TW434870B - Ground ring for metal electronic package - Google Patents

Ground ring for metal electronic package Download PDF

Info

Publication number
TW434870B
TW434870B TW086102000A TW86102000A TW434870B TW 434870 B TW434870 B TW 434870B TW 086102000 A TW086102000 A TW 086102000A TW 86102000 A TW86102000 A TW 86102000A TW 434870 B TW434870 B TW 434870B
Authority
TW
Taiwan
Prior art keywords
annular channel
side wall
depth
groove
separated
Prior art date
Application number
TW086102000A
Other languages
English (en)
Chinese (zh)
Inventor
Paul R Hoffman
Markus K Liebhard
Original Assignee
Exactech In
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US08/749,259 external-priority patent/US5764484A/en
Application filed by Exactech In filed Critical Exactech In
Application granted granted Critical
Publication of TW434870B publication Critical patent/TW434870B/zh

Links

Classifications

    • H10W76/12—
    • H10W90/701—
    • H10W70/68—
    • H10W70/6875—
    • H10W72/00—
    • H10W74/114—
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/45001—Core members of the connector
    • H01L2224/45099—Material
    • H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H01L2224/45117—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 400°C and less than 950°C
    • H01L2224/45124—Aluminium (Al) as principal constituent
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/45001—Core members of the connector
    • H01L2224/45099—Material
    • H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
    • H01L2224/45144—Gold (Au) as principal constituent
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/45001—Core members of the connector
    • H01L2224/45099—Material
    • H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
    • H01L2224/45147—Copper (Cu) as principal constituent
    • H10W70/682—
    • H10W72/075—
    • H10W72/07554—
    • H10W72/547—
    • H10W72/884—
    • H10W74/00—
    • H10W90/734—
    • H10W90/754—

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
TW086102000A 1995-11-20 1997-02-20 Ground ring for metal electronic package TW434870B (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US737495P 1995-11-20 1995-11-20
US08/749,259 US5764484A (en) 1996-11-15 1996-11-15 Ground ring for a metal electronic package

Publications (1)

Publication Number Publication Date
TW434870B true TW434870B (en) 2001-05-16

Family

ID=26676905

Family Applications (1)

Application Number Title Priority Date Filing Date
TW086102000A TW434870B (en) 1995-11-20 1997-02-20 Ground ring for metal electronic package

Country Status (5)

Country Link
EP (1) EP0956589A1 (index.php)
JP (1) JP2000500619A (index.php)
KR (1) KR19990071466A (index.php)
TW (1) TW434870B (index.php)
WO (1) WO1997019470A1 (index.php)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6716363B2 (ja) * 2016-06-28 2020-07-01 株式会社アムコー・テクノロジー・ジャパン 半導体パッケージ及びその製造方法

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3819431A (en) * 1971-10-05 1974-06-25 Kulite Semiconductor Products Method of making transducers employing integral protective coatings and supports
JPS58169943A (ja) * 1982-03-29 1983-10-06 Fujitsu Ltd 半導体装置
US5023398A (en) * 1988-10-05 1991-06-11 Olin Corporation Aluminum alloy semiconductor packages
US4939316A (en) * 1988-10-05 1990-07-03 Olin Corporation Aluminum alloy semiconductor packages
JP2598129B2 (ja) * 1989-05-18 1997-04-09 三菱電機株式会社 半導体装置
JPH0423441A (ja) * 1990-05-18 1992-01-27 Fujitsu Ltd セラミックパッケージ半導体装置およびその製造方法
US6262477B1 (en) * 1993-03-19 2001-07-17 Advanced Interconnect Technologies Ball grid array electronic package
US5353195A (en) * 1993-07-09 1994-10-04 General Electric Company Integral power and ground structure for multi-chip modules
DE59403626D1 (de) * 1993-09-29 1997-09-11 Siemens Nv Verfahren zur Herstellung einer zwei- oder mehrlagigen Verdrahtung und danach hergestellte zwei- oder mehrlagige Verdrahtung
US5629835A (en) * 1994-07-19 1997-05-13 Olin Corporation Metal ball grid array package with improved thermal conductivity

Also Published As

Publication number Publication date
KR19990071466A (ko) 1999-09-27
EP0956589A4 (index.php) 1999-11-17
WO1997019470A1 (en) 1997-05-29
JP2000500619A (ja) 2000-01-18
EP0956589A1 (en) 1999-11-17

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Legal Events

Date Code Title Description
GD4A Issue of patent certificate for granted invention patent
MM4A Annulment or lapse of patent due to non-payment of fees