EP0956589A4 - - Google Patents

Info

Publication number
EP0956589A4
EP0956589A4 EP96941385A EP96941385A EP0956589A4 EP 0956589 A4 EP0956589 A4 EP 0956589A4 EP 96941385 A EP96941385 A EP 96941385A EP 96941385 A EP96941385 A EP 96941385A EP 0956589 A4 EP0956589 A4 EP 0956589A4
Authority
EP
European Patent Office
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP96941385A
Other versions
EP0956589A1 (en
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US08/749,259 external-priority patent/US5764484A/en
Application filed filed Critical
Publication of EP0956589A4 publication Critical patent/EP0956589A4/xx
Publication of EP0956589A1 publication Critical patent/EP0956589A1/en
Withdrawn legal-status Critical Current

Links

Classifications

    • H10W76/12—
    • H10W90/701—
    • H10W70/68—
    • H10W70/6875—
    • H10W72/00—
    • H10W74/114—
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/45001—Core members of the connector
    • H01L2224/45099—Material
    • H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H01L2224/45117—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 400°C and less than 950°C
    • H01L2224/45124—Aluminium (Al) as principal constituent
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/45001—Core members of the connector
    • H01L2224/45099—Material
    • H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
    • H01L2224/45144—Gold (Au) as principal constituent
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/45001—Core members of the connector
    • H01L2224/45099—Material
    • H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
    • H01L2224/45147—Copper (Cu) as principal constituent
    • H10W70/682—
    • H10W72/075—
    • H10W72/07554—
    • H10W72/547—
    • H10W72/884—
    • H10W74/00—
    • H10W90/734—
    • H10W90/754—
EP96941385A 1995-11-20 1996-11-18 Ground ring for metal electronic package Withdrawn EP0956589A1 (en)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
US737495P 1995-11-20 1995-11-20
US7374P 1995-11-20
US08/749,259 US5764484A (en) 1996-11-15 1996-11-15 Ground ring for a metal electronic package
US749259 1996-11-15
PCT/US1996/018479 WO1997019470A1 (en) 1995-11-20 1996-11-18 Ground ring for metal electronic package

Publications (2)

Publication Number Publication Date
EP0956589A4 true EP0956589A4 (index.php) 1999-11-17
EP0956589A1 EP0956589A1 (en) 1999-11-17

Family

ID=26676905

Family Applications (1)

Application Number Title Priority Date Filing Date
EP96941385A Withdrawn EP0956589A1 (en) 1995-11-20 1996-11-18 Ground ring for metal electronic package

Country Status (5)

Country Link
EP (1) EP0956589A1 (index.php)
JP (1) JP2000500619A (index.php)
KR (1) KR19990071466A (index.php)
TW (1) TW434870B (index.php)
WO (1) WO1997019470A1 (index.php)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6716363B2 (ja) * 2016-06-28 2020-07-01 株式会社アムコー・テクノロジー・ジャパン 半導体パッケージ及びその製造方法

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4939316A (en) * 1988-10-05 1990-07-03 Olin Corporation Aluminum alloy semiconductor packages
EP0457260A1 (en) * 1990-05-18 1991-11-21 Fujitsu Limited Semiconductor device having a ceramic package
US5091772A (en) * 1989-05-18 1992-02-25 Mitsubishi Denki Kabushiki Kaisha Semiconductor device and package
WO1994022168A1 (en) * 1993-03-19 1994-09-29 Olin Corporation Ball grid array electronic package
EP0645953A1 (de) * 1993-09-29 1995-03-29 Siemens NV Verfahren zur Herstellung einer zwei- oder mehrlagigen Verdrahtung und danach hergestellte zwei- oder mehrlagige Verdrahtung
WO1996003020A1 (en) * 1994-07-19 1996-02-01 Olin Corporation Integrally bumped electronic package components

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3819431A (en) * 1971-10-05 1974-06-25 Kulite Semiconductor Products Method of making transducers employing integral protective coatings and supports
JPS58169943A (ja) * 1982-03-29 1983-10-06 Fujitsu Ltd 半導体装置
US5023398A (en) * 1988-10-05 1991-06-11 Olin Corporation Aluminum alloy semiconductor packages
US5353195A (en) * 1993-07-09 1994-10-04 General Electric Company Integral power and ground structure for multi-chip modules

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4939316A (en) * 1988-10-05 1990-07-03 Olin Corporation Aluminum alloy semiconductor packages
US5091772A (en) * 1989-05-18 1992-02-25 Mitsubishi Denki Kabushiki Kaisha Semiconductor device and package
EP0457260A1 (en) * 1990-05-18 1991-11-21 Fujitsu Limited Semiconductor device having a ceramic package
WO1994022168A1 (en) * 1993-03-19 1994-09-29 Olin Corporation Ball grid array electronic package
EP0645953A1 (de) * 1993-09-29 1995-03-29 Siemens NV Verfahren zur Herstellung einer zwei- oder mehrlagigen Verdrahtung und danach hergestellte zwei- oder mehrlagige Verdrahtung
WO1996003020A1 (en) * 1994-07-19 1996-02-01 Olin Corporation Integrally bumped electronic package components

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
See also references of WO9719470A1 *

Also Published As

Publication number Publication date
KR19990071466A (ko) 1999-09-27
TW434870B (en) 2001-05-16
WO1997019470A1 (en) 1997-05-29
JP2000500619A (ja) 2000-01-18
EP0956589A1 (en) 1999-11-17

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Legal Events

Date Code Title Description
PUAI Public reference made under article 153(3) epc to a published international application that has entered the european phase

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17P Request for examination filed

Effective date: 19980520

A4 Supplementary search report drawn up and despatched

Effective date: 19990521

AK Designated contracting states

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Designated state(s): DE GB

STAA Information on the status of an ep patent application or granted ep patent

Free format text: STATUS: THE APPLICATION IS DEEMED TO BE WITHDRAWN

18D Application deemed to be withdrawn

Effective date: 20010601