TW457618B - Silicon fixtures for wafer processing and method of fabrication - Google Patents

Silicon fixtures for wafer processing and method of fabrication Download PDF

Info

Publication number
TW457618B
TW457618B TW089106650A TW89106650A TW457618B TW 457618 B TW457618 B TW 457618B TW 089106650 A TW089106650 A TW 089106650A TW 89106650 A TW89106650 A TW 89106650A TW 457618 B TW457618 B TW 457618B
Authority
TW
Taiwan
Prior art keywords
silicon
item
tower
patent application
scope
Prior art date
Application number
TW089106650A
Other languages
English (en)
Chinese (zh)
Inventor
Raanan Zehavi
Robert Davis
Original Assignee
Integrated Materials Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US09/292,491 external-priority patent/US6225594B1/en
Priority claimed from US09/292,495 external-priority patent/US6196211B1/en
Priority claimed from US09/292,496 external-priority patent/US6205993B1/en
Application filed by Integrated Materials Inc filed Critical Integrated Materials Inc
Application granted granted Critical
Publication of TW457618B publication Critical patent/TW457618B/zh

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/10—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP]
    • H10P72/12—Vertical boat type carrier whereby the substrates are horizontally supported, e.g. comprising rod-shaped elements

Landscapes

  • Crystals, And After-Treatments Of Crystals (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
TW089106650A 1999-04-15 2000-04-10 Silicon fixtures for wafer processing and method of fabrication TW457618B (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US09/292,491 US6225594B1 (en) 1999-04-15 1999-04-15 Method and apparatus for securing components of wafer processing fixtures
US09/292,495 US6196211B1 (en) 1999-04-15 1999-04-15 Support members for wafer processing fixtures
US09/292,496 US6205993B1 (en) 1999-04-15 1999-04-15 Method and apparatus for fabricating elongate crystalline members

Publications (1)

Publication Number Publication Date
TW457618B true TW457618B (en) 2001-10-01

Family

ID=27404131

Family Applications (1)

Application Number Title Priority Date Filing Date
TW089106650A TW457618B (en) 1999-04-15 2000-04-10 Silicon fixtures for wafer processing and method of fabrication

Country Status (4)

Country Link
EP (1) EP1171905A1 (https=)
JP (2) JP4328468B2 (https=)
TW (1) TW457618B (https=)
WO (1) WO2000063952A1 (https=)

Families Citing this family (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6284997B1 (en) 2000-11-08 2001-09-04 Integrated Materials, Inc. Crack free welding of silicon
US6811040B2 (en) * 2001-07-16 2004-11-02 Rohm And Haas Company Wafer holding apparatus
JP2003086525A (ja) * 2001-09-12 2003-03-20 Toshiba Ceramics Co Ltd シリコンウエハ熱処理用治具およびその製造方法
US6838114B2 (en) 2002-05-24 2005-01-04 Micron Technology, Inc. Methods for controlling gas pulsing in processes for depositing materials onto micro-device workpieces
US6955725B2 (en) 2002-08-15 2005-10-18 Micron Technology, Inc. Reactors with isolated gas connectors and methods for depositing materials onto micro-device workpieces
US7335396B2 (en) 2003-04-24 2008-02-26 Micron Technology, Inc. Methods for controlling mass flow rates and pressures in passageways coupled to reaction chambers and systems for depositing material onto microfeature workpieces in reaction chambers
US7344755B2 (en) 2003-08-21 2008-03-18 Micron Technology, Inc. Methods and apparatus for processing microfeature workpieces; methods for conditioning ALD reaction chambers
US7235138B2 (en) 2003-08-21 2007-06-26 Micron Technology, Inc. Microfeature workpiece processing apparatus and methods for batch deposition of materials on microfeature workpieces
US7422635B2 (en) 2003-08-28 2008-09-09 Micron Technology, Inc. Methods and apparatus for processing microfeature workpieces, e.g., for depositing materials on microfeature workpieces
US7056806B2 (en) 2003-09-17 2006-06-06 Micron Technology, Inc. Microfeature workpiece processing apparatus and methods for controlling deposition of materials on microfeature workpieces
US7282239B2 (en) 2003-09-18 2007-10-16 Micron Technology, Inc. Systems and methods for depositing material onto microfeature workpieces in reaction chambers
US7323231B2 (en) 2003-10-09 2008-01-29 Micron Technology, Inc. Apparatus and methods for plasma vapor deposition processes
US7581511B2 (en) 2003-10-10 2009-09-01 Micron Technology, Inc. Apparatus and methods for manufacturing microfeatures on workpieces using plasma vapor processes
US7258892B2 (en) 2003-12-10 2007-08-21 Micron Technology, Inc. Methods and systems for controlling temperature during microfeature workpiece processing, e.g., CVD deposition
US7906393B2 (en) 2004-01-28 2011-03-15 Micron Technology, Inc. Methods for forming small-scale capacitor structures
US7584942B2 (en) 2004-03-31 2009-09-08 Micron Technology, Inc. Ampoules for producing a reaction gas and systems for depositing materials onto microfeature workpieces in reaction chambers
US8133554B2 (en) 2004-05-06 2012-03-13 Micron Technology, Inc. Methods for depositing material onto microfeature workpieces in reaction chambers and systems for depositing materials onto microfeature workpieces
US7972703B2 (en) * 2005-03-03 2011-07-05 Ferrotec (Usa) Corporation Baffle wafers and randomly oriented polycrystalline silicon used therefor
JP2006286874A (ja) * 2005-03-31 2006-10-19 Komatsu Electronic Metals Co Ltd ウェーハ熱処理用治具及び熱処理後のウェーハ
JP5519389B2 (ja) * 2010-04-23 2014-06-11 株式会社ブリヂストン 支持ピン
KR101035552B1 (ko) * 2011-03-24 2011-05-23 (주)상아프론테크 솔라웨이퍼 카세트
EP2784422B1 (en) * 2013-03-28 2017-10-04 Mitsubishi Materials Corporation Holding plate for deposition and heat treatment and method of producing the same

Family Cites Families (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6228437U (https=) * 1985-08-01 1987-02-20
JPH0761849B2 (ja) * 1987-12-09 1995-07-05 株式会社トクヤマ 構造体
US4914269A (en) * 1989-07-24 1990-04-03 Micron Technology, Inc. Method of sealing a ceramic lid on a ceramic semiconductor package with a high-power laser
JPH046826A (ja) * 1990-04-24 1992-01-10 Tokyo Electron Ltd 熱処理装置
JP2566340B2 (ja) * 1990-11-19 1996-12-25 東芝セラミックス株式会社 シリコン製ウエハ支持ボートの製造方法
JPH04300262A (ja) * 1991-03-28 1992-10-23 Shin Etsu Chem Co Ltd 炭化珪素質治具
JPH06151571A (ja) * 1992-11-06 1994-05-31 Toshiba Ceramics Co Ltd 単結晶シリコン製ウェーハボート
JPH06163676A (ja) * 1992-11-20 1994-06-10 Toshiba Ceramics Co Ltd ウエハボート
US5492229A (en) * 1992-11-27 1996-02-20 Toshiba Ceramics Co., Ltd. Vertical boat and a method for making the same
JP3245246B2 (ja) * 1993-01-27 2002-01-07 東京エレクトロン株式会社 熱処理装置
JP3117573B2 (ja) * 1993-04-02 2000-12-18 東芝セラミックス株式会社 窒化ケイ素繊維強化シリコン材及びその製造方法
JPH08107079A (ja) * 1994-09-30 1996-04-23 Toshiba Ceramics Co Ltd 縦型ウェ−ハボ−ト及び縦型熱処理炉
JP3773973B2 (ja) * 1995-12-25 2006-05-10 株式会社トクヤマ シリコン成形体用前駆体
JPH09213645A (ja) * 1996-01-29 1997-08-15 Sumitomo Sitix Corp ウェーハ支持装置及びその製造方法
TW325588B (en) * 1996-02-28 1998-01-21 Asahi Glass Co Ltd Vertical wafer boat
JP3479201B2 (ja) * 1997-03-28 2003-12-15 東芝セラミックス株式会社 組立式ウエハ用ボート及びその取付治具
JPH10284427A (ja) * 1997-04-03 1998-10-23 Mitsubishi Materials Corp シリコンウエハ支持装置
JP3507975B2 (ja) * 1997-04-15 2004-03-15 東芝セラミックス株式会社 縦型ウエハボート
JP3568017B2 (ja) * 1997-06-25 2004-09-22 東芝セラミックス株式会社 ウエハボート
US6171400B1 (en) * 1998-10-02 2001-01-09 Union Oil Company Of California Vertical semiconductor wafer carrier

Also Published As

Publication number Publication date
JP2009170938A (ja) 2009-07-30
EP1171905A1 (en) 2002-01-16
JP4328468B2 (ja) 2009-09-09
WO2000063952A1 (en) 2000-10-26
JP2002542621A (ja) 2002-12-10

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