CN114284191A - Film box, bearing device, taking and placing device and semiconductor processing equipment - Google Patents
Film box, bearing device, taking and placing device and semiconductor processing equipment Download PDFInfo
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- CN114284191A CN114284191A CN202210195053.8A CN202210195053A CN114284191A CN 114284191 A CN114284191 A CN 114284191A CN 202210195053 A CN202210195053 A CN 202210195053A CN 114284191 A CN114284191 A CN 114284191A
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- 239000004065 semiconductor Substances 0.000 title claims abstract description 12
- 230000000712 assembly Effects 0.000 claims description 15
- 238000000429 assembly Methods 0.000 claims description 15
- 235000012431 wafers Nutrition 0.000 description 73
- 239000000758 substrate Substances 0.000 description 6
- 239000000047 product Substances 0.000 description 3
- 230000014759 maintenance of location Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 239000011265 semifinished product Substances 0.000 description 2
- 238000010586 diagram Methods 0.000 description 1
- 238000006748 scratching Methods 0.000 description 1
- 230000002393 scratching effect Effects 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
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Abstract
The invention provides a chip box, a bearing device, a pick-and-place device and semiconductor processing equipment of the chip box, wherein the bearing device comprises a plurality of bearing components and at least one lifting mechanism which are arranged at intervals relatively, and the plurality of bearing components are movably arranged in the chip box; the lifting mechanism is connected with the bearing components and can lift the bearing components so as to adjust the distance between the bearing components. The bearing device can well avoid scratches, dirt, collision damage and misplacement on the surface of the wafer when the wafer is taken from or placed in the bearing device of the wafer box by adjusting the distance between the bearing components, effectively protect the surface of the wafer and avoid damage.
Description
Technical Field
The invention belongs to the technical field of semiconductors, and particularly relates to a chip box, a bearing device, a taking and placing device and semiconductor processing equipment of the chip box.
Background
Along with the continuous scale of semiconductor trade, the substrate, semi-manufactured goods and the finished product quantity that use sharply increase, also constantly improve to holding required spool box requirement, and current spool box is by mould integrated into one piece, comprises both sides brace table, and the substrate is put layer by layer, and middle interval is less and fixed, often can cause phenomenons such as mar, dirty, the damage of colliding with to the substrate surface when getting substrate, semi-manufactured goods and finished product.
In view of the above problems, it is necessary to provide a wafer cassette, a carrying device thereof, a pick-and-place device thereof, and a semiconductor processing apparatus, which are reasonably designed and effectively solve the above problems.
Disclosure of Invention
The invention aims to solve at least one technical problem in the prior art, and provides a chip box, a bearing device, a pick-and-place device and semiconductor processing equipment thereof.
One aspect of the invention provides a carrying device for a wafer box, which comprises a plurality of carrying components and at least one lifting mechanism, wherein the carrying components are arranged at intervals relatively, and the carrying components are movably arranged in the wafer box;
the lifting mechanism is connected with the bearing components and can lift the bearing components to adjust the distance between the bearing components.
Optionally, the lifting mechanism comprises a plurality of lifting support rods, and two adjacent lifting support rods are in cross movable connection;
the first end of each lifting support rod is movably connected with the first end of one of the two adjacent bearing assemblies, and the second end of the lifting support rod is movably connected with the second end of the other one of the two adjacent bearing assemblies; and/or the presence of a gas in the gas,
the bearing assembly comprises a bearing main body, a first limiting buckle and a second limiting buckle; a first adjusting groove is formed in the first end of the bearing main body, and a second adjusting groove is formed in the second end of the bearing main body;
the first limiting buckle is arranged in the first adjusting groove in a sliding mode, and the second limiting buckle is arranged in the second adjusting groove in a sliding mode;
the first end of the lifting support rod is movably connected with the corresponding first limit buckle, and the second end of the lifting support rod is movably connected with the corresponding second limit buckle.
Optionally, the outer side wall of the bearing main body is provided with a mounting groove, and the bearing assembly further comprises a first mounting part and a second mounting part;
the first mounting piece and the second mounting piece are oppositely arranged in the mounting groove at intervals, the first mounting piece is provided with the first adjusting groove, and the second mounting piece is provided with the second adjusting groove; and/or the presence of a gas in the gas,
the inner side wall of the bearing main body is provided with a supporting groove, and the bearing main body is provided with an avoiding opening allowing the wafer to pass through.
Optionally, the bearing assembly further includes a limiting member, and the limiting member is inserted into one end of the support groove departing from the avoiding opening; and/or the presence of a gas in the gas,
the carrier assembly further comprises a guard rotatably connected to the bypass open end of the carrier body; and/or the presence of a gas in the gas,
the corner end of the bearing main body is provided with a positioning piece.
The invention provides a taking and placing device for a film box, which comprises a taking and placing driving mechanism and a supporting fork, wherein the supporting fork is used for being connected with a bearing device placed in the film box;
the picking and placing driving mechanism is movably connected with the supporting fork and can drive the supporting fork to pop up or reset.
Optionally, the pick-and-place driving mechanism comprises a top rod, an ejection assembly and a connecting rod assembly;
the first end of the ejection assembly is connected with the ejector rod, the second end of the ejection assembly is rotatably connected with the first end of the connecting rod assembly, and the second end of the connecting rod assembly is connected with the supporting fork; wherein,
when the ejector rod is pressed down, the ejecting component ejects to drive the connecting rod component to rotate towards a first direction, so that the supporting fork ejects;
when the ejector rod resets, the ejection assembly resets to drive the connecting rod assembly to rotate towards the second direction, so that the support fork resets.
Optionally, the pop-up assembly comprises a movable rod, an elastic piece and a sliding chute/pulley;
the first end of the movable rod is connected with the ejector rod through the sliding chute/pulley, the second end of the movable rod is rotatably connected with the connecting rod assembly, and the movable rod is provided with a fixed part and a limiting part which are arranged at intervals;
the elastic piece is sleeved on the movable rod, and two ends of the elastic piece are respectively abutted against the fixed part and the limiting part; and/or the presence of a gas in the gas,
the connecting rod assembly comprises a first connecting rod and a second connecting rod;
the first end of the first connecting rod is rotatably connected with the second end of the movable rod, the second end of the first connecting rod is rotatably connected with the first end of the second connecting rod, and the second end of the second connecting rod is connected with the supporting fork.
Optionally, the pick-and-place driving mechanism further includes a fixing rod, a first end of the fixing rod is rotatably connected to the first connecting rod, and a second end of the fixing rod is fixedly connected to the bearing device; and/or the presence of a gas in the gas,
the support fork comprises a support fork part and an ejection part, the ejection part is arranged on one side, facing the connecting rod component, of the support fork part, and the ejection part is fixedly connected with the connecting rod component.
The invention provides a film box, which comprises a back cover and a front cover, wherein the front cover is covered on the back cover; and/or the presence of a gas in the gas,
the film box also comprises the taking and placing device, and the taking and placing device is accommodated in the film box; and/or the presence of a gas in the gas,
a fixed base is arranged on one side, away from the front cover, of the rear cover, and a fixed groove is formed in the fixed base;
when the taking and placing device comprises a second connecting rod, one end of the second connecting rod is inserted into the fixing groove.
Another aspect of the invention provides a semiconductor processing apparatus comprising a cassette as described above.
The invention provides a wafer box, a bearing device, a taking and placing device and semiconductor processing equipment of the wafer box, wherein the bearing device comprises a plurality of bearing components and at least one lifting mechanism which are arranged at intervals relatively, and the plurality of bearing components are movably arranged in the wafer box; the lifting mechanism is connected with the bearing components and can lift the bearing components so as to adjust the distance between the bearing components. The invention can well avoid scratching, dirt, collision damage and misplacing the surface of the wafer when the wafer is taken and placed from the bearing device of the wafer box by adjusting the distance between the plurality of bearing components, effectively protect the surface of the wafer and avoid damage.
Drawings
FIG. 1 is a schematic view of a cassette according to an embodiment of the present invention;
FIG. 2 is a front view of a cassette according to another embodiment of the present invention;
FIG. 3 is a schematic structural diagram of a carrier apparatus according to another embodiment of the invention;
FIG. 4 is a side view of a load bearing assembly in accordance with another embodiment of the present invention;
FIG. 5 is a side view of a load bearing assembly in accordance with another embodiment of the present invention;
FIG. 6 is a top view of a load bearing assembly in accordance with another embodiment of the present invention;
FIG. 7 is a partial perspective view of a load bearing assembly according to another embodiment of the present invention;
FIG. 8 is a partial perspective view of a load bearing assembly according to another embodiment of the present invention;
FIG. 9 is a perspective view of a carrier assembly according to another embodiment of the present invention;
fig. 10 is a schematic structural view of a pick-and-place apparatus according to another embodiment of the present invention;
FIG. 11 is a side view of a pallet fork according to another embodiment of the invention;
FIG. 12 is a schematic view of a combined carrying device and pick-and-place device according to another embodiment of the present invention;
FIG. 13 is a schematic structural view illustrating a supporting fork being ejected when the carrying device and the pick-and-place device are combined according to another embodiment of the present invention;
FIG. 14 is a schematic structural view illustrating a fork of the pick-and-place apparatus according to another embodiment of the present invention;
FIG. 15 is a perspective view of a carrier and pick-and-place device in combination according to another embodiment of the present invention;
FIG. 16 is a schematic structural view of a cassette with a loading device and a pick-and-place device disposed therein.
Detailed Description
In order to make the technical solutions of the present invention better understood, the present invention will be described in further detail with reference to the accompanying drawings and specific embodiments.
As shown in fig. 1 and fig. 2, an aspect of the present invention provides a magazine 100, the magazine 100 includes a rear cover 110 and a front cover 120 covering the rear cover 110, the magazine 100 further includes a carrying device 200 as shown in fig. 3, the carrying device 200 is movably disposed in the magazine 100; and/or, the magazine 100 further includes a pick-and-place device 300 as shown in fig. 10, and the pick-and-place device 300 is accommodated in the magazine 100. That is, only the carrying device 200, only the pick-and-place device 300, or both the carrying device 200 and the pick-and-place device 300 may be placed in the magazine 100. The carrier 200 may be used for placing wafers, including substrates, semi-finished products or epitaxial wafers, and the like, and may be selected according to actual needs.
As shown in fig. 1, a fixing base 130 is disposed on a side of the rear cover 110 facing away from the front cover 120, and a fixing groove 140 is disposed on the fixing base 130, in this embodiment, the fixing groove 140 is disposed in a central region of the fixing base 130. The both sides of protecgulum 120 are provided with first joint spare 121, and back lid 110 is provided with second joint spare 111 corresponding to first joint spare 121 department, and first joint spare 121 card is established in second joint spare 111, establishes at second joint spare 111 through first joint spare 121 card, can make things convenient for opening and closing of film cartridge 100. In this embodiment, the first clip member 121 and the second clip member 111 are both U-shaped clips, and may also be other types of clips, which is not specifically limited in this embodiment.
As shown in fig. 16, when the pick-and-place device 300 is placed in the cassette 100, the pick-and-place device 300 is inserted into the fixing groove 140, and the pick-and-place device 300 is fixed.
As shown in fig. 3, the carrying device 200 includes a plurality of carrying assemblies 210 disposed at opposite intervals, and at least one lifting mechanism 220, wherein the plurality of carrying assemblies 210 are configured to be movably disposed in the magazine 100. Wherein each carrier assembly 210 can have a wafer placed thereon.
The lifting mechanism 220 is connected to the plurality of bearing assemblies 210, and the lifting mechanism 220 can lift the plurality of bearing assemblies 210 to adjust the distance between the plurality of bearing assemblies 210. In this embodiment, two adjacent bearing components 210 are provided with a lifting mechanism 220 along the two sides of the length direction, on one hand, the two adjacent bearing components 210 are fixedly supported, and on the other hand, the distance between the two bearing components 210 can be adjusted through the lifting mechanism 220, so that the wafer can be better taken and placed, and the damage to the surface of the wafer is avoided.
When the wafer needs to be taken and placed, the front cover 120 of the wafer box 100 is opened, the bearing device 200 is taken out, the position of the bearing component 210 which needs to take and place the wafer is found, the distance between the bearing component 210 which needs to take and place the wafer and the bearing component 210 on the adjacent upper portion of the bearing component is increased through manually adjusting the corresponding lifting mechanism 220, the upper space and the lower space for taking and placing the wafer can be enlarged, and the phenomena of scratches, dirt, collision damage and the like on the surface of the wafer are avoided. The wafer in this embodiment includes a substrate, a semi-finished product, a finished product (epitaxial wafer), and the like.
The bearing device provided by the embodiment of the invention comprises a plurality of bearing components and at least one lifting mechanism which are arranged at intervals relatively, wherein the bearing components are movably arranged in a box; the lifting mechanism is connected with the bearing components and can lift the bearing components so as to adjust the distance between the bearing components. Can be through adjusting the distance between a plurality of carrier assemblies, fine solution is avoided causing mar, dirty, the damage of colliding with, the dislocation to put into when getting from the load bearing device of spool box when putting the wafer, avoids causing the damage to wafer surface effectual protection.
As shown in fig. 3, the lifting mechanism 220 includes a plurality of lifting struts 221, and two adjacent lifting struts 221 are connected in a cross-movable manner. In this embodiment, two adjacent lifting struts 221 are cross-movably connected by a pin 230, and two adjacent lifting struts 221 may also be movably connected by other manners, which is not specifically limited in this embodiment.
As shown in fig. 3, a first end of each lifting strut 221 is movably connected to a first end of one 210 of the two adjacent load bearing assemblies 210, and a second end of the lifting strut 221 is movably connected to a second end of the other 210 of the two adjacent load bearing assemblies 210. In this embodiment, as shown in fig. 3, a first end of each lifting strut 221 is movably connected to a first end of the upper bearing assembly 210 of two adjacent bearing assemblies 210 by a pin 230, and a second end of the lifting strut 221 is movably connected to a second end of the lower bearing assembly 210 by a pin 230. It should be noted that, besides the pin 230, the end of each lifting strut 221 may also be movably connected to the bearing assembly 210 in other manners, and this embodiment is not limited in particular.
As shown in fig. 4, 8 and 9, the carrier assembly 210 includes a carrier body 211, a first retention clip 212 and a second retention clip 213. A first end of the bearing body 211 is provided with a first adjusting groove 211a, and a second end of the bearing body 211 is provided with a second adjusting groove 211 b. The carrier bodies 211 are used to place wafers, and one wafer is placed on each carrier body 211.
The first limit catch 212 is slidably disposed in the first adjustment groove 211a, and the second limit catch 213 is slidably disposed in the second adjustment groove 211 b. The first end of the lifting support rod 221 is movably connected with the corresponding first limit buckle 212, and the second end of the lifting support rod 221 is movably connected with the corresponding second limit buckle 213. In this embodiment, as shown in fig. 3 and 4, a first end of each lifting strut 221 is movably connected to the corresponding first limiting buckle 212 through a pin 230, and a second end of each lifting strut 221 is movably connected to the corresponding second limiting buckle 213 through a pin 230. It should be noted that, in addition to the pin 230, the end of each lifting strut 221 may also be movably connected to the first limit buckle 212 and the second limit buckle 213 by other manners, which is not limited in this embodiment.
When the wafer needs to be taken and placed, the position of the bearing component 210 for placing the wafer is found, then the lifting support rod 221 is manually lifted to a certain height, namely, the first limiting buckle 212 and the second limiting buckle 213 on the same bearing component 210 slide in the first adjusting groove 211a and the second adjusting groove 211b in the opposite direction respectively, when the lifting support rod 221 is lifted to a certain height, the first adjusting groove 211a and the second adjusting groove 211b are used for fixing respectively, at the moment, the distance between two adjacent bearing components 210 is increased, the corresponding wafer can be taken and placed, when the wafer is effectively prevented from being taken and placed, the upper bearing component 210 and the lower bearing component 210 are touched, and therefore the phenomena of scratches, dirt, collision damage and the like on the surface of the wafer can be well guaranteed.
When the wafer is taken and put and the carrying device 200 needs to be put back into the wafer box 100, the lifting support rod 221 is manually lowered to a certain height, that is, the first limit buckle 212 and the second limit buckle 213 on the same carrying component 210 slide back to back in the first adjusting groove 211a and the second adjusting groove 211b respectively, when the lifting support rod 221 is lowered to a certain height, the first adjusting groove 211a and the second adjusting groove 211b are used for fixing respectively, at this time, the distance between two adjacent carrying components 210 is reduced, and the carrying device 200 can be put back into the wafer box 100.
As shown in fig. 7, 8 and 9, the outer side wall of the bearing body 211 is provided with a mounting groove 211c, and the mounting groove 211c has a concave structure in the present embodiment. The carrier assembly 210 further includes a first mount 214 and a second mount 215. The first and second mounting parts 214 and 215 are oppositely and alternately disposed in the mounting groove 211c, the first mounting part 214 is provided with a first adjustment groove 211a, and the second mounting part 215 is provided with a second adjustment groove 211 b. The first mounting part 214 and the second mounting part 215 are oppositely arranged in the mounting groove 211c at intervals, so that the width of the bearing component 210 is not increased, and the space can be saved.
As shown in fig. 9, the inner sidewall of the supporting body 211 is provided with a supporting groove 211d, and the supporting groove 211d is a concave structure in this embodiment, so as to limit the space of the wafer in the wafer cassette 100 and effectively protect the wafer. As shown in fig. 7 and 8, the carrier body 211 is provided with an escape opening 211e allowing the wafer to pass through. The wafer can be inserted into the support groove 211d through the escape opening 211 e.
As shown in fig. 9, the bearing assembly further includes a limiting member 216, and the limiting member 216 is inserted into one end of the supporting slot 211d away from the avoiding opening 211 e. The side of the limiting member 216 facing the wafer is a concave structure, and the limiting member 216 and the supporting groove 211d can further limit the space of the wafer in the wafer box 100, so as to further protect the wafer.
As shown in fig. 9 and 15, the carrying assembly 210 further includes a protection member 217, and the protection member 217 is rotatably connected to the end of the escape opening 211e of the carrying main body 211. In the present embodiment, the protection member 217 is rotatably connected to the end of the escape opening 211e of the bearing main body 211 through a rotation shaft. As shown in fig. 9 and 15, the inner side wall of the protection member 217 is provided with a support groove 211d corresponding to the inner side wall of the main carrying body 211, so that the space of the wafer in the wafer cassette 100 can be further limited, and the wafer can be further protected. In the embodiment, the bearing assembly 210 is provided with two protection parts 217, the protection parts 217 may be guard rails, or may have other structures, and the embodiment is not particularly limited.
In this embodiment, as shown in fig. 9, each guard 217 is provided with a handle 218, and the handle 218 can pull the guard 217, i.e., the guard rail, to both sides.
As shown in fig. 5, 6, 8 and 9, a positioning piece 211f is provided at a corner end of the bearing body 211. In this embodiment, the positioning component 211f is a positioning pin, and other positioning components may also be used, which is not specifically limited in this embodiment. As shown in fig. 6, 8 and 9, each of the four corner ends of the main bearing body 211 has a positioning pin, so that the plurality of bearing assemblies 210 are aligned from top to bottom without shaking.
It should be noted that, as shown in fig. 3, in the present embodiment, each of the bearing assemblies 210 is a single body, and can be disassembled, so as to be conveniently installed or removed. That is, the lifting pole 221 and the pin 230 can be disassembled and assembled.
As shown in FIG. 10, the pick-and-place device 300 includes a pick-and-place drive mechanism 310 and a fork 320, the fork 320 being adapted to couple to a carrier placed in a cassette. The pick-and-place driving mechanism 310 is movably connected with the supporting fork 320, and the pick-and-place driving mechanism 310 can drive the supporting fork 320 to pop up or reset.
When the wafer needs to be picked and placed, the picking and placing driving mechanism 310 is controlled to drive the supporting fork 320 to pop up, the popping of the supporting fork 320 drives the wafer to pop up, that is, the wafer is moved in the horizontal direction and moved out of the carrying device 200, and then the wafer is taken out or placed, so that the surface of the epitaxial wafer can be prevented from being damaged. After the wafer is taken out or placed, the taking and placing driving mechanism 310 is controlled to drive the supporting fork 320 to reset, so that the wafer is brought back to the bearing device.
The pick-and-place device comprises a pick-and-place driving mechanism and a supporting fork, wherein the supporting fork is used for being connected with a bearing device placed in a film box. The taking and placing driving mechanism is movably connected with the supporting fork and can drive the supporting fork to pop up or reset. Through the popping or resetting of the supporting fork, the wafer can move in the horizontal direction, so that the damage to the surface of the wafer caused when the wafer is taken and placed can be avoided, and the surface of the wafer is effectively protected.
As shown in fig. 10, the pick-and-place driving mechanism 310 includes a top bar 311, an eject assembly 312, and a connecting rod assembly 313. The first end of the pop-up component 312 is connected with the top bar 311, the second end of the pop-up component 312 is rotatably connected with the first end of the connecting rod component 313, and the second end of the connecting rod component 313 is connected with the fork 320. In this embodiment, the second end of the pop-up component 312 is rotatably connected to the first end of the connection rod component 313 through a pin, or may be rotatably connected to the first end of the connection rod component 313 through another structure, which is not limited in this embodiment.
As shown in FIG. 13, when the push rod 311 is pressed, the ejection assembly 312 ejects to rotate the connecting rod assembly 313 in the first direction, so that the fork 320 ejects. In this embodiment, the first direction is a direction in which the fork 320 is away from the link assembly 313.
As shown in fig. 14, when the push rod 311 is reset, the pop-up assembly 312 is reset to rotate the connecting rod assembly 313 in the second direction, so that the fork 320 is reset. In this embodiment, the second direction is a direction in which the fork 320 faces the connecting rod assembly 313.
As shown in fig. 10, 12, 13, 14, 15 and 16, the pop-up assembly 312 includes a movable lever 312a, an elastic member 312b and a chute/pulley 312 c. The first end of the movable rod 312a is connected to the top bar 311 through a sliding slot/pulley 312c, the second end of the movable rod 312a is rotatably connected to the connecting rod assembly 313, and the movable rod 312a is provided with a fixed part 312d and a limiting part 312e which are oppositely arranged at intervals. The elastic element 312b is disposed on the movable rod 312a, and two ends of the elastic element 312b are respectively abutted against the fixing portion 312d and the limiting portion 312 e. In this embodiment, the elastic member 312b is a spring, and other elastic members may be used, and this embodiment is not particularly limited. The chute/pulley 312c combination is a chute/wheel combination similar to the internal structure of a ball point pen.
As shown in fig. 13, when the push rod 311 is pressed, the push rod 311 moves the movable rod 312a inwards through the sliding slot/pulley 312c, the movable rod 312a compresses the elastic member 312b, the elastic member 312b is compressed under the action of the fixing portion 312d and the limiting portion 312e at the two ends of the elastic member 312b to generate an elastic force, and the movable rod 312a drives the connecting rod assembly 313 to rotate in the first direction under the action of the elastic force, so that the fork 320 is ejected.
As shown in fig. 14, when the push rod 311 is reset, the push rod 311 moves the movable rod 312a outwards through the sliding slot/pulley 312c, the elastic member 312b is reset, and the movable rod 312a drives the connecting rod assembly 313 to rotate in the second direction, so that the fork 320 is reset.
As shown in fig. 10, 12, 13, 14, 15, and 16, the connecting bar assembly 313 includes a first connecting bar 313a and a second connecting bar 313 b. A first end of the first connection rod 313a is rotatably connected to a second end of the movable rod 312a, a second end of the first connection rod 313a is rotatably connected to a first end of the second connection rod 313b, and a second end of the second connection rod 313b is connected to the fork 320. In this embodiment, the first end of the first connection rod 313a is rotatably connected to the second end of the movable rod 312a through a pin, and the first end of the first connection rod 313a may also be rotatably connected to the second end of the movable rod 312a through another component, as long as the rotatable function can be achieved, which is not limited in this embodiment.
As shown in fig. 10, 12, 13, 14, 15 and 16, the pick-and-place driving mechanism 310 further includes a fixing rod 314, a first end of the fixing rod 314 is rotatably connected to the first connecting rod 313a, and a second end of the fixing rod 314 is fixedly connected to the carrying device 200. In this embodiment, the first end of the fixing rod 314 is rotatably connected to the first connecting rod 313a through a pin, but the first end of the fixing rod 314 may also be rotatably connected to the first connecting rod 313a through another component as long as the rotatable function can be achieved, and this embodiment is not limited in particular.
As shown in fig. 10 to 16, the supporting fork 320 includes a supporting fork portion 321 and an ejecting portion 322, the ejecting portion 322 is disposed on a side of the supporting fork portion 321 facing the connecting rod assembly 313, and the ejecting portion 322 is fixedly connected to the connecting rod assembly 313. That is, the ejecting portion 322 is fixedly connected to the second connection bar 313 b. In this embodiment, the ejection portion 322 is a bump for ejecting the wafer when the fork 320 is ejected.
As shown in fig. 12 to 16, when the carrying device 200 and the pick-and-place device 300 are placed in the magazine 100 at the same time, a groove 211g is disposed on a side wall of the carrying main body 211 away from the escape opening 211e, and a second end of the second connecting rod 313b in the pick-and-place device 300 abuts against the carrying device 200 through the groove 211 g. It should be noted that, when the carrying device 200 and the pick-and-place device 300 are simultaneously placed in the magazine 100, the carrying device 200 and the pick-and-place device 300 are paired and uniformly distributed in the magazine 100.
As shown in fig. 12 to 16, the fork 320 is located in the carrier body 311 and below the supporting slot 211d for placing the wafer, so that the fork 320 can drive the wafer to eject when ejecting.
When the carrier 200 and the pick-and-place device 300 are simultaneously placed in the cassette 100, the operation principle of picking up the wafer in the carrier 200 is as follows:
the front cover 120 of the wafer box 100 is opened, the bearing device 200 in the wafer box 100 is taken out, the position of a wafer needing to be taken and placed is found, the bearing component 210 is lifted by the lifting support rod 221, the upper space and the lower space for taking and placing the wafer are enlarged, and the phenomena of scratches, dirt, collision damage and the like on the surface of the wafer are avoided.
The handle 218 of the carriage 200 is pressed to pull the guard 217 aside, thereby exposing the escape opening 211 e. When the push rod 311 is pressed down, the push rod 311 moves the movable rod 312a inwards through the sliding slot/pulley 312c, and under the action of the elastic member 312b, the movable rod 312a drives the first connecting rod 313a to rotate towards the first direction, and further drives the second connecting rod 313b to rotate towards the first direction, so that the fork 320 is ejected outwards. Then the wafer is taken out by tweezers or a suction pen, so that the surface of the epitaxial wafer can be prevented from being damaged.
When the carrying device 200 and the pick-and-place device 300 are placed in the wafer box 100, the space for picking and placing the wafer in the vertical direction and the horizontal direction can be increased, and the phenomena of scratches, dirt, collision damage and the like on the surface of the wafer are further avoided.
As shown in fig. 16, when the pick-and-place device 200 includes the second connection bar 313b when the pick-and-place device 200 is placed in the cartridge 100, one end of the second connection bar 313b is inserted into the fixing groove 140, and the carrying device 200 is fixed.
Another aspect of the invention provides a semiconductor processing apparatus comprising a cassette as described above. The specific structure of the cassette is described in detail above and will not be described herein.
It will be understood that the above embodiments are merely exemplary embodiments taken to illustrate the principles of the present invention, which is not limited thereto. It will be apparent to those skilled in the art that various modifications and improvements can be made without departing from the spirit and substance of the invention, and these modifications and improvements are also considered to be within the scope of the invention.
Claims (10)
1. The carrying device for the wafer box is characterized by comprising a plurality of carrying components and at least one lifting mechanism, wherein the carrying components are arranged at intervals relatively, and the carrying components are movably arranged in the wafer box;
the lifting mechanism is connected with the bearing components and can lift the bearing components to adjust the distance between the bearing components.
2. The carrying device according to claim 1, wherein the lifting mechanism comprises a plurality of lifting support rods, and every two adjacent lifting support rods are in cross movable connection;
the first end of each lifting support rod is movably connected with the first end of one of the two adjacent bearing assemblies, and the second end of the lifting support rod is movably connected with the second end of the other one of the two adjacent bearing assemblies; and/or the presence of a gas in the gas,
the bearing assembly comprises a bearing main body, a first limiting buckle and a second limiting buckle; a first adjusting groove is formed in the first end of the bearing main body, and a second adjusting groove is formed in the second end of the bearing main body;
the first limiting buckle is arranged in the first adjusting groove in a sliding mode, and the second limiting buckle is arranged in the second adjusting groove in a sliding mode;
the first end of the lifting support rod is movably connected with the corresponding first limit buckle, and the second end of the lifting support rod is movably connected with the corresponding second limit buckle.
3. The carrying device as claimed in claim 2, wherein the carrying body outer side wall is provided with a mounting groove, the carrying assembly further comprising a first mounting part and a second mounting part;
the first mounting piece and the second mounting piece are oppositely arranged in the mounting groove at intervals, the first mounting piece is provided with the first adjusting groove, and the second mounting piece is provided with the second adjusting groove; and/or the presence of a gas in the gas,
the inner side wall of the bearing main body is provided with a supporting groove, and the bearing main body is provided with an avoiding opening allowing the wafer to pass through.
4. The carrying device according to claim 3, wherein the carrying assembly further comprises a limiting member inserted into an end of the supporting slot away from the avoiding opening; and/or the presence of a gas in the gas,
the carrier assembly further comprises a guard rotatably connected to the bypass open end of the carrier body; and/or the presence of a gas in the gas,
the corner end of the bearing main body is provided with a positioning piece.
5. The taking and placing device for the film box is characterized by comprising a taking and placing driving mechanism and a supporting fork, wherein the supporting fork is used for being connected with a bearing device placed in the film box;
the picking and placing driving mechanism is movably connected with the supporting fork and can drive the supporting fork to pop up or reset.
6. The pick-and-place device according to claim 5, wherein the pick-and-place driving mechanism comprises a top rod, an ejecting assembly and a connecting rod assembly;
the first end of the ejection assembly is connected with the ejector rod, the second end of the ejection assembly is rotatably connected with the first end of the connecting rod assembly, and the second end of the connecting rod assembly is connected with the supporting fork; wherein,
when the ejector rod is pressed down, the ejecting component ejects to drive the connecting rod component to rotate towards a first direction, so that the supporting fork ejects;
when the ejector rod resets, the ejection assembly resets to drive the connecting rod assembly to rotate towards the second direction, so that the support fork resets.
7. The pick and place device of claim 6, wherein the ejection assembly comprises a movable rod, an elastic member and a chute/pulley;
the first end of the movable rod is connected with the ejector rod through the sliding chute/pulley, the second end of the movable rod is rotatably connected with the connecting rod assembly, and the movable rod is provided with a fixed part and a limiting part which are arranged at intervals;
the elastic piece is sleeved on the movable rod, and two ends of the elastic piece are respectively abutted against the fixed part and the limiting part; and/or the presence of a gas in the gas,
the connecting rod assembly comprises a first connecting rod and a second connecting rod;
the first end of the first connecting rod is rotatably connected with the second end of the movable rod, the second end of the first connecting rod is rotatably connected with the first end of the second connecting rod, and the second end of the second connecting rod is connected with the supporting fork.
8. The pick-and-place device of claim 7, wherein the pick-and-place driving mechanism further comprises a fixing rod, a first end of the fixing rod is rotatably connected with the first connecting rod, and a second end of the fixing rod is fixedly connected with the bearing device; and/or the presence of a gas in the gas,
the support fork comprises a support fork part and an ejection part, the ejection part is arranged on one side, facing the connecting rod component, of the support fork part, and the ejection part is fixedly connected with the connecting rod component.
9. A cartridge comprising a rear cover and a front cover covering the rear cover, wherein the cartridge further comprises the carrying device of any one of claims 1 to 4, the carrying device being movably disposed in the cartridge; and/or the presence of a gas in the gas,
the cassette further comprising the pick-and-place device of any of claims 5 to 8, the pick-and-place device being housed within the cassette; and/or the presence of a gas in the gas,
a fixed base is arranged on one side, away from the front cover, of the rear cover, and a fixed groove is formed in the fixed base;
when the taking and placing device comprises a second connecting rod, one end of the second connecting rod is inserted into the fixing groove.
10. A semiconductor processing apparatus comprising the cassette of claim 9.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210195053.8A CN114284191B (en) | 2022-03-02 | 2022-03-02 | Film box, bearing device, taking and placing device and semiconductor processing equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210195053.8A CN114284191B (en) | 2022-03-02 | 2022-03-02 | Film box, bearing device, taking and placing device and semiconductor processing equipment |
Publications (2)
| Publication Number | Publication Date |
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| CN114284191A true CN114284191A (en) | 2022-04-05 |
| CN114284191B CN114284191B (en) | 2022-08-02 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN202210195053.8A Active CN114284191B (en) | 2022-03-02 | 2022-03-02 | Film box, bearing device, taking and placing device and semiconductor processing equipment |
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| CN (1) | CN114284191B (en) |
Cited By (1)
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| Publication number | Publication date |
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| CN114284191B (en) | 2022-08-02 |
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