TW440493B - Carrier and polishing apparatus - Google Patents
Carrier and polishing apparatus Download PDFInfo
- Publication number
- TW440493B TW440493B TW088104966A TW88104966A TW440493B TW 440493 B TW440493 B TW 440493B TW 088104966 A TW088104966 A TW 088104966A TW 88104966 A TW88104966 A TW 88104966A TW 440493 B TW440493 B TW 440493B
- Authority
- TW
- Taiwan
- Prior art keywords
- plate
- pressure chamber
- carrier
- opening
- pressure
- Prior art date
Links
- 238000005498 polishing Methods 0.000 title abstract description 22
- 239000012530 fluid Substances 0.000 claims abstract description 40
- 238000000227 grinding Methods 0.000 claims description 23
- 238000007667 floating Methods 0.000 claims description 19
- 239000000853 adhesive Substances 0.000 claims description 3
- 230000001070 adhesive effect Effects 0.000 claims description 3
- 238000004891 communication Methods 0.000 claims description 3
- 238000011109 contamination Methods 0.000 abstract description 2
- 230000002265 prevention Effects 0.000 abstract 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 10
- 230000002093 peripheral effect Effects 0.000 description 6
- 230000007246 mechanism Effects 0.000 description 5
- 230000004048 modification Effects 0.000 description 5
- 238000012986 modification Methods 0.000 description 5
- 230000005540 biological transmission Effects 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 230000004308 accommodation Effects 0.000 description 2
- 239000013078 crystal Substances 0.000 description 2
- 210000003127 knee Anatomy 0.000 description 2
- 230000000149 penetrating effect Effects 0.000 description 2
- 239000002699 waste material Substances 0.000 description 2
- 239000002390 adhesive tape Substances 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 230000005484 gravity Effects 0.000 description 1
- 239000012528 membrane Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 238000007517 polishing process Methods 0.000 description 1
- 229920006327 polystyrene foam Polymers 0.000 description 1
- 239000002689 soil Substances 0.000 description 1
- 239000007921 spray Substances 0.000 description 1
- 239000002023 wood Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/27—Work carriers
- B24B37/30—Work carriers for single side lapping of plane surfaces
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP13460598 | 1998-04-29 | ||
JP14507598A JP2000015572A (ja) | 1998-04-29 | 1998-05-11 | キャリア及び研磨装置 |
Publications (1)
Publication Number | Publication Date |
---|---|
TW440493B true TW440493B (en) | 2001-06-16 |
Family
ID=26468667
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW088104966A TW440493B (en) | 1998-04-29 | 1999-03-30 | Carrier and polishing apparatus |
Country Status (7)
Country | Link |
---|---|
US (1) | US6110026A (de) |
EP (1) | EP0953408B1 (de) |
JP (1) | JP2000015572A (de) |
KR (1) | KR100301881B1 (de) |
DE (1) | DE69900398D1 (de) |
SG (1) | SG72940A1 (de) |
TW (1) | TW440493B (de) |
Families Citing this family (30)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2000084836A (ja) * | 1998-09-08 | 2000-03-28 | Speedfam-Ipec Co Ltd | キャリア及び研磨装置 |
KR100336798B1 (ko) * | 1998-10-17 | 2002-11-27 | 동부전자 주식회사 | 씨엠피용웨이퍼홀더장치 |
US7140956B1 (en) | 2000-03-31 | 2006-11-28 | Speedfam-Ipec Corporation | Work piece carrier with adjustable pressure zones and barriers and a method of planarizing a work piece |
US6390905B1 (en) * | 2000-03-31 | 2002-05-21 | Speedfam-Ipec Corporation | Workpiece carrier with adjustable pressure zones and barriers |
JP2001291689A (ja) * | 2000-04-07 | 2001-10-19 | Fujikoshi Mach Corp | ウェーハの研磨装置 |
JP2001345297A (ja) * | 2000-05-30 | 2001-12-14 | Hitachi Ltd | 半導体集積回路装置の製造方法及び研磨装置 |
US6722965B2 (en) * | 2000-07-11 | 2004-04-20 | Applied Materials Inc. | Carrier head with flexible membranes to provide controllable pressure and loading area |
US6857945B1 (en) | 2000-07-25 | 2005-02-22 | Applied Materials, Inc. | Multi-chamber carrier head with a flexible membrane |
US7198561B2 (en) * | 2000-07-25 | 2007-04-03 | Applied Materials, Inc. | Flexible membrane for multi-chamber carrier head |
US6652357B1 (en) | 2000-09-22 | 2003-11-25 | Lam Research Corporation | Methods for controlling retaining ring and wafer head tilt for chemical mechanical polishing |
US7481695B2 (en) | 2000-08-22 | 2009-01-27 | Lam Research Corporation | Polishing apparatus and methods having high processing workload for controlling polishing pressure applied by polishing head |
US6585572B1 (en) | 2000-08-22 | 2003-07-01 | Lam Research Corporation | Subaperture chemical mechanical polishing system |
US6640155B2 (en) | 2000-08-22 | 2003-10-28 | Lam Research Corporation | Chemical mechanical polishing apparatus and methods with central control of polishing pressure applied by polishing head |
US6471566B1 (en) | 2000-09-18 | 2002-10-29 | Lam Research Corporation | Sacrificial retaining ring CMP system and methods for implementing the same |
US6443815B1 (en) | 2000-09-22 | 2002-09-03 | Lam Research Corporation | Apparatus and methods for controlling pad conditioning head tilt for chemical mechanical polishing |
KR100421445B1 (ko) * | 2001-09-28 | 2004-03-09 | 삼성전자주식회사 | 연마 헤드 조립 방법 및 연마 헤드 조립 시의 공기 누설검사장치 |
US6592437B1 (en) | 2001-12-26 | 2003-07-15 | Lam Research Corporation | Active gimbal ring with internal gel and methods for making same |
US6736720B2 (en) * | 2001-12-26 | 2004-05-18 | Lam Research Corporation | Apparatus and methods for controlling wafer temperature in chemical mechanical polishing |
US6937915B1 (en) | 2002-03-28 | 2005-08-30 | Lam Research Corporation | Apparatus and methods for detecting transitions of wafer surface properties in chemical mechanical polishing for process status and control |
KR100452738B1 (ko) * | 2002-04-08 | 2004-10-14 | (주) 디에스테크노 | 쿼츠 디스크 가공용 진공 척장치 |
TWI393209B (zh) | 2003-02-10 | 2013-04-11 | Ebara Corp | 研磨基板之方法 |
US7255771B2 (en) * | 2004-03-26 | 2007-08-14 | Applied Materials, Inc. | Multiple zone carrier head with flexible membrane |
KR101057228B1 (ko) | 2008-10-21 | 2011-08-16 | 주식회사 엘지실트론 | 경면연마장치의 가압헤드 |
KR101160266B1 (ko) * | 2009-10-07 | 2012-06-27 | 주식회사 엘지실트론 | 웨이퍼 지지 부재, 그 제조방법 및 이를 포함하는 웨이퍼 연마 유닛 |
WO2013184349A1 (en) * | 2012-06-05 | 2013-12-12 | Applied Materials, Inc. | Two-part retaining ring with interlock features |
JP2015171734A (ja) * | 2012-07-18 | 2015-10-01 | 旭硝子株式会社 | 板状体の研磨装置及び板状体の研磨方法 |
SG10201606197XA (en) | 2015-08-18 | 2017-03-30 | Ebara Corp | Substrate adsorption method, substrate holding apparatus, substrate polishing apparatus, elastic film, substrate adsorption determination method for substrate holding apparatus, and pressure control method for substrate holding apparatus |
JP6463303B2 (ja) * | 2016-05-13 | 2019-01-30 | 株式会社荏原製作所 | 弾性膜、基板保持装置、基板研磨装置、基板保持装置における基板吸着判定方法および圧力制御方法 |
JP7300297B2 (ja) * | 2019-04-02 | 2023-06-29 | 株式会社荏原製作所 | 積層メンブレン、積層メンブレンを備える基板保持装置および基板処理装置 |
CN114505782B (zh) * | 2020-11-17 | 2023-08-04 | 长鑫存储技术有限公司 | 固定装置及检测系统 |
Family Cites Families (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2527232B2 (ja) * | 1989-03-16 | 1996-08-21 | 株式会社日立製作所 | 研磨装置 |
US5205082A (en) * | 1991-12-20 | 1993-04-27 | Cybeq Systems, Inc. | Wafer polisher head having floating retainer ring |
JPH0697618A (ja) * | 1992-09-10 | 1994-04-08 | Toshiba Lighting & Technol Corp | 混成集積回路装置とその製造方法 |
DE69316849T2 (de) * | 1992-11-27 | 1998-09-10 | Ebara Corp., Tokio/Tokyo | Verfahren und Gerät zum Polieren eines Werkstückes |
US5584746A (en) * | 1993-10-18 | 1996-12-17 | Shin-Etsu Handotai Co., Ltd. | Method of polishing semiconductor wafers and apparatus therefor |
JP2891068B2 (ja) * | 1993-10-18 | 1999-05-17 | 信越半導体株式会社 | ウエーハの研磨方法および研磨装置 |
US5624299A (en) * | 1993-12-27 | 1997-04-29 | Applied Materials, Inc. | Chemical mechanical polishing apparatus with improved carrier and method of use |
US5423716A (en) * | 1994-01-05 | 1995-06-13 | Strasbaugh; Alan | Wafer-handling apparatus having a resilient membrane which holds wafer when a vacuum is applied |
-
1998
- 1998-05-11 JP JP14507598A patent/JP2000015572A/ja active Pending
-
1999
- 1999-03-24 US US09/275,497 patent/US6110026A/en not_active Expired - Fee Related
- 1999-03-30 TW TW088104966A patent/TW440493B/zh active
- 1999-03-30 SG SG1999001566A patent/SG72940A1/en unknown
- 1999-03-31 DE DE69900398T patent/DE69900398D1/de not_active Expired - Lifetime
- 1999-03-31 EP EP99105190A patent/EP0953408B1/de not_active Expired - Lifetime
- 1999-04-27 KR KR1019990014967A patent/KR100301881B1/ko not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
EP0953408A2 (de) | 1999-11-03 |
KR19990083502A (ko) | 1999-11-25 |
EP0953408A3 (de) | 2000-01-12 |
EP0953408B1 (de) | 2001-10-31 |
DE69900398D1 (de) | 2001-12-06 |
JP2000015572A (ja) | 2000-01-18 |
KR100301881B1 (ko) | 2001-10-29 |
SG72940A1 (en) | 2000-05-23 |
US6110026A (en) | 2000-08-29 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
TW440493B (en) | Carrier and polishing apparatus | |
JP4217400B2 (ja) | ウェーハ研磨装置及びウェーハ研磨方法 | |
US6277009B1 (en) | Carrier head including a flexible membrane and a compliant backing member for a chemical mechanical polishing apparatus | |
US8029333B2 (en) | Device for polishing peripheral edge of semiconductor wafer | |
KR101042559B1 (ko) | 반도체 웨이퍼들을 연마하기 위한 연마 헤드 | |
JP2002527894A (ja) | 可変研磨圧キャリヤヘッドを備えた半導体ウエハ研磨装置 | |
TWI402135B (zh) | 研磨裝置 | |
JP5072161B2 (ja) | ウェーハキャリヤヘッド組立体 | |
EP1371449A3 (de) | Chemisch-mechanische Polierträgervorrichtung mit einem schwimmenden Halterring und einer Trägerplatte mit mehrzonaler Rucksteuervorrichtung | |
JPH0579467B2 (de) | ||
US6210260B1 (en) | Carrier and CMP apparatus | |
KR100440627B1 (ko) | 연마 장치의 연마 헤드 구조 | |
JP4519972B2 (ja) | 化学機械研磨の制御可能圧力及びローディング領域を有するキャリヤヘッド | |
CN110788746A (zh) | 研磨装置用的夹具及装卸顶环的至少一部分的方法 | |
CN100364720C (zh) | 在化学机械抛光过程中抛光晶片的方法和携载头 | |
KR100609843B1 (ko) | 웨이퍼 연마장치 | |
JP2003031531A (ja) | ウェーハ研磨装置及びウェーハ研磨方法 | |
JPH0671689B2 (ja) | 研磨、研削用真空吸着装置 | |
TWI833934B (zh) | 積層膜、具備積層膜的基板保持裝置及基板處理裝置 | |
JP2002096261A (ja) | 基板保持装置及び該基板保持装置を備えたポリッシング装置 | |
JP7539520B2 (ja) | Cmp装置 | |
JP2558864Y2 (ja) | ラッピング砥石定盤 | |
JP3225181B2 (ja) | 研磨装置 | |
JP4197884B2 (ja) | ポリシング装置 | |
JP2019214082A (ja) | Cmp装置及び方法 |