TW430899B - Method of manufacturing cathode of plasma etching apparatus, and cathode manufactured thereby - Google Patents

Method of manufacturing cathode of plasma etching apparatus, and cathode manufactured thereby

Info

Publication number
TW430899B
TW430899B TW087116277A TW87116277A TW430899B TW 430899 B TW430899 B TW 430899B TW 087116277 A TW087116277 A TW 087116277A TW 87116277 A TW87116277 A TW 87116277A TW 430899 B TW430899 B TW 430899B
Authority
TW
Taiwan
Prior art keywords
cathode
plasma etching
etching apparatus
manufacturing
silicon substrate
Prior art date
Application number
TW087116277A
Other languages
English (en)
Inventor
Jin-Sung Kim
Young-Gu Lee
Kyoung-Man Shim
Kyue-Sang Choi
Original Assignee
Samsung Electronics Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Samsung Electronics Co Ltd filed Critical Samsung Electronics Co Ltd
Application granted granted Critical
Publication of TW430899B publication Critical patent/TW430899B/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J9/00—Apparatus or processes specially adapted for the manufacture, installation, removal, maintenance of electric discharge tubes, discharge lamps, or parts thereof; Recovery of material from discharge tubes or lamps
    • H01J9/02—Manufacture of electrodes or electrode systems
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32009—Arrangements for generation of plasma specially adapted for examination or treatment of objects, e.g. plasma sources
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J1/00—Details of electrodes, of magnetic control means, of screens, or of the mounting or spacing thereof, common to two or more basic types of discharge tubes or lamps
    • H01J1/02—Main electrodes
    • H01J1/30—Cold cathodes, e.g. field-emissive cathode
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32431—Constructional details of the reactor
    • H01J37/32532—Electrodes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J9/00—Apparatus or processes specially adapted for the manufacture, installation, removal, maintenance of electric discharge tubes, discharge lamps, or parts thereof; Recovery of material from discharge tubes or lamps
    • H01J9/02—Manufacture of electrodes or electrode systems
    • H01J9/14—Manufacture of electrodes or electrode systems of non-emitting electrodes

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Plasma & Fusion (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Weting (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Plasma Technology (AREA)
  • Drying Of Semiconductors (AREA)
TW087116277A 1998-01-26 1998-09-30 Method of manufacturing cathode of plasma etching apparatus, and cathode manufactured thereby TW430899B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1019980002382A KR100265289B1 (ko) 1998-01-26 1998-01-26 플라즈마식각장치의 캐소우드 제조방법 및 이에 따라 제조되는 캐소우드

Publications (1)

Publication Number Publication Date
TW430899B true TW430899B (en) 2001-04-21

Family

ID=19532162

Family Applications (1)

Application Number Title Priority Date Filing Date
TW087116277A TW430899B (en) 1998-01-26 1998-09-30 Method of manufacturing cathode of plasma etching apparatus, and cathode manufactured thereby

Country Status (4)

Country Link
US (1) US6150762A (zh)
JP (1) JPH11219940A (zh)
KR (1) KR100265289B1 (zh)
TW (1) TW430899B (zh)

Families Citing this family (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100430664B1 (ko) 1997-10-03 2004-06-16 가부시끼가이샤 히다치 세이사꾸쇼 가스방전형표시장치의제조방법
KR100465844B1 (ko) * 2002-06-03 2005-01-13 주식회사 티씨케이 에칭장비용 캐소드전극의 홀 가공 방법
AU2002353591A1 (en) * 2002-11-09 2004-06-03 Worldex Int Method and device for polishing plasma chamber cathode holes
US7910218B2 (en) 2003-10-22 2011-03-22 Applied Materials, Inc. Cleaning and refurbishing chamber components having metal coatings
US7618769B2 (en) * 2004-06-07 2009-11-17 Applied Materials, Inc. Textured chamber surface
US7670436B2 (en) 2004-11-03 2010-03-02 Applied Materials, Inc. Support ring assembly
KR100710704B1 (ko) * 2005-03-23 2007-04-24 주식회사 월덱스 플라즈마 챔버 캐소드의 관통구멍 폴리싱 방법과 장치
US8617672B2 (en) 2005-07-13 2013-12-31 Applied Materials, Inc. Localized surface annealing of components for substrate processing chambers
US7762114B2 (en) 2005-09-09 2010-07-27 Applied Materials, Inc. Flow-formed chamber component having a textured surface
US9127362B2 (en) 2005-10-31 2015-09-08 Applied Materials, Inc. Process kit and target for substrate processing chamber
US8647484B2 (en) 2005-11-25 2014-02-11 Applied Materials, Inc. Target for sputtering chamber
US7981262B2 (en) 2007-01-29 2011-07-19 Applied Materials, Inc. Process kit for substrate processing chamber
US7942969B2 (en) 2007-05-30 2011-05-17 Applied Materials, Inc. Substrate cleaning chamber and components
KR100922620B1 (ko) * 2007-08-24 2009-10-21 하나실리콘(주) 플라즈마 처리 장치용 실리콘 소재의 제조 방법
KR100918076B1 (ko) * 2007-08-24 2009-09-22 하나실리콘(주) 플라즈마 처리 장치용 실리콘 소재의 제조 방법
US9101954B2 (en) 2013-09-17 2015-08-11 Applied Materials, Inc. Geometries and patterns for surface texturing to increase deposition retention
US9406534B2 (en) * 2014-09-17 2016-08-02 Lam Research Corporation Wet clean process for cleaning plasma processing chamber components

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3967150A (en) * 1975-01-31 1976-06-29 Varian Associates Grid controlled electron source and method of making same
US4745326A (en) * 1986-12-10 1988-05-17 The United States Of America As Represented By The Secretary Of The Navy Method of manufacturing integral shadow gridded controlled porosity, dispenser cathodes
EP0296348B1 (de) * 1987-05-27 1993-03-31 Siemens Aktiengesellschaft Ätzverfahren zum Erzeugen von Lochöffnungen oder Gräben in n-dotiertem Silizium
NL8701530A (nl) * 1987-06-30 1989-01-16 Stichting Fund Ond Material Werkwijze voor het behandelen van oppervlakken van substraten met behulp van een plasma en reactor voor het uitvoeren van die werkwijze.
US5395481A (en) * 1993-10-18 1995-03-07 Regents Of The University Of California Method for forming silicon on a glass substrate

Also Published As

Publication number Publication date
US6150762A (en) 2000-11-21
KR19990066450A (ko) 1999-08-16
JPH11219940A (ja) 1999-08-10
KR100265289B1 (ko) 2000-09-15

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Legal Events

Date Code Title Description
GD4A Issue of patent certificate for granted invention patent
MM4A Annulment or lapse of patent due to non-payment of fees