TW413832B - Heat processing device - Google Patents

Abstract

A heat processing device includes a hot plate on which a substrate is placed, a heater press-fitted in the hot plate for heating the substrate through the hot plate, and a reflecting plate facing an underside and side faces of the hot plate at a distance therefrom for reflecting heat radiated from the hot plate. An outside frame is arranged on the surface of the hot plate so as to surround the substrate.

Description

Printed by Men ’s Consumer Cooperative of the Central Bureau of the Ministry of Economic Affairs 413832__ 5. Description of the Invention (1) Background of the Invention The present invention relates to a heat treatment device for processing large-sized substrates such as LCD substrates by heating. LCD), a circuit pattern is formed by a so-called light lithography technique, in which a photoresist liquid is applied to a glass LCD substrate to form a blocking film thereon, and then the blocking film is exposed according to the circuit pattern and then developed. More specifically, the LCD substrate is cleaned in a cleaning device and then adhered in an adhesive device, and a photoresist film is coated on the surface of the LCD substrate in a coating prevention device. Then, the photoresist film is heated and baked in a thermal processing device, and the substrate is exposed to a predetermined pattern of light in an exposure device. The exposed LC substrate is then applied with a developer and developed in a developing device, and the developer is washed with a cleaning liquid to complete a developing process. The heat treatment device used to heat the LCD substrate in the above development process includes a hot plate on which the LCD substrate is placed, a heater for heating the LCD substrate through the hot plate, a vent cover arranged to define a processing space to fit the hot plate, and It has an air vent in the center of the ceiling and a shutter to close the processing space. Nowadays, the demand for LCD substrate expansion is gradually increasing, and there is an urgent need for a large-size substrate larger than the conventional substrate of 840x6 and 50mm of 65x55mm. However, when such a large-sized LCD substrate is subjected to the above-mentioned heat treatment, the processing temperature in the surface of the L CD substrate tends to become uneven. For example, the larger the size of the LCD substrate, the larger the temperature difference between the center and peripheral portions of the LCD substrate. (Please read the notes on the back before filling in this page) Order IX. _ This paper size applies the Chinese National Standard (CNS) A4 Zhuge (210 X 297 mm) · 4 _ 413832 a? _B7 V. Description of the invention (2 Therefore, when processing large-size LCD substrates, it is necessary to more strictly control the factors that affect the processing temperature in the heat treatment device. The change in the temperature distribution of the LC substrate may be caused by various factors, one of which is the radiation of heat from a hot plate. In particular, the bottom and sides of the hot plate are exposed to the air in the processing space, and therefore, heat is easily radiated from this, causing a temperature difference between the central and peripheral portions of the hot plate. Such a difference in the temperature of the hot plate causes a difference in temperature between the center and peripheral portions of the LCD substrate, thereby reducing the thermal uniformity on the surface of the LCD substrate. During the heat treatment, the ventilation of the processing space is also a factor of the temperature difference. In the aforementioned baking process, the photoresist film formed on the LCD substrate is heated, and the solvent in the photoresist film is evaporated by heat. The solvent is removed from the processing space, and air is exhausted through a vent hole in the vent cover. The air flow caused by ventilation reduces the temperature of the L CD substrate or the outside of the hot plate, and this temperature drop, or turbulence, will cause a temperature difference between the center and peripheral portions of the LCD substrate or the hot plate. Printed by the Central Government Bureau of the Ministry of Economic Affairs, Shellfish Consumer Cooperative (please read the precautions on the back, and then fill out this page) The hot plate that is used is formed by casting, and the heater is installed in it. Due to the recent trend of large-size LCD substrates, it is necessary to make the hot plate have a higher response to heat, and smaller thickness and light weight. However, the thickness of the cast-type hot plate can only be reduced to 40 mm due to the limitation of its manufacturing method, and the cast-type hot plate has disadvantages such as poor response to heat, difficulty in reducing weight, and increasing the height of the device. SUMMARY OF THE INVENTION The object of the present invention is to provide a heat treatment device that can apply the Chinese National Standard (CNS) A4 Zhuge (210X297 mm) to the paper size at the hot place. -5- 413832 5. Description of the invention (3) In the surface of the object, the uniformity of the processing temperature is improved, even if the size of the object is quite large. According to a first aspect of the present invention, there is provided a heat treatment apparatus including: a housing: a hot plate is arranged inside the housing to heat an object disposed on the hot plate; a heater is used to heat the hot plate; and A reflecting plate is used to reflect the heat radiated from the hot plate, wherein the bottom portion of the reflecting plate faces the lower side of the hot plate, and the side wall portion faces the relevant side of the hot plate. According to a second aspect of the present invention, there is provided a heat treatment device including: a housing; a hot plate arranged inside the housing to heat an object disposed on the hot plate; and a heater for heating the hot plate Heating; and an outer frame is arranged on the hot plate part of the object to surround the object "printed by Zhengong Consumer Cooperative Cooperative Standard (please read the precautions on the back before filling this page) according to the present invention In a third aspect, a heat treatment device is provided, including: a casing; a hot plate is arranged inside the casing to heat an object disposed on the hot plate: a heater is used to heat the hot plate: a vent cover Arranged above the hot plate, a processing space is defined therebetween, and the vent cover has a vent hole; and a shutter is arranged to surround the processing space and can be moved toward or away from the radon vent, wherein during the heat treatment, it is between the vent cover The gap between the shutter and the shutter is set to a value so that when the processing space is ventilated through the vent hole, the air flow along the side surface of the hot plate is subjected to the air flow introduced into the processing space through the gap. Suppression, so as to reduce a temperature change of the hot plate. According to a fourth aspect of the present invention, there is provided a heat treatment device including: a casing; a hot plate arranged inside the casing to heat an object disposed on the hot plate; a heater for heating the hot plate: The reflecting plate is used to reflect the heat radiated by the hot plate; the paper size of an outer frame arranged on the hot plate where the object is set is applicable to the Chinese National Standard (CNS) A4 Zhuge (210X297 mm) _β_ Industrial and consumer cooperatives printed 4138¾ ^ _Βτ__ 5. The description of the invention (4) partly surrounds the object: a ventilation cover is arranged above the hot plate, and a processing space is defined between the ventilation cover, and the ventilation cover has ventilation holes; and The shutter is arranged to surround the processing space and can move toward or away from the air vent, wherein the bottom portion of the reflecting plate faces the lower side of the hot plate, and the side wall portion faces the relevant side of the hot plate, and is heated During the treatment, the gap between the vent cover and the shutter is set to be one, so that when the processing space is ventilated through the vent hole, the air flow along the side surface of the hot plate is subjected to the introduction into the processing space through the gap. Inhibition of gas flow, so as to reduce a temperature change of the hot plate. According to a fifth aspect of the present invention, there is provided a heat treatment device including: a housing; a hot plate arranged inside the housing to heat an object disposed on the hot plate; and a heater for heating the hot plate , Wherein the heater is press-fitted in a recess formed in the hot plate. According to a first aspect of the present invention, the reflecting plate is configured to reflect radiant heat from the hot plate, whereby the heat radiated from the hot plate can be reflected to the hot plate. The bottom portion of the reflecting plate faces the lower side of the hot plate and the side wall portion faces the relevant side of the hot plate. Since the reflecting plate is arranged at a position related to the area of the hot plate with more heat radiation, the radiant heat can be reflected to this area, and therefore, the thermal uniformity of the hot plate can be enhanced. According to the second aspect of the present invention, an outer frame arrangement On the part where the hot plate of the object is arranged to surround the object, the entry of air in the area around the object can be suppressed. As a result, turbulence can be suppressed and the uniformity of the processing temperature within the surface of the object can be enhanced. According to the third aspect of the present invention, during the heat treatment, the processing space is vented in a semi-closed state, where the shutter is kept close to the vent cover, and the paper size is applicable to the Chinese National Standard (CNS) Λ4 specification (2 丨 0X297 Mm) ^ ο Pack 1 (Please read the precautions on the back before filling this page) Order-413832 A7 B7 V. Description of the invention (5) Therefore, the processing space is not completely closed due to the gap between the vent cover and the shutter . In this example, two air flows are generated due to the aeration, that is, the air flow introduced into the processing space through the gap and the upward air flow along the side of the hot plate. In these two air flows, if the air flow along the side of the hot plate is large, too much heat will be removed from the side of the hot plate, and thus the thermal uniformity of the hot plate is lost. Therefore, the gap between the vent cover and the shutter is set to be one so that the air flow along the side surface of the hot plate is suppressed by the air flow introduced into the processing space through the gap, thereby reducing the temperature change of the hot plate. As a result, heat removal from the side surface of the hot plate is suppressed, and the heat uniformity of the hot plate can be improved. Printed in accordance with the fourth aspect of the present invention by the Xinyang Procurement Bureau of the Ministry of Economic Affairs, a reflective plate is used to reflect the heat radiated by the hot plate (first aspect of the present invention), and an outer frame is arranged on the object to be set The part of the hot plate surrounds the object (the second aspect of the present invention), and the gap between the vent cover and the shutter is set to a value during heat treatment, so that when the processing space is ventilated through the vent hole, The air flow along the side surface of the hot plate is suppressed by the air flow introduced into the processing space through the gap, thereby reducing the temperature change of the hot plate (third aspect of the present invention). Due to the multiple effects of these technical features, the thermal uniformity of the hot plate can be significantly improved. According to a fifth aspect of the present invention, since the heater is press-fitted into a recess formed in the hot plate, it is different from the conventional mold hot plate in that it does not need to increase the thickness of the hot plate. Therefore, compared with the conventional hot plate, the thickness of the hot plate of the present invention can be thinner. Therefore, the hot plate of the present invention has a higher rate of response to heat, has a lighter weight, and can further suppress turbulence. Other objects and advantages of the present invention will be described in the following description-presenting -8- (read the note on the back first and then fill out this page) This paper size is applicable to China Standards (CNS) A4 (210X297 (Mm) A7 B7 Printed by the Central Standards Bureau of the Ministry of Economic Affairs, M Industrial Consumer Cooperative, 413833 V. Description of the invention (6), part of which can be learned from the description, or can be learned from the implementation of the invention. The objects and advantages of the present invention can be obtained by the facilities and combinations thereof specifically mentioned below. BRIEF DESCRIPTION OF THE DRAWINGS The drawings arranged here and constituting a part of the description present a presently preferred embodiment of the present invention, which together with the above general description and the following detailed description of the preferred embodiment are used to explain the present invention. Principle of the invention "Fig. 1 is an unplanned plan view of a coating and developing system for an LCD substrate to which the present invention is applied; Fig. 2 is a cross-sectional view of a heat treatment apparatus according to an embodiment of the present invention, which is installed in the system of Fig. 1 Figures 3 A and 3 B are sectional views of the state before and after the heater is press-fitted on a hot plate; Figure 4 is a sectional perspective view of the hot plate of the heat treatment device of Figure 2: Figure 5 is a shutter of the heat treatment device of Figure 2 Perspective view: Fig. 6 is a sectional view of a shutter raising mechanism used in the heat treatment device of Fig. 2, and Fig. 7 is a sectional view of a state of the shutter of the heat treatment device of Fig. 2 during heat treatment; Figure 2 is a sectional view of another state of the shutter of the heat treatment device of FIG. 2: 'FIG. 9 is a flowchart of the processing performed by the heat treatment device of FIG. 2: FIG. 10 is used to adjust the gap between the vent cover and the shutter Opportunity The, 1 'V' - < Please Note between the back surface of the read page and then fill)

This paper size applies to the Chinese National Standard (CNS) Α4 ^ grid (210 × 297 mm) -9- Printed by the Central Standards Bureau of the Ministry of Economic Affairs, Shellfish Consumer Cooperative, 413832 A7 _B7 V. Cross-section drawing of the modified description of the invention (7); and FIG. 11 is a perspective view of a modified example of the reflecting plate. Comparison table of main components 1 Box 2 Processing part 3 Interface part 10 Transmission mechanism 11 Transmission arm 2 a Pre-stage part 2b Intermediate part / 2 c Back-stage part 1 2, 1 3, 1 4 Transmission path 1 5 1 6 Relay part 2 1 a, 2 1 b Cleaning unit 25 UV radiation / cooling unit 26 Heat treatment unit 2 7 Cooling unit 17 * 18 Main conveyor 22 Block coating unit 23 Perimeter block removal unit 28 Heat treatment unit 29 Heating / Cooling Unit 30 Adhesive / Cooling Unit This paper size is applicable to the Chinese National Standard (CNS) A4 Zhuge (210X297 mm) _ 1〇 · --------- 装 ---- (谙 先 阋(Read the notes on the back and fill out this page) Order >.

S Printed by the Ministry of Economic Affairs 4- Central Standards Bureau Shellfish Consumer Cooperative 413832 A7 B7 V. Description of the invention (8) 19 Main conveying device 24a, 24b, 24c Developing unit 31 Heat treatment unit {Please read the precautions on the back before filling this page )

3 2, 33 heating / cooling unit 1 7 a, 1 8 a, 1 9 a arm 3 4 chemical feed unit 3 5 spacer 3 7 buffer stage 3 8 transfer mechanism 3 9 transfer arm 3 6 extension 4 1 shell 4 2 Hot plate 5 1 Vent cover 5 0 Processing space 6 0 Shutter 5 2 Vent hole 4 la, 4 1 b Opening 4 3 Heater 4 4 Support pin 4 5 Guaranteed member 7 0 Reflective plate 7 3 Base member 7 2 Outside frame Paper size applies Chinese National Standard (CNS) A4 Zhuge (210X297 mm) · 11 _ 413832 A7 B7 V. Description of the invention (9) 6 1 Bracket 62 Guide member 6 3 Cylinder 6 4 Piston rod 6 5 Stopper 9 0 Detailed Description of the Invention The present invention will be described in detail below with reference to the accompanying drawings. Fig. 1 is a plan view of a coating and developing system for an LCD substrate to which the present invention is applied. * Printed by the Central Bureau of Standards of the Ministry of Economic Affairs: Industrial and Commercial Cooperatives. This coating and developing system includes a cassette table 1 on which a substrate containing a large number of substrates G is disposed. Box C, a processing section 2 including a plurality of processing units to subject the substrate G to a sequence of processing including blocking coating and development, and an interface section 3 for transferring the substrate G to or from an exposure device (not shown) and Come. The cassette table 1 has a transfer mechanism 10 for transferring the LCD substrate between each cassette C, and then to or from the cassette table 1 and the processing section 2. The transfer mechanism 10 includes a transfer arm 11 which moves on a transfer path 10 a extending in the direction of the box C, and each substrate G transfers between the box C and the processing section 2 with the transfer arm 11. The processing section 2 is divided into a pre-stage section 2 a, an intermediate section 2 b, and a post-stage section 2 c, which have transmission paths 12, 13, 14 at the center, and various processing units arranged on both sides of the transmission path. . The relay parts 1 5 and 16 are arranged between the relevant rain joints of the three transmission paths = -12- (Please read the precautions on the back before filling this page) This paper size applies to the Chinese National Standard (CNS) A4 (210X297 mm) 413832 a? B7 V. Description of the invention (10) The former part 2a has a main conveying device 17 to move along the conveying path 12. Two cleaning units (S CR) 2 1 a and 2 1 b are arranged on one side of the conveying path 12, and the ultraviolet radiation / cooling unit 2 has an ultraviolet radiation device (UV) and a cooling device (COL) located thereon. 5. The heat treatment unit 26 with two heat treatment devices (HP) arranged one by one, and the cooling unit 2 with two cooling devices (C0L) arranged one by one 7 are arranged on the other side of the conveying path 1 2 · intermediate section 2 b It is also similar that the main transfer device 18 is moved along the transfer path 13. A blocking coating unit (CT) 22 and a peripheral blocking removing unit (ER) are used to remove blocking on the peripheral portion of the substrate G in a mutually integrated manner on one side of the conveying path 13. A heat treatment unit 2 8 having two heat treatment units (HP) provided one by one, a heat treatment / cooling unit 2 9 having a heat treatment unit (HP) and a cooling unit (COL) located thereon, and an adhesion unit (AD) and a cooling unit ( (COL) Adhesive / cooling units 30 arranged one by one are arranged on the other side of the conveying path 13. The post-stage part 2c also has a main transfer device 19 that moves along the transfer path 14. Three developing units (DEV) 24a, 24b, and 2 4 c are arranged on one side of the conveying path 14 and a heat treatment unit 3 1 having two heat treatment devices (HP) is provided one by one, and the heat treatment device (HP) and The two heat treatment / cooling units 3 2 and 3 3 of the cooling device (COL) thereon are arranged on the male side of the conveying path 14. The main conveyors 17, 18, and 19 have X- and Y-axis drive mechanisms to move them in two directions on a horizontal plane, and Z-axis drive mechanisms to move vertically -------- ^ Attack --- (Please (Read the notes on the back before filling out this page)

JJ., ΤΓ 'Central Standards Bureau of the Ministry of Economic Affairs M; Common Paper Standards (CNS > A4 size (210X297 mm)) for printed paper sizes of industrial and consumer cooperatives · 13-Printed by the Central Industrial Standards Bureau of the Ministry of Economic Affairs 413832 g_ 5. Description of the invention (11), and a rotation driving mechanism to rotate around the z-axis, and also includes arms 17 a, 18a, and 19a to support the substrate G. The processing part 2 has a structure So that only the rotation type unit, such as the cleaning unit 21a, the blocking coating unit 22 and the developing unit 24a are arranged on one side of the conveying path, and only the heat-related processing unit such as the heat treatment unit, the cooling unit, etc. Arranged on the other side of the transmission path. On the same side as the relay unit of the rotary unit. 1 5 and 16 are arranged a chemical feed unit 3 4, and provide space 3 5 to allow maintenance 0 interface part 3 It includes an extension 36 to temporarily hold the substrate while the substrate is being transferred to or from the processing section 2, two buffer stages 37 are arranged on both sides of the extension to place the buffer box thereon, and a transfer mechanism 38 is used to Exposure device (not shown) and The transfer substrate G between the cassettes »The transfer mechanism 3 8 has a transfer arm 3 9 moving along a transfer path 3 8 a extending in the direction in which the extension 36 and the buffer stage 37 are arranged, and the substrate G uses the transfer arm 3 9 And it is transferred between the processing section 2 and the exposure device. By arranging the processing units integrated in this way, space can be saved and processing efficiency can be enhanced. "In the coating and developing system constructed as described above, in the cassette C The substrate G is transferred to the processing section 2. In the processing section 2, the substrate is first subjected to a surface modification cleaning treatment by the ultraviolet radiation device (UV) of the ultraviolet radiation / cooling unit 25 in the previous section 2a, Then it is cooled by the cooling device (C ◦ L) in the same unit. After the substrate is scrubbed and cleaned in the cleaning unit (S CR) 2 1 a and 2 1 b, it is arranged in this paper. Chinese National Standard (CNS) A4 Zhuge (210X29? Mm) -14-{Please read the note on the back before filling this page)

A7 B7 413832 V. Description of the invention (12) One of the heat treatment devices (HP) in the previous part 2a is heated and dried, and then cooled in one of the cooling devices (COL) of the cooling unit 27 (please read first Note on the back page, please fill out this page again) 9 Then, the substrate G is transferred to the intermediate part 2b, where it is subjected to the adhesion treatment (HMDS treatment) by the adhesion device (AD) located on the level above the unit 30 to enhance the formation The blocking of the object is then cooled by a cooling device (C 0 L) at a level below the same unit. After the substrate is applied to prevent the stopper in the coating unit (CT), the excessive stopper on the peripheral portion of the substrate is removed in the peripheral stopper removal unit (ER) 23. The substrate G is then pre-baked by one of the heat treatment devices (HP) arranged in the intermediate section 2b, and then cooled in a cooling device (COL) at a level below the cells 29 and 30. Printed by the Central Government Bureau of the Ministry of Economic Affairs, Bureau Coconut Consumer Cooperative, and then the substrate G is transferred by the main transfer device 19 from the relay portion 16 to the interface portion 3, and then to the exposure device to expose the light of the predetermined pattern. Then, the substrate is transferred to the system through the interface 3 again, and after performing post-exposure baking processing on the substrate in a heat treatment device (HP) in one of the post-stage parts 2 c as required, the substrate is subjected to a developing unit (DEV A developing process in one of 24a, 24b, and 24c to form a predetermined circuit pattern thereon. Therefore, the developed substrate G is subjected to a post-baking treatment in one of the heat treatment devices (Η P) of the subsequent stage portion 2 c, and then cooled in a cooling device (COL), and is transported by the main conveying device 19, .18. , And 17 and the transfer mechanism 10 transfer to the predetermined cassette on the cassette table 1. The following arrangement is used in the intermediate part 2 b as an example to illustrate that the paper size installed on the upper paper is applicable to the Chinese National Standard (CNS) A4 specification (210X297 mm) _ 15-Printed by the Consumers' Cooperative of the Central Standards Bureau of the Ministry of Economic Affairs 413832 A7 ____B7____ Description of the invention (13) The heat treatment device (HP) in the coating and developing system is described. As shown in FIG. 2, the heat treatment device (HP) includes a casing 41 for heating a hot plate 4 2 of a substrate G located inside the casing 41, and a vent cover 51 covering the upper part of the casing 41 and defining a matching heat. The processing space 50 of the plate 41, and a shutter 60 surround the processing space 50 and move toward or away from the ventilation cover 51. The vent hole 52 is formed in the center of the ceiling of the ventilating cover 51. The housing 41 has an opening 4 1 a opening facing the conveying path 13, and a substrate G is conveyed by the conveying arm 18 a of the main conveying device 18 through the opening 4 1 a. Similar openings 4 1 b are formed on the external load relative to the openings 4 1 a, and these openings 4 1 a and 4 1 b act as air inlets. The air inlets arranged on the opposite side of the housing are used to reduce the difference in airflow rate between the base inlet / outlet side and the opposite side, and therefore the airflow between the base inlet / outlet side of the cooling hot plate 4 2 can be reduced. The difference between the cooling rate and the airflow rate on the opposite side of the cooling makes the temperature distribution in the area above the hot plate uniform. As a result, in the case of the pre-baking treatment, the thickness uniformity of the barrier film can be improved. The space entrances are not limited to two, but can also be four. The hot plate 42 is made of, for example, an aluminum alloy, and has a thickness of about 30 mm. The heater 4 3 for heating the hot plate 42 is arranged on the opposite side or the lower side of the hot plate 42. The heater 43 is of a tube type and is press-fitted in most depressions 42a formed in the lower side 42d of the hot plate 42 as shown in Fig. 3A. Therefore, the heater is fitted in the hot plate 42 as shown in FIG. 3B. The hot plate 4 2 further has a temperature sensor (not shown), and the paper size is applicable to the National Standard (CNS) A4 Zhuge (210X29? Mm) -16: ---- ^ ---- --r J ^ .—.-v_ (Please read the notes on the back before filling in this page) Order i 413832 a7 B7 _ V. Description of the invention (14) The temperature is fed to a control part (not shown), so It can be set at a predetermined processing temperature of, for example, 120 to 15 ° C. The hot plate 42 has four through holes 4 2 b. A support pin 4 4 for supporting the substrate G during transfer is inserted through the associated through hole 4 2 b. The support pin 4 4 is held by a holding member 4 5 arranged below the hot plate 4 2. The holding member 45 is coupled to a lifting mechanism (not shown), so the holding member 45 is moved up and down by the lifting mechanism, and the support pin 44 may protrude or be retracted below the surface 4 2 c of the hot plate 4 2. The base G may be It is placed on the hot plate 42; instead, it may be a proximity type to be held above the hot plate 42 by a support pin 44 or a spacer (not shown) so as not to be in direct contact with the hot plate. A reflecting plate 70 for reflecting radiant heat from the hot plate 42 is arranged in the outer case 41. As shown in FIG. 4, the reflecting plate 70 has a bottom portion 70 a facing the lower side 4 2 d of the hot plate 4 2 at a predetermined distance, and a relevant side 4 2 e facing the hot plate 4 2 at a predetermined distance. Side wall part 7 0 b = Printed by the Shell Specimen Consumer Cooperative of the Central Sample Bureau of the Ministry of Economic Affairs (please read the precautions on the back before filling out this page) As shown in Figure 2, the reflecting plate 7 0 is set on the housing 4 1 On the base member 73 on the bottom. Furthermore, as shown in FIG. 4, the hot plate 42 is disposed on the bottom portion 7 0 a of the reflecting plate 70 and a spacer 7 1 is interposed therebetween. Therefore, the hot plate 42 and the bottom portion 7 of the reflecting plate 7 0 0 a separation. The distance between the hot plate 42 and the reflecting plate 70 is not particularly limited, but it is preferably set to an appropriate value that maximizes the degree of heat uniformity of the hot plate 42. -The outer frame 7 2 is arranged on the surface 4 2 c of the hot plate 42 to surround the base G with a small gap. The height of the outer M frame 72 is not particularly limited as long as it is higher than the level of the surface of the substrate G, and is set to, for example, 5 mm. The paper scale is applicable to Chinese national standards (CNS > A4 specification (210X297 mm). -J7-413832 A7 B7 V. Description of the invention (15) As shown in Fig. 5, the shutter 60 has a rectangular body 60a and one The horizontal part 6 0 b is continuous from the upper end of the rectangular body and extends from it. The horizontal part 60 b enables air to be introduced from the outside along the lower surface of the ventilation cover 51 to avoid air flowing to the substrate G. As a result, at the substrate G The temperature distribution in the surface can be kept flat, thereby enhancing the uniformity of the thickness of the stopper film. The bracket 61 is protruded from the relevant center of the lower end of the rectangular body 60a. As shown in FIG. 6, the bracket 61 is set at The guide member 62 on the bottom of the housing 41 is held for vertical movement. In particular, each bracket 61 is coupled to a piston rod 64 of a cylinder 63 which serves as a lifting mechanism, and therefore, when the cylinder is driven, it can be Move up and down * Therefore, the shutter 60 can be moved up and down by the cylinder 63 to move toward or away from the vent hole 51. A stopper 65 is attached to the upper end portion of each guide member 62. When the bracket 61 is raised, the stopper 6 5 Fit the bracket 6 1 to stop the shutter 60 at the predetermined position. Quick The uppermost stop position of 60 is set to a level that can provide a gap D between the shutter 60 and the ventilation cover 51, as shown in Figure 7. During the heat treatment, The shutter 60 is raised to the uppermost position, so the processing space 50 can be ventilated in a semi-closed state, where the space 50 is not completely closed because of the gap D between the shutter 60 and the vent cover 51. In this example, due to the ventilation As a result, two air flows are generated, as shown in FIG. 7, that is, the air flow introduced into the processing space 50 through the gap D (hereinafter referred to as the level providing the gap D between the shutter 60 and the ventilation cover 51) and The airflow along the side 4 2e of the hot street 4 2 (hereinafter referred to as the side airflow B). If the side airflow B is too large in the two airflows, the heat will be drawn from the side of the hot plate 42- Note: Please fill in this page again.) This paper size applies Chinese National Standards (CNS > A4 Zhuge (2Ϊ0 × 297mm). The Central Standards Bureau of the Ministry of Economic Affairs, Shellfish Consumer Cooperatives, India 413832 ^ 5. Description of the invention (16) 42e Removed, and therefore, between the center and periphery of the hot plate 42 The temperature difference between portions becomes large, if the thermal uniformity is impaired. As a result, the uniformity of the processing temperature in the surface of the substrate G becomes low. As described above, the supply airflow A and the side airflow B are generated by ventilation, and therefore, If the processing space is ventilated at a fixed rate, the relationship between the two airflows is that when the supply airflow A increases, the side airflow B decreases; on the contrary, when the supply airflow A decreases, the side airflow B increases. It is changed by changing the gap D between the shutter 60 and the ventilation cover 51, so the gap D is set to increase the supply airflow A related to the side airflow B, and the supply airflow A is used to restrict the side airflow B, so in The temperature difference in the hot plate 42 is small. In particular, this gap can be set to 15 to 2 Omm. The ventilation hole 52 is connected to a ventilation mechanism (not shown), whereby the air in the processing space 50 can be released to the outside. As shown in FIG. 7, the inner edge of the horizontal portion 60 b of the shutter 60 extends to The position near the periphery of the hot plate 42, and therefore, when the shutter 60 is moved downward, the upward air flow from the bottom of the hot plate 42 is blocked, thereby preventing the hot plate 42 from being cooled. As shown in FIG. 8: This effect can be further enhanced by overlapping the inner edge portion of the horizontal portion 6 O b with the peripheral edge portion of the hot plate 42. Referring to Fig. 9, the heating and processing of the above-mentioned heat treatment apparatus (HP) will be described below. First, the shutter 60 is moved downward (step 1), and the pin 44 is raised (step 2). Then the base G is sent into the shell 4 1 () by the transfer arm 18 a — (Please read the precautions on the back before filling this page) The paper size of the book is applicable to Chinese national standards (CNS > A4 Zhuge (210X297) -19)-19-Printed by the Consumer Standards Cooperative of the Central Bureau of Standards of the Ministry of Economic Affairs 413832 A7 B7 V. Description of the invention (17) Step 3) and put it on the pin 44 (Step 4). Then, the pin 44 is lowered while the transfer arm 18 a is retracted (step 5) > Then, the heat treatment is started, and after the heat treatment is started, the shutter 60 is moved upward (step 6). After the substrate is heat-treated for a predetermined time , The shutter 60 moves downward (step 7), and the rear pin 4 4 moves upward to lift the substrate G (step 8), thereby completing the heating process. Then, when the substrate G is lifted, the transfer arm 8a extends to a position below the substrate G (step 9) and then moves upward, whereby the substrate G can be received by the arm 18a (step 10). Then, the substrate G is transferred to the outside by the transfer arm 1 8 a (step 1 1), and then the shutter 60 is moved upward (step 12) »Here, a reflection plate 70 is provided to reflect the radiant heat from the hot plate 42. And therefore, when the heat treatment is performed on the substrate G, the radiant heat is reflected by the reflecting plate toward the hot plate 42. Since the reflecting plate 70 faces the hot plate _ 4 2 under the side 4 2 d and the side 4 2 e at a distance, the heat can be reflected toward the underside 4 2 d and the side 4 2 e, thereby radiating more heat. . Therefore, it is possible to suppress a decrease in the local temperature of the hot plate 42, particularly a decrease in the temperature of the peripheral portion of the hot plate 42, and as a result, the thermal uniformity of the hot plate 42 can be enhanced. The side wall portion 7 0 b of the reflecting plate 70 and the side surface 4 2 e of the heat plate 4 2 are preferably arranged so that they overlap each other, as shown in FIG. 4, so that the heat passes from the side surface 4 2 of the heat plate 4 2 e Proper radiation. The height of the overlapping part (hereinafter referred to as the overlapping height H) is set to 1/3 to 1/2 (such as 15mm.) Of the thickness of the hot plate 42 (such as 30 mm). ^ If the overlapping height (please read first) Note the item on the back, please fill in this page.) The paper size of the edition is applicable to the Chinese national standard (CNS > 8 4 grid (210X297 mm) _ 2〇- A7 B7 Printed by the Central Bureau of Standards, Ministry of Economic Affairs, Consumer Cooperatives. 413832 5 Explanation of the invention (18) Η is too large, the temperature of the peripheral part of the hot plate 42 will become particularly high due to the radiation from the hot plate 42. Therefore, the thermal uniformity of the hot plate 42 will be lost. The heat treatment device (HP) is provided with an outer frame 72 on the surface 4 2 c of the hot plate 42 to surround the substrate G, and this outer frame 72 can prevent air from entering the area surrounding the substrate G. Therefore, the area surrounding the substrate G The temperature will be caused by the air flow generated by ventilation, that is, due to the turbulence, it is not reduced. Therefore, the uniformity of the processing temperature in the surface of the substrate G can be improved. Under heat treatment, when the shutter 60 moves to In the uppermost position, a gap D is formed between the ventilation cover 51 and the shutter 60 of the heat treatment device (HP). It is set so that the side air flow B is suppressed by the supply air flow A, thereby reducing the temperature difference in the hot plate 42, thereby preventing the sudden heat removal of the side surface 42e of the hot plate 42 caused by the fast side air flow B And, therefore, the temperature difference between the central and peripheral portions of the hot plate 42 can be reduced. Therefore, the thermal uniformity of the hot plate 4 can be enhanced, and as a result, the uniformity of the processing temperature in the surface of the substrate G can be improved In order to achieve some beneficial effects, the gap between the ventilation cover 51 and the shutter 60 is set to 15 to 20 mm. In the above heat treatment, the shutter 60 moves downward, and the rear pin 44 moves upward to lift the substrate. (Steps 7 and 8) to avoid the local cooling of the substrate G by directly impacting the air of the substrate G with a high flow rate. This local cooling occurs because when the amount of ventilation air is the same, the air flow rate is high, and When the shutter 60 is raised than when the shutter 60 is lowered, the air flow is more localized. After the heat treatment is completed, the shutter 60 moves upwards at step 12 (please read the note on the back before filling this page)

This paper size applies to China National Standards (CNS) Α4 格格 (210X297 mm) 21-Printed by the Central Standards Bureau of the Ministry of Economic Affairs, Machining and Consumer Cooperatives A7 £ 7__ V. Description of the invention (19), and it is as if it is being heated From time to time, the ventilation and the hot plate 42 are guided to the same state to maintain the thermal environment of the heat treatment device (HP) even during non-heating treatment, and thereby prevent temperature unevenness in the area above the hot plate 42. The hot plate 42 is a press-fit type, in which the heater 43 is embedded in the hot plate by press-fitting. Therefore, unlike the mold hot plate (having a thickness of 4 Omm or more), there is no manufacturing process here. The restrictions imposed on the thickness of the plate can therefore produce a hot plate with a smaller thickness. Therefore, the thickness of the hot plate 42 can be reduced to improve the response to heat and weight, and the height of the heat treatment device (HP) can also be reduced. Therefore, in view of the reduction in the size of the device and the response to heat, the thickness of the hot plate 42 must be as small as possible. However, if the thickness of the hot plate is less than 25 mm, the heat treatment device becomes susceptible to interference. Therefore, in view of the trade-off between the reduction in device size and the reduction in thermal uniformity, the optimal thickness of the hot plate is about 30 mm. The press-fit type thermal trigger is generally considered to be inferior in thermal conductivity because of an air layer between the depression formed in the hot plate and the heater. However, in practice, no significant adverse effect is observed here, and the press-fit type hot plate can be actually used satisfactorily. As described above, with the heat treatment apparatus (HP) according to this embodiment, by using any of the foregoing Various technologies can improve the uniformity of the processing temperature in the surface of the substrate G, and when these technologies are used in combination, the uniformity of the processing temperature can be further enhanced. In particular, for a substrate G with 840x650 mm, the achievable thermal uniformity is in the range of 1.5 t. 413832 < Please read the notes on the back before filling this page) This paper size is applicable to China National Standard (CNS) A4 Zhuge (210X297 mm) -22- Printed by the Consumer Affairs Cooperative of the Central Bureau of Standards, Ministry of Economic Affairs 413832 ^ V. Description of the Invention (20) The present invention is not limited to the foregoing embodiments, but can be modified in various ways. For example, in the foregoing embodiment, the stopper 55 is attached to each guide member 52, as shown in FIG. 6, to adjust the gap between the vent hole 51 and the shutter 60 during heat treatment. Alternatively, as shown in FIG. 10, the gap setting protrusion 90 may also be formed on four corners of the upper surface of the horizontal portion 6 Ob extending inwardly of the shutter 60, so the gap D may be determined by the height of the protrusion 90. Decided. Such gap setting protrusions can also be formed on the surface of the ventilation cover 51. Furthermore, since the corners of the hot plate 42 are cooled to a greater degree than the central portion, it can be used to increase the height of the four corners. The reflection plate 7 0 of part 7 5 is shown in FIG. 11. Although in the above embodiments, the present invention is applied to a heat treatment apparatus used in a coating development preventing system, the present invention is not limited to such an application. The invention can also be applied to other processes. Furthermore, in the foregoing embodiment, the LCD substrate is used as the substrate, but the substrate is not limited to the LCD substrate, and the present invention can of course be applied to other types of substrate processing. For those skilled in the art, other advantages and modifications can be quickly understood from the description of the present invention. Therefore, the present invention in its broad sense is not limited to the specific details described in the foregoing embodiments. Therefore, various modifications to the present invention cannot be deviated from the general definition of the following patent application parks of the present invention and their equivalents. The spirit and scope of invention. IJ --- ^ -----—— (Please read the notes on the back before filling this page) Order

I

J The paper size is in accordance with the Chinese National Standard (CNS) A4 Zhuge (210X297 mm) -23-

Claims (1)

Printed by the Ministry of Economic Affairs, Central Bureau of Standards and Labor Cooperatives 413832 6. Scope of Patent Application 1. A heat treatment device comprising: a housing; a hot plate is arranged inside the housing to heat objects placed on the hot plate; A heater is used to heat the hot plate: and a reflecting plate is used to reflect the heat radiated by the hot plate, wherein the bottom portion of the reflecting plate faces the lower side of the hot plate, and the side wall portion faces the hot plate. Related side. 2. For example, the heat treatment device of the scope of patent application, wherein the side wall portion of the reflecting plate overlaps the relevant side of the hot plate with a thickness corresponding to 1/3 to 1/2 of the hot plate in the height direction. 3. For example, the heat treatment device of the scope of patent application, wherein the hot plate has a rectangle equivalent to a rectangular object, and the side wall portion of the reflecting plate surrounds the rectangular hot plate and the corners have a height that is related to other parts. 4. The heat treatment device as claimed in claim 1, wherein the hot plate has a plurality of depressions formed on its lower side, and the heater is made of a tubular heater, which is press-fitted on each depression of the hot plate Center and fit into the hot plate. 5. A heat treatment device comprising: a housing: a hot plate arranged inside the housing to heat an object provided on the hot plate: a heater for heating the hot plate; and an outer frame arranged on the object Part of the hot plate to surround the inner body of the object q. The size of this paper is in accordance with Chinese National Standard (CNS) A4 (210X297 mm) ft. {· I i----1 »1 ^ ^^^ 1-,: .. ¾ (Please read the note on the back first (Please fill in this page again for the item) Order-413832 A8 B6 C8 D8 Printed by the Central Standardization Bureau of the Ministry of Economic Affairs, Shellfish Consumer Cooperatives 6. Apply for a patent park 6. If you apply for a heat treatment device for the scope of patent application item 5, the outer frame has Greater than the height of the object. 7. The heat treatment device as claimed in claim 5, wherein the hot plate has a plurality of depressions formed on its lower side, and the heater is made of a tubular heater and is press-fitted to each depression of the hot plate Center and fit into the hot plate. 8. A heat treatment device comprising: a housing: a hot plate is arranged inside the housing to heat an object provided on the hot plate: a heater is used to heat the hot plate: a vent cover is arranged on the hot plate Above, a processing space is defined therebetween, and the vent cover has a vent hole; and a shutter is arranged to surround the processing space and can be moved toward or away from the vent hole> where during the heat treatment, it is between the vent cover and the shutter The gap is set to a value so that when the processing space is ventilated through the vent hole, the air flow along the side surface of the hot plate is suppressed by the air flow introduced into the processing space through the gap, thereby reducing the temperature change of the hot plate. 9. The heat treatment device of item 8 in the scope of the patent application, wherein during the heat treatment, the gap between the vent cover and the shutter is 15 to 20 mm. 10. The heat treatment device according to item 8 of the patent application, wherein the shell has at least two air inlet holes opposite to each other and is formed at a position just below the radon cover. 11. If the heat treatment device of item 8 of the scope of the patent application, the thermal paper size is quickly used in China® home grade (CNS) A4 specification (210X297 mm) · 25 · I 1 ------------ 、 Installation-(Please read and read the notes on the back before filling this page) Order 0. Printed by ASBE 413832 by the Shellfish Consumer Cooperative of the Central Standards Bureau of the Ministry of Economic Affairs ?! 6. The patent application board has a large number of depressions formed under it Side, and the heater is made of a tubular heater, which is press-fitted in each recess of the hot plate and fits into the hot plate. A heat treatment device includes: a casing: a heat A plate is arranged inside the casing to heat an object provided on the hot plate; a heater is used to heat the heat plate; a reflecting plate is used to reflect the heat radiated by the hot plate; an outer frame is arranged on the hot plate of the object A ventilation cover is arranged above the hot plate, a processing space is defined therebetween, and the ventilation cover has a ventilation hole: and a shutter is arranged to surround the processing space and can be moved toward or away from the Vent hole where the bottom of the reflecting plate The portion facing the lower side of the hot plate, and the side wall portion facing the relevant side of the hot plate, and during the heat treatment, the gap between the vent cover and the shutter is set to be one, so that when the processing space passes through the opening When venting, the air flow along the side surface of the hot plate is restrained by the air flow introduced into the processing space through the gap, so as to reduce the temperature change of the hot plate. Wherein, the side wall portion of the reflecting plate overlaps the relevant side of the hot plate with a thickness corresponding to 1/3 to 1/2 of the hot plate in the height direction. . This paper size uses Chinese National Standard (CNS) A4 (210 × 297 mm) {Please read the precautions on the back before filling this page) Order 413832 Β8 C8 D8 6. Scope of patent application 1 4. If you apply The heat treatment device according to item 12 of the patent, wherein during the heat treatment, the gap between the vent cover and the shutter is 15 to 20 mm ° 1 5. The heat treatment device according to item 12 of the application, wherein the The shutter has a horizontal portion extending near the periphery of the hot plate. 16. For example, the heat treatment device according to item 15 of the scope of the application ^, wherein the horizontal portion has a peripheral edge overlapping the peripheral edge of the hot plate. 17. The heat treatment device as claimed in claim 12, wherein the hot plate has a plurality of depressions formed on its lower side, and the heater is made of a tubular heater and is press-fitted into each depression of the hot plate Center and fit into the hot plate. 18 types of heat treatment devices, including: a housing; a hot plate arranged inside the housing to heat an object disposed on the hot plate: and a heater for heating the hot plate, wherein the heater is press-fitted in the formation In a depression in the hot plate. Printed by the Central Standards Bureau of the Ministry of Economic Affairs, WC Industry and Consumer Cooperatives. 9. The heat treatment package __, such as the scope of U.S. patent application, wherein the hot plate has a large number of depressions formed on its lower side, and the heater is a tubular heater. It is made by being press-fitted in each recess of the hot plate and fitted in the hot plate. 2 0. The heat treatment device according to item 19 of the application, wherein the hot plate is made of aluminum alloy. The size of this paper is Chinese National Standard (CNS) A4 (210X297 mm) I 27-'