TW471699U - Substrate processing device in a fluid vessel - Google Patents

Substrate processing device in a fluid vessel

Info

Publication number
TW471699U
TW471699U TW090201544U TW90201544U TW471699U TW 471699 U TW471699 U TW 471699U TW 090201544 U TW090201544 U TW 090201544U TW 90201544 U TW90201544 U TW 90201544U TW 471699 U TW471699 U TW 471699U
Authority
TW
Taiwan
Prior art keywords
pct
fluid
opening
date oct
processing device
Prior art date
Application number
TW090201544U
Other languages
English (en)
Inventor
Robin Schild
Original Assignee
Steag Micro Tech Gmbh
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Steag Micro Tech Gmbh filed Critical Steag Micro Tech Gmbh
Publication of TW471699U publication Critical patent/TW471699U/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H01L21/67057—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing with the semiconductor substrates being dipped in baths or vessels
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
    • B08B3/04—Cleaning involving contact with liquid
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F26—DRYING
    • F26B—DRYING SOLID MATERIALS OR OBJECTS BY REMOVING LIQUID THEREFROM
    • F26B21/00—Arrangements or duct systems, e.g. in combination with pallet boxes, for supplying and controlling air or gases for drying solid materials or objects
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67023—Apparatus for fluid treatment for general liquid treatment, e.g. etching followed by cleaning
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S134/00—Cleaning and liquid contact with solids
    • Y10S134/902—Semiconductor wafer
TW090201544U 1996-04-24 1997-04-01 Substrate processing device in a fluid vessel TW471699U (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE19616400A DE19616400C2 (de) 1996-04-24 1996-04-24 Vorrichtung zum Behandeln von Substraten in einem Fluid-Behälter

Publications (1)

Publication Number Publication Date
TW471699U true TW471699U (en) 2002-01-01

Family

ID=7792327

Family Applications (1)

Application Number Title Priority Date Filing Date
TW090201544U TW471699U (en) 1996-04-24 1997-04-01 Substrate processing device in a fluid vessel

Country Status (9)

Country Link
US (1) US6145520A (zh)
EP (1) EP0904164B1 (zh)
JP (1) JP3190353B2 (zh)
KR (1) KR100308075B1 (zh)
AT (1) ATE209535T1 (zh)
DE (2) DE19616400C2 (zh)
ID (1) ID18404A (zh)
TW (1) TW471699U (zh)
WO (1) WO1997039840A1 (zh)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5913981A (en) * 1998-03-05 1999-06-22 Micron Technology, Inc. Method of rinsing and drying semiconductor wafers in a chamber with a moveable side wall
US6864186B1 (en) * 1998-07-28 2005-03-08 Micron Technology, Inc. Method of reducing surface contamination in semiconductor wet-processing vessels
TW499696B (en) * 1999-04-27 2002-08-21 Tokyo Electron Ltd Processing apparatus and processing method
DE19934300C2 (de) 1999-07-21 2002-02-07 Steag Micro Tech Gmbh Vorrichtung zum Behandeln von Substraten
US20060219274A1 (en) * 2005-03-29 2006-10-05 Dainippon Screen Mfg. Co., Ltd. Substrate processing apparatus
JP4498190B2 (ja) * 2005-03-29 2010-07-07 大日本スクリーン製造株式会社 基板処理装置

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2713347A (en) * 1952-07-30 1955-07-19 Hazy Lily Combination rapid or slow rinser with movable partitions
US3526970A (en) * 1968-04-11 1970-09-08 Grace W R & Co Drying oven and volatile condenser
JPS62279640A (ja) * 1986-05-28 1987-12-04 Nec Corp ウエハ洗浄装置
JP2733771B2 (ja) * 1988-07-29 1998-03-30 日本テキサス・インスツルメンツ株式会社 液体による処理装置
JPH0320031A (ja) * 1989-06-16 1991-01-29 Matsushita Electron Corp 超音波洗浄装置
US5275184A (en) * 1990-10-19 1994-01-04 Dainippon Screen Mfg. Co., Ltd. Apparatus and system for treating surface of a wafer by dipping the same in a treatment solution and a gate device for chemical agent used in the apparatus and the system
JPH0594978A (ja) * 1991-10-02 1993-04-16 Nec Corp 半導体基板浸漬処理槽
JPH05259136A (ja) * 1992-03-12 1993-10-08 Tokyo Electron Ltd 洗浄処理装置
US5282923A (en) * 1992-08-13 1994-02-01 Vlsi Technology, Inc. Liquid agitation and purification system
JP2902222B2 (ja) * 1992-08-24 1999-06-07 東京エレクトロン株式会社 乾燥処理装置
DE4413077C2 (de) * 1994-04-15 1997-02-06 Steag Micro Tech Gmbh Verfahren und Vorrichtung zur chemischen Behandlung von Substraten
DE19546990C2 (de) * 1995-01-05 1997-07-03 Steag Micro Tech Gmbh Anlage zur chemischen Naßbehandlung
DE19655219C2 (de) * 1996-04-24 2003-11-06 Steag Micro Tech Gmbh Vorrichtung zum Behandeln von Substraten in einem Fluid-Behälter

Also Published As

Publication number Publication date
DE19616400C2 (de) 2001-08-30
US6145520A (en) 2000-11-14
EP0904164A1 (de) 1999-03-31
JP3190353B2 (ja) 2001-07-23
KR20000010604A (ko) 2000-02-15
EP0904164B1 (de) 2001-11-28
DE59705559D1 (de) 2002-01-10
WO1997039840A1 (de) 1997-10-30
KR100308075B1 (ko) 2001-11-02
JPH11508823A (ja) 1999-08-03
ID18404A (id) 1998-04-02
DE19616400A1 (de) 1997-11-06
ATE209535T1 (de) 2001-12-15

Similar Documents

Publication Publication Date Title
TW279997B (zh)
MY108835A (en) Fluid treatment apparatus and method
EP0966025A3 (en) Lift fingers for substrate processing platforms
ES2195028T3 (es) Procedimiento y aparato de flotacion.
CA2373899A1 (en) Apparatus, systems and methods for processing and treating a biological fluid with light
CA2349541A1 (en) Method and apparatus for steam pasteurization of meat
FR2480778B1 (zh)
TW471699U (en) Substrate processing device in a fluid vessel
SG49561A1 (en) Roof water inlet
TW358961B (en) Substrate processing device
AU1719795A (en) Water treatment method and apparatus
TW351708B (en) Method and apparatus for treating substrate
DE59402199D1 (de) Verfahren zum Reinigen von metallischen Werkstücken
AU3060195A (en) Frying apparatus and process
ATE186423T1 (de) Verfahren und vorrichtung zur nassbehandlung von substraten in einem behälter
EP1192401B8 (de) Verfahren und anlage zum behandeln von flüssigen metallen
GB2234261B (en) Liquid metal processing
JPS6473619A (en) Method and apparatus for low-pressure process
WO1998051826B1 (en) Apparatus for and method of treating liquid metal
DE20320846U1 (de) Vorrichtung zur Isolierung eines Oberflächenbereichs eines Werkstücks
EP0625722A3 (en) Surface treatment method for liquid crystal cell substrate.
JPS647622A (en) Device for treatment of semiconductor substrate
ATE221923T1 (de) Durchlaufofen mit einer einrichtung zum abschrecken von werkstücken sowie abschreckverfahren
DE59707815D1 (de) Vorrichtung zum behandeln von substraten
AR036983A1 (es) Metodo y aparato para controlar la superficie de posicionamiento de onda y turbulencia en vasijas de fundicion continua

Legal Events

Date Code Title Description
GD4K Issue of patent certificate for granted utility model filed before june 30, 2004
MM4K Annulment or lapse of a utility model due to non-payment of fees