TW445564B - Wafer transfer device - Google Patents

Wafer transfer device Download PDF

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Publication number
TW445564B
TW445564B TW88120789A TW88120789A TW445564B TW 445564 B TW445564 B TW 445564B TW 88120789 A TW88120789 A TW 88120789A TW 88120789 A TW88120789 A TW 88120789A TW 445564 B TW445564 B TW 445564B
Authority
TW
Taiwan
Prior art keywords
cassette
substrate
aforementioned
section
cassettes
Prior art date
Application number
TW88120789A
Other languages
Chinese (zh)
Inventor
Tomoo Kato
Tatsuo Nirei
Original Assignee
Olympus Optical Co
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Filing date
Publication date
Application filed by Olympus Optical Co filed Critical Olympus Optical Co
Application granted granted Critical
Publication of TW445564B publication Critical patent/TW445564B/en

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Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005Apparatus not specifically provided for elsewhere
    • H01L21/67242Apparatus for monitoring, sorting or marking
    • H01L21/67271Sorting devices
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67769Storage means

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)

Abstract

The present invention is a wafer transfer device wherein multiple kinds of cassettes (41, 42) having different sizes and containing wafers in the stack direction can be selectively attached to an elevator mechanism (1a), and when a cassette (42) with a maximum size is attached to the elevator mechanism (1a), a second sensor (11) comprising a transmission sensor which has a light-emitting element (11a) and a light-receiving element (11b) is disposed outside the area occupied, so that a selected cassette is thereby detected, and the size of the wafer is measured based on the detection output (IO rate) from the second sensor (11).

Description

A7 44556 4 --B7__ 五、發明說明(1 ) 本發明所屬之技術領域 本發明係有關於一種將晶圓或平面顯示器之玻璃基板 等,從卡盒搬送至所定位置所使用之基板搬送裝置β 習知技藝 素來,從保持多數之晶圓等的基板之卡盒取出所要之 基扳之同時,將該所取出之基板以目視作觀察的宏觀檢查 之基扳搬送裝置,經予實用化》 但是,於進行如是之宏觀檢查的晶圓,有各種尺寸者 存在,例如,有6英吋晶圚或8英忖晶圓等,惟,因該等晶 圓之直徑尺寸的不同,而使欲保持晶圓之卡盒的大小亦相 異’特別是,於6英吋晶圊與8英吋晶圓之卡盒,其晶圓之 積層方向的間距亦有所不同· 因此,於習知之晶圓搬送裝置,對於該等相異之卡盒, 亦從卡盒取出所要的之晶圖,同時,予進行該所取出之晶 圓的宏觀檢查等之後,要再度將其退回至卡盒之原來的位 置之如是的一連貫之動作,婼無障礙予以執行,即,事先 應予檢測6英吋晶圓以及8英吋晶圓之卡盒種類,而予切換 從卡盒取出晶圓之間距,以防止於取出晶圓之時的晶圓之 破損等。 由此’素來有裝設收納大小相異之卡盒的第1卡盒部 材及第2卡盒之任一卡盒部材之時•乃設有可作on動作之 第1按鈕開關,以及有裝置第2卡盒之時可作ON動作之第2 按鈕開關,而依該等按組開關之ON動作的狀態予以檢測 第1卡盒部材以及第2卡盒部材。此場合,第2按鈕開關, 本紙張尺度適用中國國家標準(CNS)A4規格(210x297公釐) n n n n n n n n n n n I * n n n n n n I— 1 線 (請先|»讀背面之注意事項再填寫本頁> 經濟部智慧財產局ΜΚ工消費合作社印製 4 經濟部智慧財產局員工消費合泎钍印製 A7 --—---- 五、發明說明(2 ) 係位於裝設第1卡盒之第1領域的外側,而配置於外裝設苐 2卡盒之第2領域為内侧。由於有裝設第2卡盒乃於第2卡盒 底部之一部份作押推操作,而予檢測第2卡盒。 但是,依如是之構成,一般而言,收納基板之卡盒因 廠商而有種種之形狀,因此,於同一基板尺寸之卡盒,其 卡盒的大小雖然無多大差別,惟其卡盒底部之周緣部份的 形狀就多有所不同。由於此,將不同廠商之卡盒混合使用 之場合’即’有第2按鈕開關不會押推操作,是故,不僅 誤判卡盒尺寸,而於基板取出之時的基板之破損等亦會引 起。 本發明之目的 本發明因鑑於上述實況而所進行者,係欲予提供確實 施例能予進行基板尺寸的辨識之基板搬送裝置,為目的。 解決課題之本發明裝置 本發明之第1發明’係以具備將基板保持在積層方向 而尺寸相異之多數種類的卡盒,以選擇性可裝設之卡盒裝 設部、配置在前述卡盒裝設部,予以裝設前述多數種類之 卡盒之中最大尺寸之卡盒時,所占有之領域外而欲予檢測 所選擇之卡盒的多數之無接觸感測器,以及因應前述多數 之無接觸感測器的檢測輸出,予以檢出基板尺寸之基板尺 寸檢出部,為其特徵= 本發明之第2發明,係在第1發明上,前述無接觸感測 器乃具有發光元件及受光元件。當在前述長式裝設部予以 裝設所選擇之卡盒之時’從前述發光元件所發光之光束不 本纸張&度適用命固國家標準(CNSU·(規格(210 « 297公f ) I--I -裝!!--訂---------線 (請先閲讀背面之注意事項再填寫本頁) 44556 4 Α7 Β7 五、發明說明(3 ) 受前述所選擇之卡盒的一部份所遮蔽,而依是否由前述受 光元件所受光予以檢測卡盒,作為特徵。 本發明之第3發明’係於第1發明上,前述無接觸感測 器’乃予檢出從前述所選擇之卡盒的反射信號,以進行檢 出所選擇之卡盒的反射式感測器,為其特徵β 本發明之第4發明,係於第1發明上,以再具備為取出 予以保持於裝設在前述卡盒裝設部之卡盒的基板之用的基 板取出部’以及以由前述基板尺寸檢出部所檢出之基板尺 寸為依據,予以變更依前述基板取出部而裝設在前述卡盒 部之卡盒所保持之基板的取出間隔之變更部,為其特徵。 本發明之第5發明,係在第4發明上,依前述變更部所 作之取出間隔的變更’乃由裝設在前述卡盒部之卡盆的移 動間隔作變更予以進行,為其特徵》 本發明之第6發明,係在第4發明上,依前述變更部所 作之取出間隔的變更,乃由變更前述基板取出部之移動間 隔予以進行,為其特徵。 本發明之第7發明,係在第1發明上的前述多數種類之 卡盒’乃使其具有開口面之前面予以一致而裝設在卡盒裝 設部,為其特徵。 本發明之第8發明,係在第1發明上的前述多數種類之 卡盒’乃使其分別所保持之基板的中心為相一致而予裝設 在前述卡盒裝設部,為其特徵。 本發明之第9發明,係在第1發明上的前述多數種類之 卡盒’乃使其後端部相一致而予裝設在前述卡盒裝設部’ 本紙張尺度適用中國园家標準(CNS)A4規格(210 X 297公爱) (請先W讀背面之注意事項再填寫本頁) 言 Γ 經濟部智慧財產局員工消費合作社印製 6A7 44556 4 --B7__ V. Description of the invention (1) The technical field to which the present invention belongs The present invention relates to a substrate transfer device for transferring a wafer or a flat panel glass substrate from a cassette to a predetermined position β The conventional technique has been to practically remove the required substrate from a cassette holding a large number of wafers and other substrates, and use the substrate to be removed as a macro inspection substrate for visual inspection. However, it has been put into practical use. But There are various sizes of wafers for macro inspections such as 6-inch wafers or 8-inch wafers. However, because of the different diameters of these wafers, it is necessary to keep them. The size of the cassettes of wafers are also different. In particular, in the case of 6-inch wafers and 8-inch wafers, the pitch of the wafer stacking direction is also different. Therefore, in the conventional wafers, The conveying device also removes the required crystal patterns from the cassettes for these different cassettes. At the same time, after the macro inspection of the removed wafers is performed, it is returned to the original cassettes again. Consistent location The action should be executed without any obstacles, that is, the cassette types of 6-inch wafers and 8-inch wafers should be detected in advance, and the distance between the wafers to be removed from the cassettes should be switched to prevent the wafers from being removed when the wafers are removed. Damage to the wafer. Therefore, when the first cassette member and the second cassette member having different size cassettes were installed, the first button switch capable of being turned on and the device were provided. At the time of the second cassette, the second button switch that can be turned on can be detected, and the first cassette component and the second cassette component are detected according to the state of the ON operation of the group switch. In this case, the second button switch, this paper size applies the Chinese National Standard (CNS) A4 specification (210x297 mm) nnnnnnnnnnn I * nnnnnn I— 1 line (please first read the precautions on the back before filling this page > Economy Printed by the Intellectual Property Bureau of the Ministry of Industry and Intellectual Property Cooperative Cooperatives 4 Printed by the Intellectual Property Bureau of the Ministry of Economic Affairs and printed by employees of the Intellectual Property Bureau of the Ministry of Economics A7 ---------- V. Invention Description (2) It is located in the first field where the first card box The second area of the second card box is located on the inside. The second card box is installed on the bottom of the second card box to perform a push operation, and the second card is detected. However, according to the structure, in general, the cassettes for storing substrates have various shapes due to the manufacturer, so although the size of the cassettes on the same substrate size is not much different, the bottom of the cassette is the same. The shape of the peripheral part is more different. Because of this, when the cassettes of different manufacturers are used in a mixed manner, that is, the second button switch will not be pushed and pushed. Breakage of the substrate when the substrate is taken out The purpose of the present invention is to provide a substrate conveying device capable of identifying a substrate size according to an embodiment of the present invention. The purpose of the present invention is to solve the problem. The first invention 'is equipped with a plurality of types of cassettes having different sizes in which the substrate is held in the lamination direction, and is selectively mounted on the cassette mounting portion and installed in the cassette mounting portion. In the case of the largest size of the above-mentioned most types of cassettes, the non-contact sensor of the majority of the selected cassettes outside the occupied area and the detection of the majority of the non-contact sensors The output is a substrate size detection unit that detects the substrate size. Its feature = the second invention of the present invention is based on the first invention. The aforementioned non-contact sensor has a light emitting element and a light receiving element. When the installation unit installs the selected card box, the light beam emitted from the aforementioned light-emitting element does not conform to the national standard (CNSU · (Specification (210 «297 公 f))- I- !!!-Order --------- line (please read the precautions on the back before filling this page) 44556 4 Α7 Β7 V. Description of the invention (3) Part of the card box selected by the foregoing It is characterized by detecting the cassette depending on whether or not the light is received by the light receiving element. A third invention of the present invention is the "first invention, the said non-contact sensor" is detected from the selected The reflective signal of the cassette is used to detect the selected reflective cassette sensor. It is a feature of the fourth invention. The fourth invention of the present invention is based on the first invention, and it is further provided to be held in the installation for removal. The substrate take-out portion for the substrate of the cartridge in the cartridge installation portion and the substrate size taken out by the substrate size detection portion are changed based on the substrate take-out portion and installed on the card. The change section of the take-out interval of the substrate held by the cassette in the box section is characterized in that. The fifth invention of the present invention is based on the fourth invention, and the change of the take-out interval according to the change section described above is performed by changing the moving interval of the tray installed in the above-mentioned card section, and its characteristics are as follows: A sixth invention of the invention is the fourth invention, in which the change of the take-out interval made by the changing section is performed by changing the moving interval of the substrate taking-out section and is characterized in that. The seventh invention of the present invention is characterized in that the above-mentioned many types of cassettes' are mounted on the cassette mounting portion so that their front faces are uniformly provided with opening faces. An eighth invention of the present invention is characterized in that the plurality of types of cassettes' according to the first invention are mounted on the cassette mounting portion in such a manner that the centers of the substrates held by them are aligned, respectively. According to a ninth invention of the present invention, the above-mentioned most types of cassettes are 'installed in the aforementioned cassette mounting unit' so that their rear ends are consistent with each other. CNS) A4 size (210 X 297 public love) (Please read the precautions on the back before filling out this page) Word Γ Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs 6

經濟部智«时產局員工消費合作社印制代 A7 ____ B7_ 五、發明說明(4 ) 為其特徵。 其結果,依據本發明,即,由於以無接觸感測器予以 檢測所選擇之卡盒,乃對於同一基板尺寸之卡盒,雖其盒 底部之形狀相異者,亦能確實予以辨識各卡盒之基板尺 寸。 本發明之實施態樣 以下,依照圖面說明本發明之一實施態樣。 第1圖係表示本發明所適用之晶圓搬送裝置的概略性 構成。在圖上,1為晶圓搬送裝置本體,其具有將於後述 之升降機構部la及宏觀檢查部3 ^鄰接於該晶圓搬送裝置 本體1 ’而予配置對於所選擇供給之晶囿8, 8,進行微觀檢 查的微觀檢查部2,就搆成份為晶圓檢查裝置。 在該晶圓搬送裝置本體丨,具有鄰接於宏觀檢査部3而 大小相異之基板,例如,收納6英吋晶圓8之卡盒41或收納 8英吋晶園8’之卡盒42 ’作為以選擇性為裝設可能之卡盒 裝設部的升降機構部la。該升降機構部1&,對應於各個大 小之晶圊8 ’ 8’以積層方向具有所定間距而保持多數片的 卡盒4卜42,而以所定之移動間距成為上下動作可能。 此場合,於升降機構部^上之卡盒4卜42之裝設方法, 如在第湖所示,係㈣使在各卡盒41,42各別所收納 之6英吋晶圓8及8英吋晶圓8,之中心相一致的中心對準方 式。 另方面,在升降機構部1a,設有為檢出卡盒41,42有 否正確5又置之用的第1感測器10,以及為辨識卡盒4卜42 w、張 ㈣家㈣ 2]ΰχ 297 & -------I 1 I I I -------- (請先閲讀背面之注意事項再填寫本頁) 44556 4 經濟部智慧財產局員工消费合作社印製 A7 B7 五、發明說明(5 ) 之用的第2感測器11 »第1感測器1 〇,例如,由按紐開關所 成者’其配置在裝設卡盒41 ’ 42之時,共同所占有而在圖 中予以附加影線所示之領域B内,若予裝設該等卡盒41, 42之任一種之時’就可檢測卡盒41,42。此場合予以檢出 設在卡盒41 ’ 42底面之連結部材的位置,即,以1個感測 器10就能予檢測所有之卡盒。又,第2感測器11,係由具 有發光元件11a及受光元件lib之透過式感測器所成者,其 乃配置為僅於裝設8英吋用卡盒42之時所占有而在困中以 附加影線所示之領域A ’如同以所定之高度橫切之般。當 裝設8英吋用卡盒42時,即,從發光元件na透過至受光元 件lib之光束就被遮蔽,乃可檢知卡盒42。此場合,第2感 測器11如在第2A圖所示,係於卡盒41前方,僅予裝設卡 盒42之時所占有之領域A,如同橫切之般的配置。 在裝置本艘1,對向於卡盒41,42設有作為晶圓搬送 機構之晶圓取出/退回臂5以及中央工作台6。晶圓取出/ 退回臂5 ’係具有沿著對於卡盒41,42為未囷示之導執(導 向)作前進及後退之直線移動機構,以及於後退位置在上 下方向作移動之上下移動機構.而其在卡盒4丨,42方向前 進並將卡盒41,42内之晶圓8,8’吸著保持之同時,一邊 後退而一邊取出並依在後退位置之下方向的移動,將晶圓 8,8’轉交於中央工作台6,且將中央工作台6上之晶圓8, 8’予以吸著保持之同時,暫時移動至上方向並前進至卡盒 41,42方向,而將晶困g» g,退回至卡盒41 , 42内之*連 貫的動作為可行。 本紙張尺度適用令困國家標準(CNS)A4規格(210 x 297公爱) H ϋ n I n n n n n n I I ^ I «^1 n I I^eJ· n I ϋ .^1 I 線 (請先閲讀背面之注意事項再填寫本頁) 經濟部智慧財產局員工消費合作社印製 A7 B7 五、發明說明(6 ) 構成宏觀檢查部3之中央工作台6,係吸著保持所載置 之晶圓8,8’之同時,並可作旋轉動作。此場合’中央工 作台6之旋轉動作,係於觀察載置在中央工作台之晶圓8, 8’之表面之時,由未圖示之操作機構所執行。由於該旋轉 動作乃可從種種的宏觀角度能予觀察晶圓8’ 8’之表面。 另方面,如同圍繞中央工作台6之般予以配置背面宏 觀觀察用晶圓保持臂7,而構成宏觀檢查部3。該晶圓保持 臂7 ’係具有延出至晶圓8,8’之中心方向的多數之晶®保 持部701 ’而由該晶圓保持部70丨之吸著部可將在中央工作 台6上之晶圓8 ’ 8,,從背面側作吸著保持。 而如是之晶圓保持臂7乃支撐為依旋轉軸可作轉動, 而將旋轉轴9作為令心予以轉動所定角度,就可將所保持 之晶圓8 ’ 8’予以翻面,並使背面之宏觀觀察成為可行。 第3圖係表示以如是所構成之晶圓搬送裝置上的晶圓 尺寸檢出迴路。在圊中’ 12為内藏在晶圓搬送裝置本體i 之CPU,而於該CPU12乃連接上述之第1感測器1〇及第2感 測器11 ’且連接升降驅動部13並介著顯示驅動部14而連接 於顯示部15 « CPU 12 ’係控制裝置整體者’於此,乃從第1感測器1 〇 及第2感測器11之檢知結果,而予選別6英吋晶圓用卡盒41 或8英吋晶圓用卡盒42之同時,亦作晶圓尺寸之判斷。升 降驅動部13 ’乃依CPU12之判斷結果而予設定對卡盒41, 42之升降機構部la的移動量之間距者。又,顯示部丨5,乃 要顯示於CPU12之指令或判定結果者。 本紙張又度過用中國因家標单(匚\幻八4規络(210 * 297公爱) -------------裝------—訂---------線 {請先閱讀背面之注意事項再填寫本頁) 9 4 4 5 5 6 4 經濟部智慧財產局員工消費合作社印製 A7 B7 五、發明說明(7 ) 其次’說明以如此所構成之實施態樣的動作。 首先,欲以自動檢出晶圓尺寸之場合,就操作裝置本 體1之操作盤91予以指定自動檢出模態,就執行在第4圊所 示之流程囷。 該場合,於步驟401,在裝置本想1之升降機構部1&予 以裝設卡盒41 ’ 42,就於步驟402開始晶圓尺寸之自動檢 出,而於步驟403予以判斷第1感測器10有否檢出卡盒41 , 42。於此’卡盒41,42未被檢出之場合,即,判斷為忘記 卡盒41 ’ 42之裝設,或者,裝設為不完全,而於步驟4〇4, 在顯示部15作錯誤之顯示。 另方面,於步驟403,第1感測器10檢出卡盒4卜42時, 就進入步驟405,而予判斷第2感測器11有否檢出卡盒42。 於此,卡盒42未被檢出之場合,即,予以判斷裝設在裝置 本體1之升降機構部a之卡盒為6英吋晶園8用者,並進入步 驟406 ’而在升降驅動部π予以設定對於6英吋晶圓用卡盒 41的升降機構部la之移動量的間距β其後,在步称4〇7, 就對於收納在卡盒41之晶圓8執行於宏銳檢查部3之宏觀檢 查以及於微觀檢查部2之微觀檢查。 另方面’於步驟405,第2感測器11有檢出卡盒42之場 合,即’判斷為裝設在裝設本體1之卡盒裝設部la之卡盒 為8英吋晶圓者,而進入步驟408,而在升降驅動部丨3予以 設定對於8英吋晶圓用卡盒42之升降機構部ia之移動量的 間距,而後,於步驟407,就對於收納在8英吋用卡盒42之 晶圓8’執行於宏觀檢查部3之宏觀檢查,以及於微觀檢査 本纸張尺度適用中國因家標準(CNS)A4規格(210x297公®) -1111 — — — — — — — — — 4. I 1 I I 1 I I ·11111111 (锖先Μ讀背面之注奇苯項再填寫本頁) 10 蛵濟郜智慧吋產局員工消費合作社"製 A7 B7 五、發明說明(8 ) 部2之微觀檢查。 其次,以手動檢出晶圓尺寸之場合,就如在第5圖所 示之流程圖予以執行。 此場合’於步驟5〇1,將卡盒41,42裝設在升降機構 部la,而於步驟502,就在操作盤91上操作為設定6英吋或 8英吋之晶圓尺寸用而未圊示之設定開關。即於步驟5〇3 , 於表示部15就顯示所設定之晶圓尺寸,同時,在升降驅動 部13,就對於所設定之晶圓尺寸之卡盒41,42 ’予以設定 升降機構部la之移動量的間距β 從此狀態下,於步驟504,就開始晶圓尺寸之檢出, 並於步驟505,判斷第丨感測器1〇有否檢出卡盒41,42。於 此,卡盒41,42未被檢出之場合,即予判斷忘記裝設卡盒 41,42,或者,裝設為不完全,而於步驟在顯示部15 作錯誤顯示。 而於步驟505,第1感測器10檢出卡盒4丨,42時,就進 入步驟507,並予判斷第2感測器u有否檢出8英吋用卡盒 42。於此,卡盒42未被檢出之場合’裝設在升降機構部13 之卡盒就予判斷為6英叫晶圓用者’惟,於步驟5〇8,予以 判斷是否與未圖示而事先依設定開關所設定之晶圓為一 致3於此,若為一致,就由升降驅動部13送出對應於6英 叶卡盒41之驅動信號至升降機構部ia,而依晶圓取出/退 回臂5而從卡盒41内所選擇供給之6英吋晶圓8,就於步驟 509執行於宏覲檢查部3之宏觀檢查,以及於微觀檢查部2 之微觀檢查°而於步驟508,若為不一致時,就於步驟51〇 , 本紙張汶用中囷國家標瘳(CNS)A4规格(210 X 297公* ) ------------•裝--------訂---------線 (請先閱讀背面之注意事項再填寫本頁) 11 445564 經濟部智慧財產局員工消費合作社印製 A7 B7 五、發明說明(9 ) 在顯示部15作卡盒尺寸相異之顯示β 另方面’於步驟507,檢出卡盒42之場合,就予判斷 裝設在升降機構部la之卡盒為8英吋晶困用者,惟,於步 驟511即予判斷是否與事先而未圖示的設定開關所設定之 晶圓尺寸為一致。於此,若為一致,即,由升降驅動部13 送出對應於8英吋卡盒41之驅動信號至升降機構部ia,且 依晶圊取出/退回臂5而從卡盒42内所選擇供給之g英吋晶 圓8’,就於步驟512,執行於宏觀檢查部3之宏觀檢査以及 於微觀檢査部2之微觀檢查。又,於步驟411,若為不一致 時,就於步驟513,在顯示部15作卡盒尺寸相異之顯示。 由於此,依據如此’由於使用由在卡盒41,42所共同 占有之第1領域B内所配置之第1感測器1〇之同時,具有如 同橫切僅由卡盒42所占有之第2領域A之般所配置的發光 元件1U及受光元件lib之透過式感測器所成之第2感測器 11,因此,素來對於同一晶圓尺寸之卡盒,其卡盒之大小 並無多大之改變’但,卡盒底部之周緣部份的形狀乃多方 相異’是故,將不同礙商之卡盒溫合使用之場合,即,多 方會誤辨卡盒尺寸,不過,本發明對於該等同樣之晶圓尺 寸的卡盒而盒底部之形狀相異者,亦能予確實辨識各卡盒 之卡盒尺寸。 由於採用具有發光元件11 a及受光元件1 lb之透過式感 測器作為第2感測器11,因此,可將第2感測器11之配置, 能予設定在卡盒42之高度方向的任意位置,是故,能予有 效利用裝設本體1上之空間。 本紙張尺度適用中國國家標準(CNS)A4規格(210 X 297公釐) ml--111^. !| 訂-------- <請先閲It背面之注意事項再填寫本頁) 12 經濟部智慧財產局員工消費合作社印製 A7 B7 五、發明說明(10 ) 替代該透過式感測器,亦能使用對所選擇之卡盒送出 檢出信號’並從該卡盒受訊其反射信號之超音波反射式感 測器或光學反射感測器等之無接點感測器。 於上述實施態樣之卡盒裝設部la上之卡盒4丨,42的裝 設方法方面’係以採用使於各卡盒41,42個別所收納之6 英吋晶圓及8英吋晶圓之中心相一致的中心對準方式為例 作說明’但’如在第2B圖所示,採用使於各卡盒41,42 ; 個別所收納之6英吋晶圓及8英吋晶圓的前方端部相—致的 則端對準方式者亦能適用。此場合,第2感測器丨丨,乃於 卡盈41後方予以配置為如同橫切僅予裝設卡盒42之時所占 有的領域A之般。又,對於如在第2C圖所示’使於各卡盒 41,42個別所收納之6英吋晶圊以及8英吋晶圓之後方端部 相一致之後端對準方式亦能予適用s此場合,第2感測器u 乃於卡盒41前方,予以配置為如同橫切僅有裝設卡盒之 時所占有的領域A之般。又,在上述之實施態樣,基板方 面乃以對於半導體晶圓適用之例作表示,惟,對於平面面 板顯不器用之玻璃基板當然亦能適用。又’於上述之實施 態樣,係為升降卡盒而使其具有升降機能,惟,採用使搬 送臂側予以升降之方式的場合,即,卡盒裝設部具有載置 卡盒之機能就足夠。 如上述,依據本發明,即,對於同一基板尺寸之卡盒’ 雖其盒底部之形狀相異者,亦能予確實辨識各卡盒之基板 尺寸。 本發明於產業上之利用可能性 -----^-----J !訂♦ --------線 (請先Μ讀背面之注意事項再填寫本頁) (CNS)A4 規格1 297 么、笼 13 1 ㈣家標準 445564 A7 _______ B7 五、發明說明(11 ) 如上述’依據本發明有關之基板搬送裝置,即,適用 於將晶圊或平面顯示器之玻璃基板等,而從卡盒掩送至所 定位置。 囷面之簡單說明 第1圖係表示有關本發明之一實施態樣的基板搬送裝 置。 第2A、B、C圖係同一實施態樣之第1及第2感測器的 位置關係的說明圖。 第3圖係表示使用在同一實施態樣之晶圓尺寸檢出迴 路, 第4圖係欲說明同一實施態樣之自動檢出動作之用的 流程.圖。 第5圖係欲說明同一實施態樣之手動檢出動作之用的 流程圖。 1_丨1!|丨—丨—丨 __裝 — — — — — —— ---— — — — — — (請先閱讀背面之注意事項再填寫本頁) 經濟部智慧財產局員工消費合作社印製 14 本紙張尺度適用中國國家標準(CNS)A4規格(210 X 297公釐) 五、發明說明(12 A7 B7 元件標號對照 1…晶圓搬送裝置本體 1 a…升降機·構部 2…微觀檢查部 3…宏觀檢查部 5…晶圓取出/退回臂 6…中央工作台 7…晶圓保持臂 8…6”晶圓 8’…8”晶圓 9…旋轉軸 10…第1感測器 II…第2感測器 i la…發光元件 11 b…受光元件 12—CPU 13 * ·升降驅動部 14…顯示驅動部 15…顯示部 41…6”卡盒 42…8”卡盒 91…操作盤 401〜407…步驟順序(自動 檢出) 501〜513…步驟順序(手動 檢出) 701…晶圓保持部 -------------裝*-------訂---------線 (請先閱讀背面之注意事項再填寫本頁) 經濟部智慧財產局員工消費合作社印製 本%張尺Ϊ通用* S S家標在(CNS)A·!規格(2]ϋ X 297公« ) 15Printed by the Ministry of Economic Affairs «Time Production Bureau Staff Consumer Cooperatives A7 ____ B7_ V. Invention Description (4) is its feature. As a result, according to the present invention, since the selected card case is detected by a non-contact sensor, it is for a card case of the same substrate size. Although the shapes of the bottoms of the boxes are different, each card can be surely identified. Box size. Embodiment of the present invention An embodiment of the present invention will be described below with reference to the drawings. Fig. 1 shows a schematic configuration of a wafer transfer apparatus to which the present invention is applied. In the figure, 1 is a wafer transfer device main body, which has a lifting mechanism section 1a and a macro inspection section 3 to be described later, and is arranged adjacent to the wafer transfer device main body 1 ', and is provided with a crystal wafer 8 selected for supply, 8. The micro inspection unit 2 that performs micro inspections constitutes a wafer inspection device. The wafer transfer device body 丨 has substrates of different sizes adjacent to the macro inspection section 3, for example, a cassette 41 for storing a 6-inch wafer 8 or a cassette 42 'for storing an 8-inch wafer 8'. The lifting mechanism unit 1a is a cassette mounting unit that is optional. This lifting mechanism unit 1 & corresponds to the cassettes 8'8 'of each size, and holds a plurality of cassettes 42 with a predetermined pitch in the stacking direction, and can move up and down with a predetermined moving pitch. In this case, as shown in the first lake, the installation method of the cassettes 4 and 42 on the lifting mechanism section ^ is to use 6-inch wafers 8 and 8 inches stored in each of the cassettes 41 and 42. In the wafer 8, the center alignment is consistent. On the other hand, the lifting mechanism unit 1a is provided with a first sensor 10 for detecting whether the cassettes 41 and 42 are correctly placed 5 and a cassette 42 for identifying the cassette 4 and 42. ] ΰχ 297 & ------- I 1 III -------- (Please read the notes on the back before filling out this page) 44556 4 Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs A7 B7 Fifth, the second sensor 11 used in the description of the invention (5) »the first sensor 1 〇, for example, the button switch is formed by the 'when it is arranged in the installation box 41' 42, In the area B indicated by the additional hatching in the figure, if any of these cassettes 41 and 42 is installed, the cassettes 41 and 42 can be detected. In this case, the position of the connecting member provided on the bottom surface of the cassette 41'42 is detected, that is, all the cassettes can be detected with one sensor 10. The second sensor 11 is a transmissive sensor having a light-emitting element 11a and a light-receiving element lib. The second sensor 11 is configured to be occupied only when the 8-inch cassette 42 is installed. The area A 'shown by the additional hatching in the sleep is as if it was cut at a predetermined height. When the 8-inch cassette 42 is installed, that is, the light beam transmitted from the light-emitting element na to the light-receiving element lib is shielded, and the cassette 42 can be detected. In this case, as shown in FIG. 2A, the second sensor 11 is arranged in front of the card case 41, and only the area A occupied when the card case 42 is installed is arranged in a transverse manner. The apparatus main vessel 1 is provided with a wafer taking-out / retracting arm 5 and a center table 6 as a wafer transfer mechanism opposite to the cassettes 41 and 42. The wafer take-out / retracting arm 5 'is provided with a linear movement mechanism for advancing and retreating along the unguided guides (guides) for the cassettes 41, 42 and an up-down movement mechanism for moving up and down in the retracted position. While it is advancing in the direction of the cassettes 4 丨, 42 and holding and holding the wafers 8 and 8 'in the cassettes 41 and 42 while holding back, it takes out while moving backwards and moves in the direction below the retracted position. The wafers 8 and 8 'are transferred to the center table 6 and the wafers 8 and 8' on the center table 6 are sucked and held while temporarily moving to the upper direction and advancing to the direction of the cassettes 41 and 42, and If the crystal is g »g, returning to the cassettes 41, 42 for * continuous action is possible. This paper size is applicable to the National Standard (CNS) A4 specification (210 x 297 public love) H ϋ n I nnnnnn II ^ I «^ 1 n II ^ eJ · n I ϋ. ^ 1 I line (please read the first Note: Please fill in this page again.) Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs, A7, B7. 5. Description of the invention (6) The central workbench 6, which constitutes the macro inspection department 3, is used to hold and hold the wafers 8, 8 'At the same time, it can be rotated. In this case, the rotation operation of the 'central workbench 6' is performed by an operating mechanism (not shown) while observing the surface of the wafers 8, 8 'placed on the central workbench. Since the rotation action can observe the surface of the wafer 8 '8' from various macroscopic angles. On the other hand, the back surface macro observation wafer holding arm 7 is arranged as if it surrounds the center table 6, and the macro inspection section 3 is constituted. The wafer holding arm 7 ′ has a plurality of crystal® holding portions 701 ′ extending to the center direction of the wafers 8 and 8 ′, and the suction portion of the wafer holding portion 70 丨 can be placed on the center table 6. The upper wafer 8'8 is held by suction from the back side. And if the wafer holding arm 7 is supported to be rotatable according to the rotation axis, and the rotation axis 9 is rotated by a predetermined angle, the held wafer 8 '8' can be turned and the back surface can be turned. Macro observations became feasible. Fig. 3 is a diagram showing a wafer size detection circuit in a wafer transfer device constructed as described above. In the case, '12 is a CPU built in the wafer transfer device body i, and the above-mentioned first sensor 10 and the second sensor 11 'are connected to the CPU 12 and the lifting drive unit 13 is connected to the CPU 12 The display drive unit 14 is connected to the display unit 15 «CPU 12 'is the control device as a whole' here, based on the detection results of the first sensor 10 and the second sensor 11, 6 inches are selected. The wafer cassette 41 or 8-inch wafer cassette 42 is also used to determine the wafer size. The ascending and descending driving section 13 ′ sets a distance between the movement amounts of the ascending and descending mechanism sections la of the cassettes 41 and 42 in accordance with the judgment result of the CPU 12. In addition, the display section 5 is a command or judgment result to be displayed on the CPU 12. This paper has been used in China because of the home label list (幻 \ Magic Eight 4 profile (210 * 297 public love) ------------- install ---------- order-- ------- line {Please read the notes on the back before filling out this page) 9 4 4 5 5 6 4 Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs A7 B7 V. Description of the invention (7) Next 'Description Perform the action in such a manner. First, when the wafer size is to be detected automatically, the operation panel 91 of the operation device body 1 is designated to automatically detect the mode, and the process shown in (4) is executed. In this case, in step 401, a cassette 41'42 is installed in the lifting mechanism unit 1 & of the device 1 and the automatic detection of the wafer size is started in step 402, and the first sensing is determined in step 403 The cassette 10 has detected the cassettes 41, 42. In the case where the 'card cases 41 and 42 are not detected, that is, it is judged that the installation of the card case 41' 42 is forgotten or the installation is incomplete, and in step 404, an error is made in the display portion 15 Of display. On the other hand, in step 403, when the first sensor 10 detects the cassette 42 and 42, it proceeds to step 405 to determine whether the second sensor 11 has detected the cassette 42. Here, when the cassette 42 is not detected, that is, it is judged that the cassette installed in the lifting mechanism part a of the device body 1 is a 6-inch crystal garden 8 user, and the process proceeds to step 406 'to drive the lift The distance π is set to the distance β of the moving amount of the lifting mechanism portion 1a of the 6-inch wafer cassette 41. Then, in step 407, Hong Rui is executed on the wafer 8 stored in the cassette 41. Macro inspection by inspection unit 3 and micro inspection by micro inspection unit 2. On the other hand, when the second sensor 11 detects the cassette 42 in step 405, that is, it is judged that the cassette installed in the cassette mounting portion 1a of the mounting body 1 is an 8-inch wafer Then, it proceeds to step 408, and the distance of the moving amount of the lifting mechanism portion ia for the 8-inch wafer cassette 42 is set in the lifting driving section 3, and then, in step 407, the storage for the 8-inch wafer is used. The wafer 8 'of the cassette 42 is performed in the macro inspection of the macro inspection department 3 and in the micro inspection. The paper size is applicable to China Standards (CNS) A4 specification (210x297 male®) -1111 — — — — — — — — — 4. I 1 II 1 II · 11111111 (Please read the note on the back of the article and then fill in this page) 10 蛵 郜 Smart Smart Industry Bureau Employee Consumption Cooperative " A7 B7 Manufacturing 5. Description of the invention (8) Microscopic inspection of Part 2. Next, when the wafer size is manually detected, it is performed as shown in the flowchart shown in FIG. 5. In this case, in step 501, the cassettes 41 and 42 are installed in the lifting mechanism section 1a, and in step 502, the operation panel 91 is operated to set a wafer size of 6 inches or 8 inches. Unshown setting switch. That is, at step 503, the set wafer size is displayed on the display unit 15, and at the same time, the lift drive unit 13 sets the lift mechanism unit 1a for the cassettes 41, 42 'of the set wafer size. From this state, the distance β of the moving amount starts to detect the wafer size at step 504, and at step 505, it is determined whether the cassettes 41, 42 are detected by the first sensor 10. In this case, if the cassettes 41 and 42 are not detected, it is judged that the cassettes 41 and 42 are forgotten to be installed or the installation is incomplete, and an error display is performed on the display section 15 in the step. In step 505, when the first sensor 10 detects the cassettes 4 and 42, it proceeds to step 507 and determines whether the second sensor u has detected the 8-inch cassette 42. Here, if the cassette 42 is not detected, 'the cassette installed in the lifting mechanism section 13 is judged to be a 6-wafer user'. However, at step 508, it is judged whether it is different from the one shown in the figure. The wafer set in advance according to the setting switch is consistent here. If it is consistent, the driving signal corresponding to the 6-inch card box 41 is sent by the lifting drive unit 13 to the lifting mechanism unit ia, and the wafer is taken out according to the wafer / The 6-inch wafer 8 that was withdrawn from the cassette 41 and withdrawn from the arm 5 is returned to the macro inspection in the Acer inspection unit 3 in step 509 and the micro inspection in the micro inspection unit 2 in step 508. If it is inconsistent, then in step 51, this paper uses the Chinese National Standard (CNS) A4 specification (210 X 297 male *) ------------ • installation ---- ---- Order --------- line (please read the notes on the back before filling this page) 11 445564 Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs A7 B7 V. Description of the invention (9) The display section 15 displays a different size of the cassette. On the other hand, when the cassette 42 is detected in step 507, it is judged that the cassette installed in the lifting mechanism section la is 8 inches crystal. However, it is judged at step 511 whether the wafer size is the same as the wafer size set by a setting switch (not shown). Here, if it is the same, that is, the driving signal corresponding to the 8-inch card box 41 is sent from the lifting driving section 13 to the lifting mechanism section ia, and is selected and supplied from the card box 42 according to the take-out / retract arm 5 For the g-inch wafer 8 ', the macro inspection in the macro inspection section 3 and the micro inspection in the micro inspection section 2 are performed in step 512. In step 411, if there is a discrepancy, then in step 513, the display section 15 displays a different cassette size. Because of this, the reason is that, because the first sensor 10 disposed in the first area B shared by the cassettes 41 and 42 is used, the first sensor 10 has the same cross-section as that occupied by the cassette 42 only. The second sensor 11 formed by the transmissive sensor of the light-emitting element 1U and the light-receiving element lib arranged in the field 2 as usual. Therefore, for a cassette of the same wafer size, the size of the cassette is not always the same. How big the change is, "However, the shape of the peripheral part of the bottom of the card box is different from each other" is the reason, when different card holders are used in combination, that is, the size of the card box is misidentified by multiple parties. However, the present invention For those cassettes of the same wafer size but different shapes at the bottom of the cassette, the cassette size of each cassette can also be reliably identified. Since a transmissive sensor having a light-emitting element 11 a and a light-receiving element 1 lb is used as the second sensor 11, the configuration of the second sensor 11 can be set in the height direction of the cassette 42. Arbitrary positions can effectively use the space on the installation body 1. This paper size applies to China National Standard (CNS) A4 specification (210 X 297 mm) ml--111 ^.! | Order -------- < Please read the precautions on the back of It before filling this page ) 12 Printed by the Consumers ’Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs A7 B7 V. Description of the invention (10) Instead of the transmission sensor, you can also send out a detection signal to the selected card box and receive information from the card box Non-contact sensors such as ultrasonic reflection sensors or optical reflection sensors that reflect signals. With regard to the method of installing the cassettes 4 丨, 42 on the cassette mounting portion la of the above-mentioned embodiment, the 6-inch wafer and the 8-inch wafer that are individually stored in each of the cassettes 41 and 42 are adopted. The center alignment method of the wafer center is used as an example to explain the 'but', as shown in Figure 2B, each of the cassettes 41, 42 is used; 6-inch wafers and 8-inch wafers are individually stored. If the front ends of the circle match, the end alignment method can also be applied. In this case, the second sensor 丨 丨 is arranged behind the card 41 as if it traverses the area A occupied when only the card box 42 is installed. In addition, as shown in FIG. 2C, the rear-end alignment method of 6-inch wafers and 8-inch wafers accommodated in each of the cassettes 41 and 42 can be applied. In this case, the second sensor u is arranged in front of the cartridge 41 so as to cross-cut the area A occupied when only the cartridge is installed. Also, in the above-mentioned embodiment, the substrate is shown as an example applicable to a semiconductor wafer, but it can of course be applied to a glass substrate for a flat panel display. In the above-mentioned embodiment, the card box is provided with a lifting function for the purpose of lifting the card box. However, when the method of lifting the conveying arm side is used, that is, the card box mounting section has the function of placing the card box. enough. As described above, according to the present invention, even for the cassettes of the same substrate size, although the shapes of the bottoms of the cassettes are different, the substrate size of each cassette can be accurately identified. The possibility of using the invention in the industry ----- ^ ----- J! Order ♦ -------- Line (Please read the precautions on the back before filling this page) (CNS) A4 Specification 1 297 Mod, cage 13 1 Home standard 445564 A7 _______ B7 V. Description of the invention (11) As mentioned above, the substrate transfer device according to the present invention, that is, a glass substrate suitable for transferring crystal wafers or flat displays, etc. Instead, it is hidden from the cassette to a predetermined position. Brief Description of the Figures Fig. 1 shows a substrate transfer apparatus according to an embodiment of the present invention. Figures 2A, B, and C are explanatory diagrams of the positional relationship between the first and second sensors in the same embodiment. Fig. 3 is a diagram showing a wafer size detection circuit using the same embodiment, and Fig. 4 is a flowchart for explaining the automatic detection operation of the same embodiment. Fig. 5 is a flowchart for explaining the manual detection operation in the same embodiment. 1_ 丨 1! | 丨 — 丨 — 丨 __install — — — — — — — — — — — — — (Please read the notes on the back before filling out this page) Employees of the Intellectual Property Bureau of the Ministry of Economic Affairs Printed by the cooperative 14 This paper size is in accordance with China National Standard (CNS) A4 (210 X 297 mm) V. Description of the invention (12 A7 B7 Component number comparison 1 ... Wafer transfer device body 1 a ... Lifter ... 2 ... Micro inspection section 3 ... Macro inspection section 5 ... Wafer extraction / retraction arm 6 ... Central table 7 ... Wafer holding arm 8 ... 6 '' wafer 8 '... 8' 'wafer 9 ... Rotary axis 10 ... First sensing Device II ... 2nd sensor i la ... light-emitting element 11 b ... light-receiving element 12-CPU 13 * · Lifting driving section 14 ... display driving section 15 ... display section 41 ... 6 "cassette 42 ... 8" cassette 91 ... Operation panel 401 ~ 407 ... Sequence of steps (automatic detection) 501 ~ 513 ... Sequence of steps (manual detection) 701 ... Wafer holding section ------------- mounting * ----- --Order --------- line (please read the notes on the back before filling out this page) Printed by the Intellectual Property Bureau Employees Consumer Cooperatives of the Ministry of Economic Affairs (CNS) A ·! Specifications (2] ϋ X 297 public «) 15

Claims (1)

^4556 4六、申請專利範圍 A8B8C8D8 經濟部智慧財產局員工消費合作社印製 1· 一種基板搬送裝置,包含: 卡盒裝設部,係可選擇性裝設將基板保持於積層 方向之尺寸相異之多數種類的卡盒; 多數無接觸感測器’係在前述卡盒裝設部裝設前 述多數種類的卡盒之中’大尺寸之卡盒之時,配置所 占有的領域外,並檢知所選擇之卡盒;及 基板尺寸檢出部,係因應前述多數之無接觸感測 器之檢知輪出,而檢出基板尺寸。 2·如申請專利範圍第1項之基板搬送裝置,其中: 前述無接觸感測器係具有發光元件與受光元件, 而在前述卡盒裝設部裝設所選擇之卡盒時,從前述發 光元件所發光之光束不會被前述所選擇之卡盒的一部 份所遮蔽,而檢知是否由前述受光元件所受光,以檢 知卡盒。 3_如申請專利範圍第1項之基板搬送裝置,其中: 前述無接觸感測器’係檢出從前述所選擇之卡盒 的反射信號,而進行所選擇之卡盒的檢出之反射式感 測器。 4‘如申請專利範圍第1項之基板搬送裝置,其在構成份上 再具備: 基板取出部’係用以取出保持在裝設於前述卡盒 裝設部之卡盒的基板;及 變更部,係以由前述基板尺寸檢出部所檢出之基 板尺寸為根基板’而變更裝設在利用前述基板取出部 本紙張尺度適用令固國家標準(CNS)A4規格(210 X 297公釐) (請先閲讀背面之注意事項再填寫本頁) -丨广 . .線 16 A8B8C8D8 六、申請專利範圍 之前述卡盒部所保持於卡盒的基板之取出間隔。 乂如申請專利範圍第4項之基板搬送裝置,其中: 依前述變更部所作之取出間隔變更,係用以變更 裝設在前述卡盒部之卡盒的移動間隔。 如申請專利範圍第4項之基板搬送裝置,其中: 依前述變更部所作之取出間隔的變更,係變更前 述基板取出部之移動間隔。 7. 如申請專利範圍第1項之基板搬送裝置,其中: 前述多數種類之卡盒,係使具有開口面之前面相 —致’而裝設在前述卡盒裝設部》 8. 如申請專利範圍第1項之基板搬送裝置,其中: 前述多數種類之卡盒,係使其各自所保持之基板 的中心相一致,而裝設在前述卡盒裝設部。 9. 如申請專利範圍第1項之基板搬送裝置,其中: 前述多數種類之卡盒’係使其後端相一致,而裝 設在前述卡盒之裝設部·> 1---- ----I I ! isj ! ! I t I 訂· — — — - <請先閱讀背面之注意事項再填寫本頁> 埏濟部智.¾.財產局員工消費合作.社印製 國國家標丑(CNS)e規袼(210 X 297公芨) 17^ 4556 4 6. Scope of patent application A8B8C8D8 Printed by the Consumer Cooperative of Intellectual Property Bureau of the Ministry of Economic Affairs 1. A substrate conveying device, including: a card box installation section, which can be optionally installed to keep the substrates in the stacking direction with different sizes Most types of cartridges; most of the non-contact sensors are installed in the above-mentioned cartridge installation section when the large-sized cartridges are installed in the large-sized cartridges. Know the selected cassette; and the substrate size detection unit, which detects the substrate size in response to the detection rotation of most of the aforementioned non-contact sensors. 2. The substrate transfer device according to item 1 of the patent application scope, wherein: the non-contact sensor has a light emitting element and a light receiving element, and when the selected card case is installed in the card case installation portion, the light is emitted from the foregoing The light beam emitted by the element will not be blocked by a part of the selected cassette, and whether the light is received by the aforementioned light receiving element is detected to detect the cassette. 3_ The substrate conveying device according to item 1 of the patent application scope, wherein: the aforementioned non-contact sensor is a reflective type that detects a reflected signal from the aforementioned selected cassette and performs detection of the selected cassette Sensor. 4 'The substrate conveying device according to item 1 of the scope of patent application, further comprising: a substrate taking-out section for taking out a substrate held in a cassette mounted on the aforementioned cassette mounting section; and a changing section It is based on the substrate size detected by the aforementioned substrate size detection section as the root substrate, and the installation is changed in the use of the aforementioned substrate extraction section. The paper size is applicable to the national standard (CNS) A4 specification (210 X 297 mm). (Please read the precautions on the back before filling in this page)-丨 Guangdong .. Line 16 A8B8C8D8 VI. The patent application scope of the aforementioned card box section held on the card substrate to take out the interval.乂 If the substrate conveying device of item 4 of the patent application scope, wherein: The change of the take-out interval according to the aforementioned changing section is used to change the moving interval of the cassette installed in the aforementioned cassette section. For example, the substrate transfer device of the scope of patent application No. 4 includes: The change of the take-out interval according to the aforementioned change section is to change the movement interval of the aforementioned substrate take-out section. 7. For the substrate conveying device of the first scope of the patent application, among which: most of the above-mentioned types of cassettes are installed in the aforementioned cassette installation section so that the front surface with the opening surface is the same. The substrate transfer device according to item 1, wherein: the above-mentioned types of cassettes are mounted on the cassette mounting portion so that the centers of the respective substrates are aligned with each other. 9. For the substrate conveying device in the first scope of the patent application, wherein: most of the aforementioned types of cassettes are made to have their rear ends consistent, and are installed in the mounting section of the aforementioned cassette. ≫ 1 ---- ---- II! Isj!! I t I Order · — — —-< Please read the notes on the back before filling out this page > National Standard Ugly (CNS) e Regulations (210 X 297 public address) 17
TW88120789A 1998-11-30 1999-11-29 Wafer transfer device TW445564B (en)

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JP33933298A JP3573634B2 (en) 1998-11-30 1998-11-30 Substrate transfer device

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AU (1) AU1411800A (en)
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WO (1) WO2000033377A1 (en)

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Publication number Priority date Publication date Assignee Title
TWI794507B (en) * 2018-06-20 2023-03-01 日商東京威力科創股份有限公司 Automatic teaching method and control device

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Publication number Priority date Publication date Assignee Title
JP4091380B2 (en) 2002-08-29 2008-05-28 東京エレクトロン株式会社 Load port compatible with multiple types of cassettes containing substrates to be processed
JP2018107312A (en) * 2016-12-27 2018-07-05 株式会社ディスコ Processing device

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Publication number Priority date Publication date Assignee Title
JPH0724279B2 (en) * 1987-09-08 1995-03-15 東京エレクトロン東北株式会社 Wafer transfer device
JPH0424936A (en) * 1990-05-15 1992-01-28 Tokyo Electron Ltd Prove device
JP3674063B2 (en) * 1994-06-21 2005-07-20 東芝機械株式会社 Wafer transfer device
JPH09139415A (en) * 1995-11-14 1997-05-27 Nikon Corp Wafer housing device

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI794507B (en) * 2018-06-20 2023-03-01 日商東京威力科創股份有限公司 Automatic teaching method and control device

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