TW416881B - Process for the reflow soldering of electronic components and soldering apparatus for the implementation of such a process - Google Patents

Process for the reflow soldering of electronic components and soldering apparatus for the implementation of such a process Download PDF

Info

Publication number
TW416881B
TW416881B TW088112437A TW88112437A TW416881B TW 416881 B TW416881 B TW 416881B TW 088112437 A TW088112437 A TW 088112437A TW 88112437 A TW88112437 A TW 88112437A TW 416881 B TW416881 B TW 416881B
Authority
TW
Taiwan
Prior art keywords
substrate
scope
patent application
item
electronic component
Prior art date
Application number
TW088112437A
Other languages
English (en)
Chinese (zh)
Inventor
Claude Carsac
Gilles Conor
Thierry Sindzingre
Denis Verbockhaven
Original Assignee
Air Liquide
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Air Liquide filed Critical Air Liquide
Application granted granted Critical
Publication of TW416881B publication Critical patent/TW416881B/zh

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3494—Heating methods for reflowing of solder
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/012—Soldering with the use of hot gas
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/08—Treatments involving gases
    • H05K2203/087—Using a reactive gas
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/09—Treatments involving charged particles
    • H05K2203/095—Plasma, e.g. for treating a substrate to improve adhesion with a conductor or for cleaning holes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
    • H05K2203/1157—Using means for chemical reduction

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
TW088112437A 1998-07-30 1999-07-22 Process for the reflow soldering of electronic components and soldering apparatus for the implementation of such a process TW416881B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR9809773A FR2781706B1 (fr) 1998-07-30 1998-07-30 Procede de brasage par refusion de composants electroniques et dispositif de brasage pour la mise en oeuvre d'un tel procede

Publications (1)

Publication Number Publication Date
TW416881B true TW416881B (en) 2001-01-01

Family

ID=9529206

Family Applications (1)

Application Number Title Priority Date Filing Date
TW088112437A TW416881B (en) 1998-07-30 1999-07-22 Process for the reflow soldering of electronic components and soldering apparatus for the implementation of such a process

Country Status (11)

Country Link
EP (1) EP1100644A1 (ja)
JP (1) JP2002521207A (ja)
KR (1) KR20010053616A (ja)
CN (1) CN1307508A (ja)
AU (1) AU4625399A (ja)
BR (1) BR9912560A (ja)
CA (1) CA2338157A1 (ja)
FR (1) FR2781706B1 (ja)
HU (1) HUP0104961A2 (ja)
TW (1) TW416881B (ja)
WO (1) WO2000006333A1 (ja)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6468833B2 (en) 2000-03-31 2002-10-22 American Air Liquide, Inc. Systems and methods for application of substantially dry atmospheric plasma surface treatment to various electronic component packaging and assembly methods
US6780225B2 (en) * 2002-05-24 2004-08-24 Vitronics Soltec, Inc. Reflow oven gas management system and method
CN100427273C (zh) * 2003-08-26 2008-10-22 宏达国际电子股份有限公司 电子元件载具
KR100975911B1 (ko) * 2008-03-17 2010-08-13 성안산업주식회사 황동과 태라스톤을 사용한 일체형 논 슬립부재
CN102173849B (zh) * 2011-02-18 2012-08-08 成都泰格微波技术股份有限公司 一种可靠的微波介质陶瓷与金属的焊接方法
CN106985564B (zh) * 2011-06-13 2019-03-08 千住金属工业株式会社 焊膏的印刷方法
ES2718380T3 (es) 2015-10-29 2019-07-01 Procter & Gamble Composición detergente líquida
FR3066935B1 (fr) * 2017-06-01 2019-06-28 Stiral Procede de brasage ou rechargement d'une piece a micro-interstices, et echangeur thermique obtenu par un tel procede.
KR102101455B1 (ko) * 2020-02-01 2020-04-16 김상군 셀렉티브 솔더링 장치
CN111360361B (zh) * 2020-03-26 2021-09-07 诚联电源股份有限公司 用于开关电源生产的电子线路板固定装置

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4921157A (en) * 1989-03-15 1990-05-01 Microelectronics Center Of North Carolina Fluxless soldering process
DE4032328A1 (de) * 1989-11-06 1991-09-19 Wls Karl Heinz Grasmann Weichl Verfahren und vorrichtung zur verarbeitung von zu verloetenden fuegepartnern
US5345056A (en) * 1991-12-12 1994-09-06 Motorola, Inc. Plasma based soldering by indirect heating

Also Published As

Publication number Publication date
CA2338157A1 (fr) 2000-02-10
JP2002521207A (ja) 2002-07-16
BR9912560A (pt) 2001-05-02
FR2781706A1 (fr) 2000-02-04
CN1307508A (zh) 2001-08-08
EP1100644A1 (fr) 2001-05-23
WO2000006333A1 (fr) 2000-02-10
FR2781706B1 (fr) 2000-08-25
KR20010053616A (ko) 2001-06-25
HUP0104961A2 (en) 2002-05-29
AU4625399A (en) 2000-02-21

Similar Documents

Publication Publication Date Title
TW416881B (en) Process for the reflow soldering of electronic components and soldering apparatus for the implementation of such a process
US5941448A (en) Method for dry fluxing of metallic surfaces, before soldering or tinning, using an atmosphere which includes water vapor
CN1095316C (zh) 波峰焊接方法和装置
TW507503B (en) Method of producing electronic part with bumps and method of producing electronic part
TW323429B (ja)
TWI289491B (en) Reflow soldering method
US5433820A (en) Method and apparatus for dry process fluxing
US6021940A (en) Method and apparatus for reflow soldering metallic surfaces
TW200533448A (en) Method for reflow soldering
JP4818181B2 (ja) 半田ペースト、部品搭載方法及び部品搭載装置
CN107112248A (zh) 芯片接合装置以及芯片接合方法
JPH0783930B2 (ja) 電子部品の基板への取り付け方法と装置
JP2013233549A (ja) 発電の際の電力及び排ガスを利用する半田付け装置及び半田付け方法
TW434073B (en) Process for the reflow soldering of electronic components using predeposited spots of solder alloy and soldering apparatus for the implementation of such a process
JP2016164987A (ja) 発電の際の電力及び排ガスを利用する半田付け装置及び半田付け方法
JP2007109859A (ja) 電子部品の製造方法
JP3313973B2 (ja) 水蒸気を包含する雰囲気を用いるはんだ付け又はスズめっき前に金属表面を乾燥フラックス処理するための方法
JP2008229690A (ja) はんだ付け方法およびそれに用いる装置
TW548346B (en) Process and apparatus for treating metal surfaces by dry means
JPH0758830B2 (ja) プリント基板の半田付け方法
KR100837734B1 (ko) 초음파를 이용한 솔더볼 본딩방법
CN114473112A (zh) 一种拆焊装置、系统及方法
CN115119471A (zh) 用于将发热构件与冷却装置连接的方法
CN114473114A (zh) 一种利用微波焊接器件的焊接装置、系统及方法
JPS62151266A (ja) 気相式はんだ付け装置

Legal Events

Date Code Title Description
GD4A Issue of patent certificate for granted invention patent
MM4A Annulment or lapse of patent due to non-payment of fees