JPH0424936A - Prove device - Google Patents

Abstract

PURPOSE:To automatically recognize the size of an element to be measured to measure it by so providing recesses as to position and place wafer cassettes of a plurality of types of different sizes at predetermined positions, and providing a plurality of sensors for detecting placing of the cassettes in the recesses. CONSTITUTION:Identification codes (ID) written at predetermined positions of semiconductor wafers 2a, 2b, 2c are read by image sensors 13 in response to recognized wafer sizes, and sent to a main controller 10. A conveying mechanism 11 receives information of how to place on a wafer stage 12 from the controller 10, executes a predetermined conveying operation, and places. Thereafter, a measuring program corresponding to the ID is loaded from a tester, the stage 12 is driven according to the program, a probe stylus 15 of a probe card 14 is brought into contact with semiconductor devices of the wafers 2a, 2b, 2c to obtain electric conductions. Electric characteristics are measured by the tester through the stylus 15.

Description

[Detailed description of the invention] [Purpose of the invention] (Industrial application field) The present invention relates to a probe device.

(Prior Art) As is well known, a large number of semiconductor devices are formed on a semiconductor wafer using a precision phototransfer technique or the like, and then cut into individual semiconductor devices. In the manufacturing process of such semiconductor devices, a probe device has traditionally been used to test and measure the electrical characteristics of a semi-finished semiconductor device in the state of a semiconductor wafer. Some efforts are being made to improve productivity by sending only products to post-processes such as packaging.

The above-mentioned probe device is a probe mechanism that drives a wafer mounting table in the X-YZ force direction and brings the probe of the probe card into contact with the electrode pad of a semiconductor device mounted on the wafer mounting table to establish electrical continuity. and a transport mechanism for loading and unloading semiconductor wafers between a wafer cassette and a wafer mounting table provided in a cassette storage section.

As such a probe device, the present applicant has proposed a probe equipped with an automatic recognition mechanism that automatically recognizes the size of the object to be measured by measuring the size of the cassette, for example, in Japanese Patent Application Laid-Open No. 119543/1983. We are proposing a device. In other words, in this probe device, when the wafer cassette is fixed in a predetermined position by a fixing pin driven by an air cylinder or the like, the size of the wafer cassette (wafer size) is determined based on the moving distance of the fixing pin from the origin. It is configured to recognize this wafer size and automatically start a transfer (loading/unloading) operation according to this wafer size.

According to such a probe device, the size (Uni/X size) of a wafer cassette transported by a transport robot or the like and placed at a predetermined position in the cassette storage section is automatically recognized, and the size of the wafer cassette is automatically recognized without operator input. Since measurement can be started automatically, complete automation (unmanned operation) can be performed, and cleanliness and productivity can be improved.

(Problem to be solved by the invention) However, even if the probe device is equipped with an automatic recognition mechanism for recognizing the size of the object to be measured as described above,
Furthermore, it is naturally required to reduce the number of mechanical sliding parts to suppress the generation of dust and to reduce manufacturing costs.

The present invention has been made in response to such conventional circumstances, and it is possible to automatically recognize the size of a target mj object and carry out measurements, and to automate the probe process. It is an object of the present invention to provide a probe device that can reduce the amount of dust generated and the manufacturing cost compared to the conventional probe device.

[Structure of the Invention] (Means for Solving the Problems) That is, the present invention brings a probe into contact with an electrode of a semiconductor device formed on a semiconductor wafer placed on a wafer mounting table, and establishes contact with the semiconductor device. The semiconductor wafer is loaded between a probe mechanism that obtains electrical continuity, a wafer cassette provided in the cassette housing section, and the wafer mounting table.
In the probe apparatus, the wafer cassette mounting surface of the cassette accommodating section is provided with a recess so that a plurality of wafer cassettes of different sizes can be positioned and mounted at predetermined positions. In addition, a plurality of sensors for detecting placement of the wafer cassette are provided in the recess, and the size of the placed wafer cassette can be recognized by these sensors.

(Function) With the probe device of the present invention, the size of the object to be measured can be automatically recognized and measured, and the probing process can be automated. In addition, it is possible to position the wafer cassette and recognize the size of the wafer cassette (wafer size) without the need for a drive mechanism such as an air cylinder or motor, which reduces the amount of dust generated and Manufacturing costs can be reduced.

(Example) Hereinafter, an example of the present invention will be described with reference to the drawings. −
The probe device is configured to be able to measure semiconductor wafers of different sizes.

As shown in FIGS. 1 and 2, the cassette mounting surface 1 of the probe device accommodates semiconductor wafers of different sizes, for example, 5-inch wafers 2a, 16-inch wafers 2b, and 8-inch wafers 2C. Cassette, i.e. 5 inch wafer cassette 3816
A convex pattern guide groove 4 is formed on the bottom surface of the cassette so that the inch wafer cassette 3b and the 18 inch wafer cassette 3C can be positioned and placed at predetermined positions.

For example, the kite groove 4 is symmetrical in FIG. 1 with a central groove 5 provided at approximately the center of the cassette mounting surface 1 so as to extend in the lateral direction in FIG. One on each side (total 2)
As shown in FIG.
Inch groove 5a 16 inch groove 5b 18 inch groove 5C
) are respectively formed in a square shape in cross section, and guide the wafer cassettes 3a, 3b, 3c conveyed onto the cassette mounting surface 1 with a certain degree of error (for example, several millimeters) into the guide groove 4. The wafer cassettes 3a, 3b, and 3C are guided by the inner surface, positioned at a predetermined position, and placed thereon.

Note that the guide groove 4 is designed to fit the wafer cassette 3 to be used.
It is necessary to change it appropriately according to the shape of the bottom surface (placing surface) of a, 3b, and 3C.

Further, inside the guide 4, there is a sensor configured to be able to detect the placement of the wafer cassette, such as a mechanical contact type sensor, a piezoelectric element, and an optical switch that are activated when a wafer cassette is placed on top. A plurality of placement detection sensors, for example four, are provided. That is, a central sensor 6 is provided approximately in the center of the central groove 5, a 5-inch sensor 6a is provided at the end of the 5-inch groove 5a, and a 6-inch sensor 6b is provided at the end of the 16-inch groove 5b. .

An 8-inch sensor 6c is provided at each end of the 8-inch groove 5c.

The placement detection signals from each of the sensors 6a, 6b, and 6c are amplified by an amplifier, converted into a digital signal, and inputted into a wafer size recognition unit 7, which is comprised of, for example, a microcomputer, as shown in FIG. It is configured. Then, when the placement detection signal of the central sensor 6 and the placement detection signal of each sensor 6a, 6b16c are input simultaneously, the wafer size recognition unit 7 detects a wafer cassette 3a of that size.
.

It is recognized that cassettes 3b and 3c have been placed correctly on the cassette placement surface 1.

In other words, for example, the central sensor 6 and the 5-inch sensor 6a
If a placement detection signal is input from , it is recognized that the 5-inch wafer cassette 3a has been placed. Furthermore, if a placement detection signal is input from the central sensor 6 and the 6-inch sensor 6b, it is recognized that the 6-inch wafer cassette 3b has been placed. Similarly, if a placement detection signal is input from both the central sensor 6 and the 8-inch sensor 6c, it is recognized that the 8-inch wafer cassette 3c has been placed. By storing the information in the memory in advance in this way, the sensors 6a, 6
The combined signal of either b or 6c is compared with the stored/reproduced signal, and a cassette size matching the output is output.

Note that, for example, if a placement detection signal is manually generated from only one sensor, it is recognized as an error. That is, for example, if the placement detection signal is input only from the central sensor 6, or if the placement detection signal is input only from each of the other sensors 6a, 6b, and 6c, for example, the wafer cassette 3a
, 3b, and 3c are recognized as not being accurately placed in the predetermined positions, such as being placed diagonally.

The recognition result by the wafer size recognition section 7 is input to the main control section 10 that comprehensively controls the operation of each part of the probe device, as shown in FIG.
The same control as when the wafer size is input by the operator is performed, and the semiconductor wafer 2 of each size is automatically
Perform measurements of a, 2b, and 2C.

That is, first, the image sensor 13 selects the semiconductor wafers 2a and 2b according to the recognized wafer size.
, 2c is read and sent to the main control unit 10.

Note that this ID is, for example, the semiconductor wafer 2a12b, 2
It is written with numbers etc. at the end of c, and indicates the type of semiconductor device, lot number, etc. At this time, if the wafer size is not recognized in advance, it will be difficult to read this ID.

The transport mechanism 11 then transfers the wafer 2a from the main control unit 10 to the
2b and 2c are placed on the wafer mounting table 12 (
The wafers 2a, 2b, and 2c are placed on the wafer mounting table 12 by performing a predetermined transport operation.

Thereafter, a measurement program corresponding to this ID is loaded from a tester (not shown), and the wafer mounting table 12 is driven in the x-y-z directions according to this program to place the wafer on the wafer mounting table 12. semiconductor wafers 2a, 2b,
The probe 15 of the probe card 14 is attached to the semiconductor device 2c.
to obtain electrical continuity. Then, the electrical characteristics of the semiconductor device are measured by the tester through the probe 15. In the above embodiment, an example was explained in which the determination is made on the bottom surface of the wafer cassette, but it goes without saying that the determination may be made on the top surface or the side surface. Furthermore, the determination may be made based on capacity.

That is, since the probe device of this embodiment can automatically recognize the sizes of the semiconductor wafers 2a, 2b, and 2c, it is possible to perform measurements fully automatically without inputting the wafer sizes by an operator. , the probe process can be automated. Further, the wafer cassette 3a is controlled by the guide groove 4 and a plurality of (four) sensors 6.6a s 6 b s 6 c provided in the guide groove 4 .

Since the positioning of 3b and 3c and the recognition of their size (wafer size) are performed, a drive mechanism such as an air cylinder or a motor is not required, and the amount of dust generated and manufacturing cost can be reduced.

[Effects of the Invention] As explained above, according to the probe device of the present invention,
The size of the object to be measured can be automatically recognized and measured, the probe process can be automated, and the amount of dust generated and manufacturing costs can be reduced compared to conventional methods. can.

[Brief explanation of drawings]

FIG. 1 is a diagram showing the main part configuration of a probe device according to an embodiment of the present invention, FIG. 2 is a diagram showing a longitudinal section of FIG. 1, and FIG. 3 is an overall diagram of a probe device according to an embodiment of the present invention. FIG. 3 is a diagram showing the configuration. 1...Cassette mounting surface, 2a...5
Inch wafer 2b...6 inch wafer 2
c...8 inch wafer 3a...
5 inch wafer cassette, 3b... 6 inch wafer cassette, 3c... 8 inch wafer cassette, 4...Guide groove, 5...
Center groove, 5a...Groove for 5 inches, 5b...
・Groove for 6 inches, 5c...Groove for 8 inches, 6・
...Central sensor, 6a... Sensor for 5 inches, 6b... Sensor for 6 inches, C... Sensor for 8 inches. Applicant Tokyo Electron Ltd.

Claims (1)

[Claims] (1) A probe mechanism that brings a probe into contact with an electrode of a semiconductor device formed on a semiconductor wafer placed on a wafer mounting table to establish electrical continuity with the semiconductor device; and a probe mechanism provided in the cassette housing section. In a probe device comprising a transfer mechanism for loading and unloading the semiconductor wafer between a wafer cassette and the wafer mounting table, the mounting surface of the wafer cassette of the cassette accommodating section is provided with:
In addition to providing a recess so that a plurality of wafer cassettes of different sizes can be positioned and placed in a predetermined position,
A probe device characterized in that a plurality of sensors for detecting the placement of the wafer cassette are provided in the recess, and the size of the wafer cassette placed therein can be recognized by these sensors.