TW471707U - Probing apparatus - Google Patents
Probing apparatusInfo
- Publication number
- TW471707U TW471707U TW087200536U TW87200536U TW471707U TW 471707 U TW471707 U TW 471707U TW 087200536 U TW087200536 U TW 087200536U TW 87200536 U TW87200536 U TW 87200536U TW 471707 U TW471707 U TW 471707U
- Authority
- TW
- Taiwan
- Prior art keywords
- probing apparatus
- probing
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/01—Subjecting similar articles in turn to test, e.g. "go/no-go" tests in mass production; Testing objects at points as they pass through a testing station
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
- G01R31/2887—Features relating to contacting the IC under test, e.g. probe heads; chucks involving moving the probe head or the IC under test; docking stations
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Power Engineering (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Testing Of Individual Semiconductor Devices (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP16687995A JPH08335614A (ja) | 1995-06-08 | 1995-06-08 | プロ−ブシステム |
JP8203996A JPH09246333A (ja) | 1996-03-11 | 1996-03-11 | 検査装置 |
Publications (1)
Publication Number | Publication Date |
---|---|
TW471707U true TW471707U (en) | 2002-01-01 |
Family
ID=26423075
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW085106896A TW442884B (en) | 1995-06-08 | 1996-06-08 | Probe system |
TW087200536U TW471707U (en) | 1995-06-08 | 1996-06-08 | Probing apparatus |
Family Applications Before (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW085106896A TW442884B (en) | 1995-06-08 | 1996-06-08 | Probe system |
Country Status (3)
Country | Link |
---|---|
US (1) | US5798651A (zh) |
KR (1) | KR100346147B1 (zh) |
TW (2) | TW442884B (zh) |
Families Citing this family (17)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100292699B1 (ko) * | 1996-05-17 | 2001-08-07 | 히가시 데쓰로 | 프로브 검사장치 |
EP0860704A3 (en) * | 1997-02-24 | 2000-01-19 | Tokyo Electron Limited | Method and apparatus for inspecting semiconductor integrated circuits, and contactor incorporated in the apparatus |
JP3099183B2 (ja) * | 1997-05-14 | 2000-10-16 | 株式会社東京精密 | ウェーハプロービングマシン |
US6420864B1 (en) * | 2000-04-13 | 2002-07-16 | Nanophotonics Ag | Modular substrate measurement system |
KR100500230B1 (ko) * | 2000-07-26 | 2005-07-11 | 삼성전자주식회사 | 무인운반 시스템 및 그 제어방법 |
US6876215B1 (en) * | 2003-02-27 | 2005-04-05 | Credence Systems Corporation | Apparatus for testing semiconductor integrated circuit devices in wafer form |
KR100617273B1 (ko) * | 2004-05-28 | 2006-08-31 | (주) 쎄믹스 | 반도체 웨이퍼 프로버의 웨이퍼 수용 용기 이송장치 |
US7151591B2 (en) * | 2004-09-28 | 2006-12-19 | Asml Netherlands B.V. | Alignment system, alignment method, and lithographic apparatus |
JP4529135B2 (ja) * | 2005-04-11 | 2010-08-25 | 富士機械製造株式会社 | 対回路基板作業システム |
US7671614B2 (en) * | 2005-12-02 | 2010-03-02 | Formfactor, Inc. | Apparatus and method for adjusting an orientation of probes |
US20090190426A1 (en) * | 2008-01-24 | 2009-07-30 | International Business Machines Corporation | Circuits, methods and design structures for adaptive repair of sram arrays |
US9121901B2 (en) * | 2009-02-12 | 2015-09-01 | Advantest Corporation | Semiconductor wafer test apparatus |
JP2017096949A (ja) * | 2015-11-24 | 2017-06-01 | フォトン・ダイナミクス・インコーポレーテッド | セル接触プロービングパッドを使用して平面パネル型表示装置を電気的に検査するためのシステムおよび方法 |
WO2018029833A1 (ja) * | 2016-08-10 | 2018-02-15 | 株式会社ispace | 探査方法、探査システム及び探査機 |
CN110023773B (zh) * | 2017-02-22 | 2022-03-01 | 新东工业株式会社 | 测试系统 |
JP7280700B2 (ja) * | 2019-01-21 | 2023-05-24 | 株式会社東芝 | 保持装置、制御システム、及び検査システム |
KR102202033B1 (ko) * | 2020-09-03 | 2021-01-12 | 주식회사 프로이천 | 캠승강식 오토 프로브장치 |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4639664A (en) * | 1984-05-31 | 1987-01-27 | Texas Instruments Incorporated | Apparatus for testing a plurality of integrated circuits in parallel |
JP2560371B2 (ja) * | 1988-01-05 | 1996-12-04 | 株式会社ニコン | 基板処理システム |
JP2952331B2 (ja) * | 1990-04-05 | 1999-09-27 | 東京エレクトロン株式会社 | プローブ装置 |
JPH0465850A (ja) * | 1990-07-06 | 1992-03-02 | Tokyo Electron Ltd | 検査・リペア装置 |
JP3312748B2 (ja) * | 1992-06-05 | 2002-08-12 | 株式会社東京精密 | ウエハ検査装置及びウエハ検査方法 |
KR100291109B1 (ko) * | 1993-05-31 | 2001-06-01 | 히가시 데쓰로 | 반도체 웨이퍼의 버언 인 검사기능을 구비한 프로우브 검사 및 리페어장치, 및 반도체 웨이퍼의 버언 인 검사장치 |
US5488292A (en) * | 1993-10-04 | 1996-01-30 | Tokyo Seimitsu Co., Ltd. | Wafer inspecting system |
-
1996
- 1996-06-05 KR KR1019960020012A patent/KR100346147B1/ko not_active IP Right Cessation
- 1996-06-07 US US08/661,405 patent/US5798651A/en not_active Expired - Lifetime
- 1996-06-08 TW TW085106896A patent/TW442884B/zh not_active IP Right Cessation
- 1996-06-08 TW TW087200536U patent/TW471707U/zh not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
TW442884B (en) | 2001-06-23 |
KR100346147B1 (ko) | 2002-11-23 |
KR970003749A (ko) | 1997-01-28 |
US5798651A (en) | 1998-08-25 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
GD4K | Issue of patent certificate for granted utility model filed before june 30, 2004 | ||
MK4K | Expiration of patent term of a granted utility model |