TW421827B - Substrate cleaning apparatus - Google Patents

Substrate cleaning apparatus Download PDF

Info

Publication number
TW421827B
TW421827B TW088115421A TW88115421A TW421827B TW 421827 B TW421827 B TW 421827B TW 088115421 A TW088115421 A TW 088115421A TW 88115421 A TW88115421 A TW 88115421A TW 421827 B TW421827 B TW 421827B
Authority
TW
Taiwan
Prior art keywords
cleaning
substrate
nozzle
support
cleaned
Prior art date
Application number
TW088115421A
Other languages
English (en)
Chinese (zh)
Inventor
Kenichi Mimori
Motonari Sai
Yasuhiko Kasama
Tadahiro Omi
Original Assignee
Furontekku Kk
Tadahiro Omi
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP28706798A external-priority patent/JP3725349B2/ja
Priority claimed from JP06410799A external-priority patent/JP3681916B2/ja
Application filed by Furontekku Kk, Tadahiro Omi filed Critical Furontekku Kk
Application granted granted Critical
Publication of TW421827B publication Critical patent/TW421827B/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
    • B08B3/02—Cleaning by the force of jets or sprays
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
    • B08B3/04—Cleaning involving contact with liquid
    • B08B3/10—Cleaning involving contact with liquid with additional treatment of the liquid or of the object being cleaned, e.g. by heat, by electricity or by vibration
    • B08B3/12—Cleaning involving contact with liquid with additional treatment of the liquid or of the object being cleaned, e.g. by heat, by electricity or by vibration by sonic or ultrasonic vibrations

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Cleaning By Liquid Or Steam (AREA)
TW088115421A 1998-10-08 1999-09-07 Substrate cleaning apparatus TW421827B (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP28706798A JP3725349B2 (ja) 1998-10-08 1998-10-08 洗浄装置
JP06410799A JP3681916B2 (ja) 1999-03-10 1999-03-10 基板洗浄装置

Publications (1)

Publication Number Publication Date
TW421827B true TW421827B (en) 2001-02-11

Family

ID=26405245

Family Applications (1)

Application Number Title Priority Date Filing Date
TW088115421A TW421827B (en) 1998-10-08 1999-09-07 Substrate cleaning apparatus

Country Status (2)

Country Link
KR (2) KR100344775B1 (ko)
TW (1) TW421827B (ko)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8268087B2 (en) 2007-12-27 2012-09-18 Tokyo Electron Limited Liquid processing apparatus, liquid processing method, and storage medium

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100484067B1 (ko) * 2002-06-12 2005-04-20 동부아남반도체 주식회사 반도체 소자의 제조 방법
KR100779027B1 (ko) * 2006-05-25 2007-11-23 세크론 주식회사 반도체 칩 승강장치
KR102169788B1 (ko) 2019-02-28 2020-10-26 주식회사 제이유코리아 공간 절약형 독립 워싱 유닛

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8268087B2 (en) 2007-12-27 2012-09-18 Tokyo Electron Limited Liquid processing apparatus, liquid processing method, and storage medium
TWI381471B (zh) * 2007-12-27 2013-01-01 Tokyo Electron Ltd Liquid treatment device, liquid treatment method and memory medium

Also Published As

Publication number Publication date
KR100360120B1 (ko) 2002-11-07
KR20020003850A (ko) 2002-01-15
KR20000028720A (ko) 2000-05-25
KR100344775B1 (ko) 2002-07-19

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Legal Events

Date Code Title Description
GD4A Issue of patent certificate for granted invention patent
MM4A Annulment or lapse of patent due to non-payment of fees