TW490772B - Wire-bonding method - Google Patents

Wire-bonding method Download PDF

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Publication number
TW490772B
TW490772B TW089107951A TW89107951A TW490772B TW 490772 B TW490772 B TW 490772B TW 089107951 A TW089107951 A TW 089107951A TW 89107951 A TW89107951 A TW 89107951A TW 490772 B TW490772 B TW 490772B
Authority
TW
Taiwan
Prior art keywords
unit
lead frame
bonding
tool
component
Prior art date
Application number
TW089107951A
Other languages
Chinese (zh)
Inventor
Masayuki Shimura
Hisashi Arai
Original Assignee
Shinkawa Kk
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shinkawa Kk filed Critical Shinkawa Kk
Application granted granted Critical
Publication of TW490772B publication Critical patent/TW490772B/en

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/60—Attaching or detaching leads or other conductive members, to be used for carrying current to or from the device in operation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H01L2224/8512—Aligning
    • H01L2224/85148—Aligning involving movement of a part of the bonding apparatus
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01004—Beryllium [Be]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01005—Boron [B]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01033—Arsenic [As]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01082—Lead [Pb]

Abstract

The object of the invention is to suppress the loss time to a minimum and to aim at enhancing the productivity. To achieve the object, in a process subsequent to the detection of a last device 27 which is bonded on one unit of a lead frame 11 and the end of a bonding of a device 25, detection of devices 21 and 22 which are bonded on the following one unit of a lead frame 12 is performed simultaneously. Thereafter, the bond finished devices on one unit of the devices which are bonded after these devices, and the following one unit of the devices are moved forward for a device component which is set as one unit of the devices, and the bonding head of a wire-bonding device is moved to the start position of bonding, so as to suppress the time loss to a minimum and enhance the productivity.

Description

經濟部智慧財產局員工消費合作社印製 490772 A7 B7 五、發明說明（/ ) 〔發明所屬之技術領域〕 本發明係關於引線接合方法及裝置。 〔先前技術〕 以往，作爲能同時進行元件的位置檢測及引線接合之 物，可列舉日本專利特公昭6卜55248號公報、特公平1- 41026號公報等。將該引線接合方法用圖2及圖3來說明 〇 如圖2所示般，在引腳框11、12···1Ν上，分別貼合 有複數個（圖示的例子有7個）等間隔的晶粒(pelkt)20，以 晶粒20爲中心來形成元件(device)21、22…27。晶粒20和 引腳30間是用後述的接合裝置40來連接引線31。引腳框 11、12···1Ν是沿著相對向配設之導軌32而以未圖示的框 推進(feed)手段來推進。用以加熱引腳框11、12···1Ν之加 熱塊33是以能上下移動的方式設置於導軌32間。 接合裝置40，具備能在ΧΥ方向移動之ΧΥ台 (table)41，ΧΥ台41是藉X軸用馬達42和Υ軸用馬達43 來朝X方向及Y方向移動。XY台41上搭載著接合頭 (head)44，在接合頭44上裝設能上下移動的接合臂45。在 接合臂45的前端部裝設工具46，該工具46上插通著引線 (未圖示）。用以檢測元件21、22…27的位置之檢測器47， 係配設成比工具46更靠引腳框供給側2元件的分量，係透 過支持體48來裝設於接合頭44。Printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs 490772 A7 B7 V. Description of the Invention (/) [Technical Field to which the Invention belongs] The present invention relates to a wire bonding method and device. [Prior Art] Conventionally, examples of objects that can simultaneously detect the position of a component and wire bonding include Japanese Patent Publication No. 6B 55248 and Japanese Patent Publication No. 1-41026. This wire bonding method will be described with reference to FIGS. 2 and 3. As shown in FIG. 2, a plurality of lead frames 11 and 12 · 1N are attached to each other (the example shown in the figure is 7), etc. The spaced-apart grains 20 form the devices 21, 22 ... 27 with the grains 20 as the center. The lead 31 is connected between the die 20 and the lead 30 by a bonding device 40 described later. The lead frames 11, 12 ... 1N are advanced along a guide rail 32 arranged oppositely by a frame feeding method (not shown). A heating block 33 for heating the lead frames 11, 12 ... 1N is provided between the guide rails 32 so as to be movable up and down. The bonding device 40 includes a XY table 41 capable of moving in the XY direction. The XY table 41 is moved in the X and Y directions by the X-axis motor 42 and the Y-axis motor 43. A head 44 is mounted on the XY stage 41, and a head 45 is mounted on the head 44 so as to be movable up and down. A tool 46 is attached to the front end of the engaging arm 45, and a lead wire (not shown) is inserted into the tool 46. The detector 47 for detecting the positions of the components 21, 22 ... 27 is provided closer to the lead frame supply side 2 components than the tool 46, and is mounted on the bonding head 44 through the support 48.

接著用圖2及圖3來說明動作。引腳框11、12…1N 是以7個元件分爲1單位來進行接合。引腳框11、12…1N 3 本紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公釐） —--------訂---------^11^" (請先閱讀背面之注意事項再填寫本頁) 經濟部智慧財產局員工消費合作社印製 490772 A7 B7 五、發明說明（）） 之元件間距及接合點的位置座標’係事先記憶於未圖示的 微電腦中，依照該微電腦的指令，來將XY台41、即接合 頭44向XY方向移動，並將接合臂45、即工具46向上下 (Z)方向移動。又，圖3中，〇記號代表工具46的位置， X記號代表檢測器47的位置。 引腳框Π被未圖示的推進手段向箭頭A方向推進， 將引腳框11的元件21之晶粒2〇定位於接合站(station)部 。接著將元件21的晶粒20之任意基準的1點或2點映像 用檢測器47做檢測並記憶而進行步驟1。之後根據所記憶 的映像而用微電腦算出實際檢測點相對基準點的偏差量， 以修正事先記憶於微電腦的接合點位置並記憶之。當檢測 終了時，將X軸用馬達42向箭頭B方向驅動1元件的分 量而使檢測器47位於元件22的晶粒20的上方，同樣的對 元件22做檢測、記憶而進行步驟2。亦即，在步驟1、2 中，是對引腳框11的元件21、22僅進行檢測。 接著將X軸用馬達42向箭頭B方向驅動1元件的分 量而使檢測器47位於元件23的晶粒20的上方，工具46 將位於元件21的晶粒20的上方。於是，根據事先所記憶 之顯示元件21修正後的點位置之信號來驅動X軸馬達42 及Y軸馬達43以使接合頭44移動，工具46會導向接合 點並在元件21的晶粒21和引腳30上連接引線31以進行 接合。接合時將元件23的晶粒20之位意基準的1點或2 點的映像用檢測器47檢測並記憶而進行第3步驟。之後根 據所記憶的映像而用微電腦算出實際檢測點相對基準點的 4 本紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公釐） --------------------訂---------MAWI (請先閱讀背面之注咅？事項再填寫本頁) 490772 A7 B7 經濟部智慧財產局員工消費合作社印製 五、發明說明（3 ) 偏差量，以修正事先記憶於微電腦的接合點位置並記憶之 。亦即，步驟3中，在對元件23進行檢測的同時，也對元 件21進行接合。 以後，相同於上述步驟3而依序在步驟4、5、6、7 重複進行檢測及接合。亦即，在步驟3〜7是同時進行檢測 及接合。 接著將X軸用馬達42向箭頭B方向驅動i元件的分 量而使工具46位於元件26的晶粒20的上方，在步驟8進 行元件26的接合。當該元件26的接合終了時，在相同於 步驟8之步驟9進行元件27的接合。亦即，在步驟8、9 是對元件26、27僅進行接合。 當引腳框11的1單位之接合完成時，將X軸驅動用 馬達42向箭頭B方向之相反方向驅動8個元件的分量， 而使接合頭44、即工具46及檢測器47返回原先的起始位 置。又以使下一引腳框12的元件21之晶粒20位於檢測器 47下方的方式用框推進手段進行推進。接著，對引腳框12 也進行前述步驟1〜9。 〔發明所要解決的課題〕 對引腳框11的最後2個元件26、27，在步驟8、9是 僅進行接合，又對下一引腳框12的最初2個元件21、22 ，在步驟1、2是僅進行檢測。因此，有時間上的浪費，而 造成生產性降低。 本發明的課題係提供一引線接合方法及裝置，能將時 間上的浪費減少到最小，而謀求生產性的提昇。 5 ^紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公釐1 --------訂---------^^1 (請先閱讀背面之注意事項再填寫本頁) 經濟部智慧財產局員工消費合作社印製 490772 A7 _ B7 五、發明說明（本） 〔用以解決課題之手段〕 爲解決上述課題之本發明的手段之引線接合方法或裝 置，是將晶粒等間隔的貼合於引腳框之各元件上，並具備 :用以在引腳框的引腳和晶粒上進行引線接合之工具，用 以保持該工具且能在XY方向移動之接合頭，和工具隔著 元件的間距或整數倍的間距之間隔、能和工具一起在引腳 框的上方移動之接合頭上所裝設的檢測器；邊將接合頭向 一定方向移動邊用檢測器對1單位之複數個元件依序進行 檢測，在該檢測的同時，將完成檢測的元件根據檢測器的 檢測資料而用工具做引線接合，之後將引腳框推進完成引 線接合之該1單位元件的分量，又將接合頭移動到起始位 置；其特徵在於， 正在接合之1單位的最後元件的檢測及那時所接合的元 件之接合終了後的步驟中，到該正在接合的1單位之剩餘 的元件完成接合爲止，在該接合的同時會進行下1單位的 元件之檢測，之後將完成接合的1單位元件和待接合的下 1單位元件推進1單位元件的分量，又將接合頭移動到起 始位置。 〔發明之實施形態〕 用圖1及圖2來說明本發明的一實施形態。所圖1所 示般，從步驟1〜步驟7是和圖3所示的習知例相同。於是 ，對該步驟1〜步驟7，爲避免重複說明而僅做簡單的說明 。當引腳框11的元件21之晶粒20被推進並定位於接合站 時，在步驟1、2是僅進行元件21、22的檢測。接著在步 6 本紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公釐） -------------------訂---------^^1 (請先閱讀背面之注意事項再填寫本頁) 經濟部智慧財產局員工消費合作社印制衣 490772 A7 B7 五、發明說明（古） 驟3〜7中，在對元件23〜27進行檢測的同時也進行元件 21〜25的接合。 當步驟7完成後，接下來就進行本發明的特徵之步驟 8、9。如前述般，當引腳框11的元件21之晶粒20被推進 並定位於接合站時，在引腳框11推進的同時引腳框12也 會被推進，引腳框12最初的元件21被定位於相對引腳框 11最後的元件27保持1個元件間距的位置。於是，在步 驟8中，不僅進行引腳框11的元件26之接合，由於檢測 器47是位於引腳框12的元件21上方，故同時進行引腳框 12的元件21之檢測。在接下來的步驟9中也是同樣的， 在對引腳框11的元件27進行接合的同時，也對引腳框12 的元件22進行檢測。 如此般，當引腳框11的1單位接合終了時，引腳框 11、12···1Ν係朝箭頭A方向推進7個元件的分量。又將X 軸驅動馬達42朝箭頭B方向的相反方向驅動6個元件的 分量而將工具46移動到引腳框12的元件21上方。接著進 行步驟10。步驟10中工具46和檢測器47的位置，對以 後的引腳框12···1Ν係構成起始位置。又引腳框12之元件 21、22係在步驟8、9進行檢測，如前述般由於引腳框12 被推進7個元件的分量，引腳框12之元件21、22之X方 向的檢測數據係以能配合以下說明的步驟10、11之方式做 修正。 由於前述般之引腳框12之元件21、22的檢測已完成 ，步驟10是在進行引腳框12的元件21之接合的同時，也 7 本€張尺度適用中國國家標準（CNS)A4規格（210 X 297公釐） -------------------訂--------- (請先閱讀背面之注意事項再填寫本頁) 490772 A7 B7 五、發明說明（么） 進行元件23的檢測。亦即’步驟1〇是和歩驟3相同。之 後，對引腳框12也進行相同於步驟4〜7之步驟11〜14(步 驟I4未圖示）。對引腳框I2之未圖布的元件26、27和接 下來的引腳框13(未圖不)之未圖不的兀件22也是進行相同 於步驟8、9的步驟。 如此般依序進行引腳框11、I2…之元件21、22···27 的接合，對最後的元件1Ν，當步驟Ν - 2完成元件25的接 合和元件27的檢測，接下來的步驟Ν - 1及ν則進行引腳 框1Ν之元件26、27的接合。由於步驟Ν、1和Ν與圖3 所示的習知例之步驟8、9相同，在此省略其詳細的說明。 如此般，由於做爲1單位(實施形態爲7個元件21、 22···27)來處理的最後部分的元件26、27和下1單位的最 初部分的元件21、22係同時進行接合和檢測，時間上的損 失將減少，生產性將提昇。 又，上述實施形態中，工具46和檢測器47的間檢是 隔2個元件的間距，但取1個元件間距或3個元件間距的 間隔亦可。又雖針對把7個元件21、22…27當做1單位來 處理的情形做說明，但1單位所處理的元件數目，能依照 接合裝置4〇的性能、即接合頭4之X方向的移動量來做 進意的設定。又上述實施形態中，雖針對適用於短柵狀的 引腳框的情形做說明，當然也能適用於連續的引腳框。 〔發明之效果〕 依據本發明，正在接合之丨單位的最後元件的檢測及 那時所接合的元件之接合終了後的步驟中，到該正在接合 8 ______ --------------------訂--------- C請先閲讀背面Μ涑意事頊再填寫本貢Λ 經濟部智慧財產局員工消費合作社印製 本紙張尺錢財_國家標準（CNS)A4規格（210 X 297公璧） 490772 經濟部智慧財產局員工消費合作社印製 Α7 Β7 五、發明說明（7) 的1單位之剩餘的元件完成接合爲止，在該接合的同時會 進行下1單位的元件之檢測，之後將完成接合的1單位元 件和待接合的下1單位元件推進1單位元件的分量，又將 接合頭移動到起始位置，以將時間上的損失減少到最小， 而謀求生產性的提昇。 〔圖式之簡單說明〕 圖1係顯示本發明的引線接合方法之一實施形態之檢 測及接合步驟的說明圖。 圖2係顯不引線接合裝置，（a)爲俯視圖，（b)爲前視 圖。 圖3係以往的引線接合方法的檢測和接合步驟的說明 圖。 〔符號說明〕 11、12···1Ν 引腳框 20 晶粒 21、22…27 元件 30 引腳 31 引線 40 接合裝置 44 接合頭 46 工具 47 檢測器 9 本紙張尺度適用中國國家標準（CNS)A4規格（21〇 X 297公釐） ---------------------訂--------- (請先閱讀背面之注意事項再填寫本頁)Next, the operation will be described with reference to FIGS. 2 and 3. The lead frames 11, 12 ... 1N are joined by dividing seven elements into one unit. Lead frame 11, 12 ... 1N 3 This paper size applies to China National Standard (CNS) A4 (210 X 297 mm) —-------- Order --------- ^ 11 ^ " (Please read the precautions on the back before filling this page) Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs and printed on 490772 A7 B7 V. Description of the invention ()) The component coordinates and the position coordinates of the joints are memorized in advance. In the illustrated microcomputer, the XY stage 41, that is, the joint head 44 is moved in the XY direction, and the joint arm 45, that is, the tool 46 is moved in the up and down (Z) direction in accordance with the instructions of the microcomputer. In FIG. 3, the 0 mark represents the position of the tool 46, and the X mark represents the position of the detector 47. The lead frame Π is advanced in the direction of the arrow A by a pushing means (not shown), and the die 20 of the element 21 of the lead frame 11 is positioned at a bonding station portion. Next, one-point or two-point mapping of an arbitrary reference of the die 20 of the element 21 is detected and memorized by the detector 47, and step 1 is performed. Then, the deviation amount of the actual detection point from the reference point is calculated by the microcomputer based on the memorized image, so as to correct the position of the joint point stored in the microcomputer in advance and memorize it. When the inspection is completed, the X-axis motor 42 is driven in the direction of the arrow B by the amount of one element so that the detector 47 is positioned above the die 20 of the element 22. Similarly, the element 22 is detected and memorized to perform step 2. That is, in steps 1 and 2, only the components 21 and 22 of the lead frame 11 are detected. Next, the X-axis motor 42 is driven in the direction of arrow B by the amount of one element so that the detector 47 is positioned above the die 20 of the element 23, and the tool 46 is positioned above the die 20 of the element 21. Then, the X-axis motor 42 and the Y-axis motor 43 are driven to move the joint head 44 according to the signal of the corrected point position of the display element 21 memorized in advance, and the tool 46 will guide the joint point and move the die 21 and A lead 31 is connected to the lead 30 for bonding. The third step is performed by detecting and memorizing the image of one or two reference points of the die 20 of the element 23 at the time of bonding by the detector 47. Then based on the memorized image, use a microcomputer to calculate the 4 paper sizes of the actual detection point relative to the reference point. The paper size applies the Chinese National Standard (CNS) A4 specification (210 X 297 mm) ------------- ------- Order --------- MAWI (Please read the note on the back? Matters before filling out this page) 490772 A7 B7 Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs (3) The amount of deviation to correct the position of the joint point stored in the microcomputer in advance and memorize it. That is, in step 3, the component 23 is inspected and the component 21 is also bonded. Hereinafter, the detection and joining are repeated in steps 4, 5, 6, and 7 in the same manner as in step 3 above. That is, in steps 3 to 7, detection and joining are performed simultaneously. Next, the X-axis motor 42 drives the component of the i element in the direction of arrow B so that the tool 46 is positioned above the die 20 of the element 26, and the element 26 is bonded in step 8. When the joining of the element 26 is completed, the joining of the element 27 is performed in the same step as in step 9 of step 8. That is, in steps 8 and 9, only the elements 26 and 27 are bonded. When the 1-unit bonding of the lead frame 11 is completed, the X-axis driving motor 42 drives the components of 8 elements in the direction opposite to the direction of the arrow B, and returns the bonding head 44, that is, the tool 46 and the detector 47 to the original starting point. Further, the die 20 of the element 21 of the next lead frame 12 is advanced by a frame advancement means so that it is positioned below the detector 47. Next, the aforementioned steps 1 to 9 are also performed on the lead frame 12. [Problems to be Solved by the Invention] The last two elements 26 and 27 of the lead frame 11 are bonded only in steps 8 and 9 and the first two elements 21 and 22 of the next lead frame 12 are processed in the step. 1, 2 is for detection only. Therefore, there is a waste of time, which leads to a decrease in productivity. An object of the present invention is to provide a wire bonding method and apparatus, which can reduce the time waste to a minimum and improve the productivity. 5 ^ Paper size applies to China National Standard (CNS) A4 (210 X 297 mm 1 -------- Order --------- ^^ 1 (Please read the precautions on the back before (Fill in this page) Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs 490772 A7 _ B7 V. Description of the Invention (this) [Means to Solve the Problem] The wire bonding method or device of the means to solve the above problems is The die is adhered to the components of the lead frame at equal intervals, and a tool for wire bonding on the lead of the lead frame and the die is provided, which is used to hold the tool and can move in the XY direction. Detector mounted on a bonding head that can be moved above the lead frame with the tool with a tool or component space or an integral multiple of the pitch; used while moving the bonding head in a certain direction The detector sequentially inspects a plurality of components of a unit, and at the same time as the inspection, the completed components are wire-bonded with a tool according to the detection data of the detector, and then the lead frame is advanced to complete the wire-bonding of the 1 The components of the unit element, which will be joined again The head moves to the starting position; it is characterized in that in the steps following the detection of the last element of the unit being joined and the completion of the joining of the joined unit at that time, until the remaining elements of the unit being joined are completed joining At the same time, the detection of the next unit of components is performed at the same time. After that, the unit of the completed unit and the unit of the next unit to be joined are advanced by the unit of one unit, and the joint head is moved to the starting position. Embodiment of the invention] An embodiment of the present invention will be described with reference to Figs. 1 and 2. As shown in Fig. 1, steps 1 to 7 are the same as the conventional examples shown in Fig. 3. Therefore, this step Steps 1 to 7 are described briefly to avoid repetitive descriptions. When the die 20 of the component 21 of the lead frame 11 is advanced and positioned at the bonding station, only the components 21 and 22 are performed in steps 1 and 2. Inspection. Then in step 6, the paper size is in accordance with China National Standard (CNS) A4 (210 X 297 mm) ------------------- Order ----- ---- ^^ 1 (Please read the notes on the back before filling out this page) Employees of the Bureau of Intellectual Property, Ministry of Economic Affairs Fei cooperative prints clothes 490772 A7 B7 V. Description of the Invention (Ancient) In steps 3 to 7, the components 23 to 27 are tested and the components 21 to 25 are also joined. When step 7 is completed, the next step is Steps 8 and 9 of the features of the present invention. As mentioned above, when the die 20 of the element 21 of the lead frame 11 is advanced and positioned at the bonding station, the lead frame 12 is also pushed while the lead frame 11 is advanced. Pushing forward, the first component 21 of the lead frame 12 is positioned at a distance of one component relative to the last component 27 of the lead frame 11. Therefore, in step 8, not only the bonding of the components 26 of the lead frame 11 is performed. The detector 47 is located above the element 21 of the lead frame 12, so the detection of the element 21 of the lead frame 12 is performed at the same time. This is the same in the next step 9. When the component 27 of the lead frame 11 is bonded, the component 22 of the lead frame 12 is also detected. In this way, when one unit of the lead frame 11 is terminated, the lead frames 11, 12 ... 1N are advanced by the components of the seven elements. The X-axis drive motor 42 drives the components of the six elements in the direction opposite to the direction of the arrow B to move the tool 46 above the element 21 of the lead frame 12. Then proceed to step 10. The positions of the tool 46 and the detector 47 in step 10 constitute a starting position for the subsequent lead frame 12 ··· 1N. The components 21 and 22 of the lead frame 12 are detected in steps 8 and 9. As described above, the component of the lead frame 12 is advanced by 7 components, and the detection data of the components 21 and 22 of the lead frame 12 in the X direction are detected. The correction is made in a manner compatible with steps 10 and 11 described below. Since the inspection of the components 21 and 22 of the lead frame 12 has been completed as described above, step 10 is to join the components 21 of the lead frame 12 at the same time as the standard of China National Standards (CNS) A4. (210 X 297 mm) ------------------- Order --------- (Please read the notes on the back before filling this page) 490772 A7 B7 V. Description of the invention That is, 'Step 10' is the same as Step 3. Thereafter, steps 11 to 14 of the lead frame 12 are also performed in the same manner as in steps 4 to 7 (step I4 is not shown). The same steps as steps 8 and 9 are performed on the unillustrated components 26 and 27 of the lead frame I2 and the unillustrated elements 22 of the following lead frame 13 (not shown). In this way, the bonding of the components 21, 22, 27 of the lead frame 11, I2, ... is performed sequentially. For the last component 1N, when step N-2 completes the bonding of component 25 and the detection of component 27, the next step is Ν-1 and ν bond the elements 26 and 27 of the lead frame 1N. Since steps N, 1 and N are the same as steps 8 and 9 of the conventional example shown in FIG. 3, detailed descriptions thereof are omitted here. In this way, the components 26 and 27 in the last part processed as one unit (in the embodiment, seven elements 21 and 22 ... 27) and the components 21 and 22 in the first part of the next unit are simultaneously bonded and Inspection, loss of time will be reduced, and productivity will be improved. Further, in the above-mentioned embodiment, the inspection between the tool 46 and the detector 47 is performed at a pitch of two elements, but it is also possible to adopt a pitch of one element or an interval of three elements. Although the case where 7 elements 21, 22 ... 27 are processed as one unit will be described, the number of components processed by one unit can be based on the performance of the bonding device 40, that is, the amount of movement in the X direction of the bonding head 4. Let's set the intention. Also, in the above-mentioned embodiment, although the case where it is applied to a short grid-shaped lead frame has been described, it can of course be applied to a continuous lead frame. [Effects of the Invention] According to the present invention, in the step of detecting the last element of the unit being joined and the joining of the joined element at that time, to the time of joining 8 ______ ---------- ---------- Order --------- CPlease read the M on the back first, and then fill in this tribute. This paper is printed on a paper rule._ National Standard (CNS) A4 Specification (210 X 297 Gong) 490772 Printed by the Consumers' Cooperative of Intellectual Property Bureau of the Ministry of Economic Affairs A7 B7 V. Invention Description (7) The remaining components of 1 unit are completed, and the joint is made at the same time as the joint The detection of the next unit will be performed. After that, the completed unit and the next unit to be joined will be advanced by the unit of one unit, and the joint head will be moved to the starting position to reduce the time loss. To the minimum, and seek to improve productivity. [Brief description of the drawings] FIG. 1 is an explanatory diagram showing the detection and bonding steps of one embodiment of the wire bonding method of the present invention. Fig. 2 shows a wire bonding device, (a) is a plan view, and (b) is a front view. Fig. 3 is an explanatory diagram of detection and bonding steps of a conventional wire bonding method. [Symbols] 11, 12 ... 1N Lead frame 20 Die 21, 22 ... 27 Element 30 Pin 31 Lead 40 Bonding device 44 Bonding head 46 Tool 47 Detector 9 This paper standard applies to Chinese National Standard (CNS) A4 specification (21〇X 297 mm) --------------------- Order --------- (Please read the precautions on the back first (Fill in this page)

Claims (1)

490772 A8B8C8D8 Λ 六、申請專利範圍 f ! (請先閲讀背面之注意事項再塡寫本頁) 1、一種引線接合方法，係將晶粒等間隔的貼合於引 腳框之各元件位置，並具備：用以在引腳框的引腳和晶粒 上進行引線接合之工具，用以保持該工具且能在χγ方向 移動之接合頭，和工具隔著元件的間距或整數倍的間距之 間隔、能和工具一起在引腳框的上方移動之接合頭上所裝 設的檢測器；邊將接合頭向一定方向移動邊用檢測器對1 單位之複數個元件依序進行檢測，在該檢測的同時，將完 成檢測的元件根據檢測器的檢測資料而用工具做引線接合 ，之後將引腳框推進完成引線接合之該1單位元件的分量 ，又將接合頭移動到起始位置；其特徵在於， 正在接合之1單位的最後元件的檢測及那時所接合的元 件之接合終了後的步驟中，到該正在接合的1單位之剩餘 的元件完成接合爲止，在該接合的同時會進行下1單位的 元件之檢測，之後將完成接合的1單位元件和待接合的下 1單位元件推進1單位元件的分量，又將接合頭移動到起 始位置。 1 本紙張尺度適用中國國家標準（CNS)A4規格(210 X 297公釐)490772 A8B8C8D8 Λ 6. The scope of patent application f! (Please read the precautions on the back before writing this page) 1. A wire bonding method is to attach the die at equal intervals to the position of each component of the lead frame, and Equipped with: a tool for wire bonding on the lead and die of the lead frame, a bonding head capable of holding the tool and capable of moving in the χγ direction, and a distance between the tool and the tool through an element pitch or an integer multiple of the pitch A detector installed on the bonding head that can be moved above the lead frame together with the tool; while the bonding head is moved in a certain direction, the detector is used to sequentially detect multiple units of 1 unit. At the same time, the component that has been tested is wire-bonded with a tool according to the detection data of the detector, and then the lead frame is pushed into the component of the unit unit that has been wire-bonded, and the bonding head is moved to the starting position; In the steps after the detection of the last component of the unit being joined and the joining of the joined components at that time is completed, the remaining components of the unit being joined are completed. So far, while the bonding may be detected at one element of the unit, after the completion of the engagement element unit 1 and the lower member 1 to be joined propulsion unit component element unit 1, in turn engaging head is moved to start position. 1 This paper size applies to China National Standard (CNS) A4 (210 X 297 mm)
TW089107951A 1999-06-14 2000-04-27 Wire-bonding method TW490772B (en)

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Application Number Priority Date Filing Date Title
JP16620799A JP3455137B2 (en) 1999-06-14 1999-06-14 Wire bonding method and apparatus

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JP4839251B2 (en) 2007-03-26 2011-12-21 株式会社新川 Wire bonding method

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