JP2008108765A - Tool and method for adjusting position, and method of manufacturing electronic equipment - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a position adjustment tool capable of adjusting the position of a carrier machine precisely and quickly. <P>SOLUTION: The position adjustment tool 1 is used when a carrier container storing a substrate is suspended by the carrier machine for moving onto the load port of aimed manufacturing equipment and the position is adjusted so that a connection groove provided at the bottom of the carrier container is connected to a kinematic pin on the load port. The position adjustment tool 1 has: a flange 14 provided corresponding to a top flange on the carrier container and retained by the carrier machine; a body 16 connected to the flange 14; and a base plate 10 that is connected to the body, and has a through hole provided at a position corresponding to the kinematic pin with a surface corresponding to the bottom of the carrier container as a rear. The diameter of the through hole 12 is larger than that of the kinematic pin. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

  The present invention relates to automatic transfer of a transfer container that stores a substrate or the like, and more particularly to a position adjusting jig, a position adjusting method, and an electronic device manufacturing method for adjusting the position of a transfer machine that transfers a transfer container to a manufacturing apparatus.

  A semiconductor substrate used in a manufacturing process of a semiconductor device is housed and transported in an airtight container called a pod with a front door (FOUP). “FOUP” is a 300 mm wafer sealed transfer container that conforms to the standard of the Semiconductor Equipment and Materials Institute (SEMI). The dimensions of FOUP are defined by SEMI standards E1.9, E47.1, E57, E62, and the like. The SEMI standard defines the top flange on the top surface of the FOUP, the position of the secondary kinematic pin of the V-shaped receptacle on the bottom surface of the FOUP, and the conveyor rail on the bottom surface of the FOUP as interfaces with a transporter that automatically transports the FOUP. Further, the position of the primary kinematic pin of the receptacle on the bottom surface of the FOUP is defined as an interface for kinematic coupling with a load port provided in the manufacturing apparatus.

  In order to automatically transport the FOUP with high reliability, it is necessary to store the position of the manufacturing apparatus with respect to the load port on the basis of the top flange and the receptacle of the FOUP. In addition, in the FOUP conveyance in the manufacturing apparatus, it is necessary to store the position relative to the load port of the manufacturing apparatus on the basis of the position of the secondary kinematic pin of the receptacle, the conveyor rail, and the position of the primary kinematic pin of the receptacle. is there.

  Normally, FOUP is used for teaching work for storing the load port position in the transport machine. In teaching work, it is assumed that the FOUP to be transported and the primary kinematic pins of the load port comply with the SEMI standard. However, there are tolerances in the SEMI standard, and there are dimensional errors for each FOUP. In particular, since FOUP is made of resin, its processing accuracy is inferior to that of metal or semiconductor. Therefore, the FOUP used for teaching is not necessarily a FOUP suitable for teaching. Further, since the V-groove provided in the FOUP receptacle is on the lower surface of the FOUP, it is difficult to confirm the position.

Regarding the position adjustment of the FOUP, there is one in which the relative position between the FOUP holding part and the lid opening / closing part of the load port is adjusted using a position adjusting jig (see, for example, Patent Document 1). However, a jig for adjusting the position of the transfer machine with respect to the load port is not disclosed.
JP 2000-269302 A

  An object of the present invention is to provide a position adjusting jig, a position adjusting method, and an electronic device manufacturing method capable of performing position adjustment of a transport machine with high accuracy in a short time.

  According to the first aspect of the present invention, (a) the transfer container for storing the substrate is suspended by the transfer machine and moved onto the load port of the target manufacturing apparatus, and the coupling groove provided at the bottom of the transfer container is A position adjustment jig used when adjusting the position so as to be coupled with a kinematic pin on a load port, and (b) a flange portion provided corresponding to the top flange on the transfer container and held by the transfer machine And (c) a main body connected to the flange, and (d) a surface corresponding to the bottom surface of the transport container as a back surface, and a through hole provided at a position corresponding to the kinematic pin connected to the main body. And (e) a position adjusting jig in which the diameter of the through hole is larger than the diameter of the kinematic pin.

  According to the second aspect of the present invention, (a) a transfer container for storing a substrate is suspended by a transfer machine and moved onto a load port of a target manufacturing apparatus, and a coupling groove provided at the bottom of the transfer container; A position adjustment method for adjusting a position so as to be coupled with a kinematic pin on a load port, (b) a flange portion provided corresponding to a top flange on a transport container and held by a transport machine; and a flange portion And a base plate having a through hole provided at a position corresponding to the kinematic pin and having a surface corresponding to the bottom surface of the transport container as the back surface, connected to the main body portion, and having a through hole diameter. A position adjustment method for adjusting the transfer position of the transfer machine on the load port is provided by a position adjustment jig whose diameter is larger than the diameter of the kinematic pin.

  According to the third aspect of the present invention, (a) a transfer container for storing a substrate is hung and transferred between a plurality of manufacturing apparatuses by a transfer device, and the substrates stored in the transfer container are sequentially correspondingly manufactured. A method of manufacturing an electronic device that is transferred to a device and performs a series of processes by a plurality of manufacturing devices, and (b) a flange portion provided corresponding to the top flange on the transport container and held by the transporter And a base plate connected to the flange, and a base plate having a through hole provided at a position corresponding to the kinematic pin connected to the main body with the surface corresponding to the bottom surface of the transport container as the back surface, The step of adjusting the transfer position of the transfer machine on the load port with the position adjustment jig whose diameter of the through hole is larger than the diameter of the kinematic pin, and (c) After the transfer position is adjusted, the transfer container is specified by the transfer machine A step of transferring from the first manufacturing apparatus that has completed the process to the load port of the second manufacturing apparatus that executes the next scheduled process; and (d) transferring the substrate from the transfer container. A method of manufacturing an electronic device is provided that includes performing a process scheduled by a second manufacturing apparatus.

  According to the present invention, it is possible to provide a position adjustment jig, a position adjustment method, and an electronic device manufacturing method capable of performing position adjustment of a transport machine with high accuracy in a short time.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings. In the following description of the drawings, the same or similar parts are denoted by the same or similar reference numerals. However, it should be noted that the drawings are schematic, and the relationship between the thickness and the planar dimensions, the configuration of the apparatus and the system, and the like are different from the actual ones. Therefore, specific dimensions and configurations should be determined in consideration of the following description. Moreover, it is a matter of course that portions having different dimensional relationships and configurations are included between the drawings.

  As shown in FIGS. 1 and 2, the position adjustment jig 1 according to the embodiment of the present invention includes a flange portion 14, a body portion 16, and a base plate 10. The position adjusting jig 1 hangs the transfer container for storing the substrate by the transfer machine and moves it onto the load port of the target manufacturing apparatus, and the coupling groove provided at the bottom of the transfer container is connected to the kinematic pin on the load port. It is used when adjusting the position so that they are combined.

  The flange portion 14 corresponds to a top flange provided on the transport container. The main body portion 16 is connected to the flange portion 14. The base plate 10 is connected to the main body portion 16. The base plate 10 has three through holes 12 provided at positions corresponding to kinematic pins on the load port with the surface corresponding to the bottom surface of the transport container as the back surface.

  On the base plate 10, each through hole 12 is disposed at the position of the apex of the triangle. The end of the base plate 10 parallel to one side of the triangle formed by the through hole 12 corresponds to the front surface to which the lid of the transport container is attached. The diameter of the through hole 12 is Dh. Further, the height of the main body portion 16 is determined so that the distance between the flange portion 14 and the base plate 10 corresponds to the distance between the back surface of the transport container and the top flange.

  A manufacturing facility for manufacturing a semiconductor device as an electronic device according to the embodiment includes a plurality of manufacturing apparatuses 54a, 54b, and a storage 58 as shown in FIG. Each of the manufacturing apparatuses 54a to 54b has a semiconductor substrate stored in a transfer container 60 that is transferred along a plurality of inter-process transfer paths defined between the manufacturing apparatuses 54a to 54b in accordance with the flow of the manufacturing process of the semiconductor device. To process. The storage 58 can store a plurality of transport containers 60.

  Further, a ceiling suspended transfer (OHT) system is used for transfer between the manufacturing apparatuses 54a to 54b and between the storage 58 and the manufacturing apparatuses 54a to 54b. The OHT system includes a transfer machine 40, a transfer rail 52, and the like configured to be able to automatically transfer a transfer container 60 containing a semiconductor substrate. Each of the manufacturing apparatuses 54a to 54b is provided with load ports 56a,..., 56b for transferring the semiconductor substrate from the transport container 60 that has been transported. The storage 58 is provided with a load port 56 c for storing the transport container 60. The transporter 40 hangs the transport container 60 and moves along the transport rail 52. Further, the transporter 40 transfers the transport container 60 onto the manufacturing apparatuses 54 a to 54 b and the load ports 56 a to 56 c of the storage 58.

  Two load ports 56a to 56c are provided in each of the manufacturing apparatuses 54a to 54b and the storage 58. However, the load port may be one or a plurality of three or more.

  Examples of the manufacturing apparatuses 54a to 54b include dry etching apparatuses such as reactive ion etching (RIE), wet processing apparatuses, CVD apparatuses, sputtering apparatuses, vapor deposition apparatuses, ion implantation apparatuses, heat treatment apparatuses, diffusion processing apparatuses, and photolithography systems. , A plating apparatus, a dicing apparatus, a bonding apparatus, and the like. The manufacturing apparatuses 54a to 54b also include various inspection apparatuses and measuring apparatuses such as an interference film thickness meter, an ellipsometer, a contact film thickness meter, a microscope, and a resistance measuring device.

  For example, FOUP or the like is used for the transport container 60 used in the method for manufacturing a semiconductor device according to the embodiment. FIG. 4A shows a state in which the front opening lid 62 is opened when a FOUP is used as the transport container 60. For example, through a groove (slot) cut inside the container body 61, FIG. The figure shows a state where 24 wafers (semiconductor substrates) 63 of one lot are stored in the container body 61. On the other hand, FIG. 4 (b) corresponds to FIG. 4 (a) and shows a sealed state in which the front opening lid 62 of the transport container 60 is closed. A top flange 64 that is held by the transfer machine 40 is provided on the upper surface of the transfer container 60. Three receptacles 66 having V grooves that are coupled to the kinematic pins of the load ports 56a to 56c are provided on the bottom surface of the transport container 60. As shown in FIG. 5, the receptacle 66 has a V-shaped coupling groove 67 having a width Wg. The coupling groove 67 may be U-shaped.

  FIG. 6 is a diagram in which a specific set of the manufacturing apparatuses 54a to 54b and the load ports 56a to 56b illustrated in FIG. 3 is selected as a representative, and is comprehensively illustrated as the manufacturing apparatus 54 and the load port 56. . Three kinematic pins 30 for positioning and holding the transfer container 60 on the load port 56 are provided on the upper surface of the load port 56. The diameter Dp of the kinematic pin 30 is smaller than the width Wg of the coupling groove 67 of the transport container 60.

  For example, a transport container that houses a semiconductor substrate in a target manufacturing apparatus (k-th manufacturing apparatus: k is a positive integer equal to or greater than 2) 54 is replaced with another manufacturing apparatus ((k−1) -th) that has completed the process. When transporting from the manufacturing apparatus), as shown in FIG. 7, the transporter 40 suspends the transport container 60 by holding the top flange 64 by the chuck portion 42 based on the control of the control unit 46 and transports the transport rail. The vehicle travels under the conveyance rail 52 under the line 52. The control unit 46 detects a signal from a position sensor (not shown) installed on the transport rail 52 and moves the transport container 60 above the manufacturing apparatus 54 for the purpose of transferring the transport container 60 to the load port 56. Stop at a fixed position.

  As shown in FIG. 8, the transport machine 40 lowers the transport container 60 to the load port 56 using a hoist mechanism 44 such as a wire or a belt at a fixed position based on the control of the control unit 46. As shown in FIG. 9, the transfer container 60 is transferred onto the load port 56 by a three-point kinematic coupling of three receptacles 66 and three kinematic pins 30. Thereafter, the hoist mechanism 44 is wound up, and the chuck portion 42 is accommodated in the main body of the transport device 40.

  Thereafter, the lid 62 of the transport container 60 shown in FIG. The substrate is transferred from the transfer container 60 to the manufacturing apparatus 54 via a transfer chamber (not shown) that is locally cleaned by the clean area. In the manufacturing apparatus 54, a predetermined process is performed on the substrate. The substrate for which the process has been completed is transferred to the load port 56 through the transfer chamber. The substrate is stored in the transfer container 60 by the load port 56. Further, the lid 62 of the transport container 60 is closed. Thereafter, the chuck portion 42 lowered by the hoist mechanism 44 holds the top flange 64. The hoist mechanism 44 is wound up and the transport container 60 held by the chuck portion 42 is collected in the main body of the transport machine 40. According to the transport rail 52, the transporter 40 transports the transport container 60 to the manufacturing device ((k + 1) th manufacturing device) for the next step.

  When the manufacturing apparatus for the next process cannot be used during processing of another lot or during maintenance, the transport container 60 stands by on the transport rail 52 immediately before the manufacturing apparatus for the next process. Alternatively, if it is determined that the manufacturing apparatus for the next process is unusable for a long time, the transport container 60 is transported to the load port 56c and stored in the storage 58 via the load port 56c.

  As shown in FIG. 10, the three receptacles 66 of the transport container 60 are held in contact with the three kinematic pins 30 of the load port 56 by a three-point kinematic coupling based on the SEMI standard. As shown in FIGS. 5 to 7, the width Wg of the coupling groove 67 of the receptacle 66 is larger than the diameter Dp of the kinematic pin 30 in consideration of the SEMI standard tolerance. However, there is a variation in dimensions due to manufacturing errors of the transport containers between the transport containers. Therefore, when the position of the transport device 40, particularly the chuck portion 42, with respect to the load port 56 is adjusted using the transport container 60 as a product, the reliability of transfer of the transport container 60 to the load port 56 deteriorates. Further, since the receptacle 66 is installed on the bottom surface of the transport container 60, it is difficult to adjust the position by visual observation.

  In the embodiment, the position adjustment of the transport machine 40 is performed using the position adjustment jig 1 shown in FIGS. 1 and 2. The relative positional relationship between the flange portion 14 of the position adjustment jig 1 and the through-hole 12 is the SEMI standard position defined by the top flange 64 of the FOUP as the transport container 60 and the primary kinematic pin position of the receptacle 66. According to the relationship. The position adjusting jig 1 is suspended from the conveyor 40 by the flange portion 14. The diameter Dh of the through hole 12 is larger than the diameter Dp of the kinematic pin 30 and is, for example, approximately the same as the width Wg of the coupling groove 67. The position of the conveyor 40 is adjusted so that the kinematic pin 30 passes through the through hole 12 without touching the base plate 10 by visual observation of the operator. Here, the “primary kinematic pin position” is a coupling position with the kinematic pin 30 in the coupling groove 67 of the receptacle 66.

  The position adjusting jig 1 can be processed with higher accuracy than a resin FOUP. Therefore, when the position adjustment of the transfer device 40 is performed using the position adjustment jig 1 according to the embodiment, the reliability of transfer of the transfer container 60 to the load port 56 is improved. Further, the position of the kinematic pin 30 of the load port 56 can be easily visually confirmed by the through hole 12 corresponding to the position of the primary kinematic pin of the coupling groove 67. As a result, the position adjustment time can be shortened. As described above, according to the position adjustment jig 1 according to the embodiment, it is possible to improve the reliability of the position adjustment.

  Next, an adjustment method according to the embodiment and a method for manufacturing a semiconductor device will be described with reference to the configuration diagrams shown in FIGS. 11 to 14 and the flowchart shown in FIG.

  (A) In step S <b> 100, the conveyor 40 holds the flange portion 14 of the position adjustment jig 1 with the chuck portion 42 and suspends the position adjustment jig 1. Under the control of the control unit 46, the transporter 40 travels under the transport rail 52 according to the transport rail 52 toward the manufacturing apparatus 54 that is a position adjustment target.

  (B) In step S101, as shown in FIG. 11, the control unit 46 detects a signal from a position sensor (not shown) installed on the transport rail 52, and moves the transport machine 40 to a fixed position above the manufacturing apparatus 54. Stop.

  (C) In step S <b> 102, the control unit 46 lowers the position adjusting jig 1 from the transport device 40 to the position just above the load port 56 using the hoist mechanism 44. An operator visually confirms the position of the kinematic pin 30 from the through hole 12. If the positions of the through hole 12 and the kinematic pin 30 are deviated, an amount of deviation is input to the control unit 46 from an input device (not shown) connected to the control unit 46. For example, the positional deviation in the direction along the conveyance rail 52 is adjusted by moving the conveyance device 40 or the hoist mechanism 44. The hoist mechanism 44 adjusts the displacement with respect to the direction orthogonal to the transport rail 52 and the rotational displacement.

  (D) In step S103, as shown in FIGS. 13 and 14, the position of the transporter 40 or the hoist mechanism 44 is adjusted so that the kinematic pin 30 passes through the through hole 12 without touching the base plate 10. The control unit 46 stores the adjustment position. The position adjusting jig 1 is removed from the transport machine 40.

  (E) In step S104, the transfer machine 40 holds the transfer container 60 to be transferred. In step S <b> 105, the transporter 40 travels on the transport rail 52 and moves to the home position of the manufacturing apparatus 54. In step S <b> 106, the transport machine 40 moves to the adjustment position stored in the control unit 46.

  (F) In step S <b> 107, the transport machine 40 transfers the transport container 60 to the load port 56 using the hoist mechanism 44 at the adjustment position based on the control of the control unit 46. In step S108, the lid 62 of the transport container 60 shown in FIG. The substrate is transferred from the transfer container 60 to the manufacturing apparatus 54 via a transfer chamber (not shown) that is locally cleaned by the clean area. In step S109, the manufacturing apparatus 54 performs a predetermined process on the substrate.

  (G) In step S110, the substrate for which the process has been completed is transferred to the load port 56 through the transfer chamber. The substrate is stored in the transfer container 60 by the load port 56. Further, the lid 62 of the transport container 60 is closed. In step S <b> 111, the chuck portion 42 lowered by the hoist mechanism 44 holds the top flange 64. The hoist mechanism 44 is wound up and the transport container 60 held by the chuck portion 42 is collected in the main body of the transport machine 40. In step S <b> 112, the transporter 40 transports the transport container 60 through the transport rail 52 to the manufacturing apparatus for the next process.

  In this way, the transport machine 40 whose position is adjusted using the position adjusting jig 1 according to the embodiment transports the transport container 60 and manufacture of the semiconductor device is performed. Using the position adjusting jig 1 processed with high accuracy, the position adjustment of the transport machine 40 is performed. The position of the kinematic pin 30 on the load port 56 can be easily seen from the through hole 12. Therefore, the adjustment time can be shortened. Thus, according to the embodiment, the adjustment cost can be reduced, and the reliability of the position adjustment can be improved.

(First modification)
As shown in FIGS. 16 and 17, the position adjustment jig 1 a according to the first modification of the embodiment of the present invention includes a center of gravity adjustment unit 18 in the base plate 10. The center-of-gravity adjustment unit 18 is fitted into a groove 19 provided in the base plate 10. The center-of-gravity adjustment unit 18 is movable along the groove 19 in a direction from the front side corresponding to the front opening lid 62 side of the transport container 60 shown in FIG. 4 toward the center of the base plate 10.

  The first modification of the embodiment is different from the embodiment in that the center of gravity adjustment unit 18 is provided. Other configurations are the same as those in the embodiment, and thus redundant description is omitted.

  When the lid 62 is attached to the front surface of the transport container 60, the center of gravity of the transport container 60 such as FOUP is biased toward the front surface side. Therefore, when suspended from the transport device 40, the front side of the transport container 60 is inclined downward. The adjustment position is displaced due to the inclination of the transport container 60. In the position adjustment jig 1 a, the center of gravity adjustment unit 18 can be moved along the groove 19 to match the deviation of the center of gravity of the transport container 60. As a result, the position adjusting jig 1 a can be held by the transport machine 40 with the same inclination as the transport container 60. Thus, position adjustment with higher reliability is possible using the position adjustment jig 1a according to the first modification of the embodiment.

(Second modification)
As shown in FIGS. 18 and 19, the position adjustment jig 1 b according to the second modification of the embodiment of the present invention includes an annular position determination unit 20 that fits into the through hole 12. The diameter Wh of the opening 21 of the position determination unit 20 is larger than the diameter Dp of the kinematic pin 30. The position determination unit 20 has a larger diameter than the through hole 12 on the surface side of the base plate 10. The position determination unit 20 is movable above the base plate 10.

  The position adjustment jig 1b according to the second modification of the embodiment differs from the embodiment in that it includes a position determination unit 20. Other configurations are the same as those in the embodiment, and thus redundant description is omitted.

  In the second modification of the embodiment, the diameter Wh of the opening 21 of the position determination unit 20 is larger than the diameter Dp of the kinematic pin 30 and is, for example, approximately the same as the width Wg of the coupling groove 67. The position of the conveyor 40 is adjusted so that the kinematic pin 30 of the load port 56 passes through the opening 21 without touching the position determination unit 20 by visual observation of the operator from the opening 21.

  For example, as illustrated in FIG. 20, it is assumed that the position of the transport device 40 is shifted so that the position determination unit 20 overlaps the kinematic pin 30 of the load port 56. In such a case, as shown in FIG. 21, when the position adjusting jig 1 b is lowered toward the load port 56, the position determination unit 20 comes into contact with the kinematic pin 30 and the position determination unit 20 is located above the base plate 10. Float up. Therefore, it is possible to easily check the positional deviation of the transporter 40. As shown in FIG. 22, the position of the transporter 40 is adjusted so that the kinematic pin 30 passes through the opening 21.

  According to the second modification of the embodiment, the position of the kinematic pin 30 on the load port 56 can be easily visually observed from the opening 21. Further, the position determination unit 20 can easily confirm the positional deviation of the transport device 40 with respect to the kinematic pin 30. As described above, it is possible to perform position adjustment with higher reliability in a short time by using the position adjustment jig 1b according to the second modification of the embodiment.

(Third Modification)
The position adjustment jig 1c according to the third modification of the embodiment of the present invention includes a position determination unit 20a as shown in FIGS. The position determination unit 20a includes two sets of gauges 26 and an I-shaped reference rod 22 that face each other in directions orthogonal to each other. The reference rod 22 is supported by a support portion 24 connected to the base plate 10. An erosion needle 28 of a gauge 26 is in contact with the lower end portion of the reference rod 22. The lower end of the reference rod 22 has substantially the same diameter as the kinematic pin 30.

  The position adjustment jig 1c according to the third modification of the embodiment differs from the embodiment in that it includes a position determination unit 20a. Other configurations are the same as those in the embodiment, and thus redundant description is omitted.

  In the third modification of the embodiment, the position of the transporter 40 is adjusted so that the reference rod 22 overlaps the kinematic pin 30. In order to adjust the position, the position of the kinematic pin 30 is measured in the through hole 12 by the gauge 26 of the position determination unit 20a.

  For example, as shown in FIG. 25, it is assumed that the reference rod 22 is displaced with respect to the kinematic pin 30. In such a case, as shown in FIG. 26, when the position adjusting jig 1c is lowered toward the load port 56, the reference rod 22 of the position determination unit 20a comes into contact with the kinematic pin 30, and the reference rod 22 is moved to the base plate. Move up 10. As a result, the erosive needle 28 comes into contact with the kinematic pin 30. By measuring the displacement amount from the gauge 26, the displacement amount of the kinematic pin 30 from the position of the reference rod 22 is obtained. As shown in FIG. 27, the reference rod 22 can be aligned with the kinematic pin 30 by adjusting the transporter 40 based on the obtained positional deviation amount.

  According to the third modification of the embodiment, the position of the kinematic pin 30 on the load port 56 can be easily visually observed from the through hole 12. Furthermore, the relative position of the kinematic pin 30 on the load port 56 with respect to the reference rod 22 of the position determination unit 20a can be easily measured by the gauge 26. As described above, it is possible to perform position adjustment with higher reliability in a short time using the position adjustment jig 1c according to the third modification of the embodiment.

(Other embodiments)
Although the embodiments of the present invention have been described as described above, it should not be understood that the descriptions and drawings constituting a part of this disclosure limit the present invention. From this disclosure, various alternative embodiments, examples and operational techniques will be apparent to those skilled in the art.

  In the embodiment of the present invention, a method for manufacturing a semiconductor device has been described. However, the present invention is not limited to a semiconductor device, but a liquid crystal device, a magnetic recording medium, an optical recording medium, a thin film magnetic head, a superconducting element, an acoustoelectric conversion element, It can be easily understood from the above description that the present invention can also be applied to a method for manufacturing an electronic device.

  As described above, the present invention naturally includes various embodiments that are not described herein. Accordingly, the technical scope of the present invention is defined only by the invention specifying matters according to the scope of claims reasonable from the above description.

It is a top view of the position adjustment jig which concerns on embodiment of this invention. It is a side view of the position adjustment jig which concerns on embodiment of this invention. It is a figure which shows typically an example of the manufacturing equipment used for description of embodiment of this invention. It is the bird's-eye view which shows the state in which the lid | cover of the front opening of the conveyance container which concerns on embodiment of this invention was opened, and (b) the bird's-eye view which shows the state in which the lid | cover of front opening was closed. It is a bottom view of the conveyance container which concerns on embodiment of this invention. It is a figure which shows an example of the load port of the manufacturing apparatus used for description of embodiment of this invention. It is a figure (the 1) which shows an example of conveyance of the conveyance container used for description of embodiment of this invention. It is FIG. (2) which shows an example of conveyance of the conveyance container used for description of embodiment of this invention. It is FIG. (3) which shows an example of conveyance of the conveyance container used for description of embodiment of this invention. It is FIG. (The 4) which shows an example of conveyance of the conveyance container used for description of embodiment of this invention. It is FIG. (1) which shows an example of the position adjustment of the conveying machine by the position adjustment jig which concerns on embodiment of this invention. It is FIG. (2) which shows an example of the position adjustment of the conveying machine by the position adjustment jig which concerns on embodiment of this invention. It is FIG. (3) which shows an example of the position adjustment of the conveying machine by the position adjustment jig which concerns on embodiment of this invention. It is FIG. (4) which shows an example of the position adjustment of the conveying machine by the position adjustment jig which concerns on embodiment of this invention. It is a flowchart explaining an example of the manufacturing method of the position adjustment method and electronic device which concern on embodiment of this invention. It is a top view of the position adjustment jig which concerns on the 1st modification of embodiment of this invention. It is a figure which shows the AA cross section of the position adjustment jig | tool 1 shown in FIG. It is a top view of the position adjustment jig which concerns on the 2nd modification of embodiment of this invention. It is a figure which shows the BB cross section of the position adjustment jig | tool shown in FIG. It is a figure which shows an example of the position adjustment method which concerns on the 2nd modification of embodiment of this invention. It is a figure which shows CC cross section before the position adjustment of the position determination part shown in FIG. It is a figure which shows CC cross section after the position adjustment of the position determination part shown in FIG. It is a top view of the position adjustment jig which concerns on the 3rd modification of embodiment of this invention. It is a figure which shows DD cross section of the position adjustment jig | tool shown in FIG. It is a figure which shows an example of the position adjustment method which concerns on the 3rd modification of embodiment of this invention. It is a figure which shows the EE cross section before position adjustment of the position determination part shown in FIG. It is a figure which shows the EE cross section after the position adjustment of the position determination part shown in FIG.

Explanation of symbols

DESCRIPTION OF SYMBOLS 10 ... Base plate 12 ... Through-hole 14 ... Flange part 16 ... Main-body part 18 ... Gravity center adjustment part 20, 20a ... Position determination part 30 ... Kinematic pin 40 ... Conveyor machine 52 ... Conveyance rail 54 ... Manufacturing apparatus 56 ... Load port

Claims (6)

The transfer container for storing the substrate is suspended by the transfer machine and moved onto the load port of the target manufacturing apparatus, and the coupling groove provided at the bottom of the transfer container is connected to the kinematic pin on the load port. A position adjustment jig used for adjustment,
Provided corresponding to the top flange on the transport container, a flange portion held by the transport machine,
A main body connected to the flange,
A base plate having a through hole provided at a position corresponding to the kinematic pin, connected to the main body portion, with a surface corresponding to the bottom surface of the transport container as a back surface,
The position adjusting jig, wherein a diameter of the through hole is larger than a diameter of the kinematic pin.   The position adjusting jig according to claim 1, further comprising: a center of gravity adjusting portion provided on the base tablet for adjusting the position of the center of gravity so as to coincide with the center of gravity of the transport container.   3. The base plate includes an annular position determination unit that has an inner diameter larger than the diameter of the kinematic pin and fits into the through hole so as to be movable above the surface of the base plate. The position adjustment jig described.   The position determination unit including two sets of gauges facing each other in a direction orthogonal to each other capable of measuring the position of the kinematic pin in the through hole is provided in the base plate. Position adjustment jig. The transfer container for storing the substrate is suspended by the transfer machine, moved onto the load port of the target manufacturing apparatus, and positioned so as to be connected to the coupling groove provided at the bottom of the transfer container and the kinematic pin on the load port. A position adjustment method to adjust,
Provided corresponding to the top flange on the transport container, a flange portion held by the transport machine, a main body connected to the flange portion, and a surface corresponding to the bottom surface of the transport container as the back surface, And a base plate having a through hole provided at a position corresponding to the kinematic pin and connected to the main body, and the load is adjusted by a position adjusting jig having a diameter of the through hole larger than the diameter of the kinematic pin. A position adjustment method comprising adjusting a transfer position of the transfer machine on a port. A transfer container for storing a substrate is suspended and transferred between a plurality of manufacturing apparatuses by a transfer device, and the substrates stored in the transfer container are sequentially transferred to a corresponding manufacturing apparatus, and a series of the plurality of manufacturing apparatuses. An electronic device manufacturing method for performing
Provided corresponding to the top flange on the transport container, a flange portion held by the transport machine, a main body connected to the flange portion, and a surface corresponding to the bottom surface of the transport container as the back surface, And a base plate having a through hole provided at a position corresponding to the kinematic pin and connected to the main body, and the load is adjusted by a position adjusting jig having a diameter of the through hole larger than the diameter of the kinematic pin. Adjusting the transport position of the transport machine on the port;
After the transport position is adjusted, the transport container is placed on the load port of the second manufacturing apparatus that executes the next scheduled process from the first manufacturing apparatus that has finished processing the specific process by the transport machine. A transfer step;
And transferring the substrate from the transfer container and performing the scheduled process by the second manufacturing apparatus.

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