TW429500B - Method and apparatus for testing semiconductor devices - Google Patents

Method and apparatus for testing semiconductor devices

Info

Publication number
TW429500B
TW429500B TW088112300A TW88112300A TW429500B TW 429500 B TW429500 B TW 429500B TW 088112300 A TW088112300 A TW 088112300A TW 88112300 A TW88112300 A TW 88112300A TW 429500 B TW429500 B TW 429500B
Authority
TW
Taiwan
Prior art keywords
semiconductor devices
adhering
position correction
tape
testing
Prior art date
Application number
TW088112300A
Other languages
English (en)
Inventor
Kenji Itasaka
Teruki Kamifukumoto
Yuji Akasaki
Nobuo Oyama
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Application granted granted Critical
Publication of TW429500B publication Critical patent/TW429500B/zh

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/26—Testing of individual semiconductor devices
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/04—Housings; Supporting members; Arrangements of terminals
    • G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/302—Contactless testing
    • G01R31/308—Contactless testing using non-ionising electromagnetic radiation, e.g. optical radiation
    • G01R31/311—Contactless testing using non-ionising electromagnetic radiation, e.g. optical radiation of integrated circuits

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Power Engineering (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
TW088112300A 1998-12-01 1999-07-20 Method and apparatus for testing semiconductor devices TW429500B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP10341936A JP2000162275A (ja) 1998-12-01 1998-12-01 半導体試験方法及び半導体試験装置

Publications (1)

Publication Number Publication Date
TW429500B true TW429500B (en) 2001-04-11

Family

ID=18349914

Family Applications (1)

Application Number Title Priority Date Filing Date
TW088112300A TW429500B (en) 1998-12-01 1999-07-20 Method and apparatus for testing semiconductor devices

Country Status (4)

Country Link
US (1) US6392433B2 (zh)
JP (1) JP2000162275A (zh)
KR (1) KR100681772B1 (zh)
TW (1) TW429500B (zh)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106093742A (zh) * 2016-06-06 2016-11-09 深圳市矽电半导体设备有限公司 一种led测试扎针位置校正方法及装置

Families Citing this family (24)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3738176B2 (ja) * 2000-08-03 2006-01-25 三洋電機株式会社 半導体装置の製造方法
JP4583581B2 (ja) * 2000-11-07 2010-11-17 ルネサスエレクトロニクス株式会社 固体撮像装置の製造方法
SG111091A1 (en) * 2002-10-29 2005-05-30 Advanced Systems Automation Handler for semiconductor singulation and method therefor
US7014527B2 (en) * 2003-12-16 2006-03-21 Xerox Corporation Die level testing using machine grooved storage tray with vacuum channels
JP5172211B2 (ja) * 2007-05-29 2013-03-27 株式会社サキコーポレーション 被検査体の検査システム
TW201007868A (en) * 2008-08-15 2010-02-16 Microelectonics Technology Inc Probing and sorting device
AT507322B1 (de) * 2008-10-07 2011-07-15 Nanoident Technologies Ag Schaltvorrichtung zur elektrischen kontaktprüfung
JP5515024B2 (ja) * 2010-11-24 2014-06-11 株式会社日本マイクロニクス チップ積層デバイス検査方法及びチップ積層デバイス再配列ユニット並びにチップ積層デバイス用検査装置
US9099547B2 (en) * 2011-10-04 2015-08-04 Infineon Technologies Ag Testing process for semiconductor devices
US8883565B2 (en) 2011-10-04 2014-11-11 Infineon Technologies Ag Separation of semiconductor devices from a wafer carrier
CN102590566B (zh) * 2012-03-16 2014-06-04 苏州工业园区世纪福科技有限公司 一种电子产品测试夹具的自动对准方法
JP5825502B2 (ja) * 2013-02-27 2015-12-02 株式会社東京精密 プローブ装置
US20150241477A1 (en) * 2014-02-27 2015-08-27 Texas Instruments Incorporated Effective and efficient solution for pin to pad contactor on wide range of smd package tolerances using a reverse funnel design anvil handler mechanism
US9455192B2 (en) 2014-03-26 2016-09-27 Infineon Technologies Ag Kerf preparation for backside metallization
US9397055B2 (en) 2014-05-29 2016-07-19 Infineon Technologies Ag Processing of thick metal pads
US9618570B2 (en) 2014-06-06 2017-04-11 Advantest Corporation Multi-configurable testing module for automated testing of a device
US9618574B2 (en) * 2014-06-06 2017-04-11 Advantest Corporation Controlling automated testing of devices
US9933454B2 (en) * 2014-06-06 2018-04-03 Advantest Corporation Universal test floor system
US9638749B2 (en) * 2014-06-06 2017-05-02 Advantest Corporation Supporting automated testing of devices in a test floor system
US9678148B2 (en) 2014-06-06 2017-06-13 Advantest Corporation Customizable tester having testing modules for automated testing of devices
US10852321B2 (en) 2016-08-19 2020-12-01 Delta Design, Inc. Test handler head having reverse funnel design
CN108132362B (zh) * 2017-12-04 2020-05-01 国家电网公司 变压器绕组变形高空试验钳
CN113740701B (zh) * 2020-05-28 2024-03-08 第一检测有限公司 环境控制设备及芯片测试系统
KR102518092B1 (ko) * 2021-05-03 2023-04-06 매그나칩 반도체 유한회사 디스플레이 드라이버 ic의 신뢰성 테스트 방법

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4046985A (en) * 1974-11-25 1977-09-06 International Business Machines Corporation Semiconductor wafer alignment apparatus
JPS6387832U (zh) * 1986-11-26 1988-06-08
JPH0567652A (ja) * 1991-09-05 1993-03-19 Tokyo Electron Ltd プローブ装置
JPH05341000A (ja) * 1992-06-05 1993-12-24 Fujitsu Ltd 半導体チップの試験方法
KR0178134B1 (ko) * 1996-10-01 1999-04-15 삼성전자주식회사 불연속 절연층 영역을 갖는 반도체 집적회로 소자 및 그 제조방법
JPH10163281A (ja) * 1996-10-04 1998-06-19 Hitachi Ltd 半導体素子およびその製造方法
US5999268A (en) * 1996-10-18 1999-12-07 Tokyo Electron Limited Apparatus for aligning a semiconductor wafer with an inspection contactor
JPH10160791A (ja) * 1996-11-29 1998-06-19 Ricoh Co Ltd 半導体パッケージ搬送方法および半導体パッケージ搬送装置
JP3324641B2 (ja) * 1998-02-20 2002-09-17 日本電気株式会社 半導体装置の製造方法

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106093742A (zh) * 2016-06-06 2016-11-09 深圳市矽电半导体设备有限公司 一种led测试扎针位置校正方法及装置
CN106093742B (zh) * 2016-06-06 2019-04-26 深圳市矽电半导体设备有限公司 一种led测试扎针位置校正方法及装置

Also Published As

Publication number Publication date
US20010043076A1 (en) 2001-11-22
US6392433B2 (en) 2002-05-21
KR20000047438A (ko) 2000-07-25
KR100681772B1 (ko) 2007-02-12
JP2000162275A (ja) 2000-06-16

Similar Documents

Publication Publication Date Title
TW429500B (en) Method and apparatus for testing semiconductor devices
SG78283A1 (en) Method and apparatus for performing operative testing on an integrated circuit
WO2005065258A3 (en) Active wafer probe
EP0671687A3 (en) System for automatically checking an electronic device during periods of rest.
AU2002359736A1 (en) Method and apparatus for mounting a lidless semiconductor device
TW327250B (en) Wafer dicing/bonding sheet and process for producing semiconductor device
NO20014371D0 (no) Apparat og fremgangsmåte for en integrert krets som har höye Q-reaktive komponenter
AU4237696A (en) Mounting spring elements on semiconductor devices, and wafer-level testing methodology
EP1045438B8 (en) Probe card for testing semiconductor device, and semiconductor device test method
MY131229A (en) Wafer planarization apparatus
SG103931A1 (en) Dicing tape applying apparatus and back-grinding/dicing tape applying system
WO2004019013A3 (en) Method and apparatus for receiving a removable media member
EP0858110A4 (en) DISCONNECTING METHOD, METHOD FOR TRANSMITTING A THIN FILM COMPONENT, THIN FILM INTEGRATED CIRCUIT COMPONENT, AND LIQUID CRYSTAL DISPLAY COMPONENT PRODUCED USING THE TRANSFER METHOD
AU2003267062A1 (en) Method and device for producing an electrical connection of sub-assemblies and modules
EP1098167A3 (en) Jig for use in measuring mounting accuracy of mounting device and method of measuring mounting accuracy of mounting device
AU6872596A (en) Imaging system and method
GB9505893D0 (en) Apparatus and method for testing circuit traces on a flexible substrate
FI973555A (fi) Menetelmä ohmisen kontaktin tuottamiseksi sekä tällaisella ohmisella kontaktilla varustettu puolijohdeväline
CN1983549B (zh) 用于布置器件进行处理的装置和方法
TW363131B (en) Test device, test assembly, method for testing and method for calibrating a test device
WO2002095587A3 (en) Method and apparatus for fault tolerant and flexible test signature generator
GB2390167B (en) Method and apparatus for testing an electrical component
GB2390693B (en) Testing device and method for testing backplanes and connectors on backplanes
AU7119998A (en) Method and apparatus for measuring temperature with an integrated circuit device
MY114471A (en) Ic testing method and apparatus

Legal Events

Date Code Title Description
GD4A Issue of patent certificate for granted invention patent
MM4A Annulment or lapse of patent due to non-payment of fees