm's distance usually, comb piece 10 according to so little distance preparation often because thickness is less, length is longer and makes comb piece 10's rigidity relatively poor, lead to comb piece 10 to warp or break easily at the guide in-process, consequently set up in this application and let groove 11 and jacking groove 12, the interval between the groove 11 of stepping down and the interval between jacking groove 12 are the twice of quartz boat mounting groove interval, make the thickness of comb piece 10 can increase, thereby increase its whole rigidity and structural strength. In this case, the silicon wafer 30 on the quartz boat can be inserted/taken twice.

Specifically, a first group of silicon wafers 30 are placed in the jacking groove 12, the transfer equipment inserts the comb-tooth piece 10 together with the first group of silicon wafers 30 into a silicon wafer 30 mounting groove of the quartz boat, and the odd/even silicon wafer 30 mounting groove is filled with the first group of silicon wafers 30; then the loading guide device is reset, the loading guide device or the quartz boat integrally moves to one side for the distance between the adjacent silicon wafer 30 mounting grooves, a second group of silicon wafers 30 are placed in the jacking groove 12, the transferring equipment inserts the comb plate 10 and the second group of silicon wafers 30 into the silicon wafer 30 mounting grooves of the quartz boat, at the moment, the even-numbered/odd-numbered silicon wafer 30 mounting grooves are filled with the second group of silicon wafers 30, and the first group of silicon wafers 30 are accommodated in the abdicating groove 11; and finally, the loading guide device is reset, the step of inserting the silicon wafer 30 on the single quartz boat is completed, and the step of taking the silicon wafer 30 is reversed. In the course of the work, if the condition that a certain or several broach pieces 10 damaged appears, only need unscrew the locking screw 23 that corresponds with this broach piece 10 and can remove this broach piece 10 and do not have the influence to other broach pieces 10, improve the replacement efficiency, reduce the influence to production.

The above-mentioned embodiments are merely preferred embodiments for fully illustrating the present invention, and the scope of the present invention is not limited thereto. Equivalent substitutes or changes made by the technical personnel in the technical field on the basis of the utility model are all within the protection scope of the utility model. The protection scope of the present invention is subject to the claims.

Claims

1. The utility model provides a silicon chip leads carries device, a serial communication port, including broach piece and picture peg, the equidistance is provided with a plurality of slots on the picture peg, broach piece one end is inserted in the slot, form the groove of stepping down between the adjacent broach piece, a picture peg side is equipped with and link up the locking screw hole of slot, locking screw pass through locking screw hole butt broach piece, in order to fix the broach piece, the jacking groove along vertical direction extension is seted up to the broach piece other end.

2. The silicon wafer loading guide device according to claim 1, wherein the slot penetrates through the insert plate, a bottom plate is arranged at one end of the slot, and the bottom plate is fixedly connected with the insert plate through a fastening screw.

3. The silicon wafer loading guide apparatus as claimed in claim 2, wherein the bottom plate has a convex cross-section, and the bottom surface of the insert plate has a concave shape which fits the bottom plate.

4. The silicon wafer guide device according to claim 1, wherein the bottom of the lift-up groove is provided with a placement slope inclined to one side of the comb teeth, and the angle between the placement slope and the horizontal plane is 30-60 °.

5. The silicon wafer guide device of claim 1, wherein the depth of the jacking groove is not greater than the depth of the abdicating groove.

6. The silicon wafer guide device of claim 1, wherein the width of the jacking slot is less than the width of the abdicating slot.

7. The silicon wafer guide apparatus of claim 1, wherein the top opening of the lift groove is provided with a guide slope that gradually expands the top opening.

8. The silicon wafer guide apparatus of claim 7, wherein the angle between the guide slope and the vertical direction is 5 ° to 15 °.