TWI766545B - Loading device for semiconductor carrier - Google Patents

Abstract

The subject disclosure relates to a loading device for a semiconductor carrier. The loading device comprises a platform for loading the semiconductor carrier and at least one moveable positioning pin which could match the semiconductor carrier. The moveable pin is configured to be protruded from one of at least two positions on the platform.

Description

Loading equipment for semiconductor carriers

The present disclosure relates to a loading device for semiconductor carriers, especially a loading device that can load semiconductor carriers of different sizes and can quickly read radio frequency tags thereon.

In the semiconductor manufacturing process, each wafer lot is marked with a wafer lot number, and each processing machine selects the corresponding process recipe according to the wafer lot number to process the wafers . Generally speaking, each carrier for loading wafers is usually attached with a smart tag, and the data stored in the smart tag includes: carrier data (such as carrier identification information and carrier cleaning time, etc.) ), the wafer data contained in the carrier (such as wafer lot number), and the processing data of the contained wafer (such as process program data). In recent years, the smart tags used on the wafer carrier mostly use RFID tags, and RFID devices or systems are used to identify the smart tags on the wafer carrier.

Of course, there is currently no special fixture or loading equipment that can be used to carry wafer carriers of different sizes, and can quickly read and write smart tags on wafer carriers. When it is necessary to read and write smart tags on wafer carriers of different sizes, different fixtures or loading equipment need to be provided to carry the wafer carriers of different sizes before reading and writing smart tags on them; or, It is necessary to manually adjust the position of the read/write head on the fixture or loading equipment to match the wafer carriers of different sizes, or remove the smart label on the wafer carrier before reading and writing. No matter which method is adopted, it is time-consuming, labor-intensive, and cost-increasing.

In some embodiments, the present disclosure provides a loading device for a carrier, comprising: a platform for supporting the semiconductor carrier and a first positioning post disposed on the platform and fixed on the platform and a second positioning column that can move relative to the platform. The platform has a first position and a second position, and the second positioning post protrudes from the platform only at the first position or the second position. The first positioning post and the second positioning post are configured to cooperate with a positioning structure of the semiconductor carrier.

In some embodiments, the present disclosure provides a loading apparatus for a carrier, which includes: a platform for supporting the semiconductor carrier, a positioning structure disposed on the platform and capable of being connected with the semiconductor carrier A first hole and a positioning post in the first hole are combined. A gap is included between a side wall of the positioning post and an inner wall of the first hole. .

The foregoing has outlined rather broadly the technical features of the present disclosure in order to provide a better understanding of the detailed description of the present disclosure that follows. Other technical features constituting the subject matter of the scope of the present disclosure will be described below. It should be understood by those skilled in the art to which the present disclosure pertains that the concepts and specific embodiments disclosed below can be readily utilized as modifications or designs of other structures or processes to achieve the same purposes of the present disclosure. Those skilled in the art to which the present disclosure pertains should also understand that such equivalent constructions cannot depart from the spirit and scope of the present disclosure as defined by the appended claims.

The following disclosure provides many different embodiments or examples for implementing different features of the provided subject matter. Specific examples of components and configurations are described below to simplify the present disclosure. Of course, these are only examples and are not intended to be limiting. For example, in the following description, "forming a first member over a second member or on a second member" may include embodiments in which the first member and the second member are formed in direct contact, and may also Embodiments are included in which additional members may be formed between the first member and the second member such that the first member and the second member may not be in direct contact. Additionally, the present disclosure may repeat reference numerals and/or letters in various instances. This repetition is intended for simplicity and clarity and does not in itself indicate a relationship between the various embodiments and/or configurations discussed.

Furthermore, for convenience of description, spatially relative terms (such as "below," "below," "under," "over," "on," "above," and the like may be used herein to describe an element or component relationship to another element(s) or components as depicted in the figures. In addition to the orientation depicted in the figures, spatially relative terms are also intended to encompass different orientations of the device in use or operation. The device may be otherwise oriented (rotated 90 degrees or at other orientations), and the spatially relative descriptors used herein may also be interpreted accordingly.

As used herein, terms such as "first", "second", and "third" describe various elements, components, regions, layers and/or sections, such elements, components, regions, layers and/or Sections should not be limited by these terms. These terms may only be used to distinguish an element, component, region, layer or section from one another. Terms such as "first," "second," and "third," when used herein do not imply a sequence or order unless the context clearly dictates otherwise.

As used herein, the terms "substantially," "substantially," "substantially," and "about" are used to describe and explain small variations. When used in conjunction with an event or circumstance, terms can refer to both the exact instance in which the event or circumstance occurs and the instance in which the event or circumstance occurs very closely. For example, when used in conjunction with a numerical value, the term can refer to a range of variation less than or equal to ±10% of the numerical value, such as less than or equal to ±5%, less than or equal to ±4%, less than or equal to ±3%, less than or equal to ±3% Equal to ±2%, less than or equal to ±1%, less than or equal to ±0.5%, less than or equal to ±0.1%, or less than or equal to ±0.05%. For example, if a difference between two values is less than or equal to ±10% of the mean of one of the values (such as less than or equal to ±5%, less than or equal to ±4%, less than or equal to ±3%, less than or equal to ±2%, less than or equal to ±1%, less than or equal to ±0.5%, less than or equal to ±0.1%, or less than or equal to ±0.05%), then such values may be considered to be "substantially" the same or equal . For example, "substantially" parallel may refer to an angular variation of less than or equal to ±10° relative to 0°, such as less than or equal to ±5°, less than or equal to ±4°, less than or equal to ±3°, less than or equal to ±3° ±2°, less than or equal to ±1°, less than or equal to ±0.5°, less than or equal to ±0.1°, or less than or equal to ±0.05°. For example, "substantially" vertical may refer to an angular variation of less than or equal to ±10° relative to 90°, such as less than or equal to ±5°, less than or equal to ±4°, less than or equal to ±3°, less than or equal to ±3° ±2°, less than or equal to ±1°, less than or equal to ±0.5°, less than or equal to ±0.1°, or less than or equal to ±0.05°.

In the semiconductor process, it is necessary to use semiconductor carriers of different sizes to load substrates or wafers of different sizes. For example, for 150mm, 300mm and 450mm wafers of three different sizes, three different sizes of semiconductor carriers are required to load. Of. In addition, each semiconductor carrier has a radio frequency identification (RFID) tag (RFID Tag; hereinafter referred to as RFID tag), the user can use the loading device to carry and transport the semiconductor carrier, and read and write semiconductors. RFID tags for vehicles.

However, as mentioned above, in the semiconductor process, it is often necessary to use semiconductor carriers of different sizes to load substrates, wafers or other semiconductor devices of different sizes. To read and write the RFID tag of the semiconductor carrier, you need to use a number of different loading equipment to match the semiconductor carriers of different sizes; or, adjust the position of the RFID tag read-write head on the loading equipment, or disassemble the semiconductor carrier. It can read and write RFID tags on semiconductor carriers of different sizes.

FIG. 1A is a schematic perspective view of a semiconductor carrier according to an embodiment of the present disclosure. The semiconductor carrier W1 shown in FIG. 1A may be used to carry substrates, wafers or other semiconductor devices. In some embodiments of the present disclosure, the semiconductor carrier W1 may include a Front Opening Unified Pod (FOUP). ) or the Front Opening Shipping Box (FOSB). Semiconductor carrier W1 has a body W11 configured to receive wafers, substrates or other semiconductor devices therein. In addition, the semiconductor carrier W1 has a base W12. In some embodiments of the present disclosure, the base W12 has a positioning structure and an RFID tag W125. In some embodiments of the present disclosure, the positioning structure includes three positioning holes W121 , W122 and W123 . The positioning holes W121, W122, W123 of the W12 of the base of the semiconductor carrier W1 are configured to be matched with the positioning columns of the loading equipment (described in detail below), and the positioning holes W121, W122, W123 are roughly elliptical, and The three positioning holes W121 , W122 and W123 are arranged in a triangular shape with each other, the positioning holes W122 and W123 are arranged symmetrically with each other, and the positioning hole W121 is arranged adjacent to the RFID tag W125 .

FIG. 1B is a three-dimensional schematic diagram of the loading apparatus according to the disclosed embodiment. As shown in FIG. 1B , the loading apparatus 1 has a platform 10 configured to carry semiconductor carriers, an RFID tag reading and writing interface 13 and casters 15 . The platform 10 of the loading device 1 further has three positioning columns 101, 102, 103 and an RFID read/write head 105. The three positioning columns 101, 102, 103 are fixedly arranged on the platform 10 and are configured to They can be combined with the positioning holes W121 , W122 and W123 of the base W12 of the semiconductor carrier W1 , respectively. In some embodiments of the present disclosure, the three positioning posts 101 , 102 and 103 are generally arranged in an equilateral triangle shape, the positioning posts 102 and 103 are symmetrically arranged with each other, and the positioning hole 101 is disposed adjacent to the RFID tag for reading and writing Head 105. In some embodiments of the present disclosure, the positioning posts 101 , 102 and 103 have substantially cylindrical top surfaces with circular arcs. In addition, since the loading facility 1 is provided with the casters 15, the semiconductor carrier W1 can be transported to another location. In some embodiments of the present disclosure, the conductivity of the positioning posts 101 , 102 and 103 is above 1.33 S/m. In some embodiments of the present disclosure, the positioning posts 101 , 102 and 103 include stainless steel material or are made of stainless steel material.

2A and 2B are schematic diagrams of operations of the loading apparatus according to the disclosed embodiment. As shown in FIG. 2A , the semiconductor carrier W1 is to be placed down on the platform 10 of the loading apparatus 1 ; the base W12 of the semiconductor carrier W1 is substantially facing the platform 10 of the loading apparatus 1 , and the base W12 of the semiconductor carrier W1 is The positioning holes W121, W122, and W123 are roughly aligned with the positioning posts 101, 102, and 103 on the platform 10 of the loading device 1, respectively. The positioning hole W121 of the semiconductor carrier is roughly aligned with the positioning posts 101 of the loading device. The positioning hole W122 is roughly aligned with the positioning column 102 of the loading device, and the positioning hole W123 of the semiconductor carrier is roughly aligned with the positioning column 103 of the loading device.

Furthermore, as shown in FIG. 2B , the semiconductor carrier W1 is placed on the platform 10 of the loading device 1 , and the positioning holes W121 , W122 , W123 of the base W12 of the semiconductor carrier W1 are respectively aligned with the platform 10 of the loading device 1 . The positioning posts 101, 102, 103 are combined with each other. In some embodiments of the present disclosure, the positioning holes W121 , W122 , and W123 of the base W12 of the semiconductor carrier W1 are substantially elliptical, and the positioning posts 101 , 102 , and 103 on the platform 10 of the loading device 1 have circular shapes. The arc-shaped top surface, so the positioning holes W121, W122, W123 can be easily combined with the positioning columns 101, 102, 103, and in the process of mutual combination, the positioning holes W121, W122, W123 and the positioning columns 101, 102, 103 friction between each other. In addition, when the semiconductor carrier W1 is carried on the platform 10 of the loading device 1, the RFID tag W125 of the semiconductor carrier W1 will be approximately located within the readable and writable range of the RFID tag read/write head 105 of the loading device 1, and the user can further The RFID tag W125 of the semiconductor carrier W1 is read and written by using the RFID tag read/write head 105 by manipulating the read/write interface 15 . In some embodiments of the present disclosure, the RFID tag W125 of the semiconductor carrier W1 is disposed adjacent to the positioning hole W121 of the semiconductor carrier W1, and the RFID tag read/write head 105 of the loading device 1 is disposed adjacent to the semiconductor carrier W1. The positioning column 101 with the positioning holes W121 of W1 combined with each other can ensure that when the semiconductor carrier W1 is carried on the loading device 1, the RFID tag W125 of the semiconductor carrier W1 can be located on the RFID tag read-write head 105 of the loading device 1. within the readable and writable range.

FIG. 3A is a schematic perspective view of a loading apparatus 2 according to an embodiment of the present disclosure, especially a loading apparatus 2 that can be used to carry semiconductor carriers of two different sizes. As shown in FIG. 3A , the loading apparatus 2 has a platform 20 configured to carry semiconductor carriers, an RFID tag reading and writing interface 23 and casters 25 . The platform 20 of the loading device 2 further has four through holes 212 , 213 , 214 and 215 respectively arranged at different positions, and four positioning posts 202 , 203 , 204 and 205 are respectively movably accommodated in the through holes 212 , 214 , and 200 . 213, 214, 215; furthermore, the platform 20 for loading equipment further has a fixed positioning column 201 and an RFID tag read-write head 207; in some embodiments of the present disclosure, the positioning column 201 and the through holes 212 and 213 They are arranged in an equilateral triangle shape, and the positioning posts 201 and the through holes 214 and 215 are arranged in an equilateral triangle shape. Moreover, in some embodiments of the present disclosure, the positioning posts 201 are arranged in an equilateral triangle shape. Adjacent to the RFID tag read/write head 207 . In some embodiments of the present disclosure, the positioning posts 201 , 202 , 203 , 204 , and 205 have substantially cylindrical top surfaces with circular arcs. In addition, since the loading apparatus 2 is provided with the casters 25, the loading apparatus 2 can be used for carrying semiconductor carriers. In some embodiments of the present disclosure, the electrical conductivity of the positioning posts 201 , 202 , 203 , 204 and 205 is above 1.33 S/m. In some embodiments of the present disclosure, the positioning posts 201 , 202 , 203 , 204 , and 205 include or are made of stainless steel.

The positioning posts 202, 203, 204, 205 accommodated in the through holes 212, 213, 214, 215 can move up and down relative to the through holes 212, 213, 214, 215, that is, the positioning posts 202, 203, 204, 205 can be selectively Move upward from the opposite through holes 212, 213, 214, 215 to protrude from the platform 20 of the loading device 2, or optionally move downward from the opposite through holes 212, 213, 214, 215 to sink into the through holes holes 212, 213, 214, 215. In some embodiments of the present disclosure, the positioning column 202 is linked with the positioning column 204 , and the positioning column 203 is linked with the positioning column 205 . When the platform 20 protrudes, the positioning posts 204 and 205 move downward relative to the through holes 214 and 215 to be submerged in the through holes 214 and 215 , or when the positioning posts 204 and 205 move upward relative to the through holes 214 and 215 to be self-loading When the platform 20 of the device 2 protrudes, the positioning posts 202 and 203 move downward relative to the through holes 212 and 213 and sink into the through holes 212 and 213 .

FIG. 3B is an enlarged schematic cross-sectional view of part A of FIG. 3A , especially for revealing an embodiment of a linkage mechanism configured to drive the positioning post 202 and the positioning post 204 to move. As shown in FIG. 3B , the platform 20 of the loading device 2 has through holes 212 and 214 , and the movable positioning posts 202 and 204 are respectively accommodated in the through holes 212 and 214 ; in some embodiments of the present disclosure, the through holes The diameters of the holes 212 and 214 are only slightly larger than the cross-sectional diameters of the positioning columns 202 and 204 . In other words, the through holes 212 and 214 and the positioning columns 202 and 204 are combined with each other by means of clearance. In some embodiments of the present disclosure, the sidewalls of the positioning pillars 202 are at least partially in contact with the inner walls of the through holes 212 , and the sidewalls of the positioning pillars 204 are at least partially in contact with the inner walls of the through holes 214 .

The loading device 2 further has a linkage mechanism 28, which is arranged on the lower side of the platform 20 and connected with the positioning columns 202 and 204. The linkage mechanism 28 is configured so that when the positioning column 202 is under the action of an external force, the positioning column 202 is sunk into the through hole 212. The positioning column 204 is forced to move upward to protrude from the platform 20 when the positioning column 204 is forced to move upward to protrude from the platform 20 when the positioning column 204 is submerged into the through hole 214 due to external force. In some embodiments of the present disclosure, the linkage mechanism 28 has a rod member 281 and a fulcrum 282. Two ends 2812 and 2814 of the rod member 281 abut against the bottoms of the positioning posts 202 and 204, respectively, and the fulcrum 282 is disposed on the rod. The two ends 2812 and 2814 of the piece 281 are fixedly connected to the platform 20 . As shown in FIG. 3B , the rod 281 and the fulcrum 282 of the linkage mechanism 28 form a structure like a seesaw plate. If the positioning post 202 is pushed to move downward relative to the through hole 212 , the end of the rod 281 at the bottom of the positioning post 202 is pushed against the end of the rod 281 . The portion 2812 will also move downward, and at the same time, the end portion 2814 of the rod 281 will move upward as the rod 281 rotates around the fulcrum 282, thereby pushing the positioning post 204 to move upward relative to the through hole 214; similarly, if the positioning post 204 After being pushed to move downward relative to the through hole 214 , the end 2814 of the rod 281 abutting against the bottom of the positioning post 204 will also move downward. Move upward, and then push the positioning post 202 to move upward relative to the through hole 212 . Furthermore, in some embodiments of the present disclosure, since the sidewalls of the positioning pillars 202 are at least partially in contact with the inner walls of the through holes 212 , and/or the sidewalls of the positioning pillars 204 are at least partially in contact with the inner walls of the through holes 214 , Therefore, when the positioning column 202 moves relative to the through hole 212 and the positioning column 204 moves relative to the through hole 214 , the side wall of the positioning column 202 will rub against the inner wall of the through hole 212 , and/or the side wall of the positioning column 204 will rub against the through hole 214 . friction on the inner wall.

Furthermore, the loading device 2 has a linkage mechanism that can drive the positioning column 203 and the positioning column 205 to move. Then, when the positioning column 205 moves upward relative to the through hole 215 and protrudes from the platform 20 of the loading device 2, the positioning column 203 moves downward relative to the through hole 213. Move and sink into the through hole 213 . In some embodiments of the present disclosure, the linkage mechanism that can drive the positioning column 203 and the positioning column 205 to move has the same or similar structure as the above-mentioned linkage mechanism 28 connected to the positioning columns 202 and 204 , which will not be repeated here.

In addition, in some embodiments of the present disclosure, the diameters of the through holes 213 and 215 are only slightly larger than the cross-sectional diameters of the positioning pillars 203 and 205 . In other words, the through holes 213 and 215 and the positioning pillars 203 and 205 are combined with gaps. combined with each other. Therefore, in some embodiments of the present disclosure, the sidewalls of the positioning pillars 203 at least partially contact the inner walls of the through holes 213 , and the sidewalls of the positioning pillars 205 at least partially contact the inner walls of the through holes 215 . Therefore, when the positioning post 203 moves relative to the through hole 213 and the positioning post 205 moves relative to the through hole 215, the side wall of the positioning post 203 will rub against the inner wall of the through hole 213, and/or the side wall of the positioning post 205 will be in contact with the through hole. The inner wall of 215 produces friction.

FIG. 4A is a schematic perspective view of a semiconductor carrier according to an embodiment of the present disclosure. The semiconductor carrier W2 shown in FIG. 4A may be used to carry substrates, wafers or other semiconductor devices. In some embodiments of the present disclosure, the semiconductor carrier W2 may include a Front Opening Unified Pod (FOUP). ) or the Front Opening Shipping Box (FOSB). Semiconductor carrier W2 has a body W21 configured to receive wafers, substrates or other semiconductor devices therein. In some embodiments of the present disclosure, the semiconductor carrier W2 has a first size for accommodating wafers, substrates or other semiconductor devices having a specific size. In addition, the semiconductor carrier W2 has a base W22. In some embodiments of the present disclosure, the base W22 has a positioning structure and an RFID tag W225. In some embodiments of the present disclosure, the positioning structure includes three positioning holes W221, W222 and W223. In some embodiments of the present disclosure, each of the positioning holes W221, W222, and W223 is substantially elliptical; in addition, the three positioning holes W221, W222, and W223 are arranged in a triangular shape, and the positioning hole W221 is disposed adjacent to the RFID Label W225. The distance between the positioning hole W222 and the positioning hole W223 can roughly correspond to the distance between the through hole 214 and the through hole 215 on the platform 20 of the loading device 2, and the distance between the positioning hole W222 and the positioning hole W221 and The distance between the positioning hole W223 and the positioning hole W221 may roughly correspond to the distance between the positioning column 201 and the through hole 214 and the distance between the positioning column 201 and the through hole 215 on the platform 20 of the loading device 2 . In other words, the arrangement of the three positioning holes W221 , W222 and W223 of the base W22 of the semiconductor carrier W2 can roughly correspond to the arrangement of the positioning posts 201 and the through holes 214 and 215 on the platform 20 of the loading device 2 .

4B and 4C are schematic diagrams of operations of the loading apparatus according to the disclosed embodiment, especially related to the schematic diagrams of operations of loading the semiconductor carrier W2 disclosed in FIG. 4A on the loading apparatus 2 disclosed in FIGS. 3A and 3B . As shown in FIG. 4A , the semiconductor carrier W2 is to be placed down on the platform 20 of the loading device 2 ; the base W22 of the semiconductor carrier W2 is substantially facing the platform 20 of the loading device 2 , and, as mentioned above, the semiconductor The arrangement of the three positioning holes W221, W222 and W223 of the base W22 of the carrier W2 roughly corresponds to the arrangement of the positioning posts 201 and the through holes 214 and 215 on the platform 20 of the loading device 2. Therefore, the positioning hole W221 of the semiconductor carrier It is roughly aligned with the positioning post 201 of the loading device 2 , the positioning hole W222 of the semiconductor carrier is roughly aligned with the through hole 214 of the loading device 2 , and the positioning hole W223 of the semiconductor carrier is roughly aligned with the through hole 215 of the loading device.

Furthermore, as shown in FIG. 4B , the semiconductor carrier W2 is placed on the platform 20 of the loading device 2 . As mentioned above, the positioning holes W221 of the semiconductor carrier are roughly aligned with the positioning posts 201 of the loading device 2, the positioning holes W222 of the semiconductor carrier W2 are roughly aligned with the through holes 214 of the loading device 2, and the positioning holes W223 of the semiconductor carrier It is roughly aligned with the through hole 215 of the loading device; therefore, the positioning hole W221 of the base W22 of the semiconductor carrier W2 is combined with the positioning post 201 on the platform 20 of the loading device 2, and further, the base W22 of the semiconductor carrier W2 is connected to each other. The bottom will push the positioning column 202 of the loading device 2 and push the positioning column 202 to move downward relative to the through hole 212. At the same time, the linkage mechanism 28 connected with the positioning columns 202 and 204 will force the positioning column 204 to move upward relative to the through hole 214. Protruding from the platform 20, the positioning posts 204 which are pushed and moved upward from the through holes 214 of the platform 20 will be combined with the positioning holes W222 of the semiconductor carrier W2, and the bottom of the base W22 of the semiconductor carrier W2 will be loaded against the top The positioning column 203 of the device 2 pushes the positioning column 203 to move downward relative to the through hole 213, and at the same time, the linkage mechanism connected with the positioning columns 203 and 205 will force the positioning column 205 to move upward relative to the through hole 215 and protrude from the platform 20 through the The positioning posts 205 protruding from the through-holes 215 of the platform 20 are pushed upward and are combined with the positioning holes W223 of the semiconductor carrier W2. In some embodiments of the present disclosure, the positioning holes W221 , W222 , W223 of the base W22 of the semiconductor carrier W2 are substantially elliptical, and the positioning posts 201 , 204 , and 205 on the platform 20 of the loading device 2 have circular shapes. The arc-shaped top surface, so the positioning holes W221, W222, W223 can be easily combined with the positioning columns 201, 204, 205, and in the process of combining with each other, the positioning holes W221, W222, W223 and the positioning columns 201, 204, 205 are reduced. 205 friction between each other.

When the semiconductor carrier W2 is carried on the platform 20 of the loading device 2 by being combined with the positioning posts 201 , 204 , and 205 of the loading device 2 , the RFID tag W225 of the semiconductor carrier W2 will be roughly located on the RFID tag of the loading device 2 for reading and writing. Within the readable and writable range of the head 207 , the user can further use the RFID tag reading and writing head 207 to read and write the RFID tag W225 of the semiconductor carrier W2 by manipulating the reading and writing interface 27 . In some embodiments of the present disclosure, the RFID tag W225 of the semiconductor carrier W2 is disposed adjacent to the positioning hole W221 of the semiconductor carrier W2, and the RFID tag read/write head 207 of the loading device 2 is disposed adjacent to the semiconductor carrier The positioning column 201 with the positioning holes W221 of W2 combined with each other can ensure that when the semiconductor carrier W2 is carried on the loading device 2, the RFID tag W225 of the semiconductor carrier W2 can be located on the RFID tag read-write head 207 of the loading device 2 within the readable and writable range.

However, when the semiconductor carrier W2 is placed on the platform 20 of the loading device 2, the positioning posts 202, 203, 204, 205 will move relative to the through holes 212, 213, 214, 215, and further, as described above , the sidewalls of the positioning columns 202, 203, 204, 205 are at least partially in contact with the inner walls of the through holes 212, 213, 214, 215; therefore, when the semiconductor carrier W2 is placed on the platform 20 of the loading device 2, the positioning columns 202 are forced When , 203, 204, 205 move relative to the through holes 212, 213, 214, 215, the side walls of the positioning posts 202, 203, 204, 205 may rub against the inner walls of the through holes 212, 213, 214, 215, thereby causing Unnecessary static electricity that may damage substrates, wafers or semiconductor devices contained in the semiconductor carrier W2.

FIG. 5A is a schematic perspective view of a semiconductor carrier according to an embodiment of the present disclosure. The semiconductor carrier W3 shown in FIG. 5A may be used to carry substrates, wafers or other semiconductor devices. In some embodiments of the present disclosure, the semiconductor carrier W3 may include a Front Opening Unified Pod (FOUP). ) or the Front Opening Shipping Box (FOSB). Semiconductor carrier W3 has a body W31 configured to receive wafers, substrates or other semiconductor devices therein. In some embodiments of the present disclosure, the semiconductor carrier W3 has a second dimension different from the first dimension, and is used to accommodate a wafer, substrate or other semiconductor device having another specific dimension. In addition, the semiconductor carrier W3 has a base W32. In some embodiments of the present disclosure, the base W32 has a positioning structure and an RFID tag W325. In some embodiments of the present disclosure, the positioning structure includes three positioning holes W321, W322 and W323. In some embodiments of the present disclosure, each of the positioning holes W321, W322, and W323 is approximately elliptical; in addition, the three positioning holes W321, W322, and W323 are arranged in a triangular shape, and the positioning hole W321 is disposed adjacent to the RFID Label W325. The distance between the positioning hole W322 and the positioning hole W323 can roughly correspond to the distance between the through hole 212 and the through hole 213 on the platform 20 of the loading device 2, and the distance between the positioning hole W322 and the positioning hole W321 and The distance between the positioning hole W323 and the positioning hole W221 may roughly correspond to the distance between the positioning column 201 and the through hole 212 and the distance between the positioning column 201 and the through hole 213 on the platform 20 of the loading device 2 . In other words, the arrangement of the three positioning holes W321 , W322 and W323 of the base W32 of the semiconductor carrier W3 can roughly correspond to the arrangement of the positioning posts 201 and the through holes 212 and 213 on the platform 20 of the loading device 2 .

5B and 5C are schematic diagrams of operations of the loading apparatus according to the disclosed embodiment, especially related to the schematic diagrams of operations of loading the semiconductor carrier W3 disclosed in FIG. 5A on the loading apparatus 2 disclosed in FIGS. 3A and 3B . As shown in FIG. 5A, the semiconductor carrier W3 is to be placed down on the platform 20 of the loading device 2; the base W32 of the semiconductor carrier W3 is generally facing the platform 20 of the loading device 2, and furthermore, as described above, the semiconductor The arrangement of the three positioning holes W321, W322 and W323 of the base W32 of the carrier W3 roughly corresponds to the arrangement of the positioning posts 201 and the through holes 212 and 213 on the platform 20 of the loading device 2. Therefore, the positioning hole W321 of the semiconductor carrier It is roughly aligned with the positioning post 201 of the loading device 2 , the positioning hole W322 of the semiconductor carrier is roughly aligned with the through hole 212 of the loading device 2 , and the positioning hole W323 of the semiconductor carrier is roughly aligned with the through hole 213 of the loading device.

Furthermore, as shown in FIG. 5B , the semiconductor carrier W3 is placed on the platform 20 of the loading device 2 . As mentioned above, the positioning holes W321 of the semiconductor carrier are roughly aligned with the positioning posts 201 of the loading device 2, the positioning holes W322 of the semiconductor carrier W3 are roughly aligned with the through holes 212 of the loading device 2, and the positioning holes W323 of the semiconductor carrier It is roughly aligned with the through hole 213 of the loading device; therefore, the positioning hole W321 of the base W32 of the semiconductor carrier W3 is combined with the positioning post 201 on the platform 20 of the loading device 2, and furthermore, the base W32 of the semiconductor carrier W3 is connected to each other. The bottom will push the positioning column 204 of the loading device 2 and push the positioning column 204 to move downward relative to the through hole 214. At the same time, the linkage mechanism 28 connected with the positioning columns 204 and 202 will force the positioning column 202 to move upward relative to the through hole 212. Protruding from the platform 20, the positioning posts 202 which are pushed and moved upward from the through holes 212 of the platform 20 will be combined with the positioning holes W322 of the semiconductor carrier W3, and the bottom of the base W32 of the semiconductor carrier W3 will be loaded against the top The positioning column 205 of the device 2 pushes the positioning column 205 to move downward relative to the through hole 215, and at the same time, the linkage mechanism connected with the positioning columns 205 and 203 will force the positioning column 203 to move upward relative to the through hole 213 and protrude from the platform 20 through the The positioning posts 203 protruding from the through-holes 213 of the platform 20 are pushed upward and are combined with the positioning holes W323 of the semiconductor carrier W3. In some embodiments of the present disclosure, the positioning holes W321, W322, W323 of the base W32 of the semiconductor carrier W3 are approximately elliptical, and the positioning posts 201, 202, 203 on the platform 20 of the loading device 2 have circular shapes The arc-shaped top surface, so the positioning holes W321, W322, W323 can be easily combined with the positioning columns 201, 202, 203, and in the process of mutual combination, the positioning holes W321, W322, W323 and the positioning columns 201, 202, 203 friction between each other.

When the semiconductor carrier W3 is combined with the positioning posts 201, 202, 203 of the loading device 2 to be carried on the platform 20 of the loading device 2, the RFID tag W325 of the semiconductor carrier W3 will be roughly located in the RFID tag of the loading device 3 to read and write. Within the readable and writable range of the head 305 , the user can further use the RFID tag read-write head 305 to read and write the RFID tag W325 of the semiconductor carrier W2 by manipulating the read-write interface 27 . In some embodiments of the present disclosure, the RFID tag W325 of the semiconductor carrier W3 is disposed adjacent to the positioning hole W321 of the semiconductor carrier W3, and the RFID tag read/write head 305 of the loading device 3 is disposed adjacent to the semiconductor carrier W3. The positioning column 201 with the positioning holes W321 of W3 combined with each other can ensure that when the semiconductor carrier W3 is carried on the loading device 2, the RFID tag W325 of the semiconductor carrier W3 can be located on the RFID tag read-write head 207 of the loading device 2 within the readable and writable range.

However, when the semiconductor carrier W3 is placed on the platform 20 of the loading device 2, the positioning posts 202, 203, 204, and 205 will be moved relative to the through holes 212, 213, 214, and 215. Furthermore, as described above , the sidewalls of the positioning columns 202, 203, 204, 205 are at least partially in contact with the inner walls of the through holes 212, 213, 214, 215; therefore, when the semiconductor carrier W3 is placed on the platform 20 of the loading device 2, the positioning columns 202 are forced When , 203, 204, 205 move relative to the through holes 212, 213, 214, 215, the side walls of the positioning posts 202, 203, 204, 205 may rub against the inner walls of the through holes 212, 213, 214, 215, thereby causing Unnecessary static electricity may damage substrates, wafers or semiconductor devices contained in the semiconductor carrier W3.

FIG. 6A is a schematic perspective view of a loading device 3 according to an embodiment of the present disclosure, especially a loading device 3 that can be used to carry semiconductor carriers of two different sizes. As shown in FIG. 6A , the loading apparatus 3 has a platform 30 configured to carry a semiconductor carrier, an RFID tag reading and writing interface 33 , and casters 35 . The platform 30 of the loading device 3 further has four through holes 312 , 313 , 314 and 315 respectively disposed at different positions, and at least two positioning posts 302 and 303 , which can be moved and placed in the through holes 312 and 313 , 314 and 315; furthermore, the platform 30 of the loading device further has a fixed positioning column 301 and an RFID tag read-write head 307; in some embodiments of the present disclosure, the positioning column 301 and the through hole 312 and 313 are generally arranged in an equilateral triangle shape, and the positioning pillars 301 and the through holes 314 and 315 are generally arranged in an equilateral triangle shape with each other; in addition, in some embodiments of the present disclosure, the positioning pillars 301 is positioned adjacent to the RFID tag read/write head 307 . In some embodiments of the present disclosure, the positioning posts 301 , 302 , and 303 have substantially cylindrical top surfaces with circular arcs. In some embodiments of the present disclosure, the positioning posts 302 and 303 have the same or similar structures and shapes, and the through holes 312 , 313 , 314 , and 315 have the same or similar structures and shapes. In addition, since the loading apparatus 2 is provided with the casters 35, the loading apparatus 3 can be used for carrying semiconductor carriers. In some embodiments of the present disclosure, the conductivity of the positioning posts 301 , 302 and 303 is above 1.33 S/m. In some embodiments of the present disclosure, the positioning posts 301 , 302 and 303 include or are made of stainless steel.

FIG. 6B is an enlarged schematic cross-sectional view of part B of FIG. 6A . As shown in FIG. 6B , the platform 30 of the loading device 3 has through holes 312 and 314 , and the positioning column 302 can be placed and accommodated in the through hole 312 , and the user can use manual or other mechanical actions to remove the positioning column 302 from the through hole 312 The positioning post 302 can also be taken out, moved and placed in the through hole 314 by manual or other mechanical actions; in addition, in some embodiments of the present disclosure, The user can also place the positioning post 302 in other through holes, such as through holes 313 and 315, or take the positioning post 302 out of other through holes, such as through holes 313 and 315, and place it in the through holes 312 or 314.

Referring to FIG. 6B , the cylindrical body of the positioning column 302 has a cross-sectional diameter D1 , and the through hole 312 has a diameter D2 . In some embodiments of the present disclosure, the cross-sectional diameter D1 of the positioning column 302 is smaller than that of the through hole 312 Therefore, when the positioning column 302 is accommodated in the through hole 312, there is a space between a side wall 3025 of the positioning column 302 and the inner wall 3125 of the through hole 312. In other words, a side wall 3025 of the positioning column 302 and the through hole 312 There is a gap between the inner walls 3125, which are separated from each other and not in contact with each other; in this way, when the positioning post 302 moves relative to the through hole 312, if the positioning post 302 is taken out from the through hole 312 or the positioning post During the process of placing the 302 in the through hole 312 , there is no friction between the positioning post 302 and the through hole 312 . In some embodiments of the present disclosure, the sidewalls 3025 of the positioning posts 302 and the inner walls 3125 of the through holes 312 are spaced apart from each other by more than 2 mm. In some embodiments of the present disclosure, the positioning posts 302 and 303 have the same or similar structures and shapes, and the through holes 312 , 313 , 314 , and 315 have the same or similar structures and shapes. 302 moves relative to the through holes 313, 314, and 315 without friction with the through holes 313, 314, and 315, and when the positioning post 303 moves relative to the through holes 312, 313, 314, and 315, it also does not rub against the through holes. 312, 313, 314, 315 generate friction.

6B and 6C, in some embodiments of the present disclosure, the through hole 312 has a bottom 3120 made of magnetically conductive material, and the bottom 3020 of the positioning post 302 has a portion 3021 made of magnetically attractive material, so When the positioning column 302 is accommodated in the through hole 312 , the bottom 3020 of the positioning column 302 and the bottom 3120 of the through hole 312 attract each other, so that the positioning column 302 can be stably placed in the through hole 312 . In some embodiments of the present disclosure, the bottom portion 3020 of the positioning post 302 further has a portion 3022 made of non-magnetic material, which is substantially disposed around the portion 3021 made of magnetic material. In addition, the loading device 2 The platform 20 is made of non-magnetic material, such as stainless steel. Furthermore, as described above, in some embodiments of the present disclosure, the positioning posts 302 and 303 have the same or similar structures and shapes, and the through holes 312 , 313 , 314 , 315 have the same or similar structures and Therefore, the bottom of the positioning post 303 may also have a portion made of magnetically attractive material, and the through holes 313 , 314 and 315 may also have a bottom made of magnetically conductive material, which will not be described here.

7A is a schematic perspective view of a semiconductor carrier according to an embodiment of the present disclosure. The semiconductor carrier W4 shown in FIG. 7A may be used to carry substrates, wafers or other semiconductor devices. In some embodiments of the present disclosure, the semiconductor carrier W4 may include a Front Opening Unified Pod (FOUP). ) or the Front Opening Shipping Box (FOSB). Semiconductor carrier W4 has a body W41 configured to receive wafers, substrates or other semiconductor devices therein. In some embodiments of the present disclosure, the semiconductor carrier W4 has a first size for accommodating wafers, substrates or other semiconductor devices having a specific size. In addition, the semiconductor carrier W4 has a base W42. In some embodiments of the present disclosure, the base W42 has a positioning structure and an RFID tag W425. In some embodiments of the present disclosure, the positioning structure includes three positioning holes W421, W422 and W423. In some embodiments of the present disclosure, each of the positioning holes W421, W422, W423 is substantially elliptical; in addition, the three positioning holes W421, W422 and W423 are arranged in a triangular shape, and the positioning hole W421 is disposed adjacent to the RFID Label W425. The distance between the positioning hole W422 and the positioning hole W423 can roughly correspond to the distance between the through hole 314 and the through hole 315 on the platform 30 of the loading device 3, and the distance between the positioning hole W422 and the positioning hole W421 and The distance between the positioning hole W423 and the positioning hole W421 may roughly correspond to the distance between the positioning column 301 and the through hole 314 and the distance between the positioning column 301 and the through hole 315 on the platform 30 of the loading device 3 . In other words, the arrangement of the three positioning holes W421 , W422 and W423 of the base W42 of the semiconductor carrier W4 can roughly correspond to the arrangement of the positioning posts 301 and the through holes 314 and 315 on the platform 20 of the loading device 3 .

7B and 7C are schematic diagrams of operations of the loading apparatus according to the disclosed embodiment, especially related to the schematic diagrams of operations of loading the semiconductor carrier W4 disclosed in FIG. 7A on the loading apparatus 3 disclosed in FIGS. 6A , 6B and 6C. As shown in FIG. 7A, the semiconductor carrier W4 is to be placed down on the platform 30 of the loading device 3; the base W42 of the semiconductor The arrangement of the three positioning holes W421, W422 and W423 of the base W42 of the carrier W4 roughly corresponds to the arrangement of the positioning posts 301 and the through holes 314 and 315 on the platform 30 of the loading device 3. Therefore, the positioning hole W421 of the semiconductor carrier It is roughly aligned with the positioning post 301 of the loading device 3, the positioning hole W422 of the semiconductor carrier W4 is roughly aligned with the through hole 314 of the loading device 3, and the positioning hole W423 of the semiconductor carrier W4 is roughly aligned with the through hole 315 of the loading device . To this end, the user can manually or mechanically move and place the positioning posts 302 in the through holes 314, and manually or mechanically move and place the positioning posts 303 in the through holes 315, so that the semiconductor carrier The positioning holes W422 and W423 with W4 can correspond to the positioning posts 302 and 303 respectively.

In addition, as described above, the positioning posts 302, 303 and the through holes 312, 313, 314, 315 are configured so that there is no friction when they move relative to each other, so when the user moves the positioning posts 302, 303 to the through holes During the process of 314 and 315, unnecessary static electricity will not be generated, thereby preventing the substrate, wafer or semiconductor device accommodated in the semiconductor carrier W4 from being damaged by static electricity. In some embodiments of the present disclosure, after moving the bit posts 302 and 303 to the through holes 314 and 315 , the user may further perform a step of grounding discharge to ensure that static electricity is not generated.

Furthermore, as shown in FIG. 7B , the semiconductor carrier W4 is placed on the platform 30 of the loading device 3 , and the positioning holes W421 , W422 , W423 of the base W42 of the semiconductor carrier W4 are respectively connected to the platform 30 of the loading device 3 . The positioning posts 301 , 302 , 303 are combined with each other, wherein the positioning posts 302 , 303 have been moved into the through holes 314 , 315 by the user. In some embodiments of the present disclosure, the positioning holes W421 , W422 , W423 of the base W42 of the semiconductor carrier W4 are substantially elliptical, and the positioning posts 301 , 302 , and 303 on the platform 30 of the loading device 3 have circular shapes. Because of the arc-shaped top surface, the positioning holes W421, W422, W423 can be easily combined with the positioning columns 301, 302, 303, and in the process of mutual combination, the positioning holes W421, W422, W423 and the positioning columns 301, 302, 303 friction between each other. In addition, when the semiconductor carrier W4 is carried on the platform 30 of the loading device 3, the RFID tag W425 of the semiconductor carrier W4 is approximately located within the readable and writable range of the RFID tag read/write head 307 of the loading device 3, and the user can further The RFID tag W425 of the semiconductor carrier W4 is read and written by using the RFID tag read/write head 307 by manipulating the read/write interface 37 . In some embodiments of the present disclosure, the RFID tag W425 of the semiconductor carrier W4 is disposed adjacent to the positioning hole W421 of the semiconductor carrier W4, and the RFID tag read/write head 307 of the loading device 3 is disposed adjacent to the semiconductor carrier W4. The positioning column 301 with the positioning holes W421 of W4 combined with each other can ensure that when the semiconductor carrier W4 is carried on the loading device 3, the RFID tag W425 of the semiconductor carrier W4 can be located on the RFID tag read-write head 307 of the loading device 3 within the readable and writable range.

FIG. 8A is a schematic perspective view of a semiconductor carrier according to an embodiment of the present disclosure. The semiconductor carrier W5 shown in FIG. 8A may be used to carry substrates, wafers or other semiconductor devices. In some embodiments of the present disclosure, the semiconductor carrier W5 may include a Front Opening Unified Pod (FOUP). ) or the Front Opening Shipping Box (FOSB). Semiconductor carrier W5 has a body W51 configured to receive wafers, substrates or other semiconductor devices therein. In some embodiments of the present disclosure, the semiconductor carrier W5 has a second dimension different from the first dimension, and is used to accommodate a wafer, substrate or other semiconductor device having another specific dimension. In addition, the semiconductor carrier W5 has a base W52. In some embodiments of the present disclosure, the base W52 has a positioning structure and an RFID tag W525. In some embodiments of the present disclosure, the positioning structure includes three positioning holes W521, W522 and W523. In some embodiments of the present disclosure, each of the positioning holes W521, W522, W523 is substantially elliptical; in addition, the three positioning holes W521, W522 and W523 are arranged in a triangular shape, and the positioning hole W521 is disposed adjacent to the RFID Label W525. The distance between the positioning hole W522 and the positioning hole W523 can roughly correspond to the distance between the through hole 312 and the through hole 313 on the platform 30 of the loading device 3, and the distance between the positioning hole W522 and the positioning hole W521 and The distance between the positioning hole W523 and the positioning hole W521 may roughly correspond to the distance between the positioning column 301 and the through hole 312 and the distance between the positioning column 301 and the through hole 313 on the platform 30 of the loading device 3 . In other words, the arrangement of the three positioning holes W521 , W522 and W523 of the base W52 of the semiconductor carrier W5 can roughly correspond to the arrangement of the positioning posts 301 and the through holes 312 and 313 on the platform 30 of the loading device 3 .

8B and 8C are schematic diagrams of operations of the loading apparatus according to the disclosed embodiment, especially related to the schematic diagrams of operations of loading the semiconductor carrier W5 disclosed in FIG. 8A on the loading apparatus 3 disclosed in FIGS. 6A , 6B and 6C. As shown in FIG. 8A, the semiconductor carrier W5 is to be placed down on the platform 30 of the loading device 3; the base W52 of the semiconductor The arrangement of the three positioning holes W521, W522 and W523 of the base W52 of the carrier W5 roughly corresponds to the arrangement of the positioning posts 301 and the through holes 312 and 313 on the platform 30 of the loading device 3. Therefore, the positioning hole W521 of the semiconductor carrier It is roughly aligned with the positioning post 301 of the loading device 3, the positioning hole W522 of the semiconductor carrier W5 is roughly aligned with the through hole 312 of the loading device 3, and the positioning hole W523 of the semiconductor carrier W5 is roughly aligned with the through hole 313 of the loading device . To this end, the user can manually or mechanically move and place the positioning post 302 in the through hole 312, and manually or mechanically move and place the positioning post 303 in the through hole 313, so that the semiconductor carrier The positioning holes W522 and W523 with W5 can correspond to the positioning posts 302 and 303 respectively.

In addition, as described above, the positioning posts 302, 303 and the through holes 312, 313, 314, 315 are configured so that there is no friction when they move relative to each other, so when the user moves the positioning posts 302, 303 to the through holes During the process of 314 and 315, unnecessary static electricity will not be generated, thereby preventing the substrate, wafer or semiconductor device accommodated in the semiconductor carrier W5 from being damaged by static electricity. In some embodiments of the present disclosure, the user may further perform a grounding step after moving the bit posts 302 and 303 to the through holes 314 and 315 to ensure that static electricity is not generated.

Furthermore, as shown in FIG. 8B , the semiconductor carrier W5 is placed on the platform 30 of the loading device 3 , and the positioning holes W521 , W522 , W523 of the base W52 of the semiconductor carrier W5 are respectively connected to the platform 30 of the loading device 3 . The positioning posts 301 , 302 , 303 are combined with each other, wherein the positioning posts 302 , 303 have been moved into the through holes 312 , 313 by the user. In some embodiments of the present disclosure, the positioning holes W521 , W522 , W523 of the base W52 of the semiconductor carrier W5 are substantially elliptical, and the positioning posts 301 , 302 , and 303 on the platform 30 of the loading device 3 have circular shapes. The arc-shaped top surface, so the positioning holes W521, W522, W523 can be easily combined with the positioning columns 301, 302, 303, and in the process of mutual combination, the positioning holes W521, W522, W523 and the positioning columns 301, 302, 303 friction between each other. In addition, when the semiconductor carrier W5 is carried on the platform 30 of the loading device 3, the RFID tag W525 of the semiconductor carrier W5 is approximately located within the readable and writable range of the RFID tag read/write head 307 of the loading device 3, and the user can further The RFID tag W525 of the semiconductor carrier W5 is read and written by using the RFID tag read/write head 307 by manipulating the read/write interface 37 . In some embodiments of the present disclosure, the RFID tag W525 of the semiconductor carrier W5 is disposed adjacent to the positioning hole W521 of the semiconductor carrier W5, and the RFID tag read/write head 307 of the loading device 3 is disposed adjacent to the semiconductor carrier The positioning column 301 with the positioning holes W521 of W5 combined with each other can further ensure that when the semiconductor carrier W5 is carried on the loading device 3, the RFID tag W525 of the semiconductor carrier W5 can be located on the RFID tag read-write head 307 of the loading device 3 within the readable and writable range.

FIG. 9 is a schematic perspective view of a loading device 4 according to an embodiment of the present disclosure, especially a loading device 4 that can be used to carry two or more semiconductor carriers of different sizes. As shown in FIG. 9 , the loading apparatus 4 has a platform 40 configured to carry semiconductor carriers, an RFID tag reading and writing interface 44 and casters 45 . The platform 40 of the loading device 4 has two movable rails 42 and 43 , and the rail 42 has a positioning post 402 which can move along the rail 42 , and the rail 43 has a positioning post 403 which can move along the rail 43 . In some embodiments of the present disclosure, the rail 42 has a groove for accommodating the positioning post 402 , and the rail 43 has a groove for accommodating the positioning post 403 . Furthermore, the platform 40 of the loading device 4 further has a fixed positioning column 401 and an RFID tag read-write head 407 . In some embodiments of the present disclosure, the positioning post 401 is positioned adjacent to the RFID tag read/write head 407 . In some embodiments of the present disclosure, the positioning posts 401 , 402 , and 403 have substantially cylindrical top surfaces with circular arcs. In some embodiments of the present disclosure, the positioning posts 402 and 403 have the same or similar structures and shapes, and the rails 42 and 43 have the same or similar structures and shapes. In addition, the adjacent two sides 408 and 409 of the platform 40 of the loading device 4 have movable holders 48 and 49, respectively. In addition, since the loading apparatus 4 is provided with the casters 45, the loading apparatus 4 can be used for carrying semiconductor carriers. In some embodiments of the present disclosure, the conductivity of the positioning posts 401 , 402 and 403 is above 1.33 S/m. In some embodiments of the present disclosure, the positioning posts 401 , 402 and 403 include or are made of stainless steel.

In some embodiments of the present disclosure, one end 421 of the rail 42 is pivotally connected to the platform 40 , and one end 431 of the rail 43 is pivotally connected to the platform 40 , so the rail 42 can rotate approximately around its end 421 , and the rail 43 can approximately revolve around its end 421 . The end 431 rotates. Furthermore, the positioning column 402 can move along the track 42, and the positioning column 403 can move along the track 43. Therefore, the positioning columns 402, 403 and the tracks 42, 43 cooperate with each other and can be moved to the platform 40. Different positions correspond to the positioning holes of the bases of semiconductor carriers of various sizes; therefore, the loading device 4 can be used to carry semiconductor carriers of more than two different sizes. In some embodiments of the present disclosure, the rails 42 and/or the rails 43 can be rotated so that the rails 42 and/or the rails 43 extend toward the fixed positioning post 401 .

In addition, since the cooperating movement process of the positioning posts 402, 403 and the rails 42, 43 takes a long time, the friction between the components during the movement of the positioning posts 402, 403 and the rails 42, 43 will not generate static electricity. In some embodiments of the present disclosure, the user may further perform a step of grounding discharge after moving the bit posts 402 and 403 to the position to ensure that static electricity will not be generated.

In addition, after the semiconductor carrier is carried on the platform 40 of the loading device 4, the user can further move the holders 48, 49 disposed on the adjacent two sides 408, 409 of the platform 40, so that the holders 48, 49 can be The two adjacent side surfaces of the semiconductor carriers carried on the platform 40 are respectively pressed against each other, so that the semiconductor carriers can be more stably carried on the platform 40 of the loading device 4 . In addition, the holders 48 and 49 that are the same or similar to the embodiments of the present disclosure can be applied to other embodiments of the loading apparatus of the present disclosure.

FIG. 10 is a schematic perspective view of a loading device 5 according to an embodiment of the present disclosure, especially a loading device 5 that can be used to carry two or more semiconductor carriers of different sizes. As shown in FIG. 10 , the loading apparatus 5 has a platform 50 configured to carry semiconductor carriers, an RFID tag reading and writing interface 53 and casters 55 . The platform 50 of the loading device 5 has a fixed rail 52 and a rail 53 arranged on the rail 52 and movable along the rail 52 . Furthermore, the platform 50 of the loading device 5 further has a fixed positioning column 501 and an RFID tag read-write head 507 . In some embodiments of the present disclosure, the positioning post 501 is positioned adjacent to the RFID tag read/write head 507 . In some embodiments of the present disclosure, the positioning posts 501 , 502 , and 503 have substantially cylindrical top surfaces with circular arcs. In some embodiments of the present disclosure, the positioning posts 502 and 503 have the same or similar structures and shapes. In addition, the adjacent two sides 508 and 509 of the platform 50 of the loading device 5 have movable holders 58 and 59, respectively. In addition, since the loading apparatus 5 is provided with the casters 55, the loading apparatus 5 can be used for carrying semiconductor carriers. In some embodiments of the present disclosure, the conductivity of the positioning posts 501 , 502 and 503 is above 1.33 S/m. In some embodiments of the present disclosure, the positioning posts 501 , 502 and 503 include or are made of stainless steel.

Since the rail 53 can be moved along the rail 52, and the positioning posts 502 and 503 can be moved along the rail 53, the positioning posts 502, 503 and the rails 52, 53 can be moved to different positions on the platform 50 in cooperation with each other to correspond to various Positioning holes for the bases of semiconductor carriers of different sizes; therefore, the loading device 5 can be used to carry semiconductor carriers of more than two different sizes.

In addition, since the cooperating movement process of the positioning posts 502, 503 and the rails 52, 53 takes a long time, the friction between the components during the movement of the positioning posts 502, 503 and the rails 52, 53 will not generate static electricity. In some embodiments of the present disclosure, the user may further perform a step of grounding discharge after moving the bit posts 502 and 503 to the position to ensure that static electricity will not be generated.

In addition, after the semiconductor carrier is carried on the platform 50 of the loading device 5, the user can further move the holders 58, 59 disposed on the adjacent two sides 508, 509 of the platform 50, so that the holders 58, 59 can be The two adjacent side surfaces of the semiconductor carriers carried on the platform 50 are respectively pressed against each other, so that the semiconductor carriers can be more stably carried on the platform 50 of the loading device 5 . In addition, the holders 58 and 59 that are the same or similar to the embodiments of the present disclosure can be applied to other embodiments of the loading apparatus of the present disclosure.

FIG. 11 is a flowchart 7 of the operation of the loading device according to the disclosed embodiment. In operation step 71 of the operation flowchart, the user moves the fixing column on the platform of the loading device to a position where it can be properly combined with the positioning hole of the base of the semiconductor carrier according to the size of the semiconductor carrier to be loaded.

If the user operates the loading device 3 of the embodiment disclosed in FIGS. 6A , 6B and 6C, the user can move the positioning posts 302 and 303 to place them on any two of the through holes 312 , 313 , 314 and 315 on the platform 30 . Among them, according to the size of the semiconductor carrier to be loaded; if the user wants to use the loading device 3 to carry the semiconductor carrier W4 shown in FIG. 7A , the positioning posts 302 and 303 can be moved to the through holes on the platform 30 314 and 315, so that the positioning posts 310, 302, 303 of the loading device 3 can be respectively combined with the positioning holes W421, W422, W423 of the base W42 of the semiconductor carrier W4; When the semiconductor carrier W5 is shown, the positioning pillars 302 and 303 can be moved into the through holes 312 and 313 on the platform 30 so that the positioning pillars 310, 302 and 303 of the loading device 3 can be respectively combined with the base of the semiconductor carrier W5. Positioning holes W421, W422, W423 of W52. Furthermore, if the user operates the loading device 4 of the embodiment as disclosed in FIG. 9, the user can move the rails 42, 43 and the positioning posts 402, 403, so that the positioning posts 401, 402, 403 can be combined with the desired load, respectively The positioning hole of the base of the semiconductor carrier. In addition, if the user operates the loading device 5 of the embodiment shown in FIG. 10, the user can move the rails 52, 53 and the positioning posts 502, 503, so that the positioning posts 501, 502, 503 can be respectively combined with the desired load The positioning hole of the base of the semiconductor carrier.

In the operation step 72 of the operation flowchart, the user can optionally further ground the loading device after the positioning column is moved and positioned, so as to eliminate frictional static electricity that may be generated by moving the positioning column on the loading device.

In the operation step 73 of the operation flowchart, the user can place the semiconductor carrier to be carried on the platform of the loading device, so that the loading device can carry the semiconductor carrier. In some embodiments of the present disclosure, the user may perform the operation step 73 after performing the ground discharge operation in the operation step 72 . In some embodiments of the present disclosure, the user may adjust the position of the fixing post after performing the operation step 71 . After the location is reached, step 73 is executed.

In the operation step 73 of the operation flowchart, the user can move the two fixtures disposed on the adjacent two sides of the platform of the loading equipment, so that the fixtures abut the adjacent ones of the semiconductor carriers carried on the platform Two sides, so that the semiconductor carrier can be stably carried on the platform of the loading equipment.

In operation step 75 of the operation flowchart, the user can operate the RFID tag read/write head through the RFID read/write interface of the loading device to read and write the RFID tag of the semiconductor carrier carried on the platform of the loading device. In some embodiments of the present disclosure, the user may perform the operation step 75 after performing the operation of the holder in the operation step 74, and in some embodiments of the present disclosure, the user may perform the operation step 73 to place the semiconductor carrier After the tool is placed, the operation step 75 is executed.

Using the loading device for semiconductor carriers of the present disclosure, semiconductor carriers of different sizes can be loaded and transported, and the RFID tags of the semiconductor carriers of different sizes can be read and written quickly and accurately.

The foregoing has outlined features of several embodiments so that those skilled in the art may better understand aspects of the present disclosure. Those skilled in the art should appreciate that they may readily use the present disclosure as a basis for designing or modifying other procedures and structures for carrying out the same purposes and/or achieving the same advantages of the embodiments introduced herein. Those skilled in the art should also realize that these equivalent constructions should not depart from the spirit and scope of the present disclosure, and that they may make various changes, substitutions and alterations herein.

1: Loading equipment 2: Loading equipment 3: Loading equipment 4: Loading equipment 5: Loading equipment 7: Operation flow chart 10: Platform 13: Read and write interface 15: Casters 20: Platform 315: Through hole 23: Read and write interface 25: Casters 28: Linkage mechanism 30: Platform 33: Read and write interface 35: Casters 40: Platform 42: Orbit 43: Orbit 44: Read and write interface 45: Casters 48: Retainer 49: Retainer 50: Platform 52: Orbit 53: Orbit 54: Read and write interface 55: Casters 58: Retainer 59: Retainer 71: Operation steps 72: Operation steps 73: Operation steps 74: Operation steps 75: Operation steps 101: Positioning post 102: Positioning post 103: Positioning post 105: Read and write head 201: Positioning Post 202: Positioning post 203: Positioning post 204: Positioning post 205: Positioning post 207: Read and write head 212: Through hole 213: Through hole 214: Through hole 215: Through hole 281: Rod 282: Pivot 301: Positioning post 302: Positioning post 303: Positioning post 305: Read and write head 312: Through hole 313: Through hole 314: Through hole 401: Positioning post 402: Positioning post 403: Positioning post 408: Side 409: Side 421: end 431: end 501: Positioning post 502: Positioning post 503: Positioning post 508: Side 509: Side 2812: End 2814: Pivot 3020: Bottom 3021: Section 3022: Section 3025: Sidewall 3120: Bottom 3125: inner wall W1: Semiconductor carrier W2: Semiconductor carrier W3: Semiconductor Carrier W4: Semiconductor Carrier W5: Semiconductor Carrier W11: Ontology W12: Base W21: Ontology W22: Base W31: Ontology W32: Base W41: Ontology W42: Base W51: body W52: Base W121: Positioning hole W122: Positioning hole W123: Positioning hole W125: Labels W221: Positioning hole W222: Positioning hole W223: Positioning hole W225: Labels W321: Positioning hole W322: Positioning hole W323: Positioning hole W325: Labels W421: Positioning hole W422: Positioning hole W423: Positioning hole W425: Labels W521: Positioning hole W522: Positioning hole W523: Positioning hole W525: Label

Aspects of the present disclosure will be better understood from the following description, together with the accompanying drawings. It should be noted that in accordance with standard industry practice, the various features are not drawn to scale. In fact, the dimensions of the various features may be arbitrarily expanded or reduced for clarity.

FIG. 1A is a three-dimensional schematic diagram of a semiconductor carrier according to an embodiment of the disclosure.

FIG. 1B is a three-dimensional schematic diagram of the loading apparatus according to the disclosed embodiment.

2A and 2B are schematic diagrams of operations of the loading apparatus according to the disclosed embodiment.

FIG. 3A is a schematic perspective view of a loading device carrier according to an embodiment of the disclosure.

FIG. 3B is an enlarged schematic cross-sectional view of part A of FIG. 3A .

FIG. 4A is a schematic perspective view of a semiconductor carrier according to an embodiment of the disclosure.

4B and 4C are schematic views of the operation of the loading apparatus according to the disclosed embodiment.

FIG. 5A is a schematic perspective view of a semiconductor carrier according to an embodiment of the disclosure.

FIG. 5B and FIG. 5C are schematic views of the operation of the loading apparatus according to the disclosed embodiment.

FIG. 6A is a schematic perspective view of a loading device carrier according to the disclosed embodiment.

FIG. 6B is an enlarged schematic cross-sectional view of part B of FIG. 6A .

FIG. 6C is an enlarged perspective view of the positioning column of the loading equipment carrier according to the disclosed embodiment.

7A is a schematic three-dimensional view of a semiconductor carrier according to an embodiment of the disclosure.

7B and 7C are schematic views of the operation of the loading apparatus according to the disclosed embodiment.

FIG. 8A is a schematic perspective view of a semiconductor carrier according to an embodiment of the disclosure.

8B and 8C are schematic diagrams of operations of the loading apparatus according to the disclosed embodiment.

FIG. 9 is a three-dimensional schematic diagram of the semiconductor carrier according to the disclosed embodiment.

FIG. 10 is a three-dimensional schematic diagram of the semiconductor carrier according to the disclosed embodiment.

FIG. 11 is a flow chart of the operation of the loading device according to the disclosed embodiment.

3: Loading equipment

30: Platform

301: Positioning post

302: Positioning post

303: Positioning post

305: Read and write head

312: Through hole

313: Through hole

314: Through hole

315: Through hole

33: Read and write interface

35: Casters

Claims (18)

A loading device for a semiconductor carrier, which comprises: a platform for carrying the semiconductor carrier; and a first positioning column fixed on the platform and a first positioning post arranged on the platform and a movable relative to the platform the second positioning column; wherein the platform has a first position and a second position, and wherein the second positioning column only protrudes from the platform at the first position or the second position; wherein the first position A positioning post and the second positioning post are configured to be combined with a positioning structure of the semiconductor carrier; wherein the second positioning post can be moved so that the contact between the second positioning post and the first positioning post is A distance is adjusted. 2. The loading apparatus of claim 1, wherein, when the second alignment post protrudes from the platform in the first position, the first alignment post and the second alignment post are configured to align with the one having a first dimension The positioning structure of the semiconductor carrier cooperates, and wherein, when the second positioning post protrudes from the platform in the second position, the first positioning post and the second positioning post are configured to have a second positioning post The positioning structure of the semiconductor carrier of the size matches. . The loading apparatus of claim 2, wherein the second positioning post is movable from the first position to the second position or from the second position to the first position, and wherein the second positioning post is moving No static electricity is generated on this loading device during the process. The loading device of claim 3, wherein the first position has a first hole for accommodating the second positioning post, and the second position has a second hole for accommodating the second positioning post, and wherein the first position A diameter of a hole is larger than a cross-sectional diameter of the second positioning post, and a diameter of the second hole is larger than a cross-sectional diameter of the second positioning post. The loading apparatus of claim 3, wherein a track exists between the first position and the second position, and wherein the second positioning post moves along the track from the first position to the second position or from the second position position moves the first position. The loading apparatus of claim 1, further having a first hole disposed in the first position and configured to receive the second positioning post, disposed in the second position and configured to receive a third A second hole of the positioning column, wherein the third positioning column can be combined with the positioning structure of the semiconductor carrier, wherein when the second positioning column is submerged into the platform through the first hole by an external force, the The third positioning column can simultaneously pass through the second hole to protrude on the platform and be combined with the positioning structure of the semiconductor carrier, wherein when the third positioning column is subjected to an external force, it passes through the second hole and sinks into the platform. When the platform is used, the second positioning column can simultaneously pass through the first hole to protrude on the platform and be combined with the positioning structure of the semiconductor carrier. The loading device of claim 6, further having a linkage mechanism connected to the second positioning post and the third positioning post, wherein the linkage mechanism is configured to allow the second positioning post to pass through the first hole to The third locating post protrudes on the platform through the second hole while submerging the platform, and is configured so that the third locating post passes through the second hole while submerging the platform The second positioning post protrudes on the platform through the first hole. The loading device of claim 1, wherein the platform further has a third positioning column that can be combined with the semiconductor carrier, the first positioning column, the second positioning column and the third positioning column forming a triangular shape with each other arrangement. A loading device for a semiconductor carrier, comprising: a platform for carrying the semiconductor carrier; a first hole disposed on the platform and capable of being combined with a positioning structure of the semiconductor carrier; and a first positioning post located in the first hole, wherein a gap is included between a side wall of the first positioning post and an inner wall of the first hole; wherein the first positioning post is configured to be opposite to the first positioning post A hole moves, and the first positioning post can avoid contact with the inner wall of the first hole in the process of moving relative to the first hole. The loading apparatus of claim 13, wherein the gap includes a space surrounding the side wall of the first positioning post and between the side wall of the first positioning post and the inner wall of the first hole. The loading device of claim 9, wherein the platform has a fixing column fixed on the platform and capable of being combined with the positioning structure of the semiconductor carrier and a second hole capable of being combined with the positioning structure of the semiconductor carrier, and wherein the first hole, the second hole and the fixing column are arranged in a first triangle with each other; wherein the platform further has a third hole and a fourth hole which can be combined with the positioning structure of the semiconductor carrier , and wherein the third hole, the fourth hole and the fixing column are arranged in a second triangle with each other, and wherein the first triangle is different from the second triangle; and wherein the mounting The carrier device further has a movable second positioning column, when the first positioning column is accommodated in the first hole and the second positioning column is accommodated in the second hole, the fixed column, the first positioning column and the The second positioning column can cooperate with the positioning structure of the semiconductor carrier having a first size. When the first positioning column is accommodated in the third hole and the second positioning column is accommodated in the fourth hole, the fixing column, The first positioning column and the second positioning column can cooperate with the positioning structure of the semiconductor carrier having a second size together. The loading device of claim 9, wherein a bottom of the first positioning column has a first material, a bottom of the first hole has a second material, and wherein the first material and the second material are magnetic to each other attract each other. The loading device of claim 9, wherein the first positioning column has a top surface of a circular arc. The loading device of claim 9, wherein the platform has a fixing column fixed on the platform and capable of being combined with the positioning structure of the semiconductor carrier and a second hole capable of being combined with the positioning structure of the semiconductor carrier, And wherein the first hole, the second hole and the fixing column are arranged in a first triangle with each other. The loading device of claim 14, wherein the platform further has a third hole and a fourth hole that can be combined with the positioning structure of the semiconductor carrier, and wherein the third hole, the fourth hole and the fixing post They are arranged in a second triangle, and the first triangle is different from the second triangle. The loading device of claim 9, wherein the loading device is configured to be grounded. The loading device of claim 16, wherein the electrical conductivity of the first positioning column is above 1.33 S/m. The loading device of claim 16, wherein the first positioning post comprises a stainless steel material.

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