TW440529B - Multi-layer structures containing an adhesion promoting layer - Google Patents
Multi-layer structures containing an adhesion promoting layer Download PDFInfo
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- TW440529B TW440529B TW085106999A TW85106999A TW440529B TW 440529 B TW440529 B TW 440529B TW 085106999 A TW085106999 A TW 085106999A TW 85106999 A TW85106999 A TW 85106999A TW 440529 B TW440529 B TW 440529B
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- 229910052793 cadmium Inorganic materials 0.000 description 1
- BDOSMKKIYDKNTQ-UHFFFAOYSA-N cadmium atom Chemical compound [Cd] BDOSMKKIYDKNTQ-UHFFFAOYSA-N 0.000 description 1
- 230000000711 cancerogenic effect Effects 0.000 description 1
- 239000004202 carbamide Substances 0.000 description 1
- 235000013877 carbamide Nutrition 0.000 description 1
- 231100000357 carcinogen Toxicity 0.000 description 1
- 239000003183 carcinogenic agent Substances 0.000 description 1
- 229920002678 cellulose Polymers 0.000 description 1
- 239000001913 cellulose Substances 0.000 description 1
- 230000005465 channeling Effects 0.000 description 1
- 239000000460 chlorine Substances 0.000 description 1
- 229910052801 chlorine Inorganic materials 0.000 description 1
- HYXXTUOWDIJLPS-UHFFFAOYSA-N copper;sulfane Chemical compound S.[Cu+2] HYXXTUOWDIJLPS-UHFFFAOYSA-N 0.000 description 1
- 238000005336 cracking Methods 0.000 description 1
- 238000004132 cross linking Methods 0.000 description 1
- KJGTYKBXQJWZQE-UHFFFAOYSA-N cyclopenta-1,4-dien-1-yl(triethoxy)silane Chemical compound C1=CC(=CC1)[Si](OCC)(OCC)OCC KJGTYKBXQJWZQE-UHFFFAOYSA-N 0.000 description 1
- 125000000058 cyclopentadienyl group Chemical group C1(=CC=CC1)* 0.000 description 1
- 210000004268 dentin Anatomy 0.000 description 1
- YQGOWXYZDLJBFL-UHFFFAOYSA-N dimethoxysilane Chemical compound CO[SiH2]OC YQGOWXYZDLJBFL-UHFFFAOYSA-N 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- ZSWFCLXCOIISFI-UHFFFAOYSA-N endo-cyclopentadiene Natural products C1C=CC=C1 ZSWFCLXCOIISFI-UHFFFAOYSA-N 0.000 description 1
- 230000002708 enhancing effect Effects 0.000 description 1
- 150000002118 epoxides Chemical group 0.000 description 1
- 239000004744 fabric Substances 0.000 description 1
- 239000004459 forage Substances 0.000 description 1
- 150000002240 furans Chemical class 0.000 description 1
- 238000007429 general method Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 230000009477 glass transition Effects 0.000 description 1
- 125000003147 glycosyl group Chemical group 0.000 description 1
- 229910052735 hafnium Inorganic materials 0.000 description 1
- VBJZVLUMGGDVMO-UHFFFAOYSA-N hafnium atom Chemical compound [Hf] VBJZVLUMGGDVMO-UHFFFAOYSA-N 0.000 description 1
- 229910000449 hafnium oxide Inorganic materials 0.000 description 1
- WIHZLLGSGQNAGK-UHFFFAOYSA-N hafnium(4+);oxygen(2-) Chemical compound [O-2].[O-2].[Hf+4] WIHZLLGSGQNAGK-UHFFFAOYSA-N 0.000 description 1
- 229910052736 halogen Inorganic materials 0.000 description 1
- 150000002367 halogens Chemical class 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 229930195733 hydrocarbon Natural products 0.000 description 1
- 150000002430 hydrocarbons Chemical class 0.000 description 1
- 239000000017 hydrogel Substances 0.000 description 1
- 125000004435 hydrogen atom Chemical group [H]* 0.000 description 1
- 229910052740 iodine Inorganic materials 0.000 description 1
- 239000011630 iodine Substances 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- FPYJFEHAWHCUMM-UHFFFAOYSA-N maleic anhydride Chemical compound O=C1OC(=O)C=C1 FPYJFEHAWHCUMM-UHFFFAOYSA-N 0.000 description 1
- 239000000155 melt Substances 0.000 description 1
- 229910021645 metal ion Inorganic materials 0.000 description 1
- UIUXUFNYAYAMOE-UHFFFAOYSA-N methylsilane Chemical compound [SiH3]C UIUXUFNYAYAMOE-UHFFFAOYSA-N 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- GDGOJEMDZGZECC-UHFFFAOYSA-N n'-[(3-ethenylphenyl)methyl]-n-(3-trimethoxysilylpropyl)ethane-1,2-diamine Chemical compound CO[Si](OC)(OC)CCCNCCNCC1=CC=CC(C=C)=C1 GDGOJEMDZGZECC-UHFFFAOYSA-N 0.000 description 1
- GEMHFKXPOCTAIP-UHFFFAOYSA-N n,n-dimethyl-n'-phenylcarbamimidoyl chloride Chemical compound CN(C)C(Cl)=NC1=CC=CC=C1 GEMHFKXPOCTAIP-UHFFFAOYSA-N 0.000 description 1
- CLYWMXVFAMGARU-UHFFFAOYSA-N n-benzyl-3-trimethoxysilylpropan-1-amine Chemical compound CO[Si](OC)(OC)CCCNCC1=CC=CC=C1 CLYWMXVFAMGARU-UHFFFAOYSA-N 0.000 description 1
- 235000012149 noodles Nutrition 0.000 description 1
- 239000003921 oil Substances 0.000 description 1
- 125000001117 oleyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])/C([H])=C([H])\C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 239000003960 organic solvent Substances 0.000 description 1
- 125000001181 organosilyl group Chemical group [SiH3]* 0.000 description 1
- 150000002916 oxazoles Chemical class 0.000 description 1
- 230000001590 oxidative effect Effects 0.000 description 1
- 238000012856 packing Methods 0.000 description 1
- 239000003973 paint Substances 0.000 description 1
- 238000010422 painting Methods 0.000 description 1
- 239000011087 paperboard Substances 0.000 description 1
- 150000002989 phenols Chemical class 0.000 description 1
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 description 1
- ZUOUZKKEUPVFJK-UHFFFAOYSA-N phenylbenzene Natural products C1=CC=CC=C1C1=CC=CC=C1 ZUOUZKKEUPVFJK-UHFFFAOYSA-N 0.000 description 1
- 229910052697 platinum Inorganic materials 0.000 description 1
- 239000011120 plywood Substances 0.000 description 1
- 239000004848 polyfunctional curative Substances 0.000 description 1
- 229920000307 polymer substrate Polymers 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- HJWLCRVIBGQPNF-UHFFFAOYSA-N prop-2-enylbenzene Chemical compound C=CCC1=CC=CC=C1 HJWLCRVIBGQPNF-UHFFFAOYSA-N 0.000 description 1
- 239000001294 propane Substances 0.000 description 1
- 150000003217 pyrazoles Chemical class 0.000 description 1
- 150000003230 pyrimidines Chemical class 0.000 description 1
- 150000003233 pyrroles Chemical class 0.000 description 1
- 150000003235 pyrrolidines Chemical class 0.000 description 1
- 239000012779 reinforcing material Substances 0.000 description 1
- 238000005070 sampling Methods 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 239000007921 spray Substances 0.000 description 1
- 150000003440 styrenes Chemical class 0.000 description 1
- 230000003746 surface roughness Effects 0.000 description 1
- 238000004381 surface treatment Methods 0.000 description 1
- 239000002335 surface treatment layer Substances 0.000 description 1
- 238000010998 test method Methods 0.000 description 1
- YLQBMQCUIZJEEH-UHFFFAOYSA-N tetrahydrofuran Natural products C=1C=COC=1 YLQBMQCUIZJEEH-UHFFFAOYSA-N 0.000 description 1
- 150000003557 thiazoles Chemical class 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
- 239000010936 titanium Substances 0.000 description 1
- FTDRQHXSYGDMNJ-UHFFFAOYSA-N trimethoxy(3-pyrrol-1-ylpropyl)silane Chemical compound CO[Si](OC)(OC)CCCN1C=CC=C1 FTDRQHXSYGDMNJ-UHFFFAOYSA-N 0.000 description 1
- 229920006337 unsaturated polyester resin Polymers 0.000 description 1
- 239000002023 wood Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
- C08J5/12—Bonding of a preformed macromolecular material to the same or other solid material such as metal, glass, leather, e.g. using adhesives
- C08J5/124—Bonding of a preformed macromolecular material to the same or other solid material such as metal, glass, leather, e.g. using adhesives using adhesives based on a macromolecular component
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
- H05K3/389—Improvement of the adhesion between the insulating substrate and the metal by the use of a coupling agent, e.g. silane
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/31504—Composite [nonstructural laminate]
- Y10T428/31652—Of asbestos
- Y10T428/31663—As siloxane, silicone or silane
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T442/00—Fabric [woven, knitted, or nonwoven textile or cloth, etc.]
- Y10T442/30—Woven fabric [i.e., woven strand or strip material]
- Y10T442/3382—Including a free metal or alloy constituent
- Y10T442/3415—Preformed metallic film or foil or sheet [film or foil or sheet had structural integrity prior to association with the woven fabric]
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Organic Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Health & Medical Sciences (AREA)
- Materials Engineering (AREA)
- Laminated Bodies (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Reinforced Plastic Materials (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US08/505,741 US5614324A (en) | 1995-07-24 | 1995-07-24 | Multi-layer structures containing a silane adhesion promoting layer |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| TW440529B true TW440529B (en) | 2001-06-16 |
Family
ID=24011633
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW085106999A TW440529B (en) | 1995-07-24 | 1996-06-11 | Multi-layer structures containing an adhesion promoting layer |
Country Status (8)
| Country | Link |
|---|---|
| US (1) | US5614324A (en:Method) |
| EP (1) | EP0756443B1 (en:Method) |
| JP (2) | JP3163011B2 (en:Method) |
| KR (1) | KR100276010B1 (en:Method) |
| CN (1) | CN1076272C (en:Method) |
| DE (1) | DE69625554T2 (en:Method) |
| IN (1) | IN188605B (en:Method) |
| TW (1) | TW440529B (en:Method) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US10751975B2 (en) | 2015-10-28 | 2020-08-25 | Industrial Technology Research Institute | Composite laminate |
Families Citing this family (23)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB2328322A (en) * | 1997-08-12 | 1999-02-17 | Shipley Co Llc | Multilayer PCB manufacture with dielectric material matched to photo-resist material |
| US6284309B1 (en) | 1997-12-19 | 2001-09-04 | Atotech Deutschland Gmbh | Method of producing copper surfaces for improved bonding, compositions used therein and articles made therefrom |
| US6174561B1 (en) | 1998-01-30 | 2001-01-16 | James M. Taylor | Composition and method for priming substrate materials |
| US6555170B2 (en) | 1998-01-30 | 2003-04-29 | Duratech Industries, Inc. | Pre-plate treating system |
| US6413923B2 (en) * | 1999-11-15 | 2002-07-02 | Arch Specialty Chemicals, Inc. | Non-corrosive cleaning composition for removing plasma etching residues |
| EP1342395A2 (en) * | 2000-08-15 | 2003-09-10 | WORLD PROPERTIES, INC, an Illinois Corporation | Multi-layer circuits and methods of manufacture thereof |
| JP2002064277A (ja) * | 2000-08-22 | 2002-02-28 | Ibiden Co Ltd | 多層プリント配線板および多層プリント配線板の製造方法 |
| JP2002084073A (ja) * | 2000-09-07 | 2002-03-22 | Ibiden Co Ltd | 多層プリント配線板および多層プリント配線板の製造方法 |
| US20050208278A1 (en) * | 2001-08-22 | 2005-09-22 | Landi Vincent R | Method for improving bonding of circuit substrates to metal and articles formed thereby |
| WO2003020000A1 (en) * | 2001-08-22 | 2003-03-06 | World Properties Inc. | Method for improving bonding of circuit substrates to metal and articles formed thereby |
| JP4298943B2 (ja) * | 2001-10-18 | 2009-07-22 | 日鉱金属株式会社 | 銅箔表面処理剤 |
| DE60237102D1 (de) * | 2001-11-01 | 2010-09-02 | Arakawa Chem Ind | Polyimidmetallschichten aufweisende produkte und polyamidimidmetallschichten aufweisendes produkt |
| KR100841414B1 (ko) * | 2004-01-13 | 2008-06-25 | 우베 고산 가부시키가이샤 | 폴리이미드-금속 적층체 및 폴리이미드 회로 기판 |
| DE102004005824A1 (de) * | 2004-02-06 | 2005-08-25 | Degussa Ag | Organosiliciumeinheiten enthaltende Zubereitung auf Acrylatbasis, deren Herstellung und deren Verwendung |
| EP1978024A1 (en) * | 2007-04-04 | 2008-10-08 | Atotech Deutschland Gmbh | Silane compositions comprising novel crosslinking agents |
| EP2995449A1 (en) * | 2009-03-20 | 2016-03-16 | Dow Global Technologies LLC | Multilayer structure and method of making the same |
| CN101917826B (zh) * | 2010-08-03 | 2013-08-21 | 东莞市仁吉电子材料有限公司 | 印刷电路板基板中,增加导电体与非导电高分子介电层之间结合力的方法 |
| CN104073175B (zh) * | 2013-03-25 | 2016-03-09 | 中国石油天然气集团公司 | 一种聚氨酯涂层与三层聚乙烯涂层化学键粘结的方法 |
| CN104073176B (zh) * | 2013-03-25 | 2015-10-14 | 中国石油天然气集团公司 | 一种提高三层聚乙烯涂层和液体补口涂层粘结性的方法 |
| EP2857407B1 (en) * | 2013-10-03 | 2017-02-01 | Shin-Etsu Chemical Co., Ltd. | Organosilicon compound, making method, adhesive composition, and article |
| JP6523942B2 (ja) * | 2014-12-19 | 2019-06-05 | 四国化成工業株式会社 | 無機材料または樹脂材料の表面処理液、表面処理方法およびその利用 |
| DE102014119576A1 (de) * | 2014-12-23 | 2016-06-23 | Ernst-Moritz-Arndt-Universität Greifswald | Pharmazeutische Arzneimittelform zur Applikation auf Schleimhäuten |
| KR20210099192A (ko) * | 2016-05-18 | 2021-08-11 | 아이솔라 유에스에이 코프 | 회로 기판들을 제조하는 방법 |
Family Cites Families (22)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3508983A (en) * | 1967-04-24 | 1970-04-28 | Schjeldahl Co G T | Use of a silane coating to bond copper to plastic in making a printed circuit |
| US3708458A (en) * | 1971-03-16 | 1973-01-02 | Upjohn Co | Copolyimides of benzophenone tetracarboxylic acid dianhydride and mixture of diisocyanates |
| JPS56111289A (en) * | 1980-02-07 | 1981-09-02 | Fujitsu Ltd | Method of manufacturing copperrlined laminate |
| DE3208198A1 (de) * | 1982-03-06 | 1983-09-08 | Nippon Denkai Co., Ltd., Tokyo | Verfahren zur verbindung von kupferfolie mit laminat-formmaterial |
| JPS6094348A (ja) * | 1983-10-28 | 1985-05-27 | 松下電工株式会社 | 銅張積層板の製法 |
| US4624978A (en) * | 1983-11-14 | 1986-11-25 | Rogers Corporation | High temperature polyimide processing aid |
| JPS6177535A (ja) * | 1984-09-25 | 1986-04-21 | Niles Parts Co Ltd | 車両用定速走行装置 |
| JPH062828B2 (ja) * | 1986-05-15 | 1994-01-12 | 宇部興産株式会社 | ポリイミドフイルムの製造法 |
| US4902731A (en) * | 1986-08-27 | 1990-02-20 | Hercules Incorporated | Organosilicon prepolymers |
| US4732858A (en) * | 1986-09-17 | 1988-03-22 | Brewer Science, Inc. | Adhesion promoting product and process for treating an integrated circuit substrate |
| US5189128A (en) * | 1988-06-20 | 1993-02-23 | Ciba-Geigy Corporation | Solution stable polyimide resin systems |
| US4910077A (en) * | 1988-08-04 | 1990-03-20 | B.F. Goodrich Company | Polynorbornene laminates and method of making the same |
| US4923678A (en) * | 1989-02-14 | 1990-05-08 | The B. F. Goodrich Company | Low dielectric constant prepreg based on blends of polynorbornene and polyolefins derived form C2 -C4 monomers |
| MX166210B (es) * | 1988-12-23 | 1992-12-23 | Goodrich Co B F | Procedimiento para obtener un laminado y el laminado asi obtenido |
| US4923734A (en) * | 1988-12-23 | 1990-05-08 | The B. F. Goodrich Company | Laminates of polynorbornene and polyolefins derived from C2 -C4 monomers |
| JPH07120564B2 (ja) * | 1989-10-02 | 1995-12-20 | 日本電解株式会社 | 抵抗層付導電材料及び抵抗層付プリント回路基板 |
| US5145937A (en) * | 1989-11-09 | 1992-09-08 | The United States Of America As Represented By The Administrator Of The National Aeronautics And Space Administration | Polyimides with carbonyl and ether connecting groups between the aromatic rings |
| US5227244A (en) * | 1990-09-21 | 1993-07-13 | E. I. Du Pont De Nemours And Company | Polyimide film with metal salt coating resulting in improved adhesion |
| US5114757A (en) * | 1990-10-26 | 1992-05-19 | Linde Harold G | Enhancement of polyimide adhesion on reactive metals |
| JPH0539295A (ja) * | 1991-08-02 | 1993-02-19 | Nikko Kyodo Co Ltd | 金属表面処理剤 |
| JPH06177536A (ja) * | 1992-12-09 | 1994-06-24 | Japan Energy Corp | 金属表面処理剤 |
| JPH06177535A (ja) * | 1992-12-09 | 1994-06-24 | Japan Energy Corp | 金属表面処理剤 |
-
1995
- 1995-07-24 US US08/505,741 patent/US5614324A/en not_active Expired - Lifetime
-
1996
- 1996-05-30 IN IN987CA1996 patent/IN188605B/en unknown
- 1996-06-11 TW TW085106999A patent/TW440529B/zh not_active IP Right Cessation
- 1996-07-10 JP JP18103496A patent/JP3163011B2/ja not_active Expired - Fee Related
- 1996-07-22 DE DE69625554T patent/DE69625554T2/de not_active Expired - Fee Related
- 1996-07-22 EP EP96305356A patent/EP0756443B1/en not_active Expired - Lifetime
- 1996-07-23 KR KR1019960029661A patent/KR100276010B1/ko not_active Expired - Fee Related
- 1996-07-23 CN CN96111302A patent/CN1076272C/zh not_active Expired - Fee Related
-
2000
- 2000-05-15 JP JP2000142378A patent/JP2001030428A/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US10751975B2 (en) | 2015-10-28 | 2020-08-25 | Industrial Technology Research Institute | Composite laminate |
Also Published As
| Publication number | Publication date |
|---|---|
| KR970009483A (ko) | 1997-02-24 |
| JP3163011B2 (ja) | 2001-05-08 |
| DE69625554D1 (de) | 2003-02-06 |
| DE69625554T2 (de) | 2003-11-20 |
| CN1145849A (zh) | 1997-03-26 |
| EP0756443B1 (en) | 2003-01-02 |
| JP2001030428A (ja) | 2001-02-06 |
| EP0756443A1 (en) | 1997-01-29 |
| JPH0939152A (ja) | 1997-02-10 |
| US5614324A (en) | 1997-03-25 |
| KR100276010B1 (ko) | 2000-12-15 |
| IN188605B (en:Method) | 2002-10-19 |
| CN1076272C (zh) | 2001-12-19 |
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