TW386641U - Packaging structure of semiconductor - Google Patents

Packaging structure of semiconductor

Info

Publication number
TW386641U
TW386641U TW87217713U TW87217713U TW386641U TW 386641 U TW386641 U TW 386641U TW 87217713 U TW87217713 U TW 87217713U TW 87217713 U TW87217713 U TW 87217713U TW 386641 U TW386641 U TW 386641U
Authority
TW
Taiwan
Prior art keywords
semiconductor
packaging structure
packaging
Prior art date
Application number
TW87217713U
Other languages
Chinese (zh)
Inventor
Hung-Jr Yan
Original Assignee
Win Technologies Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Win Technologies Co Ltd filed Critical Win Technologies Co Ltd
Priority to TW87217713U priority Critical patent/TW386641U/en
Publication of TW386641U publication Critical patent/TW386641U/en

Links

TW87217713U 1998-10-27 1998-10-27 Packaging structure of semiconductor TW386641U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW87217713U TW386641U (en) 1998-10-27 1998-10-27 Packaging structure of semiconductor

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW87217713U TW386641U (en) 1998-10-27 1998-10-27 Packaging structure of semiconductor

Publications (1)

Publication Number Publication Date
TW386641U true TW386641U (en) 2000-04-01

Family

ID=21637129

Family Applications (1)

Application Number Title Priority Date Filing Date
TW87217713U TW386641U (en) 1998-10-27 1998-10-27 Packaging structure of semiconductor

Country Status (1)

Country Link
TW (1) TW386641U (en)

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