TW491752B - Polishing device - Google Patents

Polishing device Download PDF

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Publication number
TW491752B
TW491752B TW090126242A TW90126242A TW491752B TW 491752 B TW491752 B TW 491752B TW 090126242 A TW090126242 A TW 090126242A TW 90126242 A TW90126242 A TW 90126242A TW 491752 B TW491752 B TW 491752B
Authority
TW
Taiwan
Prior art keywords
honing
guide
aforementioned
patent application
protruding portion
Prior art date
Application number
TW090126242A
Other languages
English (en)
Chinese (zh)
Inventor
Isao Sugaya
Original Assignee
Nikon Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nikon Corp filed Critical Nikon Corp
Application granted granted Critical
Publication of TW491752B publication Critical patent/TW491752B/zh

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/27—Work carriers
    • B24B37/30—Work carriers for single side lapping of plane surfaces
    • B24B37/32—Retaining rings

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Grinding-Machine Dressing And Accessory Apparatuses (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
TW090126242A 2000-10-24 2001-10-24 Polishing device TW491752B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2000323474A JP2002134448A (ja) 2000-10-24 2000-10-24 研磨装置

Publications (1)

Publication Number Publication Date
TW491752B true TW491752B (en) 2002-06-21

Family

ID=18801135

Family Applications (1)

Application Number Title Priority Date Filing Date
TW090126242A TW491752B (en) 2000-10-24 2001-10-24 Polishing device

Country Status (3)

Country Link
JP (1) JP2002134448A (fr)
TW (1) TW491752B (fr)
WO (1) WO2002035592A1 (fr)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102886733A (zh) * 2011-07-21 2013-01-23 台湾积体电路制造股份有限公司 用于晶圆研磨的装置
CN111390750A (zh) * 2020-03-25 2020-07-10 福建北电新材料科技有限公司 晶片面型加工装置

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI386989B (zh) 2005-02-25 2013-02-21 Ebara Corp 研磨裝置及研磨方法
JP5080904B2 (ja) 2007-08-27 2012-11-21 昭和電工株式会社 記憶媒体の製造方法
JP5267918B2 (ja) * 2008-07-15 2013-08-21 株式会社ニコン 保持装置および研磨装置
US9238293B2 (en) * 2008-10-16 2016-01-19 Applied Materials, Inc. Polishing pad edge extension
KR101170760B1 (ko) * 2009-07-24 2012-08-03 세메스 주식회사 기판 연마 장치
US9254547B2 (en) * 2010-03-31 2016-02-09 Applied Materials, Inc. Side pad design for edge pedestal
JP5737325B2 (ja) * 2013-05-07 2015-06-17 株式会社ニコン 保持装置、加工装置及び研磨装置
WO2019154630A1 (fr) * 2018-02-06 2019-08-15 Asml Netherlands B.V. Système, dispositif et procédé servant à reconditionner un support de substrat

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3109558B2 (ja) * 1994-11-24 2000-11-20 住友金属工業株式会社 ウエハ保持具
JP3850924B2 (ja) * 1996-02-15 2006-11-29 財団法人国際科学振興財団 化学機械研磨装置及び化学機械研磨方法
JP2780703B2 (ja) * 1996-06-28 1998-07-30 日本電気株式会社 液晶パネルクリーニング装置
JPH11262854A (ja) * 1997-12-15 1999-09-28 Canon Inc 精密研磨装置および該精密研磨装置を用いた精密研磨方法
JP2000334655A (ja) * 1999-05-26 2000-12-05 Matsushita Electric Ind Co Ltd Ｃｍｐ加工装置

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102886733A (zh) * 2011-07-21 2013-01-23 台湾积体电路制造股份有限公司 用于晶圆研磨的装置
CN111390750A (zh) * 2020-03-25 2020-07-10 福建北电新材料科技有限公司 晶片面型加工装置
CN111390750B (zh) * 2020-03-25 2021-09-03 福建北电新材料科技有限公司 晶片面型加工装置

Also Published As

Publication number Publication date
JP2002134448A (ja) 2002-05-10
WO2002035592A1 (fr) 2002-05-02

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