TW468867U - Cutting structure of chip package body - Google Patents

Cutting structure of chip package body

Info

Publication number
TW468867U
TW468867U TW88222472U TW88222472U TW468867U TW 468867 U TW468867 U TW 468867U TW 88222472 U TW88222472 U TW 88222472U TW 88222472 U TW88222472 U TW 88222472U TW 468867 U TW468867 U TW 468867U
Authority
TW
Taiwan
Prior art keywords
chip package
package body
cutting structure
cutting
chip
Prior art date
Application number
TW88222472U
Other languages
Chinese (zh)
Inventor
Shih-Hsiang Chou
Original Assignee
Shih-Hsiang Chou
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shih-Hsiang Chou filed Critical Shih-Hsiang Chou
Priority to TW88222472U priority Critical patent/TW468867U/en
Publication of TW468867U publication Critical patent/TW468867U/en

Links

TW88222472U 1999-12-29 1999-12-29 Cutting structure of chip package body TW468867U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW88222472U TW468867U (en) 1999-12-29 1999-12-29 Cutting structure of chip package body

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW88222472U TW468867U (en) 1999-12-29 1999-12-29 Cutting structure of chip package body

Publications (1)

Publication Number Publication Date
TW468867U true TW468867U (en) 2001-12-11

Family

ID=21658197

Family Applications (1)

Application Number Title Priority Date Filing Date
TW88222472U TW468867U (en) 1999-12-29 1999-12-29 Cutting structure of chip package body

Country Status (1)

Country Link
TW (1) TW468867U (en)

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