TW201020194A - Substrate processing apparatus and substrate conveying apparatus for use in the same - Google Patents

Abstract

A substrate processing apparatus includes a substrate processing section that processes a plurality of substrates assuming a vertical posture in a batch manner; a first traversing mechanism that laterally moves a first traverse holding portion along a first traversing path between a substrate transfer position and a substrate delivery position; a second traversing mechanism that laterally moves a second traverse holding portion along a second traversing path disposed below the first traversing path between the substrate transfer position and the substrate delivery position; an elevation mechanism that raises and lowers an elevation holding portion in the substrate transfer position; and a main transfer mechanism that conveys a plurality of substrates assuming a vertical posture in a batch manner between the substrate delivery position and the substrate processing section, the first and second traverse holding portions, and the elevation holding portion each holds a plurality of substrates assuming a vertical posture in a batch manner.

Description

[Technical Field] The present invention relates to a substrate processing apparatus for collectively performing processing on a plurality of substrates, and a substrate transporting apparatus provided in the substrate processing apparatus. The substrate to be processed or transported includes, for example, a semiconductor wafer, a substrate for a liquid crystal display device, a substrate for a plasma display, a substrate for FED (Field EmiSsi (Dn Display)), a substrate for a disk, and a disk. A substrate, a substrate for a magneto-optical disk, a substrate for a photomask, etc. [Prior Art] A substrate processing apparatus for performing a treatment using a chemical liquid on a substrate such as a semiconductor wafer is a batch type in which a plurality of substrates are collectively processed. An example of a batch type substrate processing apparatus is disclosed in Japanese Patent Laid-Open No. Hei. No. 4, the substrate processing apparatus is wounded with: a carrier mounting portion, a horizontal transfer robot, a posture switching mechanism, and a pusher. (-e small main conveying mechanism and substrate processing unit. The carrier mounting portion carries a carrier (receiving container) which is in a horizontal state and a laminated state in a vertical direction. The horizontal transfer machine is composed of a vertical multi-joint robot type transfer robot, which is configured to expand and contract the multi-joint robot. Turning the wrong straight axis to rotate the film, ~, thereby, the horizontal transfer robot will face the multi-joint robot arm toward the carrier, and layer the substrate in a horizontal position and face straight direction, 098130024 4 201020194 When the person is out, the multi-joint arm is rotated toward the posture, and the substrate is stacked in the vertical direction and transferred to the posture conversion mechanism. The horizontal transplant robot is detachable. The articulated arm last arm and the monolithic arm. The batch arm is used to transport the composite substrate, and the single-arm arm is used to transport the cymbal 每次 every time. The replacement of the arm is carried out by the horizontal transfer robot, the mechanical part, the replacement part, and the (four) application. The rhyme arm (4) material has 3 side arm fixing brackets, which are divided into _ Yu Jian: batch type robot arm, unprocessed substrate The monolithic robot arm and the single-piece robot arm for processing the substrate. The horizontal transfer robot is, for example, when the batch robot arm is disassembled and the monolithic robot arm is installed, it is based on the batch robot arm (4)@ Batching (4) batch The robot arm is configured to be mounted on a single-piece robot arm that is housed on the robot arm holder of the one-piece robot arm, thereby automatically replacing the robot arm without requiring the person I. The conversion mechanism converts the plurality of layers of the substrate into a horizontal posture and a vertical posture. The pusher system has a fixing frame capable of moving up and down and horizontally moving, and is vertically aligned with the posture changing mechanism. In the transfer of the post-propagation substrate, the transfer of the plurality of substrates in a vertical posture is performed in a unified manner between the main transfer mechanisms, and the pitch of the plurality of filament boards is reduced, and the substrate is held at a flying distance. For example, from the posture conversion mechanism After the 25-piece 098130024 201020194 board is transferred to the holder, the holder is moved by a small distance toward the water in the direction of the substrate stack. In this state, the other 25 substrates are transferred from the posture switching mechanism to the mosquito trap. The 25 substrates conveyed later will form a batch of the total $/first board on the holder between the 25 boards that were transferred before the eve. Accordingly, the offset formed by combining the plurality of substrate groups = "base group". When the substrate is transferred from the pusher to the posture conversion mechanism, 25 of the 50 substrates held by the fixed Y-Y is transferred to the posture conversion mechanism frame, and the 25 substrates are converted into a horizontal posture, and then transmitted to the 50-piece substrate. Level in the robot. Money, the remaining 25 pieces of substrate on the fixed frame are transferred to the posture shifting mechanism, and after being converted into a horizontal posture by the posture, it is convenient to use the water transplanting machine = transfer out. Accordingly, 50 substrates were separated into two groups of 25 substrates, and the plurality of substrates formed into a batch were separated into a plurality of substrate groups/"batch release". * The main transport mechanism has a plurality of substrates on which a batch is formed, and the substrate holder held in a vertical posture can move the plurality of substrates constituting the batch to the substrate processing unit by moving the substrate holder in the horizontal direction / Move out. In order to clean the substrate holder, for example, between the pusher and the main transfer mechanism, a jig cleaning unit is disposed below the substrate transfer position. The substrate processing unit is provided with a plurality of processing units arranged along the moving direction of the main transport mechanism. The processing unit includes a chemical liquid tank, a water washing tank, and a drying unit. The drug solution tank is configured such that a plurality of substrates in a vertical posture are immersed in a chemical solution stored in the tank, and a plurality of substrates are collectively subjected to a chemical liquid treatment. In the washing tank, a plurality of substrates in a vertical position of 098130024 6 201020194 are immersed in the tank, and pure water (deionized water) is uniformly applied to the plurality of substrates to collectively apply an organic solvent to the plurality of substrates. Cleaning) processing. The drying part is treated with a dry ingredient. _such as isopropyl alcohol) supply, or liquid month 1j, the first step in the technology of the substrate processing, the base of the organization, the 基 丨 ' ' ' 推 四 四 四 四 四 四 四 主 主 主 主 主 主 主 主 主 主 主 主 主 主 主 主 主The substrate is carried out and the substrate is transferred to the substrate. Moreover, when the untreated substrate is not sent to the unprocessed substrate and the unprocessed substrate is fed into the main transport mechanism, since the batch group operation must be performed on the solid frame of the pusher, since the substrate is processed, Reluctantly long-time _ mechanism up to the outbound structure: 推动: the pusher 'will use the pusher for the front secret path from the posture conversion mechanism to the main transport mechanism, and the other pusher for use from the main transport mechanism It is transported to the return path of the posture switching mechanism. However, according to this configuration, an increase in the occupied area (coverage area) of the device is inevitable. SUMMARY OF THE INVENTION The purpose of the present invention is to provide a substrate processing apparatus capable of increasing the processing speed of a substrate while suppressing the occupied area of the apparatus. Another object of the present invention is to provide a substrate carrying position which can shorten the time required for switching between the integrated transfer of the plurality of substrates and the single-piece transfer of the single-piece substrate, and which can be simplified in structure. Still another object of the present invention is to provide a substrate processing apparatus having such a substrate transfer apparatus. 098130024 201020194 The substrate processing apparatus according to the aspect of the invention includes a substrate processing unit, a first traverse mechanism, a second traverse mechanism, an elevating mechanism, and a main transport mechanism; and the substrate processing unit 复 a plurality of substrates in a vertical posture The first horizontal traveling mechanism is configured to integrate the first horizontal row holding portion of the plurality of substrates held in the vertical posture between the substrate transfer position and the substrate transfer position along the first horizontal path; a second horizontal row holding portion of the plurality of substrates in the vertical posture of the structure (4), and a second horizontal path that is lower than the second horizontal path of the substrate transfer position m; the lifting mechanism And a lifting and lowering portion of the plurality of substrates that maintain the vertical posture is raised and lowered at the substrate transfer position; the main transfer mechanism is configured between the substrate transfer position and the substrate processing portion, and the plurality of substrates in the vertical posture are integrated Transfer. According to this configuration, the substrate transfer between the substrate transfer position and the substrate transfer position is performed by the first and second horizontal paths which are arranged vertically by the 帛1 traverse mechanism and the second traverse mechanism. In other words, the transport of the substrate can be carried out by transferring the substrate between the substrate transfer position and the substrate transfer position. Thereby, the substrate transfer from the substrate transfer position to the substrate transfer position can be carried out by any of the second and second traverse mechanisms and can be transferred from the substrate transfer position to the substrate transfer position, and can be first and second. The other of the rampages is implemented. For example, the substrate processed by the substrate processing unit is transported to the substrate transfer position by the main transfer mechanism, and the fourth (4) let (4) secret transfer to the i-th row holding unit 41 is carried out through the second horizontal path to 098130024 201020194 The carrier position is transferred by the lifting and lowering of the lifting mechanism to the lifting line, and the material is transferred. On the other hand, when the unprocessed substrate is loaded, the second horizontal line is transferred to the substrate transfer position. Then, the moving plate is held in advance by the lifting and lowering portion to facilitate the lifting and lowering of the lifting portion. After that, the flute am is lowered and transferred to the second horizontal line to hold and then the 4 2 & 仃 holding portion will be moved to the substrate. Then, the substrate to be transferred at the transfer position of the substrate is transferred to the processing unit = the transfer mechanism of the main transfer mechanism, and the substrate is moved toward the substrate. Therefore, the main transfer mechanism is moved to the third substrate. After the second portion, the second substrate holding portion can perform the operation of receiving the unprocessed substrate, and the position of the substrate (4) can be checked in the position of the substrate (4), and the substrate can be carried out. As a result, the substrate transfer retention can be suppressed, and the substrate processing speed can be improved by ® . Further, since the first and second traverse mechanisms pass through the first horizontal path of the first disk set up and down, and the second traverse and the second horizontal traverse are traversed, the device footprint can be suppressed even if the transport path is provided with two systems. Preferably, the first horizontal traveling mechanism is dedicated to the removal of the substrate, and the second horizontal traveling mechanism is preferably used for the loading of the unprocessed substrate. By this, the processing substrate can be transported through the upper path, so that the processing substrate can be kept in a clean state. 098130024 9 201020194 Preferably, the substrate processing apparatus further includes a posture conversion mechanism that collectively converts the plurality of substrates in the horizontal posture from the horizontal posture to the vertical posture, and transfers the position to the substrate transfer position. At the same time, the elevating mechanism at the same time collectively collects a plurality of substrates held in a vertical posture by the elevating mechanism located at the substrate transfer position, and switches from a vertical posture to a horizontal posture. In this configuration, the substrate processing apparatus further preferably includes a container holding portion and a loading and unloading mechanism, and the container holding portion holds the container, the container is for receiving a plurality of substrates in a horizontal posture; The loading mechanism collectively performs the loading and unloading of the plurality of substrates in the horizontal posture on the container held by the container holding portion, and collectively performs the transfer of the plurality of substrates in the horizontal posture with the posture switching mechanism. . With such a configuration, a plurality of substrates can be collectively taken out and processed from a container in which a plurality of substrates are accommodated in a horizontal posture. Further, the processed plurality of substrates can be housed in a container. Preferably, the second substrate transport path between the carry-in/out mechanism and the elevating mechanism and the second substrate transport path between the elevating mechanism and the substrate transfer position intersect at a predetermined angle. In this case, it is preferable that the elevating mechanism is disposed at an intersection of the first worker and the second substrate transport path. When the structure is linearly connected to the first substrate transport path and the second substrate transport path, the installation space of the carry-in mechanism can be easily ensured. As a result, the footprint of the device can be reduced. Moreover, it is also easy to move the access mechanism, 098130024 10 201020194 posture switching mechanism, lifting mechanism and substrate transfer position. In other words, when the alignment is performed, the first substrate transport path is aligned, the lift mechanism and the substrate transfer mechanism are aligned with the second substrate transport path, and the lift mechanism is placed in the first position. The intersection with the second soil transporting path 1 can be performed if the alignment is performed, and the former is aligned with the transfer position mechanism, the lifting mechanism, and the substrate transfer position on the same line. Obviously easier. The moving mechanism may further include: a batch type robot arm that holds a plurality of substrates in a horizontal posture, a robot arm advance and retreat mechanism that advances and retracts the batch type robot arm in a horizontal direction, and an upper type: an undertype In the case of the right axis, the rotary _ turn mechanism is used. In this case, the village is the robot that advances and retreats when the container held by the above-mentioned batch type container holding unit is protected by the surname # Ρ The arm moves forward and backward, and the direction is perpendicular to the horizontal direction of the second substrate transport path. The plurality of substrates in the horizontal posture are transferred to the posture conversion mechanism, and the water is collectively collected from the posture changing mechanism. The batch type robot arm rotates, and the phase is taken out and taken out from the container in a unified manner. 'The batch type robot arm can be rotated and can be constructed. In addition, the batch type robot arm is used to collect the plurality of substrates in the horizontal posture, and Batch of arms

098130024 201020194 is a second drive mechanism in which the rotary drive mechanism ==i diameter and the first posture of the plurality of substrates held in the vertical posture and the second posture of the plurality of substrates held in the vertical posture along the second substrate transport path Between the above, the lifting and lowering holding portion is formed around the straight axis of the ship. New, (4) Jane Money can transfer the substrate between the first and second horizontal mechanisms and the posture conversion mechanism. Further, the 'feeding and lowering mechanism is preferably configured to transfer the plurality of substrates in the vertical posture from the lifting and lowering portion to the second horizontal holding portion in a vertical direction, and the lifting and lowering portion is used by the lifting and lowering portion. The plurality of substrates 'in a vertical posture held by the first horizontal traveling holding portion are collectively picked up by the above-described lifting and holding unit. In this way, the second horizontal row can be moved to the inspection base (4), and the first horizontal row holding portion can be used for carrying out the substrate. By using the first horizontal row holding portion 211 disposed above the second horizontal row holding portion for carrying out the processing of the substrate, it is possible to prevent the foreign matter from falling onto the processing substrate from the unprocessed substrate. Preferably, the substrate processing apparatus for raising and lowering the position further includes an intermediary mechanism for correcting the correction of the plurality of substrates, and the substrate is transferred to the substrate according to the structure. The transfer of the substrate is performed between the holding portions of the first and/or the 21st row. For example, the intermediate mechanism preferably transfers the plurality of substrates in a unified manner between the second lateral rotating portion and the second horizontal rotating portion by the intermediate medium holding portion being placed on the substrate. Thereby, for example, the second riding unit can be transferred to the substrate transfer position after being transported to the substrate transfer position at the silk plate transfer position of the Silk County. Thereby, the second horizontal turning portion can perform an operation for collecting the next unprocessed substrate from the elevating mechanism. Therefore, the unprocessed substrate can be placed in the middle of the stencil before it is collected by the main transport mechanism, so that the waiting time for the second traverse holding portion to move into the next unprocessed substrate can be shortened. . Thereby, the substrate processing speed can be further improved. In this case, it is preferable that the main transport mechanism is configured to transfer the plurality of substrates in a unified manner between the first lateral row holding portion and the intermediate medium holding portion at the substrate transfer position. In this way, for example, the main transport mechanism can produce a cleaning operation in such a manner that the processing substrate is carried out by the i-th row holding 4 towels and the unprocessed substrate is received from the intermediary holding portion. In this case, the second holding unit _ the second horizontal running unit has the unprocessed substrate reading base (4) at the position, so that the buffer (standby place) function before the unprocessed substrate is transferred to the main transport mechanism can be exhibited. As a result, for example, when the substrate processing time is changed by the change of the substrate processing conditions, the variation of the time interval is absorbed by the medium holding portion. Thereby, the stagnation of the substrate loading can be suppressed, so that the substrate processing speed can be further improved. Preferably, the substrate processing apparatus further includes a substrate alignment mechanism that is disposed at a position lower than the second horizontal path at the substrate transfer position and that aligns the plurality of sheets 098130024 13 201020194 in the direction of the substrate. According to this configuration, since the substrate direction alignment mechanism is provided at the substrate transfer position, the substrate direction alignment mechanism can be set without increasing the occupied area. The substrate direction alignment mechanism may perform substrate alignment processing on the substrate held by the second lateral holding portion at the substrate transfer position. For example, when a notch portion (notch or orientation plane) indicating a crystal direction or the like is formed on a circular substrate such as a semiconductor wafer, the substrate alignment process is a process of aligning the notch portions. Furthermore, the first horizontal row holding portion preferably includes a pair of substrate guides that are parallel to each other and a guide opening and closing unit that opens the gap between the pair of substrate guide members larger than The open state of the substrate width is changed between a closed state in which the width of the substrate is narrower than the width of the substrate but larger than the width of the lift holding portion. If the state of the substrate is held by the substrate guide wire, the lift holding portion is raised by the pair of the substrate guides, and the base (4) can be transferred from the substrate guide to the lift holding portion. After the substrate is transferred to the lift holding portion, if the substrate guide is opened, the substrate guide can be lowered by the substrate guide member and the substrate to be fed. In accordance with this, the "1" horizontal (four) holding portion transfers the substrate to the lifting and holding portion. A substrate conveying apparatus according to another aspect of the present invention includes: a batch type machine arm, a batch arming arm mechanism, a single piece advance and retreat mechanism, a 拄^ an early type machine # constituting a base, and a lifting mechanism And the slewing mechanism, and the batch type 098130024 201020194 mechanical arm system holds the plurality of substrates in a laminated manner (4); the batch type mechanical arm advance and retreat mechanism enables the batch type mechanical arm to advance and retreat; the single piece The mechanical arm system maintains a wire plate; the fresh machine mechanism causes the single-piece 2 arm to advance and retreat; the Saki base system (4) the batch-type robot arm advance and retreat mechanism arm advance and retreat mechanism; the lifting mechanism enables the The structure in which the susceptor is rotated and the hopper is oriented in the direction of the material base is stored in the prior art replacement unit described in the Japanese Patent Publication No. 354604, and the remaining mechanical arms other than the machine are replaced by the mechanical arm. Chest ^ Set the space for the arm replacement part. Moreover, when the shifting portion is accessed, the horizontal shifting robot has to be more necessary for the robot arm to perform the required robot arm:: and the robot arm replacement takes time. Processing speed. During the processing, 'the substrate will be greatly damaged.' In addition, the robot can be replaced by a hard-moving access to the horizontal arm, but the vertical multi-joint robotic arm will be used vertically. . It is also a high unit price, so the structure of the p-arm type robot is complicated, and thus, it is a problem of improving the profit. When the direction is moved, the copying robot arm robot must transport the substrate toward the horizontal substrate, and the drive shaft can be driven synchronously. So if there is a bad possibility. Therefore, there will be vibrations in the machine, and there may be a problem of transporting 098130024. It is difficult to mention the substrate transfer speed, and therefore the phenomenon 201020194 will be more difficult to improve the productivity of the substrate processing apparatus. ❹ On the other hand, according to the substrate transfer apparatus of the present invention having the above-described structure, the batch type robot arm advances and retreats the batch type robot arm advance and retreat mechanism, and the one-piece type arm arm advance and retract mechanism that advances and retreats, Maintained by a common base. Thief, the ship's Baoxian Miscellaneous _ lifting into the upper and lower movements, and a rotary machine _ round direct gift to carry out, for the transfer of the object location, so that the subtraction machine (four) or the single-piece robotic arm in the relative state of the 'crowd The financial operation or the single-receiving arm advances and retreats the target site, and the substrate can be carried in and out of the transfer target site.批次The batch type robot arm advance and retract mechanism and the single-piece arm advance and retreat mechanism are separate settings, so the batch.. roll can advance and retreat independently. In the case of the robotic arm, the mechanical arm will be used. Therefore, since the robot arm is not required to be replaced, the total transfer of the plurality of substrates by the batch type robot arm and the use of the single-piece robot arm (4) The switching of the single correction of the substrate can be achieved by any one of the batch machine movement advance/retract mechanism or the single-piece robot arm advance and retreat mechanism. Therefore, unlike the prior art described above, the overall transfer = switching between single-chip transfers will not take a long time. Thereby, even when the switching between the overall transfer and the single-sheet transfer is required, the substrate transfer can be efficiently performed. Furthermore, since there is no need to replace the robot arm, a vertical multi-joint robot arm type robot having a complicated structure as in the prior art is not required, and a lifting mechanism for moving the holding base and a swing for rotating the holding base are provided. Machine 098130024 16 201020194 constituting 'and in the (four) base rainbow set thief _ _ arm arm arm advance and retreat mechanism can be. Therefore, (10) in the cutting technology, because _ simple, _ can be a big correction. Moreover, the substrate movement of the horizontal amount is controlled by the rotation of the holding base and the advancement and retreat of the arm. (4) In the case of a multi-joint robot type robot, it is necessary to perform the same operation of the complex drive. Therefore, the transport speed of the substrate can be increased. ❹ Furthermore, since the arm replacement part is not required, the area (coverage area) can be reduced. The * of the I has another 'the direction of the advance and retreat of the batch type robot arm, and the direction of the monolithic machine may be different, but it is preferably parallel. Retreat the back center of each of the above-mentioned batch type robot arm and the single-piece machine, and then the lower U-shirts are respectively made, because the state of the batch can be reduced. According to the radius of gyration of this configuration, due to: The sheet type robot arm performs the retracting shape, and the single-piece type robot arm preferably sets the installation space of the soil preparation device. The two robot arm elements are disposed, and the mechanical arm elements are separated from each other to be equipped with the first substrate and the second substrate. In this case, the first step includes the arm opening and closing mechanism that opens and closes by moving the above-mentioned 2^ substrate, and the two armes are opened in the horizontal direction. In the above-mentioned first substrate cut portion, the two mechanical arms are described in the second mechanical arm, and the two mechanical arms are required to hold the substrate at the same time and in the closed state. _ 098130024 J 丄 brother 201020194 The second substrate support portion holds the substrate at the second height. According to this configuration, the two arm requirements are opened and closed by the mechanical arm opening and closing mechanism. Supported by the first substrate supporting portion The state of the substrate or the state in which the substrate is supported by the second substrate supporting portion. Since the first and second substrate supporting portions are at different heights, when the substrate is supported by one of the substrate supporting portions, the substrate can be formed. The substrate does not come into contact with the other substrate supporting portion. Therefore, the first and second substrate supporting portions can be used to support the floor substrate. For example, one of the first and second substrate supporting portions can be used. The support of the unprocessed substrate is used, and the other is used to process the support of the substrate. Thereby, the one-piece robot can be used separately for two purposes without the need to prepare individual unprocessed as in the prior art described above. The one-piece robot arm for the substrate and the one-piece robot arm for processing the substrate do not need such replacement. Therefore, it is not necessary to use the robot arm in addition to the robot arm that does not need to be replaced. The replacement processing time and the processing of the substrate are performed by the individual substrate supporting portions 。. The substrate processing apparatus according to another aspect of the present invention includes: a container holding cassette, a substrate holding portion, and The substrate transfer device is configured to hold the container in which the plurality of substrates are stacked in a state in which the plurality of substrates are stacked; the substrate holding portion is a (four) substrate; and the substrate is moved (4) in the container. According to this configuration, the container is transported between the container and the substrate holding unit. 098130024 18 201020194 According to this configuration, the container held by the container holding unit and the substrate holding unit are reduced (four) to send a profit. It is implemented by the transfer of the arm, or by the single-plate transfer of the single-piece robot. When switching between the integrated transfer and the single-piece transfer, the time required for the replacement of the robot arm can be eliminated. This switching can be quickly performed, thereby increasing the speed of substrate transfer and thus increasing the processing speed of the substrate. The above or other objects, features and effects of the present invention can be implemented by referring to the following drawings. The form is clear and clear. [Embodiment] FIG. 1 is a schematic plan view for explaining the entire structure of a substrate processing apparatus according to an embodiment of the present invention. The substrate processing apparatus 1 includes a wafer cassette (F0UP 'Front Opening Unified Pod, a wafer cassette) holding unit, a substrate processing unit 2, a main transport mechanism 3, and a loading and unloading mechanism 4, The posture changing mechanism 5, the pusher 6, the transfer mechanism 7, the clip cleaning unit 8, and the controller 9 (control unit). The wafer cassette holding portion 1 is disposed in a rectangular portion of the substrate processing apparatus 10 - a corner portion in plan view. The cassette holding portion i belongs to a container holding portion that holds the wafer cassette F, and the wafer cassette F is formed in a plurality of sheets (for example, 25 sheets) in a horizontal posture in the z direction (up and down direction, vertical direction). The container in which the storage is carried out. According to the front surface 1a of the substrate processing apparatus 10 (corresponding to a short side in a plan view), the automatic wafer cassette transport apparatus shown by the two-dot chain line is arranged in the opposite direction. It has the function of supplying the wafer cassette ρ that has accommodated the unprocessed substrate W to the wafer cassette holding unit 1 and the wafer cassette to which the processed substrate w is to be accommodated, as described in the following: 098130024 19 201020194 (empty yen) is supplied to the wafer cassette holding portion 1; and the wafer held by the wafer cassette holding portion 1 is replaced by the wafer cassette held by the holding unit 1 The role of the box F retreat. In the present embodiment, the substrate W is a circular substrate like a semiconductor wafer. For example, a semiconductor wafer is provided with a notch indicating a crystal direction at the peripheral portion. The substrate processing unit 2 is a plurality of processing units 20 (processing units) arranged in the Y direction (horizontal direction) of the first substrate (H_ (for one long side of the line) 10b). The first chemical liquid tank 21 and the second chemical liquid tank 21 are included in the first chemical liquid tank 2, the first cleaning liquid tank 22, the second chemical liquid tank 23, the second cleaning liquid tank 24, and the drying processing unit 25. 23 storing the same or different kinds of chemical liquids, respectively, and uniformly immersing the plurality of substrates w in the liquid medicine to perform the chemical liquid treatment. The first cleaning liquid tank 22 and the second cleaning liquid tank 24 respectively store the cleaning liquid (for example, pure water). In the cleaning liquid, a plurality of sheets (for example, 10 52 sheets) of the substrate W are uniformly immersed, and the surface is subjected to a cleaning treatment. In the embodiment, the first chemical liquid tank 21 and the third cleaning liquid tank adjacent thereto are provided. The second system liquid tank 23 and the second cleaning liquid tank 24 adjacent thereto are paired with each other, and the first elevator 27 and the second elevator 28 are provided; the first elevator 27 is used for The substrate W subjected to the Le liquid treatment in the first chemical solution tank 21 is transferred to the dedicated transfer mechanism in the first cleaning liquid tank 22, and the The lifter 28 is configured to move the substrate W subjected to the chemical solution treatment in the second chemical solution tank 23 098130024 20 201020194 to the dedicated transfer mechanism for the second cleaning liquid tank 24. The first and second lifts 27, The 28 series includes a substrate supporting portion, a lifting and lowering driving mechanism, and a horizontal driving mechanism. The substrate supporting portion is formed by stacking a plurality of (for example, 52) substrates W in a vertical posture in the X direction (horizontal direction). State support; the lifting drive mechanism causes the substrate support portion to move up and down; and the horizontal drive mechanism causes the substrate support portion to traverse in the Y direction. Further, the 'X direction is along the front surface of the substrate processing device 10 The direction is a direction orthogonal to the Y direction. With this configuration, the first elevator 27 collectively collects a plurality of substrates W stacked in the X direction in a vertical posture from the main transport mechanism 3, and the plurality of substrates W are stacked. The first lifter 27 raises the substrate support portion and pulls the plurality of substrates W from the chemical solution after the predetermined chemical solution treatment time has elapsed. Up, The substrate supporting portion is traversed toward the first cleaning liquid tank 22, and the substrate supporting portion is lowered in the first cleaning sputum tank 22, and is immersed in the cleaning liquid. After the predetermined cleaning processing time by the standby, the first elevator 27 is lifted. When the substrate support portion is raised, the substrate W is pulled up from the cleaning liquid. Then, the plurality of substrates W are collectively transferred from the first elevator 27 to the main transport mechanism 3. The second elevator 28 is similarly transported from the main conveyor. - The mechanism 3 collectively collects a plurality of substrates W' stacked in the X direction in a vertical posture, and lowers the plurality of substrates W into the second chemical solution tank 23' and immersed in the chemical liquid. After the processing time, the second elevator 28 raises the substrate supporting portion, pulls up the plurality of substrate signals from the chemical solution, and 098130024 21 201020194 causes the substrate supporting portion to traverse toward the second cleaning liquid tank 24, and then supports the substrate. The portion is lowered into the second cleaning liquid tank 24 and is immersed in the cleaning liquid. After the predetermined cleaning processing time has elapsed, the second elevator 28 raises the substrate supporting portion and pulls up the substrate W from the cleaning liquid. Then, the plurality of substrates W are collectively transferred from the second elevator 28 to the main transport mechanism 3. The drying processing unit 25 has a substrate holding mechanism that holds a plurality of sheets (for example, 52 sheets) of the substrate W in a vertical posture and is stacked in the X direction, and the organic solvent (isopropyl alcohol or the like) is used in a reduced pressure atmosphere. The substrate W is supplied to the substrate W or the liquid component on the surface of the substrate W is dried by centrifugal force to dry the substrate W. The drying processing unit 25 can transfer the substrate W between the main transfer unit 3 and the main transfer unit 3. The main transport mechanism 3 includes a pair of substrate holders (clamping mechanisms) 30, a jig drive mechanism, a horizontal drive mechanism, and a lift drive mechanism; wherein the pair of substrate holders (clamping mechanisms) 30 are plural in a vertical posture The substrate W of the sheet (for example, 52 sheets) is integrally held by the substrate in a state of being laminated in the X direction; the chuck driving mechanism causes the substrate holder 30 to operate; the horizontal driving mechanism causes the substrate holder 30 to move in the Y direction The horizontal movement (traverse) is performed; and the elevation drive mechanism causes the substrate holder 30 to move up and down in the Z direction. Each of the pair of substrate holders 30 has a shaft-shaped support guide 31' extending in the X direction, and a plurality of substrate support grooves are formed at intervals in the axial direction on the opposite sides of the support guides 31; A plurality of substrates W in a vertical posture are received and supported from below. The jig drive mechanism expands and contracts the distance between the pair of the guide members 3i by rotating the pair of 098130024 22 201020194 substrate holders 30 in the direction of the arrow 33. By this, the substrate holder 3 performs the opening and closing operation of switching between the holding state of the substrate w and the release state of the substrate W and the release state of the substrate W. By the opening and closing operation and the vertical movement of the i-th and second elevators 27 and 28, the transfer of the substrate W can be performed between the first and second elevators 27 and 28 and the substrate holder. The main transport mechanism 3 further transfers the plurality of substrates W in a state of being stacked in the vertical direction and in the x direction with respect to the drying processing unit 25. The main transport mechanism 3 receives a plurality of unprocessed substrates w stacked in the vertical direction and stacked in the X direction at the substrate transfer position ρ, and carries out a plurality of sheets processed in the vertical direction and stacked in the x direction at the substrate transfer position ρ. The way that produces the action. The jig cleaning unit 8 is disposed between the substrate transfer position p and the processing unit. The cleaning unit 8 has a cleaning tank 35. The cleaning tank 35 is formed with a pair of substrate holders 3 - Right to the opening. In the cleaning tank 35, the substrate holder 30 (especially, the support guide 31) is washed with a cleaning liquid. The main transfer mechanism 3 inserts the substrate misalignment 3 into the cleaning tank 35 of the jig cleaning unit 8 before the process of performing the drying process on the completed money processing unit 25 is carried out. Then, after the substrate holder 3 is washed in the cleaning tank 35, the main conveyance mechanism 3 collectively receives the processing of the substrate w in accordance with the drying processing unit 25. The wire feeding mechanism 3 can narrow the interval of the pair of supporting guides 098130024 23 201020194 provided at the lower end of the substrate cooler 30. When the cleaning process in the cleaning tank 35 is performed by narrowing the interval between the branch guides 31, the cleaning tank 3 can be cut. Thus, the occupied area of the substrate processing apparatus 1G can be suppressed. A blocking door is provided between the jig cleaning unit 8 and the substrate transfer position p! 5 is when the main transport mechanism 3 transfers the position from the substrate to the field. When the side moves, and the main transport mechanism 3 moves from the side of the processing unit 2, when the position P is moved, it is in the other (four)_^ state. By this, it is possible to suppress or prevent the medicine on the side of the treatment unit 2 from being looped. Fig. 2A is an enlarged plan view showing the structure of the wafer cassette F and the main transport mechanism (4); The wafer cassette is held in the system; the loading and unloading mechanism 4 is opposed to each other. Loading and unloading mechanism 4 in the pod holding portion 1

The side ' is configured with an opener 12 that will block the wafer cassette F from opening and closing. The posture conversion mechanism 5 is disposed on the substrate transfer position p side of the loading and unloading mechanism 4 . Further, the posture switching mechanism 5 is disposed with the pusher 6 disposed on the substrate transfer position p side and then the transfer mechanism is disposed at the substrate transfer position p. The transfer mechanism 7 operates in accordance with the method of shifting the remaining s of the substrate belonging to the position of the pusher 6 and transporting the substrate w at the substrate transfer position. The transport path τρι between the carry-in/out mechanism 4 and the pusher 6 and the transport path τρ2 between the pusher 6 and the substrate transfer position P are intersected by a mosquito angle (for example, 170 degrees 185 degrees). That is, a skew path is formed parallel to the X-direction transport path 1 with respect to the transport path; the skew path follows the 098130024 24 201020194 pusher 6 with the direction of the carry-out mechanism 4, and (4) the front line. Along the transport path TP1, the carry-in mechanism 4, the mechanism 5, and the pusher 6 are arranged. Further, along the transport path τρ2, the substrate transfer position S and the substrate transfer position ρ arranged by the rower 6 are arranged at the intersection position of the transport path ΤΡ2.此种 此种 This type of configuration has the function of ensuring that the carry-in/out mechanism 4 accesses the wafer cassette F along the γ side, and the occupied area (coverage area) of the substrate processing apparatus. In addition, when the transport path from the loading and unloading mechanism to the substrate transfer position is linear, the carry-out mechanism 4, the posture change mechanism 5, the pusher 6, and the substrate transfer position ρ must be arranged on a straight line. It is difficult to ensure that the adjustment of its accuracy will be difficult. On the other hand, in the present embodiment, the transport path m and Tp2 are intersected at a predetermined angle. Therefore, the carry-in/out mechanism 4 and the posture changer ς 5 are aligned along the transport path ΤΡ1, and the pusher 6 and the substrate are placed. Transfer location? It is aligned along the transport path ΊΤ2, and the pusher 6 can be positioned at the intersection of the transport paths m and ΤΡ2, so adjustment will tend to be easy. Figure 2A is an elevational view as seen from arrow A1 in Figure 2A. However, the illustration of the jig cleaning unit 8 is omitted. The loading and unloading mechanism 4 is an embodiment of the present invention. The substrate transfer device of the present invention includes a one-piece robot arm 39, a batch type robot arm 40, a holding base (mechanical arm supporting portion) 41, a turning block body 42, and The lifting block body 43 and the base portion 44; wherein the one-piece robot arm 39 can hold one substrate W; the batch type robot arm 40 can hold the plurality of substrates w 098130024 25 201020194 in a laminated state. The plurality of pieces hold the robot arm; the holding base (mechanical device) 41 holds the mechanical arms 39 in common; the lifting block sends the 43 pieces in a state in which the rotating block can be rotated about the wrong axis 42. The base portion 44 supports the lift block 43 in a freely movable manner. In the holding base 41, an advance/retract drive mechanism 47 for advancing and retracting the one-piece robot arm 39 and the batch type robot arm 40 in the horizontal direction is built in. The rotating block 42 supports the holding base 41' and is rotated about the vertical axis by the action of the built-in turning mechanism 45, whereby the holding base 41 and the mechanical arms 39, 40 are rotated about the wrong axis. . By this rotation, the robot arms 39, 40 can face the wafer cassette F or face the posture changing mechanism 5. A lifting mechanism 46 for lifting the lifting block 4 3 in the weir direction is built in the base portion 44. By the action of the elevating mechanism 46, the robot arms 39, 40 can be moved up and down. By the vertical movement and the forward and backward movement by the above-described _ drive mechanism 47, the robot arms 39 and 4 can perform the transfer and removal of the substrate W to the round box F, and the execution of the posture transition: The substrate W is transferred. The batch type robot arm 40 is provided with a plurality of (for example, 25) robot arm elements stacked at the same interval from the substrate holding interval in the wafer cassette F: the plural arm element can be used to hold, for example, 25 pieces of the US plate w. By using the batch type robot arm 40, the wafer cassette F can be carried/lifted, for example, by 25^, and integrated with the posture conversion mechanism 5 25 Transfer of the sheet substrate W. 098130024 26 201020194 The one-piece robot arm 39 holds one substrate w, and is used for, for example, adding a test dummy substrate other than the 25 substrates W, and performing processing at the same time or in accordance with the substrate w in the wafer cassette F. The substrate w is subjected to the arrangement replacement process in a different order. By using the one-piece robot arm 39, one substrate W can be carried in and out of the wafer cassette F, and the wafer substrate w can be transferred between the wafer substrate and the posture conversion mechanism 5. The posture changing mechanism 5 converts the posture of the substrate w between the horizontal posture and the vertical posture. More specifically, the posture converting mechanism 5 collectively receives a plurality of substrates W stacked in a horizontal posture in a horizontal posture from the loading/unloading mechanism 4, and transfers the material substrate W to a posture in which the material substrate W is in a straight posture and is stacked in the horizontal direction. The plurality of substrates W in the vertical posture are transferred to the pusher 6. Further, the posture converting mechanism 5 collectively receives a plurality of substrates stacked in a vertical posture and stacked in the low-level direction from the pusher 6 (and the substrates are converted into a horizontal posture to stack a potential in the horizontal direction of 30). The plurality of substrates W in the horizontal posture are transferred to the carry-in/out mechanism 4. The pusher 6 has a step-up mechanism in which the (four) potential conversion mechanism 5 moves the plurality of substrates w in a vertical posture and stacks in the horizontal direction. Pushing the II 6 system on the substrate to move the remaining 5, which can

==Up and down action, and can be rotated around _, a small distance along X (for example, 5 coffee). More specifically, the elevation holding unit 105 is for the height of the 丨 丨 丨 丨 ι ι 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 更高 更高 更高 更高 更高change. The pusher 6 can perform (four) of the plurality of substrates w between the posture switching mechanism 5 by the vertical movement of the elevation holding portion 105. The elevation holding unit 105 is a two-fold number (for example, 52 pieces) of the number of sheets (for example, 52 pieces) of the number of sheets (for example, 26 pieces) that are first converted by the posture conversion mechanism 5, and the substrate holding pitch in the posture conversion mechanism 5 (equal to The substrate holding pitch in the wafer t F is maintained at one half pitch (half pitch). For example, after the 25 substrates W are transferred from the posture switching mechanism 5 to the elevation holding portion 105, the elevation holding portion 105 is rotated 180 degrees. The center axis of rotation of the elevation holding portion 105 is eccentric with respect to the center of the plurality of substrate holding positions, halving the half pitch of the half pitch toward the substrate alignment direction. Therefore, the 25 substrates W held by the 18Q degree of revolution 'only move half a pitch. In this state, 'the other 25 substrates are from the posture switching mechanism 5? It is transmitted to the lift holding portion 1〇5. Thereby, the 25 substrates w transferred later are inserted between the 25 substrates W previously transferred, and a subtraction of 50 substrates is formed on the elevation holding portion 1A5. Accordingly, the batch group of the batch is formed by combining the Wei substrate groups. At this time, each adjacent surface of the substrate w is formed in a relative state (face to face) with respect to each other (or between the back surfaces). It is also expected that the treatment will be performed in a state in which the surfaces of all the substrates w are oriented in the same direction and the surfaces of the respective substrates w are opposed to the back surface of the adjacent substrate W (facing the back). In this case, instead of the above-described (10) degree turning operation, the lift holding portion 105 is changed to the horizontal shift pitch only. In this way, the batch group can be implemented according to the face 098130024 00 201020194. When the substrate W is transferred from the pusher 6 to the posture conversion mechanism 5, for example, 25 of the 50 substrates w are held by the elevation holding unit 105, and are transmitted to the posture conversion mechanism 5'. The 25 substrates W are in the converted posture. After being in a horizontal position, it is transmitted to the loading and unloading mechanism 4. Then, the horizontal movement of the 18-degree rotation or the half-pitch portion of the elevation holding portion 1〇5 is performed. In this state, the 25 substrates W remaining on the elevation holding portion ι 5 are transmitted to the posture switching mechanism 5, and are moved to the loading/unloading mechanism 4 by the transfer posture. Accordingly, the 5 片 substrate W is separated into two sets of 25 substrates each. The transfer mechanism 7 includes a carry-out mechanism 70, a carry-in mechanism 71, and an intermediary mechanism 72, each of which is provided with jigs 73 and 74 that collectively hold a plurality of substrates w' stacked in a vertical posture and in a horizontal direction. 75. The jig 73 of the carry-out mechanism 70 (hereinafter referred to as "the carry-out jig") is disposed above the jig 74 (hereinafter referred to as "the carry-in jig 74") of the carry-in mechanism 71. The carry-out mechanism 70 moves the substrate W from the substrate by moving the carry-out jig 73 of the second horizontal traveling holding portion in the X direction (horizontal movement) along the i-th transverse path ιοί set on the carry-out height H〇. The first horizontal traveling mechanism that is transported to the substrate transfer position S (the position of the pusher 6). In other words, the carry-out jig 73 is carried out at the carry-out height H〇 of the substrate transfer position p, and the processed transfer substrate w' is taken from the main transfer mechanism 3, and the substrate w is carried out to the substrate transfer position S by the lift height. The pusher 6 picks up the substrate w from the carry-out jig 73 by raising the lift holding portion to the second transfer height H12. 098130024 29 201020194 The loading mechanism 71 moves the loading jig 74 of the second lateral row holding portion in the X direction (horizontal movement) by the second horizontal path 1〇2 set at the loading height H1^ lower than the carrying height HG. Then, the substrate W is transported from the substrate transfer position S to the second horizontal path of the substrate transfer position p. In other words, the unloading substrate w is transferred from the elevating and holding unit 1〇5 of the pusher 6, and the substrates W are transported to the substrate transfer position p and held at the transfer height. In the intermediate mechanism 72, the jig 75 of the medium holding unit (hereinafter referred to as "the intermediate jig 75") is moved up and down in a region below the carry-out height HQ, and the substrate W is taken from the carrying jig 74, and The county board w rises to the transfer height between the carry-out height H〇 and the carry-in height H1. The substrate W, which is fed by the intermediate jig 75 at the offset (four), is collected by the main transport mechanism 3. By receiving the substrate w from the loading jig 74, the intermediary mechanism 72 can form a state in which the lower-batch substrate w is received from the pusher 6 without the waiting operation of the main transport mechanism 3 by the loading jig 74. In other words, since the medium-sized jig is provided with a so-called damper position, the operations of the carry-in/out mechanism 4, the posture changing mechanism 5, the pusher 6, and the like are shifted from the operation timing of the main transport mechanism 3. Thereby, the substrate carrying operation by the loading jig 74 can be smoothly performed. In particular, when the substrate processing conditions (so-called recipe) are changed, there may be a waiting time at the substrate transfer position P. However, since the substrate W can be made to stand by in the intermediate jig 75, it can be released or shortened, such as moving out. The operation of the entering mechanism 4, the posture changing mechanism 5, and the pusher 6 generates 098130024 30 201020194 waiting time. At the substrate transfer position P, below the transfer height H1, the substrate direction alignment mechanism 13 is disposed as needed. The substrate direction alignment mechanism 13 is arranged at the loading height H1 of the substrate transfer position P, and aligns the direction of the substrate W (for example, the direction in which the semiconductor wafer is notched) constituting the batch held by the carry-in jig 74. The substrate subjected to the substrate alignment processing by the substrate alignment mechanism 13' is transported to the transfer height by the intermediate jig 75. The substrate direction alignment mechanism 13 has an alignment processing head 16 and a lifting mechanism 17 for raising and lowering the alignment processing head 16 (refer to Fig. 5 in combination). The alignment processing head 16 is provided with a pair of substrate guides 18 that are disposed to face each other with a space in the γ direction, and a newspaper mechanism 19 that is disposed on the substrate guide. Although the detailed _ is omitted, the subtractive structure 19 is provided by: abutting a plurality of lower linings in a horizontal direction, and causing each substrate w to surround the center

= a rotating roller, and an engaging member that is engaged with a red notch formed on the peripheral portion of the substrate w and that regulates the rotation of the substrate W. When the substrate alignment process is performed, the alignment processing head 16 is raised to the carry-in height 19 2 ', and the substrate W held by the transfer jig 74 is continued to the front of the roll mechanism', and only a small distance is lifted from the carry-in jig 74. In this state, the mechanism 19 generates an action 'substrate W', and the other parent mechanism 19 generates an action after the substrate guide 18 is rotated by the substrate " The secret " snaps into the card to align the notches in a straight line. Thereby, the direction of the substrate W (in the case of the semiconductor wafer in the case of 098130024 31 201020194) is aligned. In this case,

After the substrate alignment process is performed, the alignment processing head 16 is conveniently lowered by the elevating mechanism U, and the aligned substrate w is transferred to the loading jig 74. Fig. 3A shows a plan view of the posture changing mechanism 5, and Fig. 3β shows a perspective elevational view of the internal structure. The posture changing mechanism 5 includes a base 49, a rotating block 50, a pair of second holding mechanisms, a pair of second holding mechanism 52, and a substrate specification mechanism 53. The base 49 is fixed to the base 49. On the frame of the substrate processing apparatus, the pair of first holding means 51 is mounted on the movable body 50. This is the same as that of the second holding mechanism. The rotating body is rotated. The 5G system is mounted so as to be rotatable about the rotary pumping (10) with respect to the base 49. The rotating shaft 5Ga has its axial direction in the horizontal direction and its axial direction is in a plane orthogonal to the transport path τρι. The motor 55 for rotating the rotating block 5A around the rotating shaft 50a is mounted via the gear head 54. Therefore, the first and second holding mechanisms 51, 52 can be changed by driving the motor η. The pair of first holding mechanisms 51 are provided with a pair of rod-shaped water (10) arranged at intervals in the horizontal direction perpendicular to the transport path m, and a branch in each horizontal level _56 =: The circumferential surface of the second is in the opposite position of the package: qq, plug, group 58, 59. Each The groove groups 58 and 59 are formed by a plurality of holding grooves 58a and a. Each of the holding grooves 58a and 59a forms a horizontal holding member 56 in a vertical direction with respect to the longitudinal direction of the horizontal holding member 56 in the direction of 098130024 32 201020194. 59a is equal to the distance between the unloading person and the forehead (4). The pitch is the pitch of the substrate, that is, the batch machine of the Japanese-made person 4 (4) 4G holds the substrate holding pitch in the Japanese yen box F of the plurality of substrates W. The posture of the body structure - 56 is mounted in the direction of the rotating block in parallel with each other. _ - Caiping _ system 56 is in the direction of (10) straight (ζ 料 料 料 斜 58 58 58 58 58 58 58 58 58 58 58 58 58 58 Let the fresh one that is kept η be removed from below. A pair of holding groove groups 58, 59 w and a group 58) are used for holding the unprocessed substrate plate W for use in the holding process. At the base time, the unprocessed substrates transferred by the two mechanisms 4 are additionally held while being held from the axis 36. The group 58 is oppositely oriented. When the level is maintained, the processing is performed, and when the base is zero, Each of the holding groove groups 59 is opposed to each other. A pair of second holding mechanisms # square 6 " 2 series has a hanging Water in the conveying direction one thousand _ΤΡ1 arranged spaced intervals pair: vertical you like holding member 6〇 was ENGINEERING / next straight holding member 60. The posture of the rotating block 5〇1 t horizontal meal 56 is mounted on the ghost body 50. Each of the vertical holding members 6 and the plurality of retaining groove members 62 of the women's wear on the support bars (four) support bars are held. The longitudinal direction of the reinforcing support rod 61 is maintained by the pitch of the substrate at a predetermined pitch. Each of the holding groove members 62 is tied to 098130024 33 201020194 rod 61 and (four) _ end face Cai - pair simple groove 63, (4): according to the holding groove 63, along the purchase 6] long side: groove: =: shape each: holding The 64 series is attached to the pair of vertical holding members 6G in a longitudinal direction in a mutually parallel posture. Therefore, when the vertical holding member (9) is in the horizontal direction, the plurality of substrates w in the vertical posture are supported by the holding-groove 63 and the material from below. - For the simple grooves 63, 64 (for example, the holding groove is used for holding the unprocessed substrate, and the other (for example, the holding groove is used for the holding process for the substrate w. For example, the miscellaneous (4) entrance) When the unprocessed substrate w is transferred, the holding grooves 63 of the groove member 62 are held in opposite directions by the pair of support bars 61. Further, when the substrate w transferred from the pusher 6 is held, The holding grooves 64 of the holding groove member 62 held by the pair of towers 51 are opposed to each other. The rotating block 50 is horizontally positioned by the first and second holding mechanisms 51 and 52 and the substrate regulating mechanism 53. The posture (the posture shown in FIG. 3A and FIG. 3A) and the first and second holding mechanisms 51 and 52 and the substrate specification mechanism 53 are in a vertical posture in a horizontal posture (in FIG. 2a and FIG. 2B, the two-point chain line is shown). The rotation is performed between the non-postures. In the following, the i-th and second holding mechanisms 5 52 and the substrate specification mechanism ' when the rotating block 50 is in the horizontal holding posture are also referred to as "horizontal holding posture". The i-th and second-th retaining when the block 5〇 is in the vertical holding posture The postures of the structures 51 and 52 and the substrate specification mechanism 53 098130024 34 201020194 are also referred to as "vertical holding postures". When the potential posture is w, the horizontal position of the substrate w is horizontally held by the horizontal holding member 56, When the two positions in the opposite direction are from the lower posture, the holding groove member 62 of the substrate W in the vertical posture is held by the lower two regions. The mechanism 52 Ο ❹ The movable block 50 is vertically held. In the posture, the second holding mechanism is located lower than the i-th holding mechanism 51. The holding groove member 62 possessed by the holding mechanism is attached to the branch bar by a gap larger than the thickness of the substrate W. Further, the interval between the pair of tower bars 61 is larger than the width of the substrate W (the diameter of the circular substrate is the diameter). Further, between the bottoms of the pair of horizontal holding members 56 opposed to the holding grooves 58a, 59a The interval is larger than the width of the substrate W (the diameter of the circular substrate). Therefore, the first and second holding mechanisms 51 and 52 are vertically held, and the substrate W is transferred between the pusher 6 and the pusher 6. When corresponding to The substrate W held by the position of the gap 65 passes between the first and second holding mechanisms 51 and 52. The substrate specification mechanism 53 is composed of a round bar member provided parallel to the first and second holding mechanisms 51 and 52. When the substrate specification mechanism 53 is in the horizontal holding posture, it is mounted on the rotating block 50 in a manner closer to the pusher 6 than the second holding mechanism 52. The substrate specification mechanism 53 can be held along a pair of second holdings. The opposite direction of the mechanism 52 is moved. That is, the substrate specification mechanism 53 is in the vicinity of the intermediate position between the pair of second holding mechanisms 52, and can be abutted at the specification position of the end surface of the substrate w at 098130024 35 201020194 (Fig. 3A Move between the position shown by the solid line and the position shown by the line that does not interfere with the substrate's position. When the substrate specification unit 53 repels the retracted position, when the substrate W is subjected to (four) along the first and second holding mechanisms 5 in the 52-column direction (in the direction along the transport path m), the substrate w is interfered with. status.转动 Rotating block 50 is housed to drive the first! The drive mechanism of the second holding mechanism 52 and the substrate specification mechanism 53. The driving mechanism 用以 for driving the i-th holding mechanism 51 has a bearing 82, a motor 83, a squeezing cylinder 85, and a towel, the material bearing (4) cuts the state in which the yoke can be rotated about the axis; the motors are paired The branch bar 57 is comfortable with the secretive force; the milk system makes the support ❹ = 3 branch _4, along the support rod 57_ side in accordance with the predetermined strokes of the moon. By driving the motor 83, it is possible to perform selection for holding the substrate W by opposing one of the holding groove groups 58 and Μ. In addition, by driving the air pressure 85, the position of the holding grooves 58a, 59_ can be moved only by a small distance along the longitudinal direction of the support rod (four). Thus, when the rotation _ Μ is in the vertical holding posture, the holding groove 58a can be made. The wall surface of 59a is retracted from the substrate w. The drive mechanism 87 for driving the second holding mechanism 52 is provided with a slide rail 89 fixed to the support plate 88, a movement base 90 that moves along the slide rail 89, and a mounting on the moving base 9{). Bearing 91. The bearing μ is configured to rotate the support rod 61 of the second holding mechanism 52 about its axis. 098130024 36 201020194

: Support: The further advancement step is provided with a pair of support shafts (4) and (4) on the moving base 9G, and is mounted on the surface by the retaining groove member 62. The selection can be made by driving the motor 92'. Hold the ditch 63, 64 - to maintain the substrate W

The slip 89 is disposed along the alignment direction (the direction of the peppers) of the parallel-side holding mechanisms 51, 52 of the first and transport paths TP1. The transfer base 9G' which moves on the slide rail 89 is coupled to the drive cup of the pneumatic cylinder 94 via the joint member 93. By driving the pneumatic cylinder 94, the second holding mechanism 52 is moved along the /moon rail 89. Thereby, when the rotating block 5 s is horizontally held, the second holding mechanism 52 can be brought closer to or away from the substrate W ′ held by the first feeding mechanism 51 in the horizontal posture.

The drive mechanism 96 for driving the substrate specification mechanism 53 includes a slide rail 97 that is disposed in parallel with the opposing direction of the pair of second holding mechanisms 52, a movement base 98 that moves along the slide rail 97, and An actuator 1 (for example, constituted by a ball screw mechanism) for moving the movable base 98 along the slide 97. The moving base 98 is coupled to the base end portion of the substrate specification mechanism 53. The moving base 98 is coupled to the operating portion of the actuator 100 via the connecting member 99. By driving the actuator 100, the substrate specification mechanism 53 is moved between the aforementioned normal position and the retracted position. 4 is an elevational view for explaining the configuration of the pusher 6. The pusher 6 is provided with a lift holding portion (10) that holds the plurality of substrates W in a vertical posture and is vertically stacked in a horizontal direction by 098130024 37 201020194. The lift protection 5 H is a rotating shaft portion (10) / upper end that rotates around a wrong straight axis. The rotating shaft portion 106 is rotatably circulated by the traverse base 1〇7. The traverse base 1 〇 7 is supported by the hoist base 108. The lifting base 108 is coupled to the operating member n〇a of the rear actuator 110. The linear actuator incorporates a ball screw mechanism and a linear guide, and obtains a driving force ' from the motor U coupled to the upper end to drive the operating member 11Ga upward and downward. Thereby, the lifting base 108 is moved up and down. When the lift base 108 is moved up and down, the lift holding unit 1〇5 is raised in the horizontal registration base 107 between the origin height height, the first transfer height H11, and the second transfer height H12. The rotating shaft portion 1〇6 rotates the rotation mechanism 112 around the vertical axis. Thereby, the material holding portion can be formed along the transport path TP1 (the posture indicated by the two-point key line in FIG. 2A) or the posture along the transport path TP2 (the posture shown by the solid line in FIG. 2A). Further, since the face-to-face batch can be combined or the batch can be released, the direction of the elevation holding portion 105 (referred to as "the lamination of the plurality of substrates w is reversed by 180 degrees. 11" is in the lifting base 108. A pair of slide rails 113 are provided. The slide holder 3 is disposed so as to hold the stacking direction (horizontal direction) of the plurality of substrates w. The traverse base 1〇7 is movable on the slide rails 113. The pedestal 108 is provided with a sliding drive mechanism 114 for moving the traverse base 1 〇 7 along the slide rail 丨 13 鄕 L 098130024 38 201020194 distance (half pitch). 4 The slide drive mechanism 114 The ball nut is composed of, for example, a ball screw having a screw shaft and a ball screw thereof, and a rod mechanism. The ball nut is slid by a connecting member via a connecting member. Batch, or two divided by the second seat, thus enabling the lifting and holding portion 105 water The movement of the half-pitch portion is shifted from the distance 。. The hoisting and lowering holding portion 105 is provided with the first guide 116 and the second guide 117, and is configured to be used separately for the maintenance of the unprocessed substrate w. The ith guide 116 has two support members 118 disposed in the horizontal direction. Further, the 帛2 guide m has three support members 119 arranged in parallel with the horizontal direction. A plurality of (for example, 52) substrate holding grooves are formed at half pitches on the respective upper surfaces of the members 1ΐ8 and ΐ9. The second guide 117 is fixed to the upper end of the rotating shaft portion 1〇6, and on the other hand, the first guiding member 116 The branch is made up of the lifting shaft 120. The lifting shaft 12 is moved up and down by a small distance by means of an up-and-down driving mechanism (not shown) built in the moving base 1〇7. The substrate supporting height of the second guiding member 116 is higher than the substrate supporting height of the second guiding member 117, or oppositely, the substrate supporting height of the first guiding member 116 is lower than the substrate supporting of the second guiding member U7 by two degrees. In this way, the third and the second guide 116 can be used, and the degree of the substrate branch is higher. It is used in the branch of the substrate w. Therefore, for example, the first guide 116 can be used for holding the unprocessed substrate W received from the posture switching mechanism 5, and the second guide 117 can be used for the slave transfer mechanism 7 The received processing of the substrate is maintained. 098130024 39 201020194 FIG. 5 is a view for explaining the associated structure of the transfer mechanism 7, and the elevation view seen from the direction of the arrow A2 in FIG. 2A. The 70-series includes a carry-out jig 73 and a traverse mechanism 76 that traverses the carry-out jig 73 in the X direction. The carry-in mechanism 71 includes a carry-in jig 74 and a traverse mechanism 77 that traverses the carry-in jig 74 in the X direction. The intermediary mechanism 72 is provided with an intermediate jig 75 and an elevating drive mechanism 78 for moving the jig 75 up and down. The lift drive mechanism 78 includes a linear actuator 125 having a ball screw and a linear guide built therein, and a motor 126 that applies a drive force to the linear actuator 125. The linear actuator 125 obtains the driving force from the motor 126, and causes the operating element 125a to move up and down. The actuator element 125a is coupled to the intermediate fixture 75 via a coupling support frame 127. Fig. 6 is a perspective view showing the configuration of the traverse mechanism 76 of the carry-out mechanism 7'', showing a structural view seen from the direction of the arrow A3 in Fig. 5. Hereinafter, please refer to FIG. 5 in combination. The traverse mechanism 76 includes: a ball screw mechanism 13 and a moving plate 133, a fixing plate 134, and a pair of upper and lower sliding rails 135; wherein the ball screw mechanism 131 is built in the plate-shaped supporting block 130, and the supporting block 130 In a vertical posture, the frame is placed on the front side of the substrate processing apparatus 1 ;a side; the moving plate 133 is located above the ball screw mechanism 丨 31, and the support block ι3 is slid from the side of the carrying-out device 73 The movement space 132 (see FIG. 5) formed in the traverse is horizontally moved in the X direction; the fixing plate 134 is fixed to the support block 130 so as to cover the operation space 132 from the side of the unloading and cooling device 73; 098130024 201020194 The lower-to-slide rail 135 is disposed on the surface of the fixed plate 134 facing the action space 132 in the X direction (in the direction along the transport path TP2). The moving plate 133 is coupled to the slide rail 135, and is configured to be horizontally movable in the X direction along the slide rail 135. The moving plate 133 is coupled to the ball nut 136 of the ball screw mechanism 131. Further, the moving plate 133 is coupled to the carry-out harness 73 via the connecting member 137. A notch 139 is formed in the fixing plate 134 along the path of the connecting member 137 in the X direction. Therefore, when the ball nut 136 is moved in the direction of the ball 136 by driving the motor 138' of the ball screw mechanism 131, the moving plate 133 can be moved in the χ direction with the carry-out jig 73. Since the configuration of the traverse mechanism 77 of the loading jig 74 is also the same, in Fig. 5, the same reference numerals will be given to the corresponding portions of the traverse mechanism 并 and the description will be omitted. 7A, 7C, and 7C are diagrams for explaining the structure of the carry-out jig 73. Fig. 7A is a plan view, Fig. 7C is a side view seen from the _γ direction, and Fig. π is a rear view as seen from the -X direction. The carry-out jig 73 is provided with a pair of cantilever-shaped substrate guides extending in parallel with each other in the x-direction, and a base portion 14 that cantilevered the substrate guides to form a plurality of holdings on the upper surface of the substrate guide 140 In the groove, the lower edge portion of the plurality of substrates (7) stacked in the vertical direction and in the horizontal direction is swung. Keep the spacing of the grooves half the pitch. The base portion ία is a c-shaped elongated body extending in the γ direction. In the base portion 141, a pair of pneumatic cylinders 〇 9813 〇〇 24 201020194 142 are held in a state in which the operating rods are opposed to each other. On the side of the base portion (4) on the side of the guide member 140, the linear guide 143 is fixed in the direction of vl v ancient-cull - #^ / σ Y. A pair of plate guides 140 are attached to the linear guide (4) via a coupling member 144. Thereby, the pair of substrate guides 14G are opposed to each other in the γ direction at the same height position, and are movable in the γ direction. The connecting member 144 is coupled to the base end portion of the substrate guide i (four), and the rising wall portion 145 rising from the end portion is coupled to the linear guide 143 and extends horizontally from the upper end of the inner edge of the wall portion 145. The horizontal portion 146 is coupled to the pneumatic cylinder 142 to actuate the rod through the through hole 147 of the base portion 141. The through hole 147 is a long hole extending in the longitudinal direction of the base portion 141. A pair of pneumatic cylinders 142 are driven synchronously. By the action of the pneumatic cylinders 142, the pair of substrate guides 14 〇 can form a closed position (shown by a solid line) which is narrowly spaced apart from each other, or a wide open position ( According to the position shown by the two-point chain line). The substrate w can be supported from below by forming the substrate guide 14 闭 in a closed position. In response to this, the pair of pneumatic cylinders 142 constitute a guide opening and closing unit that changes the pair of substrate guides between the closed position and the open position. When the pair of substrate guides 140 are formed at the closed position and the carry-out jig 73 is closed, the interval between the substrate guides 14 is formed to be wider than the width of the lift holding portion 1〇5 of the pusher 6. Therefore, at the substrate transfer position s (see FIG. 2A), the lift-and-hold portion 1 of the pusher 6 can be passed through a pair of substrate guides in a state in which the carry-out jig 73 is closed and the substrate w is held. 098130024 42 201020194 140 between 'and rises to the second transfer height H12. Thereby, the substrate W can be transferred from the carry-out jig 73 to the lift holding portion 1〇5 of the pusher 6. When the pair of substrate guides 140 are formed in the open position and the carry-out jig 73 is opened, the interval between the substrate guides 140 is wider than the width of the substrate w (the diameter of the circular substrate is the diameter). The substrate w is passed through the state between the substrate guides 140. Therefore, at the substrate transfer position s, after the substrate W is transferred from the carry-out jig 73 to the lift holding portion 105 of the pusher 6, the ❹ carry-out jig 73 is opened, and the pair of substrate guides 14 can be passed through. And the pusher 6 and the substrate it holds are lowered. 8A, 8B and 8C are views for explaining the configuration of the loading jig 74. Fig. 8A is a plan view, Fig. 8C is a side view as seen from the direction, and Fig. 8B is a rear view as seen from the -X direction.搬 The loading jig 74 is provided with a cantilever miscellaneous-plate guide 148 extending parallel to the x-direction at the same height position, and (10) a base portion 149 coupled to the proximal end portions of the pair of substrate guides 148. On the upper surface of the substrate guide 148, a plurality of Baoxians are formed, and the ruthenium (4) is a lower portion of the plurality of substrates W which are stacked in the horizontal direction. Keep the trench off the half pitch. The pair of bases =: the mutual mutual spacing is fixed. The spacing is wider than the width of the lifting and holding portion 1〇5 of the pusher 6. At the plate position S, when the base is placed in the first jig 74 from the elevation holding portion 1〇5 of the pusher 6, the holding and holding unit (10) of the substrate W is held, and the transfer height is m, and the loading jig 74 is guided. At 098130024 43 201020194 below its location. When the elevating and holding portion 1〇5 is ejected and lowered by the pair of substrate guides 148 from this state, the substrate w is transferred from the elevating and holding unit 1〇5 to the loading jig 74. 9A, 9B, and 9C are not used to illustrate the configuration of the intermediate jig 75. Fig. 9 is a plan view of Fig. 9c which is a side view as seen from the _γ direction, and Fig. 9 is a rear view as seen from the -X direction. The I-clamp 75 is provided with: a cantilever-like shape extending parallel to each other in the X direction-to-substrate guide 150, and a base portion 15 on which the substrate guide 15 is slidably supported by the substrate A plurality of holding grooves are formed on the upper surface of the piece 15〇, and the lower edge portion of the plurality of substrates w which are stacked in the vertical direction and supported in the horizontal direction are supported by the crucible. Keep the spacing of the grooves half the pitch. The base portion 151 is a C-shaped elongated body extending in the γ direction. In the base portion 151, the pair of pneumatic cylinders 152 are held in a state in which the operating rods are opposed to each other. The linear guide 153 is fixed to the side surface of the base portion 151 on the side of the substrate guide 150 in the γ direction. A pair of substrate guides 150 are mounted on the linear guide I" via a coupling member 154. By this, a pair of substrate guides 150 are at the same height position, facing in the γ direction, and can be along γ The direction, the Q member 154 is coupled to the base end portion of the substrate guide 150, and the rising wall portion 155 rising from the base end portion is coupled to the linear guide member 153, and the rising wall portion The horizontal portion 156 that extends horizontally at the upper end of the inner edge portion of the 155 is coupled to the operating rod of the pneumatic cylinder 152 through the through hole 157 of the base portion 151. The through hole 157 extends along the longitudinal direction of the base portion 151. Long hole 098130024 44 201020194 A pair of pneumatic red 152 series synchronous drive. The rods of these pneumatic cylinders 152 are telescoped 'A pair of substrate guides 15 〇 can form a closed position with a narrow gap (solid line) The position shown) or the wide open position (indicated by the two-dot chain line). By forming the substrate guide 150 in the closed position, the substrate W can be branched from below. * A pair of substrates The guide 150 forms an open position and forms the intermediate fixture 75 In the state, the substrate guides 150 are spaced apart from each other by a width wider than the substrate w width (the diameter of the circular substrate). Thus, the substrate W can pass between the substrate guides 150. Therefore, 'the substrate transfer position p When the loading jig 74 holds the substrate W at the loading height H1, if the intermediate jig 75 is opened and lowered, the substrate guide 150 can interfere with the substrate W held by the loading jig 74. Moving downwards under the loading jig 74. When the pair of substrate guides 150 are closed and the intermediate jig 75 is closed, the interval between the pair of substrate guides 150 is narrower than that of the loading jig 74 When the substrate guides 148 are spaced apart from each other, at the substrate transfer position P (see FIG. 2A), when the loading jig 74 holds the substrate W at the height H1, the intermediate jig 75 is closed and moved from the jig. • When the lower portion is raised to the transfer height H2, the substrate W can be transferred from the loading jig 74 to the intermediate jig 75. Fig. 10A to Fig. 10Q are diagrams for explaining the flow of the substrate loading operation. Moving into the action system The control unit 3, the carry-in/out mechanism 4, the posture changing mechanism 5, the pusher 6 098130024 45 201020194, and the transfer mechanism 7 can be controlled by the controller (see FIG. 10). As shown in FIG. 10A. The loading and unloading mechanism 4 extracts a plurality of (for example, 25) unprocessed substrates W from the wafer cassette held by the wafer cassette holding unit 1 by the batch type robot arm, and performs the posture conversion mechanism 5 At this time, the posture switching mechanism 5 is controlled to be in the horizontal holding posture, and the pair of first holding mechanisms 51 are controlled to face the unprocessed substrate holding groove group (for example, the holding groove group 58). The second holding mechanism 52 is controlled to face the untreated substrate holding groove (for example, the holding groove 63). Further, the pair of second holding mechanisms 52 are not in contact with the substrate #,

It is disposed to retreat to the retracted position on the opposite side of the carry-in/out mechanism 4 (the position indicated by the one-dot chain line in Fig. 3A). Further, the substrate specification mechanism 53 is disposed at the retracted position (the position indicated by the two-dot chain line in Fig. 3A). On the other hand, the carry-out jig 73 is disposed above the lift holding portion 1A5 of the pusher 6 (the carry-out height H0 of the substrate transfer position S). The reason for this is that the transfer of the substrate between the main transport mechanism 3 and the intermediary mechanism 72 is not hindered. The elevation holding portion 1〇5 of the pusher 6 is rotated at the origin position (accepting the first half of the rotation position of the lot), and moves to the origin height H10 below the second holding mechanism 52 when the vertical support posture is lower. . In this state, as shown in Fig. 10B, the plurality of substrates W constituting the first half of the lot are collectively transmitted from the carry-in/out mechanism 4 to the posture switching mechanism 5. At this time, the first holding mechanism 51 of the posture changing mechanism 5 inserts the respective substrates f into the pair of holding grooves 58a that face each other in the horizontal direction, and supports the substrate w from the lower side 098130024 46 201020194 - to the peripheral department. The holding mechanism changing mechanism 5 is such that the second scale mechanism 52 approaches the first time, and the second partner side is horizontally traversed. Thereby, the state of FIG. 10C is formed. 63 inserts 4 plates d material (4) holds the groove b-shaped to rotate the rotating block 5 of the posture changing mechanism 5 ==:: vertical branch _. Thereby, the plurality of substrates _ are pulled down to the vertical posture to form the state of the second holding mechanism 52:=. In this state, The hoisting arm is moved toward the side of the rotating block 50, and the holding grooves 58a are separated from the substrate W. Next, as shown in Fig. _, the lift holding portion 1〇5 of the pusher 6 is raised to the first transfer direction H11 (the height of the unprocessed substrate is collected). At this time, the lift holding P 1〇5 is raised by the first and second holding mechanisms 51 and 52, and the plurality of substrates W are collectively collected from the second holding mechanism 52. Thereby, the half-piece substrate W of the ^ is held by the elevation holding portion 1〇5 in the vertical posture. At this time, the elevation holding unit 105 is used for the unprocessed substrate! The guide 116 holds the substrate w. Next, as shown in Fig. 1 ΠϊΓ & - F, the rotating block 5 of the posture changing mechanism 5 is rotated in a horizontal holding posture. Further, the first holding mechanism 51 moves in the direction away from the rotary block 50 in the axial direction thereof, and returns to the original position. 098130024 47 201020194 Further, the second holding mechanism 52 will return to the retracted position (the position indicated by the two-dot chain line in Fig. 3A). After the posture changing mechanism 5 returns to the horizontal holding posture, the pusher 6 causes the lifting and holding portion to perform the discrimination rotation about the wrong axis. Then, the elevation holding portion 105 will descend to the origin height H1 〇. Next, as shown in Figs. 10G to 10J, the same operation as in the case of Figs. 10A to 10D is performed on the other plurality of unprocessed substrates W constituting the rest of the lot. As a result, for example, the 25 substrates w are held by the second holding mechanism 52 of the posture changing mechanism 5 in the vertical posture, and the lower (lowering holding portion 105) holds the other (for example, 25) substrates w in the vertical posture. In this case, the distance between the plurality of substrates w held by the posture changing mechanism 5 and the lift holding portion are obtained! The pitch of the plurality of substrates w is kept equal to each other, and the substrates W are parallel to each other. Therefore, in plan view, the two substrate groups are equal in position in the horizontal direction parallel to the substrate surface, and the horizontal position perpendicular to the substrate surface is shifted by only half pitch. ❹ From this state, as shown in FIG. 10K, when the lift holding portion 1〇5 of the pusher 6 is raised to the first transfer height HU, the substrate w is transferred from the second holding mechanism 52' of the posture switching mechanism 5 to the lift. The holding portion 1 () 5 is formed in a state in which, for example, the μ substrate h is held at a half pitch on the holding portion 105. Germany will complete the batch group. When the elevation holding portion 1G5 is raised, the plurality of substrates w held by the holding portion 1G5 are raised by the gap 65 (see Fig. 3B) between the holding groove members 62 of the second holder. Therefore, the substrate W does not interfere with the 帛2 holding mechanism 52. °' 098130024 48 201020194 Then, as shown in FIG. 10L, the front end side of the rotating block 50 of the H丨 switching mechanism 5 is moved in the horizontal holding posture to return to the origin position. The holding mechanism 51 is oriented in the axial direction toward the retracted position. (4) "Two-point key line: Demonstration of the t-shirt ^ Next, as shown in Fig. 10M, move the clip and 2 horizontally (please refer to Figure 2B) to carry out the horizontal line (water == height of the transfer position P' in the silk touch Set s =) and from the substrate: position. And the 'lifting and holding unit' is based on the substrate == square L (four) == The height of the origin of the two of the lift holding units 1〇5 is the transfer height. 1 From this state, as shown in Fig. 1, Ν Ν+, 4*6=4, the jerk 6 is such that the lift holding unit 1〇5 is lowered from the first transfer enthalpy Η11 to the origin height Η1〇. The spacing of the substrate guides 148 carried into the jig 74 is narrower than the width of the substrate w and wider than the width of the lift-down holder 105. Therefore, the lift holding portion ι 5 is lowered between the pair of substrate guides 140 of the loading jig 74, and in the process, a plurality of sheets (for example, 50 sheets) are collectively transferred from the elevation holding portion 105 to the loading jig 74. The substrate W is processed. Next, as shown in Fig. 1A, the loading jig 74 is moved by the loading height Η1 and moved from the substrate transfer position S toward the substrate transfer position Ρ. Then, the intermediate jig 75 is moved downward (i.e., moved to the lower position of the jig 74) toward the lower loading height Η1. Before the downward movement, the intermediate jig 75 is controlled to be in an open state in which the interval of the substrate guide 15G is opened to 098130024 49 201020194. Thereby, the interval between the substrate guides 150 is wider than the diameter of the substrate w. Therefore, the ninth fixture π can be moved toward the lower side of the loading jig 74 when the substrate w is transferred by the moving button 74. As a result, as shown in Fig. 10P, when the intermediate jig 75 is moved to the lower side of the carry-in jig 74, the intermediate jig 75 forms a closed state in which the interval between the pair of substrate guides 15 is narrowed. At this time, the pair of substrate guides (5 〇 will be formed at a position closer to the inner side than the pair of substrate guides 148 of the loading jig 74. _ From this state, as shown in FIG. 10Q, the intermediate jig 75 is raised to The transfer enthalpy H2. During the ascending process, a plurality of (for example, 50) substrates w held by the loading jig 74 are collectively transferred to the intermediate jig 75. Then, the plurality of wires ugly by the intermediate jig 75 are held The plate w is taken up by the main conveying mechanism 3 and conveyed to the substrate processing unit 2. When the substrate direction alignment mechanism 13 performs an alignment operation for aligning the substrate w direction, the state is shown in Fig. 1 Before the lowering of the jig 75, the alignment processing head 16 of the substrate alignment mechanism 13 is raised. Then, the alignment of the substrate W is aligned while the substrate 保持 held by the loading jig 74 is lifted by a small distance. Then, by lowering the alignment processing head 16, the aligned substrate is again transferred to the loading jig 74. When the loading jig 74 advances to the position of the pusher 6 (the state of the substrate transfer position is illusory, The jig 75 is in a state in which the substrate w is not held, and the jig 75 can be lowered in advance from the state of FIG. 098130024 50 201020194 10N, and then the carry jig 74 is moved back to the substrate transfer position P. Accordingly, since the jig can be used 75. The operation is simplified by the lowering of the closed state. Fig. 11A to Fig. 11K are diagrams for explaining the flow of the substrate carrying out operation. The substrate carrying operation is performed by the controller 9 (see Fig. 对). The components 3, the loading and unloading mechanism 4, the posture changing mechanism 5, the pusher 6, and the transfer mechanism 7 can be controlled, and the substrate processing unit 2 performs the processed substrate w, and the main transport is performed. The mechanism 3 carries the conveyance 'and transmits it to the carry-out jig 73. The unloading jig is not provided to prevent the main transport mechanism 3 from accessing the jig 75, and is usually disposed above the lift holding portion (10) of the pusher 6 (substrate shift) When the substrate H is removed and the substrate W (4) is processed, the loading jig (water height_first) is rotated and the horizontal path ❹ m and 'moves to the substrate transfer position p. shift After the move, _ is sent by the delivery mechanism 3 to process the state of Figure 11A. ® Dog Dan, the shape of the shape ==: is controlled to a horizontal holding posture. - The opposite of the first holding group The posture of the temple group (for example, in order to ensure the processing of the substrate for the holding groove (the structure 52 is controlled). In addition, the position of the blocking mechanism 50 in the opposite direction of the holding mechanism can be ensured in the direction of the vertical axis of the disk. And the position of the interval between the substrates w held by the second holder 201020194 is 52. The mechanism 52 is disposed at a forward position close to the first holding mechanism 51 (shown by the solid line in FIG. Position). Further, the substrate specification mechanism 53 is disposed in the setting. Pushing the ϋ6 material to reduce the thickness of the substrate to maintain the substrate holding position of the substrate, which is easier to use than the unprocessed substrate! The substrate holding position of the V piece 116 is further above. Second, the state, as indicated by _, the carry-out clip: 73 will be Ο: and moved toward the upper side of the lift holding portion 1〇5 of the pusher 6 (substrate transfer position s). Then, the elevation holding unit 1〇5 is raised to the position of the carry-out clip (four) ❹ (the second transfer height H12), and the processed plurality of substrates W are collectively collected from the carry-out ware 73. Until the collection of the substrate W is completed, the carry-out jig 73 is in a closed state, that is, a state in which the interval between the pair of substrate guides 14 is narrowed. In the closed state, the interval between the pair of substrate guides 140 is wider than the width of the elevation holding portion 105 and is narrower than the width (diameter) of the substrate W. Therefore, the elevation holding portion 105 passes through the pair of substrate guides 140. The substrate is raised to the second transfer height H12, and the substrate w is taken from the carry-out jig 73. After the elevating holding unit 105 receives the processed substrate w from the carry-out jig 73, the carry-out jig 73 is controlled to be opened, and the interval between the pair of substrate guides 140 is made wider than the width (diameter) of the substrate W. Thereby, the "lifting and lowering holding portion 105" can be prevented from falling while avoiding an interference between the holding substrate w and the carrying-out jig 73. From this state, as shown in Fig. 11C, the rotating block of the posture switching mechanism 5 098130024 52 201020194 : will rotate to form a vertical holding posture. Then, as shown in Fig. 10, the push-and-hold holding portion 105 passes through between the first holding mechanism 51 and the two-turn mechanism 52 and descends to the origin height Hi0. Here, the excess half substrate W is rotated from the elevation holding portion 105 to the holding mechanism 52 a ^ 2 - the first and the remaining half-substrate W are passed through the gap 65 between the holding groove members 62 of the second holding, and are still maintained by the lifting and lowering With the status of the material _ holding. In this case, the batch is released. The lifting and holding finger 5 is located below the (four) jig 73, and before the substrate w reaches the first simplification mechanism 51, (4) the remaining straight ride is rotated, so that the substrate w held by the lifting and holding portion 1G5 is aligned with the TP1. Integration. & (6) Next, the first holding mechanism 5 is moved toward the distal end side in the axial direction, and is formed to prepare the substrate w in a horizontal posture. Then, as shown in Fig. uE, the rotating block 50 of the posture changing mechanism 5 will rotate to form a horizontal posture. By this, the substrate w is formed using the first! The state in which the holding mechanism 51 is held in a horizontal posture. Further, the substrate specification mechanism 53 will move to the canonical position of the specification substrate w. In this state, the second holding mechanism 52 is retracted to the rearward position (the position indicated by the two-dot chain line in Fig. 3A). At this time, if there is a substrate W to be followed by the second holding mechanism 52, the movement specification mechanism 53 of the substrate # is standardized. Therefore, the substrate W is held in the state held by the first holding mechanism 51. Next, as shown in FIG. 11F, the plurality of substrate boundaries held by the first holding mechanism 51 are collectively carried out by the urging mechanism arm 098130024 53 201020194 40 of the loading and unloading mechanism 4, and are received by the wafer cassette holding portion 1 The wafer cassette F is held. As shown in FIG. 11G, the pair of j-th holding mechanisms 51 are moved toward the proximal end side in the axial direction, and when the substrate W is held by the second holding mechanism 52 in the vertical posture, the space between the substrate and the substrate w can be ensured. interval. Further, the second holding mechanism 52 is disposed closer to the advancement position of the j-th holding mechanism 51 (the position where the solid line is not in Fig. 5). The substrate specification mechanism 53 is disposed at the retracted position. Further, the pusher 6 will raise the lift holding portion 1〇5. From this state, the posture changing mechanism 5 rotates the rotating block 50 in a vertical holding posture as shown in Fig. 11A. Then, the pusher 6 will rotate the lift holding portion 1〇5 180 degrees around the straight axis above the summer and second holding mechanisms 51 and 52. Thereby, the position of the plurality of substrates W held by the lift holding portion ι 5 is integrated with the substrate holding position of the No. 2 嫉 Ζ Ζ Ζ 。 。 。 mechanism 52. Then, as shown in Fig. 111, the pusher 6 will lower the lift holding portion 1〇5 to the origin height H1G. In the process, the plurality of substrates w held by the elevation holding portion are collectively transferred to the second holding mechanism 52. After the substrate w is transferred to the second holding mechanism 52, the i-th holding mechanism 51 is moved toward the distal end side in the axial direction, and is formed in a state in which it can abut against the surface of the substrate w, and the substrate W is horizontally held. The rotating block 50 is formed by the ith, and the posture switching mechanism 5 is rotated as shown in Fig. 11J to form a horizontal holding posture. Thereby, the substrate 098130024 54 201020194 holds the state in which the mechanism 51 is held in a horizontal posture. Further, the substrate specification mechanism 53 will move to the canonical position of the specification substrate w. In this state, the second holding mechanism 52 is retracted to the retracted position (the position indicated by the two-dot chain line in 胄3A). At this time, if there is a substrate w to follow the second holding mechanism 52, the movement of the substrate w is regulated by the substrate specification mechanism 53. Therefore, the substrate W is held in the state held by the first holding mechanism 51. Then, as shown in FIG. 11K, the batch type robot arm 40' of the carry-in/out mechanism 4 integrally carries out the plurality of substrates w held by the first holding mechanism 51, and is housed in the cassette holding unit. Keep in the crystal case F. The wafer cassette F is different from the wafer cassette F° in which the first half of the substrate w of the constituent lot is accommodated. According to the present embodiment, the processing is performed by the carry-out jig 73 that runs along the second horizontal path 1〇1. The substrate w is transported from the substrate transfer position p to the substrate transfer position S′, and the unprocessed substrate is transferred from the substrate transfer position S to the carry-in jig 74 that is run along the second horizontal pass path 1〇2 below the first horizontal path. Substrate transfer location p. Thereby, since the substrate transfer between the substrate transfer position s and the substrate transfer position P can be performed by the two systems, the main transfer mechanism 3 can also process the unprocessed substrate W while transporting the unprocessed substrate W to the substrate transfer position p. The substrate w is carried out. Thereby, the substrate processing speed can be improved. Further, since the second and second horizontal paths 1〇1 and 1〇2 are vertically overlapped, it is possible to provide a two-system transfer path while suppressing the occupied area of the substrate processing apparatus 1A. 098130024 55 201020194 Since the transport path between the substrate transfer position s and the substrate transfer position p is set to two systems, it is conceivable to provide a pair of pushers and to transfer the pair of pushers at the substrate transfer position S and the substrate transfer position. Cross between p. However, if such a structure is formed, in addition to greatly increasing the occupied area of the substrate for processing the farm, it is also possible to increase the cost by providing a pair of pushers of complicated structure. On the other hand, in the case of the structure of the present embodiment, as described above, since the first and second horizontal paths 101 and 102 are disposed, the occupied area can be suppressed. In addition, as long as the carry-out jig 73 and the carry-in jig can be traversed, it is not so complicated to drive the structure, and in this case, the increase in cost is also reduced. Therefore, the transport path of the 2 system can be ensured according to the structure with low cost, and the processing speed of the substrate can be improved. Further, in the present embodiment, the intermediate jig 75 that moves up and down is provided at the substrate transfer position p, whereby the so-called buffer position can be secured. With such a configuration, it is possible to contribute to an improvement in substrate processing speed while suppressing substrate transfer retention. Further, since the intermediate jig 75 is sufficient as long as it can move up and down, it is not necessary to be traversed, so that the structure of the drive mechanism is not complicated. Therefore, the position of the buffer can be ensured at a low cost, and the processing speed of the substrate can be increased. Fig. 12 is a cross-sectional view showing the structure of the movement of the carry-in/out mechanism 4 and the vertical movement. The holding base 41 is fixed to the upper end of the rotating block body 42, and the rotating block body 42 is mounted on the lifting block body 43 so as to be rotatable about the vertical axis into the 098130024 56 201020194 row, and the lifting block body 43 is attached to the base portion 44. It can be lifted and lowered in the z direction. A swing mechanism 45 is built in the swing block 42, and a lift mechanism 46 is provided in the base portion 44. The σ turning block 42 is formed in a cylindrical shape. The turning mechanism 45 is provided with a motor 16 that is fixed to the inside of the turning block 42 and a gear head 162 that inputs the driving force of the motor 161. The gear head 162 is coupled to the lower end of the swivel block 42. The output shaft 162a of the gear head 162 is coupled to the upper end of the lift block 43. By the structure ', if the motor m is driven, the driving force is transmitted to the lifting block 经由43 via the gear head 162. Since the lift block 4 is coupled to the base portion 44, the gear head 162 and its associated swivel block are rotated about the wrong straight line by the force from the lift_43 == force. The lifting mechanism 46 is attached to the motor 165 and the ball screw mechanism 166. The motor 165 is housed in the base portion 44, and the base portion 44 is fixed. The driving force of the β motor 165 is transmitted to the screw #168 of the ball screw mechanism 166 via the gear head 167. The screw shaft 168 is disposed in a staggered direction. The screw shaft 168 is screwed to the ball nut 169. The ball nut 169 is coupled to the lift block 43. The lifting movement of the lifting block 43 in the weir direction is guided by a linear guide (not shown). With this configuration, the ball nut 169 can be moved up and down by the driving of the motor 165, and in this case, the lifting block body and the rotating block body 42 held therein can be raised and lowered. In this case, since the holding base 41 supported by the rotating block 098130024 57 201020194 body 42 can be raised and lowered, the one-piece robot arm 39 and the batch type robot arm 40 supported by the holding base 41 can be raised and lowered. Fig. 13A is a perspective side view showing the configuration of the one-piece robot arm 39, the batch type robot arm 40, and the advancing and retracting drive mechanism 47 for advancing and retracting. Further, Fig. 13B is a rear view as seen from the direction of arrow A4 of Fig. 13A. The batch type robot arm 40 is provided with a robot arm element group 175. The robot arm element set 175 is composed of a plurality of arm members Π6 laminated in the z direction. Each of the mechanical arm members ι76 extends in a horizontal direction and forms a pair of mechanical arm members 176 which are opposed to each other in the horizontal direction in another horizontal direction in which the parent is in the extending direction. The configuration is such that one substrate w can be supported from below in a horizontal posture. The arrangement pitch of the arm members 176 in the Z direction is equal to the arrangement pitch of the substrate housing positions in the wafer cassette. The robot arm element 176 on the left side, the left support block m (not shown in Figure i3A) and the cantilever support 'the right side of the robot arm element are clamped with the right support Π block Π 8 and the cantilevered slab. The left support block m is a side of each pair of arm members 176 that are opposed in the horizontal direction, and supports the right support block 178 in a state of laminating in the z direction. The m of the above-mentioned respective arm members are laminated in the z direction. The state of the building.兮 cage ^ These left and right support blocks 177, 178 are tied to the arm opening and closing mechanism (10). The arm opening and closing mechanism _ more advanced -. Step through the material frame 179, ridged to the scale base Ο. Under the batch type (four), the configuration is called Jiajiazhou. Further, 098130024 58 201020194 To be sure, when any of the batch type robot arm 40 or the one-piece robot arm 39 is located at the retracted position, the sheets are arranged in a state of lamination in the z direction. The member 39 has a robot arm like the batch type robot arm 4 == the same arm member 186. That is, the arm member 186 extends in the direction of the water and is orthogonal to the direction of extension (four). This - the object element can be from the horizontal position from the τ square branch #. Wherein - the mechanical arm element 186" the arm support member 187 cantilever support, = = the support member 188 suspension. The left: the door closing mechanism 槿 _ is coupled to the mechanical arm opening and closing mechanism 190. The mechanical arm 歼 for the H system through the advance and retreat The support frame 189 is coupled to the holding base 41. The advance and retreat support frame 179 for the two-person mechanical arm 40, the support portion 182 of the mechanism groove 180, and the selective fine-tuning system are controlled by the single-chip machine. The c-shaped connecting portion 183. When the connecting portion 183 closes the mechanism 190/in the retracted position, the mechanical arm opens the arm 4 to advance and retreat, and the single-piece robot 39 or the batch type The shape of the top portion 183 of the (4) 2 is provided with: the fixed support is disposed on the side of the one-piece robot arm 39 and the two side edges of the single-piece mechanical arm 39 are drooped - the side of the brain, with the = 098130024, the bottom portion of the 183: 1 coffee The lower edges project in a direction close to each other. A pair of bottom portions 183 (between: a movement space for moving the advance and retreat support frame 189 for the single-plate machine 59 201020194 arm 39 is secured. It is not intended to illustrate a circular plan view of the structure of the advance and retreat drive mechanism 47. Figure 14 Reference is made to Fig. 13A and Fig. 13β. The advance/retract drive mechanism 47 is provided with a one-piece robot arm advance and retract mechanism 2 (U, and for the batch type robot arm 40) for advancing and retracting the one-piece robot arm 39. The advance and retreat batch type robot arm advance/retract mechanism 2〇2. ❹ Θ The one-piece arm advance/retract mechanism 201 is provided with a linear guide 2〇5 and a belt drive mechanism 206. The linear guide 2G5 is extended to the arm member 186 The upper end surface of the plate-shaped support member 207 that is erected on the bottom surface of the holding base 41 is fixed in parallel in the direction. The belt drive mechanism 2〇6 is provided with a motor 208, a drive pulley 209, and a driven pulley 21. The motor belt is fixed to the lower surface side of the holding base 41. The driving pulley 209 is disposed on the bottom surface wall of the holding base 41 to form a driving force state from the motor 208. The driven pulley The 21 turns are arranged such that the drive pulley 2G9 is in a direction parallel to the linear guide 2Q5. The belt 211 is wound between the drive pulley and the driven pulley 21A. The idler 212 is compliant with the belt 211. Give Zhang The way, from the (four) side contact belt belt. The single-type robot arm 39 (four) forward and backward support 189 series is combined with the linear guide 205, and the linear guide 2 〇 5 is used to conduct the τι, and can be linearly moved. The lower end portion of the frame 189 is provided with a light fixing portion 189 & The belt fixing portion 189a is pressed with the belt 2l3 - the belt 211. The gripper skin 098130024 60 201020194 If the motor 208 is driven, the driving pulley 209 rotates, and accordingly, The belt 211 is wound. As a result, the driving force is applied to the advancing and retracting branch 189. The advancing and retracting support frame 189 is linearly moved by the linear guide 2〇5. Thereby, the one-piece robot arm % supported by the advance/retract support frame 189 via the robot arm mechanism 190 can be advanced and retracted. The batch type robot arm advance and retract mechanism 202 is provided with a pair of right and left linear guides 215 and a belt drive mechanism 216. A pair of linear guides 2〇5 are parallel to each other, and β is arranged in parallel extending in the direction in which the arm member 176 extends. The pair of linear guides 205 # are respectively fixed to the upper end faces of the plate-shaped thrust members 217 which are erected on the bottom surface of the holding base 41. The belt drive mechanism 216 includes a motor 218, a drive pulley 219, a driven pulley 220, a belt 221, and an idle gear 222. The motor 218 is fixed to the lower surface of the holding base 41. The drive pulley 219 is disposed above the bottom wall of the holding base 41 and imparts a driving force from the motor 218. The driven pulley 22 is disposed in a state in which the driving pulley 219 is opposed to each other in the parallel direction of the linear guide 215. A belt 221 is wound around the drive pulley 219 and the driven pulley 22. The idler gear 222 contacts the belt (2) from the outer peripheral side in such a manner as to apply tension to the belt 221. The forward and backward support 179 for the batch type robot arm 40 is such that a pair of bottom surface portions 183c of the joint portion 183 are respectively coupled to the pair of linear guides 215, and guided by the linear guides 215, and the straight line can be straight. mobile. The belt fixing portion 183d is suspended from the inner edge of one of the bottom surface portions 183c of the joint portion 183. The belt fixing portion 183d holds the belt 221 together with the belt pressing 223. 098130024 61 201020194 If the motor 218 is driven, the drive pulley 219 rotates, and with this action, the belt 221 is wound. As a result, as a result of the driving force applied to the advancing support frame ι79, the advancing and supporting stand 179 is linearly moved while being guided by the linear guide 215. Thereby, the batch type robot arm 4 supported by the advance/retract support frame 179 via the arm opening and closing mechanism groove 180 can be advanced and retracted. The linear guides 205, 215 are fixed parallel to each other on the holding base 41, so that the one-piece robot arm 39 and the batch type robot arm 4 are parallel to each other.

Advance and retreat in the direction. In the present embodiment, the advancing and retracting paths of the one-piece robot arm 39 and the batch type robot arm 40 are vertically overlapped, and at the retreat positions, the one-piece robot arm 39 and the batch type robot arm 4〇 are formed up and down. The positional relationship of the layers. More specifically, the advancing and retracting path of the one-piece robot arm 39 is located below the advancing and retracting path of the batch robot arm 40. When the robot arms 39, 4 are all in the retracted position, the one-piece robot arm 39 is located in the batch. Directly below the robotic arm. Therefore, when the holding base 41 is rotated, by the mechanical arm (10),

Since the slewing radius of the carry-out mechanism 4 can be reduced by controlling the retracted position 40, the installation space of the carry-in/out mechanism 4 can be reduced, and accordingly, the occupied area of the substrate processing apparatus 10 can be suppressed. Fig. 15 is a cross-sectional view showing the structure of the singularly-collected object and the genre opening and closing 190. Referring to Fig. 15 together with reference to Fig. 1 and Fig. 2, the pair of mechanical parts 186 are arranged in the horizontal direction, and the area is referred to as "left machine is still required" and "money machine is required". The arm of the robot arm is supported by the arm of the left arm support member 187, 098130024 62 201020194 The right arm of the right arm is cantilevered by the arm arm reading member i88. The front and rear edges of the left and right arm parts and the front end of the 186R are formed with the outer edge - the base end (four) retreating _ oblique side (correctly speaking, the inclined side of the material on the way), and the third edge is disposed at the front end edge 2 The inner substrate guide 225 and the outer substrate guide 226 of the substrate support portion. The distance between the inner substrate guide and the center of the substrate held by the single-type mechanical arm 39 is shorter than the outer substrate guide 22, that is, with respect to the center of the substrate w, the inner substrate guide 225 The outer substrate guides 226 are located on opposite sides. On the upper end portions of the arm members 186L and 186R, the inner substrate guide 227 and the outer substrate guide 228 of the i-th and second substrate supporting portions are disposed. The inner substrate guides 2 27 are located on opposite sides with respect to the center of the substrate w, while the outer substrate guides 228 are located on opposite sides. The substrate guides 225 to 228 are formed in a circular shape in a plan view (in which the substrate guides 225 and 226 on the distal end side are semicircular). As shown in Fig. 16, a cylindrical projecting portion 240 is formed at the center portion. The periphery of the protruding portion forms a conical inclined surface 241 that gradually decreases toward the outer side. On the inclined surface 241, the peripheral edge of the substrate W is in a point contact state. Therefore, the horizontal movement of the substrate W is conveniently regulated by the circumferential surface of the projection 240. The outer substrate guides 226, 228 are integrally formed higher than the inner substrate guides 225, 227. That is, the substrate holding height formed by the outer substrate guides 226, 228 is higher than the base 098130024 63 201020194 plate holding height formed by the inner substrate guides 225, 227. More specifically, when the substrate w is held by the outer substrate guides 226, 228, the height under the substrate w is higher than the protruding portion 240 of the inner substrate guides 225, 227, so that the substrate W does not come into contact Inner substrate guides 225, 227. When viewed from the opposite directions of the right and left arm members 176L, 176R (the opening and closing direction of the arm member), the inner substrate guides 225 and 227 are located further outward than the outer substrate guides 226 and 228. Therefore, in the open state in which the interval between the left and right arm members 186L, 186R is relatively expanded (the state shown in Fig. 15), the substrate W is held by the inner substrate guides 225, 227, and the outer substrate guides 226, 228 are compared. The outer periphery of the substrate w is further outside and does not contact the substrate w. On the other hand, in the closed state in which the interval between the right and left arm members 186L and 186R is relatively narrow, the substrate W is held by the outer substrate guides 226 and 228, and the inner substrate guides 225 and 227 are more than the lower surface of the substrate W. It is below and does not touch the substrate W. Therefore, by opening and closing the left and right arm members 186L, 186R, the substrate w can be selected to be held by either of the inner substrate guides 225, 227 or the outer substrate guides 226, 228. In the present embodiment, when the unprocessed substrate W is transported, the one-piece robot arm 39 is closed, and the outer substrate guides 226 and 228 support the substrate W, and when the substrate W is processed, At the time of the conveyance, the one-piece robot arm 39 is opened, and the operation of the arm opening/closing mechanism 19 is controlled by the inner substrate guides 225 and 227 supporting the substrate W. Of course, the unprocessed substrate W and the processed substrate w can be reversed from the closed state of the monolithic 098130024 64 201020194 robot arm 39, so that the unprocessed substrate * is cut by the inner substrate guides 225, 227, and On the other hand, the processing substrate W is selected by the outer substrate guides 226, 228. Ο Ο The arm opening and closing mechanism 190 includes an opening and closing guide portion, a left pneumatic cylinder 232L, and a right pneumatic cylinder 232R. The opening and closing guide portion 231 is provided with a guide holder 233 and four guide shafts 234 that are inserted into the guide holder 233. The four guide shafts 234 are horizontally parallel to the opening and closing direction of the arm member 186. And inserted into the guide seat 233. The guide shafts are arranged along the advancing and retracting direction of the one-piece robot arm 39. In the four guide shafts (10), two guide shafts 234 are arranged at a distance, and each end is coupled to the rear of the left-side mechanical arm supporting member 187, and the other ends are connected to the arm of the arm. The insertion hole _ is formed in the wrist extending from the rear of the floor member (10). The ends of the insertion holes 188a are joined by a joint plate. The remaining two guide shafts 234 are coupled at one end to the right arm support member 188, and each other end is inserted into the insertion hole formed in the left arm support member 187. The end portions inserted through the insertion hole are combined by a joint plate. The left and right air pressures 232L and 232R are determined by the advance and retreat building 2 189 that holds the guide seat. The slit cylinder emblems and the 232R_bars are respectively attached to the wrist portions that extend toward the rear of the left and right robot arm reading members 187, 188. With this structure, by driving the air, the two arm members 187, 188 are guided by the opening and closing guide portion 231 while being separated from each other or left, the left and right mechanical arm members can be messed up, 18 The 098130024 65 201020194 2 is narrowed, and the one-piece robot arm 39 is closed, or the intervals are enlarged to form the one-piece robot arm 39 in an open position. Figure 2 shows a plan view of the sub-mechanical f 4q material structure. This is referred to in Figure m and Figure 13B. Each of the pair of robotic arm assemblies 175 of the batch type robotic arm 4 is disposed opposite each other on level 2. The j-arm requirements 176, which are arranged in the horizontal direction, are referred to as "left arm requirements" and "right = arm requirements". The left arm element 176L is supported by the left support block m core and the right arm element 176R is supported by the right arm block 178. The front end edges of the right and left arm members 176L and (10) are formed with inclined sides that retreat toward the base end side toward the outer side (correctly curved curved sides that are curved in the middle). The inner substrate guide 245 is disposed at the front end edge. With the outer substrate guide 246. The inner substrate guide 245 is spaced from the center of the substrate W held by the mechanical arm member and (10), and is shorter than the outer substrate guide 246. That is, the inner substrate guide is located on the opposite inner side with respect to the center of the substrate w, and the outer substrate guide 246 is located on the opposite outer side. The inner substrate guide 247 and the outer substrate guide 248 are disposed on the upper end portion of the base end portions of the arm members 176L, 176R. The inner substrate guide 247 is located on the opposite inner side with respect to the center of the substrate w and the outer substrate guide 248 is located on the opposite outer side. The substrate guides 245 to 248 have the same configuration as the substrate guides 225 to 228 provided on the one-piece robot arm 39. That is, the substrate guides 245 to 248 910130024 66 201020194 are formed in a circular shape in plan view (in which the substrate guides 245 and 246 on the front end side are semicircular), and a cylindrical projection is formed at the center portion. The periphery of the protruding portion is formed into a conical inclined surface which gradually decreases toward the outer side. On the inclined surface, the peripheral edge of the substrate w is in a point contact state. Therefore, the horizontal movement of the substrate w is conveniently regulated by the circumferential surface of the protruding portion. The outer substrate guides 246, 248 are integrally formed higher than the inner substrate guides 245, 247. That is, the substrate holding height ′ formed by the outer substrate guides 246 and 248 is higher than the substrate holding height formed by the inner substrate guides 245 and 247. More specifically, 'when the substrate W is held by the outer substrate guides 246, 248', the height under the substrate w is higher than the protrusions of the inner substrate guides 245, 247, so that the substrate w does not contact the inner side. Substrate guides 245, 247. The inner substrate guides 245, 247 are located further outward than the outer substrate guides 246, 248 when viewed in the opposing direction of the left and right arm members 176L, 176R (the opening and closing direction of the arm member). Therefore, in the open state in which the interval between the left and right arm members 176L, 176R is relatively increased, the substrate W is held by the inner substrate guides 245, 247, and the outer substrate guides 246, 248 are more than the outer periphery of the substrate W. It is on the outside and does not touch the substrate w. On the other hand, in the closed state in which the interval between the left and right arm members 176L and 176R is relatively narrow, the substrate W is held by the outer substrate guides 246 and 248, and the inner substrate guides 245 and 247 are lower than the substrate W. It is lower down and does not touch the substrate W. Therefore, by using the opening and closing of the left and right mechanical arm members 176L, 176R, 098130024 67 201020194, the substrate w can be selected to be held by either of the inner substrate guides 245, 247 or the outer substrate guides 246, 248. In the present embodiment, when the unprocessed substrate W is transported, the batch type robot arm 40 is closed, and the substrate W is supported by the outer substrate guide 2, 248, and the substrate W is processed. When the w is transported, the batch type robot arm 40 is opened, and the operation of the arm opening/closing mechanism 18 is controlled by the inner substrate guides 245 and 247 supporting the substrate w. Needless to say, the correspondence between the unprocessed substrate W and the processed substrate w and the open/close state of the batch θ robot 40 can be reversed, and the unprocessed substrate w can be supported by the inner substrate guides 245 and 247. The processing substrate w is supported by the outer substrate guides 246, 248. The arm opening and closing mechanism 180 includes an opening and closing guide portion 251, a left air pressure red 252L, and a right air cylinder 252R. The opening and closing guide portion 251 is provided with a guide holder 253 and four guide shafts 254 that are inserted into the guide holder 253. The guide seat 253 is formed in a long cuboid shape in the up and down direction, and the four guide shafts 254 are inserted into the guide 253 in a horizontal direction parallel to the opening and closing directions of the arm members 176L, 17B. The guide shafts 254 are arranged sideways (see Fig. 13A) at positions corresponding to the four vertices of the rectangle. The two guide shafts 254' disposed at the diagonal positions of the rectangle are coupled to the rear projections of the left support block 177, and the other ends are inserted into the rear projections of the right support block 178. The insertion hole 178a is formed. The ends of the insertion holes 178a are joined by a coupling plate 255. At the other diagonal position of the above rectangle, the 098130024 68 201020194 and the other two guide shafts 254 ′ are respectively coupled to the rear extension of the right support block 178, and the other ends are inserted into the left support block 177. The rear extension portion is formed in the insertion hole 177a. The ends of the insertion holes 177a are joined by a connecting plate 256. In the guide holder 253, a rectangular opening portion 253a is formed in the center portion on the back side. Left and right pneumatic cylinders 252L and 252R are fixed to both side surfaces of the opening 253a. The operating levers of the pneumatic cylinders 252L, 252R are coupled to the left and right support blocks 177, 178, respectively. With this configuration, by driving the pneumatic cylinders 252L, 252R, the support blocks 177, 178 are guided toward and away from each other while being guided by the opening and closing guide portion 251. Thereby, the interval between the right and left arm members 176L, 176R can be enlarged to open the batch type robot arm 40, or the interval between the arm members 17A and 176R can be narrowed to make the batch type robot arm 4 〇 forms a closed state. /, the person will explain the operation example of the loading and unloading mechanism 4. The operation of the loading and unloading mechanism β 4 is performed by the controller 9 for each member of the loading and unloading mechanism 4, in particular, the turning mechanism 45, the lifting mechanism 46, the one-piece robot arm advance/retract mechanism 2〇1, and the batch type robot arm advance and retract mechanism 202. Achieved by control. In the first operation example, the unprocessed substrate w is accommodated in the wafer cassette F, and the operations (total transfer) in which the posture conversion mechanism 5 is collectively transferred are described. The loading/unloading mechanism 4 rotates the holding base 41 by the turning mechanism 45, and causes the batch type robot arm 40 to face the wafer cassette F. In this state, 098130024 69 201020194 The batch-human robot arm advance and retract mechanism 2G2 advances the batch robot arm toward the wafer cassette F, and causes each arm member 176 to enter under each substrate W in the wafer cassette F. . At this time, the batch type robot arm 4 is in a closed state (a state in which the substrate w is cut by the outer substrate guides 246 and 248). Then, by the action of the elevating mechanism, the holding robot 41 is raised by a small distance (for example, equal to the pitch of the substrate holding position in the wafer cassette F), and the batch type robot arm 4 is raised, and The 25 substrates w in the round box F are collectively collected. In this state, the batch type robot arm advance/retract mechanism 2〇2 will cause the batch type robot arm 4 to retreat. Thereby, the 25 substrates W in the wafer cassette F are collectively carried out. Next, the holding base 41 is rotated by the turning mechanism 45, and the batch type robot arm 40 is opposed to the posture changing mechanism 5. In this state, the batch type arm advance/retract mechanism 202 advances the batch type robot arm 4 toward the posture switching mechanism 5, and causes the plurality of substrates w to enter the plurality of holding grooves of the first holding mechanism 51. At this time, the pair of first holding mechanisms 51 are controlled to face each other with respect to the unprocessed substrate holding groove group. Then, by the action of the lifting mechanism 46, the holding base 41 is only lowered by a small distance (for example, equal to the holding groove pitch in the i-th holding mechanism 51), whereby the batch type robot arm 4 is lowered. The 25 substrates w are transferred from the batch type robot arm 4 to the first holding mechanism 51 in a unified manner. In this state, the batch type robot arm advance/retract mechanism 2〇2 causes the batch type robot arm 40 to retreat. Thereby, the overall transfer from the pod F to the posture converting mechanism 5 is completed. In the second operation example, the posture conversion mechanism 5 holds 25 sheets of processing 098130024 201020194 sheets w, and the operations of collectively transferring the cassettes to the wafer cassettes (total transfer) will be described. The loading/unloading mechanism 4 rotates the holding base 41 by the turning mechanism 45, and the batch type robot arm 40 faces the posture switching mechanism 5. In this state, the batch type robot arm advance and retract mechanism 202 advances the batch type robot arm 40 toward the posture switching mechanism 5, and causes each of the arm member 176 to enter each of the holding grooves held by the i-th holding mechanism 51. Below the substrate w. At this time, the first holding mechanism 51 is opposed to the untreated substrate holding groove group. Further, the batch robot 40 is in an open state (a state in which the substrate w is supported by the inner substrate guides (10) and 247). Then, by the action of the elevating mechanism, the holding base 41 is raised by only a small distance (for example, equal to the holding groove pitch in the first holding mechanism 51), thereby causing the batch type robot arm 4 to rise, and collectively The 25 substrates w held by the first holding mechanism 51 are collected. In this state, the batch type robot arm advance/retract mechanism 202 retracts the batch type robot arm 4 . By this, the π-sheet evaluation is carried out in a unified manner from the first holding mechanism 51. Next, the holding base 41 is rotated by the turning mechanism 45, and the batch type robot arm 40 faces the wafer cassette F. In this state, the batch type robot arm advance and retract mechanism 202 advances the batch type robot arm 4 toward the wafer cassette F, and causes the plurality of substrate boards W to enter the right upper side of the substrate holding height in the wafer cassette F. Location. Then, by the action of the elevating mechanism 46, the holding base 41 is lowered by only a small distance (for example, equal to the substrate holding position in the wafer cassette F), and the batch type robot arm 4 is lowered, and then 25 substrates are further lowered. w system 098130024 71 201020194 is transferred from the batch robot arm 40 to the substrate holder in the wafer cassette F. In this state, the batch type robot arm advance and retract mechanism 202 retracts the batch type robot arm 40. Thereby, the collective transfer of the wafer cassette F from the posture switching mechanism 5 is completed. In the third operation example, the operation (single-chip transfer) in which the unprocessed substrate w accommodated in the wafer cassette is transferred to the posture conversion mechanism 5 one by one is explained. The loading/unloading mechanism 4 rotates the holding base 41 by the turning mechanism 45, and the one-piece robot arm 39 faces the wafer cassette F. Further, by the action of the elevating mechanism 46, the holding base 41 is moved up and down, and the height of the one-piece robot arm 39 is controlled to be smaller than the storage position of the transfer target substrate w in the wafer cassette F. The height is shorter than the distance between the substrate accommodation positions in the wafer cassette F. In this state, the one-piece robot arm advance/retract mechanism 201 advances the one-piece robot arm 39 toward the wafer cassette F, and causes the one-piece robot arm 39 to enter below the transfer target substrate w. At this time, the one-piece robot arm 39 is in a closed state (a state in which the substrate w is supported by the outer substrate guides 226 and 228). Then, by the action of the elevating mechanism 46, the holding base "only rises slightly (for example, equal to the pitch of the substrate holding position of the wafer cassette F (10))", thereby raising the one-piece robot 39 and collecting the wafer cassette In this state, the one-piece robot arm advance/retract mechanism 201 retracts the one-piece robot arm 39. Thereby, the wafer cassette f-sheet transfer target substrate W is carried out. 098130024 72 201020194 Next, the holding base 41 is rotated by the turning mechanism 45, and the one-piece robot arm 39 is opposed to the posture changing mechanism 5. Further, if necessary, the holding base 46 is held by the lifting and lowering mechanism 46. 41 lifting and lowering, thereby changing the interval of the one-piece machine #39. Thereby, the sheet held by the one-piece robot arm can be transmitted to the height maintaining groove of the first holding mechanism 51. The advancing and retracting mechanism 201 causes the one-piece robot arm 39 to push the one of the plurality of holding grooves of the front side of the posture switching mechanism 5: one piece of the substrate* into the holding groove of the first holding mechanism. In this case, corresponding to the one-piece type Robot arm 39 height, 1st holder The structure 51 is controlled to face the untreated substrate holding groove group. =:Material_46_ 'The rotation base 41 is lowered by only the micro I so that the second is equal to the holding groove pitch in the first holding mechanism 51. ), the mechanical device '39 is transmitted to the first holding and dragging arm. If the arm advances and retracts the mechanism, the single-chip machine is transported from the wafer cassette F to the posture switching mechanism 5 in a single-chip state. The substrate w that has been completed at any substrate holding position is transported to the m-th inner portion and held in an arbitrary height holding groove. Therefore, depending on the state of the first holding mechanism 51, the substrate can be replaced by the inner disk. In the case of the column body, the substrate w can be arranged in a different order from the order of the soil plate w, 098130024 73 201020194. The substrate w is held by the first holding mechanism 51. Further, when the wafer cassette F is not equal When the substrate w is not filled for 25 sheets (for example, a plurality of sheets), the substrates w can be held at equal intervals by the first holding mechanism 51. Further, when the plurality of substrates w are held at the middle position in the wafer cassette F The substrate % can be fixedly arranged in the upper position or the lower position of the first holding mechanism 51. In the fourth operation example, the operation (single piece transport) in which one of the substrates held by the posture conversion mechanism 5 is transferred into the round box F will be described. The loading and unloading mechanism 4 uses the turning mechanism & The holding base 2 is rotated, and the one-piece robot arm 39 is opposed to the posture changing mechanism 5. Further, the holding base 41 is moved up and down by the action of the lifting mechanism 46, whereby the one-piece machine is moved. The shouting control is performed at a lower distance (shorter than the distance of the holding groove interval of the first holding mechanism) from the storage position of the transfer target substrate w held by the first holding mechanism 51 of the posture changing mechanism 5. In this state, the one-piece arm advance/retract mechanism 201 advances the one-piece φ 39 toward the (four) (four) mechanism 5, and the single-plate type arm 39 is below. At this time, the holding mechanism 51 and the holding mechanism 51 are in a posture in which the holding groove group is opposed to each other. This branch pushes the state of the substrate w). The sails (by the inner substrate guides 225, 227, secondly) use the action of the lifting mechanism 46 to cause the holding base 41 to rise only slightly = (for example, 'equal to the holding groove pitch of the first holding mechanism W), thereby making the grass The sheet type robot arm 39 is raised, and the target substrate W is transferred from the second holding mechanism to the 098130024 74 201020194. In this state, the one-piece robot arm advance/retract mechanism 201 moves the one-piece robot arm 39 backward. By this, one sheet of the transfer target substrate w is carried out from the i-th holding mechanism 51. Next, the holding base 41 is rotated by the turning mechanism 45, and the one-piece robot arm 39 faces the wafer cassette f. If necessary, the holding base 41 is moved up and down by the action of the lifting mechanism 46, whereby the height of the one-piece robot arm 39 is changed. Thereby, the base plate W held by the one-piece robot arm 39 can be transmitted. The substrate holder of any height is given to the cassette F. Next, the one-piece robot arm advance/retract mechanism 2〇1 advances the one-piece robot arm 39 toward the wafer cassette F, and causes one substrate W to enter the wafer cassette F. Any of a plurality of substrate holders (corresponding to a monolithic machine) The height of the substrate 39 the retainer).

Next, by the action of the elevating mechanism 46, the holding base 41 is lowered by only a small distance (for example, equal to the pitch of the substrate holding position in the wafer cassette F), whereby the one-piece robot arm 39 is lowered, and then the cymbal is lowered. The substrate w is transferred from the single-piece arm 39 to the substrate holder of the wafer cassette F. In this state, the one-piece robot arm advance and retract mechanism 201 retracts the one-piece robot arm 39. Thereby, the single sheet transfer from the posture changing mechanism 5 to the wafer cassette F is completed. 098130024 By repeating this single-chip transfer, the plurality of substrates # can be transferred from the posture to the wafer cassette F. At this time, the substrate W held by the i-th holding mechanism can be transported to the wafer (four) at any height and height. Therefore, the substrate W can be housed in the wafer cassette F in an arrangement state different from the arrangement state of the substrate w 75 201020194 in the first holding mechanism 51. Specifically, the substrate W can be accommodated in the wafer cassette f in the order in which the order of the substrates W in the first holding mechanism 51 is different. For example, in the third operation example, the case where the first holding mechanism 51 is transported while changing the arrangement of the unprocessed substrate w in the wafer cassette F is performed, and after the processing is performed on the substrates # The processing of the substrate W is returned to the wafer cassette F in the original arrangement state. The fifth operation example is a combination of the overall transportation and the single-piece transportation. For example, 25 unprocessed substrates w are taken out from one wafer cassette F, and transferred to the posture conversion mechanism 5, and the unprocessed substrate W (for example, a dummy substrate for testing) is taken out from the other wafer cassette F, and The posture conversion mechanism 5 is transported to the posture conversion mechanism 5 to collectively hold the two substrates w. In this case, first, the 25 unprocessed substrates w are transferred from the wafer cassette F to the posture switching mechanism 5 by the collective transfer using the batch type mechanical arm 40 described in the first operation example. Next, the single-piece conveyance by the one-piece robot arm 39 described in the third operation example is described, and one unprocessed substrate w is transferred from the other wafer cassette F to the posture conversion mechanism 5. Further, in another operation example, 25 unprocessed substrates w may be collectively carried out from one wafer cassette F by the batch type robot arm 40, and a single >! type robot arm may be used from the other wafer cassette F. 39 (4) One unprocessed substrate w is placed, and a total of 26 unprocessed substrates W are held by the carry-in/out mechanism 4. Then, after the one-piece robot arm 39 and the batch type robot arm 4Q are rotated by the turning mechanism 45' to face the posture of the 098130024 201020194 changing mechanism 5, it is convenient to use the batch type robot arm 4 to apply 25 pieces of the substrate W. In the posture conversion mechanism 5, the remaining one substrate W is carried into the posture conversion mechanism 5 by the one-piece robot arm 39. On the other hand, there are 26 substrates W that have been processed by the posture changing mechanism 5, and 25 of the substrates W are housed in one wafer cassette F, and the remaining one substrate W (for example, a dummy substrate for testing) ) is accommodated in another wafer cassette F. In this case, first, the 25-piece processed substrate W is transferred from the posture switching mechanism 5 to one wafer cassette f by the general transport described by the above-described second operation example using the batch type mechanical arm 40. Then, by the single-piece conveyance by the one-piece robot arm 39 described in the fourth operation example, the remaining one substrate w is transferred from the posture conversion mechanism 5 to the other wafer cassette f. In the other operation example, the 25 pieces of the processing substrate W can be integrally carried out by the batch type robot arm from the posture changing mechanism 5, and the remaining one piece can be processed by the single-plate type robot arm 39. When it is carried out, the total of 26 pieces of the processed substrate W is held by the carry-in/out mechanism 4. Then, after the one-piece robot arm 39 and the batch type robot arm 4 are rotated to face the wafer cassette F by the turning mechanism 45, it is convenient to use the batch type robot arm 4 to collectively laminate the 25 substrates w. Move into a wafer cassette! ? Further, the remaining one substrate W can be carried into the other wafer cassette F by using a one-piece mechanical arm buckle. The switching between the unified transfer and the single-piece transfer can also be performed in accordance with the number of substrates held in the wafer cassette F by the wafer cassette holding unit. For example, when the wafer cassette F contains 098130024 77 201020194 with a predetermined number of unprocessed substrates w or more, it is executed according to the above! On the other hand, when the unprocessed substrate W which is less than the predetermined number of sheets is accommodated in the wafer cassette F, the single-piece transfer by the third operation example can be performed. Of course, even when 25 substrates W are accommodated in the wafer cassette F, in order to change the order of arrangement of the substrates W, single-piece transfer according to the third operation example described above can be employed. As described above, according to the present embodiment, the one-piece robot arm advancing and retracting mechanism 201 and the batch type robot arm advancing and retracting mechanism 202 are collectively held by the holding base 41, and the one-piece robot arm 39 and the batch type are used by these. The robotic arm is advancing independently. Further, the holding base 41 is rotated about the vertical axis by the turning mechanism 45, and is lifted and lowered by the lifting mechanism 46. Therefore, the swing mechanism 45 and the lift mechanism 46 are shared by the one-piece robot arm 39 and the batch type robot arm 40. With this configuration, since the collective transfer by the batch type robot arm 4 and the one-piece transfer by the one-piece robot arm 39 can be switched immediately, the time for replacing the robot arm is not required. Further, since it is not necessary to form a two-axis synchronous drive structure for horizontally transporting the substrate w as in the case of a vertical multi-joint robot s robot, the transport of the substrate W can be speeded up. Therefore, the substrate processing speed can be improved. Further, since it is not necessary to use a complicated structure transport mechanism such as a vertical articulated arm type robot, and the arm replacement portion is not required, the configuration can be simplified, and in this case, the cost can be reduced. Moreover, since the 906130024 78 201020194 arm replacement portion is not required, it also contributes to the reduction of the footprint of the substrate processing apparatus. Further, the one-piece robot arm 39 can use the substrate guide 225 separately depending on the unprocessed substrate W and the surface of the substrate W by changing the interval between the two arm members 186 arranged in the horizontal direction. 227; 226, 228. Therefore, since the replacement of the robot arm is not required, the substrate processing speed is facilitated. The above description of an embodiment of the present invention has been made, but the present invention can be carried out in other forms. For example, in the above embodiment, the intermediary mechanism 72 is provided, but the intermediary mechanism 72 may be omitted. In this case, the unprocessed substrate W that has been transferred to the substrate transfer by the carry-in jig is transferred directly from the carry-in jig 74 to the main transfer mechanism 3. Further, in the above embodiment, the carry-out jig 73 is disposed above the carry-in jig 74, but the vertical relationship may be reversed. Further, in the above embodiment, the batch type robot arm 40 is disposed above the one-piece robot arm 39, but the vertical relationship may be reversed. In the above-described embodiment, the loading/unloading mechanism 4 for transporting the substrate w between the wafer cassette F and the posture changing mechanism 5 is described using the example of the present invention, but the transfer destination other than the above is used. The substrate transfer device of the present invention can also be used for the substrate transfer between. Although the embodiments of the present invention have been described in detail, the present invention is not limited to the specific examples used to explain the technical contents of the present invention, and the present invention should not be construed as being limited to the specific examples. The spirit and scope are limited only by the scope of the appended claims. This application corresponds to the special wishes 2008-234273 and 2008-234274 proposed by the Japan Patent Office on September 12, 2008, and the special wishes 2009-165681 submitted to the Japan Patent Office on July 14, 2009. No. The entire disclosures of these applications are cited and incorporated in this case. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a schematic plan view showing the entire structure of a substrate processing apparatus according to an embodiment of the present invention. Fig. 2A is an enlarged plan view showing a structure related to substrate transfer between the wafer cassette and the main transfer mechanism, and is a view showing a facade 圊 seen from an arrow A1 in Fig. 2A. Fig. 3A is a plan view of the posture changing mechanism, and Fig. 3B is a perspective elevational view for explaining the internal structure of the posture changing mechanism. Fig. 4 is an elevational view for explaining the configuration of the pusher. Fig. 5 is a view for explaining the associated structure of the transfer mechanism, which is an elevation view as seen from the direction of the arrow A2 in Fig. 2A. Fig. 6 is a perspective side view showing the structure of the traverse mechanism of the carry-out mechanism. 7A, 7B and 7C are views for explaining the structure of the carry-out jig. 8A, 8B and 8C are views for explaining the structure of the loading jig. Figures 9, 9B and 9C are diagrams for explaining the construction of the intermediate fixture. 1 to 10 are diagrammatic illustrations for explaining the light flow of the substrate loading operation 80 098130024 201020194. Figure to 11K for use

BRIEF DESCRIPTION OF THE DRAWINGS Fig. 12 is a cross-sectional view for making a substrate carrying out operation flow. The related structure m for explaining the rotation and the up and down movement of the loading and unloading mechanism is a perspective side view for explaining the configuration of the one-piece robot arm, the batch type robot arm, and the advance and retreat driving mechanism for advancing and retracting, and FIG. 13B A rear view as seen from the direction of the arrow A4 in the diagram (10). It is a schematic plan view for explaining the configuration of the one-piece robot arm advance and retract mechanism and the batch type robot arm advance and retreat mechanism. Structure of the mechanical arm and the arm opening and closing mechanism Fig. 15 is a cross-sectional view for explaining a single piece. The structure of the substrate guide provided in the arm is used to explain the mechanism of the mechanical arm and the arm opening and closing mechanism. Fig. 16 is an enlarged cross-sectional view. Figure 17 is a top view for use. [Description of main component symbols] F Wafer box W Substrate X is along the horizontal direction Y of the front surface of the substrate processing apparatus along the horizontal direction of the side surface of the substrate processing apparatus 2 Up and down direction, vertical direction 098130024 81 201020194 P Substrate transfer position s Substrate transfer position HI South degree HO moving out of South H2 Transfer height TP1 Transfer path TP2 Transfer path H10 Origin height H11 First transfer height H12 Second transfer height 1 Cartridge holding unit 2 Substrate processing unit 3 Main transfer mechanism 4 Carry-in mechanism 5 posture conversion mechanism 6 pusher 7 transfer mechanism 8 jig cleaning unit 9 controller 10 substrate processing device 10a front 10b side 098130024 201020194 11 automatic wafer cassette transport device 12 opener 13 substrate direction alignment mechanism 15 door 16 alignment processing head 17 Lifting mechanism 18 Substrate guide 19 19 Roll mechanism 20 Processing unit (processing unit) 21 First chemical tank 22 First cleaning liquid tank 23 Second chemical tank 24 Second cleaning liquid tank 25 Drying processing unit 第 27 First Lift 28 2nd Lift 30 Substrate Clamp - 31 Support Guide • 33 arrow 35 Washing tank 39 Monolithic arm 40 Batch robot 098130024 83 201020194 41 Holding base 42 Turning block 43 Lifting block 44 Base part 45 Swing mechanism 46 Lifting mechanism 47 Advancing and retracting drive mechanism 49 Base Seat 50 Rotating block 50a Rotating shaft 51 First holding mechanism 52 Second holding mechanism 53 Substrate specification mechanism 54 Gear head 55 Motor 56 Horizontal holding member 57 Support rod 58 Holding groove group 58a Holding groove 59 Holding groove group 59a Holding groove 60 Vertical Holding member

098130024 84 201020194 61 Support rod 62 Holding groove member 63 Holding groove 64 Holding groove 65 Adjacent gap between the holding groove members 70 Carrying mechanism 71 Loading mechanism Ref. 72 Intermediary mechanism 73 Carrying out the jig 74 Loading the jig 75 The jig 76 The traverse mechanism 77 The traverse mechanism 78 Lifting drive mechanism ❿ 81 1st holding mechanism drive mechanism 82 Bearing 83 Motor - 84 Support plate 85 Pneumatic cylinder 87 2nd holding mechanism drive mechanism 88 Support plate 89 Slide rail 098130024 85 201020194 90 Moving base 91 Bearing 92 Motor 93 Connecting member 94 Pneumatic cylinder 96 Substrate regulating mechanism drive mechanism 97 Slide rail 98 Moving base 99 Connecting member 100 Actuator 101 First horizontal path 102 Second horizontal path 105 Lifting and holding portion 106 Rotating shaft portion 107 Traverse base 108 Lifting Base 110 linear actuator 110a action member 111 motor 112 rotary drive mechanism 113 slide rail 114 slide drive mechanism 098130024 86 201020194 116 first guide 117 second guide 118 support member 119 support member 120 lift shaft 121 up and down Actuating mechanism 125 Linear actuator 125a Actuating element 126 Motor 127 Connecting support frame 130 Support block 131 Ball screw mechanism 132 Operating space 133 Moving plate 134 Fixing plate 135 Slip 136 Ball nut 137 Connecting member 138 Motor 139 Notch 140 Base plate guide 141 Base part 098130024 87 201020194 142 Pneumatic cylinder 143 Linear guide 144 Connecting member 145 Riser wall 146 Horizontal part 147 Through hole 148 Substrate guide 149 Base part 150 Substrate guide 151 Base part 152 Pneumatic cylinder 153 Linear guide Member 154 Connecting member 155 Standing wall portion 156 Horizontal portion 157 Through hole 161 Motor 162 Gear head 162a Output shaft of gear head 165 Motor 166 Ball screw mechanism 167 Gear head

098130024 88 201020194 168 Screw shaft 169 Ball nut 175 Manipulator element set 176 Manipulator element 176L Left arm element 176R Right arm element 177 Left support block 177a Insert hole 178 Right support block 178a Insert hole 179 Advance and retract support 180 Arm opening and closing mechanism 182 Supporting portion 183 Connecting portion ©183a Top surface portion 183b Side portion 183c Bottom portion 183d Belt fixing portion 186 Robot arm element 186L Left arm element 186R Right arm element 187 Left arm supporting member 098130024 89 201020194 187a Insert Through hole 188 Right arm support member 188a Insert hole 189 Advance support frame 189a Belt fixing portion 190 Robot arm opening and closing mechanism 201 Monolithic arm advance and retract mechanism 202 Batch type robot arm advance and retract mechanism 205 Linear guide 206 Belt drive mechanism 207 Support member 208 motor 209 drive pulley 210 driven pulley 211 belt 212 idler 213 belt press 215 linear guide 216 belt drive mechanism 217 support member 218 motor 219 drive pulley 098130024 90 201020194 220 driven pulley 221 belt 222 idle 223 belt pressing 225 inner substrate guide 226 outer substrate guide 227 inner substrate guide 〇 228 outer substrate guide 229 horizontal line (symmetric line) 231 opening and closing guide portion 232L left pneumatic cylinder 232R right pneumatic cylinder 233 guide seat 234 guide shaft 235 235 splicing plate 236 splicing plate 240 protruding portion 241 conical inclined surface 245 inner substrate guide 246 outer substrate guide 247 inner substrate guide 248 outer substrate guide 098130024 91 201020194 249 horizontal line (symmetric line) 251 open and close guide portion 252L Left pneumatic cylinder 252R Right pneumatic cylinder 253 Guide seat 253a Opening 254 Guide shaft 255 Connecting plate 256 Connecting plate

098130024 92

Claims (1)

201020194 VII. Patent Application Range: 1. A substrate processing apparatus includes: a substrate processing unit that performs a processing on a plurality of substrates in a vertical posture; a first horizontal mechanism that maintains a vertical posture. The first 検仃 holding portion of the plurality of substrates traverses along the first horizontal path between the substrate transfer position and the substrate transfer position; and the β 帛 21⁄4 line mechanism is the second of the plurality of substrates that maintain the vertical posture The loose row holding portion 'between the substrate transfer position and the substrate transfer position" is traversed along a second horizontal path that is lower than the first horizontal path; and the elevating mechanism is configured to collectively support a plurality of substrates in a vertical posture The lifting and lowering holding portion is moved up and down at the substrate transfer position, and the main transfer mechanism is configured to collectively transfer a plurality of substrates in a vertical posture between the substrate transfer position and the substrate processing unit. 102. The substrate processing apparatus of claim 1, wherein the method further comprises: 'transforming (four)', which is to convert the horizontally recorded Wei U board from a horizontal posture to a vertical posture, Lin Lingchun The elevating mechanism at the loading position of the upper bobbin simultaneously collects a plurality of substrates held in a vertical posture by the elevating mechanism 'located at the substrate transfer position, and switches from a vertical posture to a horizontal posture. 3. If the substrate of the second application of the patent scope is in the county, wherein the further step 098130024 93 201020194 includes: the device is a horizontal storage container holding portion, which is a container for holding the container, the plurality of substrates; And the accommodating and accommodating mechanism, which is configured to carry out the loading and unloading of the plurality of substrates in the horizontal posture in a general manner in the container held by the container holding portion, and to perform the plural of the horizontal posture in a unified manner with the posture switching mechanism. Transfer of the substrate. 4. The substrate processing apparatus according to claim 3, wherein the loading/unloading mechanism and the elevating mechanism_i-th substrate transport path and the second substrate transport path between the elevating mechanism and the substrate transfer position are Further, the elevating mechanism is disposed at an intersection of the first and second substrate transport paths. 5. For the substrate processing apparatus of claim 4, the access mechanism includes: ::: a robotic arm that is a plurality of substrates that maintain a horizontal posture; an advancement and retraction mechanism that causes the batch robotic arm to be horizontal The slewing mechanism is configured such that the accommodating arm is held in the return straight portion and the accommodating portion is held by the holding portion, and the accommodating device is accessed by the hopper. The direction of the arm material is the horizontal direction of the _. The substrate processing apparatus of the item of the present invention, wherein the fifth aspect of the invention includes: the second driving mechanism of the invention: the second driving mechanism that holds the plurality of substrates along the first substrate transport path The posture is such that the lift holding portion is rotated about the straight axis between the second posture of the plurality of substrates held in the vertical posture along the second substrate transport path. 7. The substrate processing apparatus according to any one of claims 1 to 6, wherein the lifting mechanism is configured to move the lifting and lowering portion up and down in a vertical direction, and to form a plurality of vertical postures from the lifting and lowering portion. The plurality of substrates are collectively transferred to the second horizontal row holding portion, and the plurality of substrates in the vertical posture held by the first lateral row holding portion are collectively collected by the elevation holding portion. 8. If you apply for a patent scope! The substrate processing apparatus of the present invention further includes: a β-intermediate mechanism for moving the secondary listening portion of the pure substrate to be lifted and lowered at the substrate transfer position. 9. The substrate processing apparatus according to claim 8, wherein the intermediary mechanism performs a plurality of sheets in a unified manner with the second lateral row holding unit by moving the intermediate medium portion at the substrate transfer position. Transfer of the substrate. The substrate processing apparatus according to claim 9, wherein the main transport mechanism is at the substrate transfer position, and a plurality of sheets are collectively performed between the first horizontal line holding portion 09S130024 95 201020194 and the medium holding unit. Transfer of the substrate. 11. The substrate processing apparatus according to claim 1, further comprising: a substrate alignment mechanism that is disposed below the second horizontal path at the substrate transfer position, and that is a plurality of pieces The orientation of the substrates is aligned. 12. The substrate processing apparatus according to claim 2, wherein the substrate alignment mechanism performs substrate alignment processing on the substrate held by the second lateral holding portion at the substrate transfer position. 13. The substrate processing apparatus of claim </ RTI> wherein the first horizontal row holding portion includes: a pair of substrate guides 'which are parallel to each other; and a guide opening and closing unit that connects the pair of substrate guides The interval is changed between an open state in which the width is larger than the substrate width and a closed state in which the opening is narrower than the substrate width but larger than the width of the lifting and lowering portion. 14. A substrate transporting apparatus comprising: a batch holding robot arm, wherein the plurality of substrates are integrally supported by a layered mechanical arm material mechanism, wherein the recording: the underarm arm is advanced and retracted. Mechanical arm, which holds one substrate; 'arm arm advance and retreat mechanism, which makes the single-piece mechanical arm advance and retreat; ... soil, which is the above-mentioned subtractive machine injection advance and retreat mechanism and single 098130024 type 201020194 mechanical arm advance and retreat mechanism The elevating mechanism 'this is to move the holding base up and down and the turning mechanism' to rotate the holding base around the return line in the wrong direction. 15. If you apply for the substrate transfer device of the 4th item, the upper batch frequency (4) is loaded with the machine to shoot and touch, and the batch robot and the monolithic arm are used. It is stacked in the vertical direction. In the substrate transfer device in the case of the fourth aspect of the invention, the arm unit is provided with the first and second substrate supporting portions of the two machine arm members that are disposed apart from each other in the horizontal direction. The mechanical transfer device further includes a mechanical arm opening and closing device 4 that opens and closes by driving the two machines in the horizontal direction, and the single mechanical device (four) opens the two mechanical arm components: (b) the first substrate supporting portion of the two robot arm elements, in the first X, the substrate is closed, and the second substrate supporting portion of the arm member is in a state in which the two arm members are closed. (2) The substrate holding device is a container for holding the container holding portion, and is configured to hold the substrate holding portion of the 098130024 97 201020194 in a state in which the plurality of substrates are stacked, which is to maintain the plurality of substrates. And a substrate transfer device, wherein the substrate holding device according to any one of claims 14 to 16 is provided, and the container held by the container holding portion and the base For conveying the substrate between the holding portion. 09813002498