TW480620B - Improvement to the anisotropic chemical etching process of silicon oxide in the manufacture of MOS transistor flash EPROM devices - Google Patents

Improvement to the anisotropic chemical etching process of silicon oxide in the manufacture of MOS transistor flash EPROM devices Download PDF

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Publication number
TW480620B
TW480620B TW087113375A TW87113375A TW480620B TW 480620 B TW480620 B TW 480620B TW 087113375 A TW087113375 A TW 087113375A TW 87113375 A TW87113375 A TW 87113375A TW 480620 B TW480620 B TW 480620B
Authority
TW
Taiwan
Prior art keywords
layer
etching
oxide
silicon
chemical etching
Prior art date
Application number
TW087113375A
Other languages
English (en)
Chinese (zh)
Inventor
Felice Russo
Koteswara Rao Chintapalli
Giuseppe Miccoli
Alessandro Torsi
Giuseppe Cautiero
Original Assignee
Texas Instruments Inc
Consorzio Eagle
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Texas Instruments Inc, Consorzio Eagle filed Critical Texas Instruments Inc
Application granted granted Critical
Publication of TW480620B publication Critical patent/TW480620B/zh

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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10B—ELECTRONIC MEMORY DEVICES
    • H10B41/00—Electrically erasable-and-programmable ROM [EEPROM] devices comprising floating gates
    • H10B41/30—Electrically erasable-and-programmable ROM [EEPROM] devices comprising floating gates characterised by the memory core region
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104—Forming layers
    • H01L21/02107—Forming insulating materials on a substrate
    • H01L21/02109—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates
    • H01L21/022—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates the layer being a laminate, i.e. composed of sublayers, e.g. stacks of alternating high-k metal oxides
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
    • H01L21/3105—After-treatment
    • H01L21/311—Etching the insulating layers by chemical or physical means
    • H01L21/31144—Etching the insulating layers by chemical or physical means using masks

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Non-Volatile Memory (AREA)
  • Silicon Compounds (AREA)
  • Semiconductor Memories (AREA)
TW087113375A 1997-07-14 1998-08-14 Improvement to the anisotropic chemical etching process of silicon oxide in the manufacture of MOS transistor flash EPROM devices TW480620B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
IT97RM000430A IT1293535B1 (it) 1997-07-14 1997-07-14 Perfezionamento nel procedimento di attacco chimico anisotropo dell'ossido di silicio, in particolare nella fabbricazione di

Publications (1)

Publication Number Publication Date
TW480620B true TW480620B (en) 2002-03-21

Family

ID=11405175

Family Applications (1)

Application Number Title Priority Date Filing Date
TW087113375A TW480620B (en) 1997-07-14 1998-08-14 Improvement to the anisotropic chemical etching process of silicon oxide in the manufacture of MOS transistor flash EPROM devices

Country Status (6)

Country Link
US (1) US6110781A (h)
EP (1) EP0893820A3 (h)
KR (1) KR19990013849A (h)
IT (1) IT1293535B1 (h)
SG (1) SG71131A1 (h)
TW (1) TW480620B (h)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100607322B1 (ko) * 1999-06-30 2006-07-28 주식회사 하이닉스반도체 플래쉬 이이피롬 셀의 제조 방법
JP4149644B2 (ja) * 2000-08-11 2008-09-10 株式会社東芝 不揮発性半導体記憶装置
KR101024252B1 (ko) * 2003-10-30 2011-03-29 주식회사 하이닉스반도체 반도체소자 제조 방법
US7276755B2 (en) * 2005-05-02 2007-10-02 Advanced Micro Devices, Inc. Integrated circuit and method of manufacture
CN105070718B (zh) * 2015-08-18 2019-01-04 上海华虹宏力半导体制造有限公司 一种降低sonos存储器串联电阻的方法

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5275972A (en) * 1990-02-19 1994-01-04 Matsushita Electric Industrial Co., Ltd. Method for fabricating a semiconductor integrated circuit device including the self-aligned formation of a contact window
US5019879A (en) * 1990-03-15 1991-05-28 Chiu Te Long Electrically-flash-erasable and electrically-programmable memory storage devices with self aligned tunnel dielectric area
TW203148B (h) * 1991-03-27 1993-04-01 American Telephone & Telegraph
JP3259349B2 (ja) * 1992-06-09 2002-02-25 ソニー株式会社 不揮発性半導体装置及びその製造方法
US5270234A (en) * 1992-10-30 1993-12-14 International Business Machines Corporation Deep submicron transistor fabrication method
JP2982580B2 (ja) * 1993-10-07 1999-11-22 日本電気株式会社 不揮発性半導体装置の製造方法
US5467308A (en) * 1994-04-05 1995-11-14 Motorola Inc. Cross-point eeprom memory array
JP2891205B2 (ja) * 1996-10-21 1999-05-17 日本電気株式会社 半導体集積回路の製造方法
US5766992A (en) * 1997-04-11 1998-06-16 Taiwan Semiconductor Manufacturing Company Ltd. Process for integrating a MOSFET device, using silicon nitride spacers and a self-aligned contact structure, with a capacitor structure

Also Published As

Publication number Publication date
EP0893820A3 (en) 2003-10-29
ITRM970430A1 (it) 1999-01-14
EP0893820A2 (en) 1999-01-27
ITRM970430A0 (h) 1997-07-14
US6110781A (en) 2000-08-29
KR19990013849A (ko) 1999-02-25
SG71131A1 (en) 2000-03-21
IT1293535B1 (it) 1999-03-01

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GD4A Issue of patent certificate for granted invention patent
MM4A Annulment or lapse of patent due to non-payment of fees