JP2000012427A - Method and device for treating substrate - Google Patents

Abstract

PROBLEM TO BE SOLVED: To perform drying or leveling of a liquid applied to a substrate without using any pressure reducing chamber. SOLUTION: This substrate treating device is for performing series of treatment to the substrate and is provided with a spin coater part 2, a dry promotion processing part 3 and a bake part 6. The spin coater part 2 applies a resist to the substrate. The dry promotion processing part 3 supplies clean air at a flow velocity higher than a prescribed velocity to the substrate coated with the resist by the spin coater part 2. The bake part 6 performs heat-treatment to the substrate processed by the drying promotion processing part 3.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

The present invention relates to a substrate processing method including a step of applying a coating liquid such as a resist coating liquid to a substrate, and a substrate processing apparatus including a processing unit for applying the coating liquid to the substrate.

[0002]

2. Description of the Related Art In a manufacturing process for performing various processes on a substrate, for example, a glass substrate for manufacturing a liquid crystal display, a substrate processing apparatus for performing a certain series of processes is used. Among these apparatuses, there is a substrate processing apparatus including a step of applying a coating liquid such as a resist coating liquid to a substrate.

For example, in a substrate processing apparatus for performing a photoresist coating process in a liquid crystal display manufacturing process, a photosensitive resin material of ultraviolet light is applied to a uniform thickness over the entire substrate surface. Specifically, a spin coating method that spreads the resist liquid dropped on the substrate by centrifugal force to rotate the substrate by centrifugal force to obtain a uniform thickness, and a roll coating method that transfers the resist liquid once attached to the groove on the roller surface to the substrate Is applied. Here, in order to obtain a uniform coating over a large area and an arbitrary thickness suitable for the subsequent etching conditions, etc., and also according to the characteristics of the coating method, a resist solution having an appropriate viscosity by controlling the amount of solvent is used. Selected.

[0004] Usually, the process proceeds to an exposure process after a photoresist coating process, but before this exposure process, a pre-bake (baking) process for evaporating a residual solvent is performed. Further, in some cases, an edge rinsing process for cleaning the vicinity of the end surface of the substrate may be performed from the viewpoint of preventing generation of particles and alignment at the time of exposure.

In a substrate processing apparatus including a series of photoresist coating steps as described above, a substrate is housed in a decompression chamber immediately after the application of the resist to promote the evaporation of the solvent, and the liquid applied in the edge rinsing processing is applied. There is a vacuum drying apparatus for drying the applied liquid to some extent so that the liquid does not spread to the end face.

[0006]

Conventionally, in a vacuum drying process immediately after the application of a resist solution, a substrate is accommodated in a vacuum chamber and the atmosphere in the vacuum chamber is sucked as described above. The decompression chamber must be enlarged with the development. Such a large decompression chamber is expensive. In addition, when the pressure in the decompression chamber is reduced, it is inevitable that a certain amount of particles are entangled from the hermetically sealed portion, and the problem of self-electrostatic destruction of the charged substrate under reduced pressure is also significant.

An object of the present invention is to provide a substrate processing apparatus capable of drying a liquid applied to a substrate without using a decompression chamber.

[0008]

According to a first aspect of the present invention, there is provided a substrate processing method for performing a series of processing on a substrate, comprising a coating process, a baking process, and a drying promoting process. And an end face cleaning step. In the coating process, a coating liquid is applied to the substrate. In the baking process, a heating process is performed on the substrate on which the coating solution has been applied. The drying acceleration processing step is a step provided between the coating processing step and the baking processing step. In this step, clean air is supplied to the substrate at a flow rate higher than a predetermined rate. The edge cleaning process is a process provided between the drying acceleration process and the baking process. In this process, the vicinity of the edge of the substrate is cleaned.

When the thickness of the substrate coated with the coating solution is reduced to a certain value or less, the fluidity of the coating solution is almost lost. Conventionally, in order to prevent the applied coating liquid from flowing in the end face cleaning processing step and causing a problem, the substrate is placed under reduced pressure immediately after the coating so as to have a certain thickness or less. However, there is a problem in that the particles are entangled by the pressure reduction and adhere to the substrate. On the other hand, if the drying is performed without reducing the pressure, the processing liquid gas evaporated near the substrate surface stays, so that the evaporation is hindered and the processing time becomes longer.

On the other hand, in the present invention, in the drying acceleration processing step, the processing liquid gas, which tends to stay on the substrate surface, is blown off by a flow of a predetermined flow rate or more of the clean air, and drying is performed in a short time. Therefore, in the edge cleaning process, the processing liquid applied to the substrate surface hardly flows,
Even if a cleaning process is performed near the end surface of the substrate, the applied state of the applied processing liquid is kept good. Further, since clean air is supplied, particles and the like hardly adhere to the substrate. Further, since clean air is supplied to the substrate at a predetermined flow rate, the processing liquid gas evaporated near the surface of the substrate does not easily stay, and drying can be performed in a short time.

As described above, the liquid applied to the substrate can be dried here without using the decompression chamber. The substrate processing apparatus according to claim 2 is a substrate processing apparatus for performing a series of processing on a substrate, and includes a coating processing section, a drying promotion processing section, a baking processing section, and an end face cleaning processing section. Have. The application processing unit applies the application liquid to the substrate. The drying promotion processing section supplies clean air at a flow rate equal to or higher than a predetermined speed to the substrate on which the coating liquid has been applied in the coating processing section. The baking processing unit performs a heating process on the substrate that has been processed in the drying promotion processing unit. The edge cleaning section cleans the vicinity of the edge of the substrate after the processing in the drying acceleration processing section before performing the heating processing in the baking processing section.

When the thickness of the substrate coated with the coating solution is reduced to a certain value or less, the fluidity of the coating solution is almost lost. Conventionally, in order to prevent the applied coating liquid from flowing in the edge cleaning section and causing problems, the substrate is placed under reduced pressure immediately after the coating, so as to have a certain thickness or less. However, there is a problem in that the particles are entangled by the pressure reduction and adhere to the substrate. on the other hand,
If drying is performed without reducing the pressure, the processing liquid gas evaporated near the surface of the substrate stays, so that evaporation is hindered and the processing time becomes longer.

On the other hand, in the present invention, in the drying acceleration processing section, the processing liquid gas, which tends to stay on the substrate surface, is blown off by a flow of a predetermined flow rate or more of the clean air, and drying is performed in a short time. Therefore, in the edge cleaning section, the processing liquid applied to the substrate surface hardly flows, and the coated state of the applied processing liquid is maintained well even when the cleaning process is performed near the edge of the substrate. . Further, since clean air is supplied, particles and the like hardly adhere to the substrate. Further, since clean air is supplied to the substrate at a predetermined flow rate, the processing liquid gas evaporated near the surface of the substrate does not easily stay, and drying can be performed in a short time.

As described above, the liquid applied to the substrate can be dried without using the decompression chamber. A substrate processing apparatus according to a third aspect is the substrate processing apparatus according to the second aspect, wherein the drying promotion processing unit includes an air supply device that blows clean air. Here, a flow of the clean air having a flow rate equal to or higher than a predetermined speed is generated by blowing the clean air by the air supply device. Since the substrate processing equipment is usually installed in a clean room, it is possible to dry the substrate using the flow of clean air in the clean room as it is in the drying promotion processing unit. Is desirably provided with an air supply device. Here, an air supply device is separately provided.

Providing an air supply apparatus in this way is simpler and less expensive than installing a decompression chamber, and also eliminates the problem of entrapment of particles. According to a fourth aspect of the present invention, there is provided a substrate processing apparatus for performing a series of processing on a substrate, which is installed in a clean room in which clean air is caused to flow downward from a ceiling. This substrate processing apparatus includes a coating processing section, a drying acceleration processing section, and a baking processing section. The application processing unit applies the application liquid to the substrate. The drying promotion processing unit has a first driving device, and the first driving device causes the substrate to approach the ceiling of the clean room, so that the substrate to which the coating liquid has been applied in the coating processing unit has a predetermined speed. Supply clean air at the above flow rate.
The first driving device is a device for bringing the substrate close to the ceiling of the clean room. The baking processing unit performs a heating process on the substrate that has been processed in the drying promotion processing unit.

If the substrate on which the coating solution is applied is immediately subjected to heat treatment in the application processing section, problems such as drying of the substrate in a wavy surface state immediately after application occur. In the present invention, a drying acceleration processing unit is provided between a coating processing unit and a baking processing unit that performs a heating process, and by supplying clean air having a flow rate equal to or higher than a predetermined speed to the substrate, before performing the heating process. The substrate has been dried to some extent. For this reason, it is possible to suppress problems when the substrate is heated immediately after the application. Further, since clean air is supplied, particles and the like hardly adhere to the substrate. Further, since clean air is supplied to the substrate at a predetermined flow rate, the processing liquid gas evaporated near the surface of the substrate does not easily stay, and drying can be performed in a short time.

As described above, the liquid applied to the substrate can be dried here without using the decompression chamber. In addition, here, the clean air flowing down from the ceiling in the clean room is used to supply the clean air at a predetermined flow rate to the substrate in the drying promotion processing unit. However, since it is difficult to supply clean air at a predetermined flow rate to the substrate if it is away from the ceiling of the clean room, a first driving device that can bring the substrate close to the ceiling is provided.

According to a fifth aspect of the present invention, there is provided a substrate processing apparatus according to the fourth aspect.
3. The substrate processing apparatus according to item 1, further comprising an edge cleaning unit. The edge cleaning section cleans the vicinity of the edge of the substrate after the processing in the drying acceleration processing section before performing the heating processing in the baking processing section. When the thickness of the substrate coated with the coating solution is reduced to a certain value or less, the fluidity of the coating solution is almost lost. Conventionally, in order to prevent the applied coating liquid from flowing in the edge cleaning section and causing problems, the substrate is placed under reduced pressure immediately after the coating, so as to have a certain thickness or less. However, there is a problem in that the particles are entangled by the pressure reduction and adhere to the substrate. On the other hand, if the drying is performed without reducing the pressure, the processing liquid gas evaporated near the substrate surface stays, so that the evaporation is hindered and the processing time becomes longer.

On the other hand, in the present invention, in the drying acceleration processing section, the processing liquid gas, which tends to stay on the substrate surface, is blown off by a flow of a predetermined flow rate or more of the clean air, and drying is performed in a short time. Therefore, in the edge cleaning section, the processing liquid applied to the substrate surface hardly flows, and the coated state of the applied processing liquid is maintained well even when the cleaning process is performed near the edge of the substrate. .

According to a sixth aspect of the present invention, there is provided a substrate processing apparatus.
6. The substrate processing apparatus according to any one of items 1 to 5, wherein the drying promotion processing unit has a substrate mounting table. In the substrate mounting table, the substrate mounting surface has an outer edge larger than the substrate over the entire circumference. Here, clean air is supplied to the substrate in a state where the substrate is placed on a substrate mounting table having a larger outer edge than the substrate over the entire circumference. For this reason, the occurrence of unevenness on the surface of the coating liquid applied to the substrate is suppressed. That is, if the substrate mounting table is smaller than the size of the substrate, a flow of clean air in substantially one direction along the surface of the substrate from the inside to the outside of the substrate occurs at the peripheral portion of the substrate, and is applied to the substrate. There is a possibility that so-called wind ripples are formed on the surface of the applied coating liquid along the flow direction, resulting in unevenness. On the other hand, in the apparatus according to the present invention, a part of the clean air stagnates on the entire upper surface of the substrate mounted on the substrate mounting table to generate a vortex-like weak turbulent flow. Therefore, the surface of the coating liquid applied to the substrate is less likely to be uneven.

In the peripheral portion of the substrate mounting table on which no substrate is mounted, the above-mentioned substantially constant flow of clean air toward the outside occurs, which has an adverse effect on the surface condition of the coating liquid applied to the substrate. There is very little. The substrate processing apparatus according to claim 7 is the substrate processing apparatus according to claim 3, wherein the air supply device has an air filter.

Here, since the air supply device itself has an air filter, for example, when the substrate processing apparatus is installed in a clean room, the air supply device can be installed outside the clean room. The substrate processing apparatus according to claim 8 is the substrate processing apparatus according to claim 3, which is installed in a clean room. Then, the air supply device supplies the clean air flowing in the clean room to the substrate.

In this case, since the air supply device is installed in the clean room and supplies clean air from the clean room to the substrate, it is not necessary to provide an air filter in the air supply device itself. A substrate processing apparatus according to a ninth aspect is the substrate processing apparatus according to the third aspect, wherein the drying promotion processing unit further includes a second driving device. The second driving device is a device that can relatively move the air supply device and the substrate.

Here, the substrate and the air supply device are connected to the second
It is relatively moved by the operation of the driving device. Therefore, for example, it is possible to secure the flow velocity of the flow of the cleaning air to the substrate by bringing them close to each other at the time of processing in the drying acceleration processing unit, and to keep them away from each other so as to avoid interference when loading and unloading the substrate. . The second driving device is
The substrate may be moved, or the air supply device may be moved.

A tenth aspect of the present invention is the substrate processing apparatus according to the third aspect, wherein the air supply device has a rectifying plate. This rectifying plate rectifies the flow of the clean air supplied to the substrate. Here, a rectifying plate is provided in the air supply device so that the drying state of the coating liquid on the substrate surface becomes uniform. For example, an air filter may be used as the rectifying plate, or a plate-like member provided with a large number of holes may be used.

An eleventh aspect of the present invention is the substrate processing apparatus according to the third aspect, wherein the air supply device comprises:
It has an air discharge port, a blower, and a supply path.
The air discharge port is located above the substrate in the drying promotion processing section. The blower generates a flow of air. The supply path is a path connecting the air discharge port and the blower. Here, the air discharge port is positioned above the substrate to supply clean air to the substrate from the vicinity of the substrate, and a supply path is provided to easily secure an installation location of the blower. According to this, even when the installation space is small above the substrate, the air supply device can be installed.

A substrate processing apparatus according to a twelfth aspect is the substrate processing apparatus according to the eleventh aspect, wherein the substrate processing apparatus is installed in a clean room. And a blower is arrange | positioned in the clean room. Here, since the blower is installed in the clean room, the clean air in the clean room can be easily used.

According to a thirteenth aspect of the present invention, there is provided the substrate processing apparatus according to the twelfth aspect, wherein the blower is located above the substrate in the drying promotion processing section. Here, a blower is arranged above the substrate in addition to the air discharge port. Thereby, the clean air above the substrate in the clean room can be supplied to the substrate at a predetermined flow rate.

A substrate processing apparatus according to a fourteenth aspect is the substrate processing apparatus according to the eleventh aspect, wherein the substrate processing apparatus is installed in a clean room. And a blower is arrange | positioned outside a clean room. Here, even if it is difficult to install a blower in a clean room, or if there is a possibility that particles may be generated when a blower is installed in a clean room, these problems are caused by installing the blower outside the clean room. Is eliminated.

A substrate processing apparatus according to a fifteenth aspect is the substrate processing apparatus according to the third aspect, wherein the air supply device has an upper cover. The upper cover guides the flow of the clean air so that the clean air supplied to the substrate does not flow to the adjacent processing unit. Here, the upper cover is provided so that the cleaning air supplied to the substrate by the air supply device flows to the adjacent processing unit and the flow does not adversely affect the processing in the processing unit. Since the flow of the clean air is guided by the upper cover, the flow of the clean air from the air supply device to the adjacent processing unit is suppressed.

A substrate processing apparatus according to a sixteenth aspect is the substrate processing apparatus according to the fifteenth aspect, wherein the drying promotion processing unit further includes a lower cover. The lower cover guides the flow of the clean air downward so that the clean air supplied from the air supply device to the substrate does not soar. here,
In consideration of the possibility that particles may adhere to the substrate surface when the clean air supplied to the substrate from the air supply device hits a member supporting the substrate and so forth and rises upward.
In order to avoid this, a lower cover for guiding the flow of clean air downward is provided in the drying promotion processing unit. Thus, for example, it is possible to avoid soaring of particles generated from a driving portion of the substrate processing apparatus which is often arranged below the height level of the substrate transfer.

A substrate processing apparatus according to a seventeenth aspect is the substrate processing apparatus according to the sixteenth aspect, wherein the drying promotion processing unit further has an exhaust path. The exhaust path exhausts the clean air guided by the lower cover. Here, the clean air guided by the lower cover is exhausted through an exhaust path. If the clean air supplied to the substrate is exhausted to a predetermined place through this exhaust path, it is possible to suppress problems such as adverse effects on other processing units and flying of particles.

The substrate processing apparatus according to claim 18 is the substrate processing apparatus according to claim 17, wherein an exhaust damper is provided in the exhaust path. This exhaust damper can adjust the amount of exhaust of the clean air. The air supply device blows out a larger amount of clean air than the amount of clean air exhausted from the exhaust path. Here, by adjusting the exhaust damper, the vicinity of the substrate being dried by the supply of clean air is maintained at a higher positive pressure than the surroundings, so that the airflow caused by the suction of air from the surroundings adversely affects the substrate being dried (improper drying). (Uniform, particle adhesion) can be suppressed.

In addition, ideally, the amount of clean air exhausted from the exhaust path and the amount of clean air blown out by the air supply device completely match each other, and the amount of air from the vicinity to the vicinity of the substrate during the drying process is reduced. It is desirable to completely eliminate inhalation and blowing of air into the surroundings. The substrate processing apparatus according to claim 19 is the base substrate processing apparatus according to any one of claims 16 to 18, wherein the upper cover of the air supply device is formed such that the lower end covers the lower cover. . The height position of the lower end of the upper cover is lower than the height position of the upper end of the lower cover.

Here, the lower end of the upper cover of the air supply device is formed so as to cover the lower cover, and the height of the lower end of the upper cover is lower than the height of the upper end of the lower cover. The clean air supplied to the substrate from the supply device flows downward when coming out of both covers from the gap between the upper cover and the lower cover. Therefore, there is little possibility that the flow of clean air that has flowed out of the gap between the two covers will fly particles and the like.

According to a twentieth aspect of the present invention, in the substrate processing apparatus according to the sixteenth aspect, the shape of the lower end of the upper cover of the air supply device corresponds to the shape of the upper end of the lower cover. ing. The air supply device further includes a seal member inserted between a lower end of the upper cover and an upper end of the lower cover. Here, the shape of the lower end of the upper cover corresponds to the shape of the upper end of the lower cover, and a seal member is inserted between the upper cover and the lower cover. Leakage to the outside through the gap between both covers is suppressed. As a result, the airflow caused by the suction of air from the surroundings adversely affects the substrate being dried (non-uniform drying and adheres to particles), and the air flows out to the adjacent processing unit and adversely affects the processing in the processing unit. Giving can be suppressed.

According to a twenty-first aspect of the present invention, in the substrate processing apparatus according to the twentieth aspect, the air supply device supplies the substrate with clean air that is smaller than the amount exhausted from the exhaust path. Here, the drying process is promoted by setting the pressure in the space surrounded by the air supply device, the lower cover, and the exhaust path to a slightly negative pressure (negative pressure state). However,
Since the cleaning air is supplied to generate a slight negative pressure, there is little possibility that particles adhere to the substrate.

A substrate processing apparatus according to a twenty-second aspect is the substrate processing apparatus according to the twenty-first aspect, wherein a space surrounded by an air supply device, a lower cover, and an exhaust path in processing in the drying acceleration processing unit. Is controlled to be substantially equal to the surrounding pressure before the sealing of the space is released. Here, if the space under negative pressure is suddenly opened to the surroundings, there is a risk that the particles may be entangled and adhere to the substrate, so control to make the pressure approximately equal to the surrounding pressure is performed before the sealing of the space is released. Will be Specifically, before the airtightness of the space is released, the supply amount of clean air by the air supply device is increased or the exhaust amount is reduced.

The substrate processing apparatus according to claim 23 is the substrate processing apparatus according to claim 20, which is installed in a downflow clean room. One end of the exhaust path is connected to the lower cover, and the other end is open to the lower space of the downflow clean room. Here, the exhaust path guides the cleaning air supplied to the substrate from the lower cover to the lower space of the downflow clean room. Then, the air guided into the lower space of the downflow clean room joins the downflow of the clean room without soaring because the downflow exists in the clean room. By providing the exhaust path in this way, problems such as particles flying up near the substrate due to the cleaning air supplied to the substrate can be suppressed.

The substrate processing apparatus according to claim 24 is the substrate processing apparatus according to claim 3, wherein the air supply device comprises:
It has an air volume adjusting function for adjusting the amount of cleaning air supplied to the substrate. Here, for example, it is possible to adjust the amount (air volume) of the cleaning air supplied to the substrate according to the type of the coating liquid applied to the substrate in the coating processing unit. Also, during the processing in the drying promotion processing section, the air volume can be changed so that drying can be performed in a shorter time.

The substrate processing apparatus according to claim 25 is the substrate processing apparatus according to claim 3, wherein the air supply device comprises:
It has a temperature adjustment function for adjusting the temperature of the cleaning air supplied to the substrate. Here, for example, the temperature of the cleaning air supplied to the substrate can be adjusted according to the type of the coating liquid applied to the substrate in the coating processing unit. In addition, the temperature of the cleaning air can be changed so that drying can be performed in a shorter time during the processing in the drying acceleration processing unit.

The substrate processing apparatus according to claim 26 is the substrate processing apparatus according to claim 3, wherein the air supply device comprises:
It has a humidity adjustment function for adjusting the humidity of the cleaning air supplied to the substrate. Here, for example, the humidity of the cleaning air supplied to the substrate can be adjusted according to the type of the coating liquid applied to the substrate in the application processing unit. In addition, the humidity of the cleaning air can be changed so that drying can be performed in a shorter time during the processing in the drying acceleration processing unit.

A substrate processing apparatus according to claim 27 is the substrate processing apparatus according to claim 3, wherein the air supply device has a chemical adsorption filter. This chemical adsorption filter reduces the solvent content of the cleaning air supplied to the substrate. Here, since the solvent content of the cleaning air supplied to the substrate is reduced, drying can be performed in a shorter time.

The substrate processing apparatus according to claim 28 is the substrate processing apparatus according to claim 3, wherein the drying promotion processing section further has a flow rate adjusting mechanism. This flow rate adjustment mechanism
This is a mechanism for changing the flow velocity of the cleaning air supplied from the air supply device to the substrate near the substrate. Here, for example, the flow rate of the cleaning air supplied to the substrate in the vicinity of the substrate can be changed depending on the type of the coating liquid applied to the substrate in the coating processing section. In addition, the flow rate of the cleaning air in the vicinity of the substrate can be changed so that drying can be performed in a shorter time during the processing in the drying acceleration processing unit.

The substrate processing apparatus according to claim 29 is the substrate processing apparatus according to claim 28, wherein the flow rate adjusting mechanism comprises:
This is a mechanism for relatively moving the air supply device and the substrate. Here, the flow rate of the cleaning air supplied to the substrate near the substrate is increased by relatively bringing the air supply device and the substrate closer to each other. Further, the flow rate of the cleaning air supplied to the substrate near the substrate is reduced by relatively separating the air supply device from the substrate. For example, if the two are gradually approached as time progresses, it is possible to secure a flow rate of the cleaning air near the substrate in accordance with the degree of drying.

The substrate processing apparatus according to claim 30 is the substrate processing apparatus according to claim 3, wherein the air supply device comprises:
It has a discharge path, a supply path through which clean air supplied to the substrate passes, and switching means for switching between the discharge path and the supply path. Here, the supply of the clean air to the substrate can be temporarily stopped without stopping the operation of the air supply device by switching to the discharge path by the switching unit. This eliminates the need to stop the operation of the air supply device when transporting the substrate to the drying promotion processing unit or when unloading the substrate from the drying promotion processing unit.

The substrate processing apparatus according to claim 31 is the substrate processing apparatus according to claim 3, wherein the air supply device comprises:
It has a guide member. This guide member is a member configured such that the cross-sectional area of the flow path of the clean air decreases toward the substrate side. Here, since the flow path of the clean air is reduced toward the substrate side by the guide member, even if the flow rate of the clean air when entering the guide member from the side opposite to the substrate side is not so high, the guide from the substrate side is performed. The required flow rate of clean air when leaving the member and being supplied to the substrate can be ensured. That is, by providing the guide member, clean air at a flow rate of, for example, 0.3 m / s is supplied at a rate of 1 m /
s.

[0048]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS First Embodiment (Configuration) FIG. 1 shows an embodiment (first embodiment) of a substrate processing apparatus according to the present invention. This substrate processing apparatus is an apparatus for resist coating that connects a plurality of processing units to a rectangular glass substrate (hereinafter, referred to as a substrate) to enable consistent processing. It can be connected to a device or the like.

This substrate processing apparatus is a single-wafer type apparatus, and has a carry-in section 1, a spin coater section (coating processing section) 2, a drying acceleration processing section 3, an edge rinse section (edge cleaning section) 4,
It comprises a placing section 5 and a baking section (baking processing section) 6. The substrate processing apparatus is disposed, for example, between a substrate cleaning apparatus 11 that is a pre-processing apparatus and an exposure machine 12 that is a post-processing apparatus. And the substrate is carried out from the baking unit 6 to the exposure machine 12 by a transfer robot or the like. From the loading unit 1 to the mounting unit 5, the substrate is transported by so-called intermittent transfer sliders 7a to 7b which have a plurality of hands and sequentially transport the substrate to an adjacent processing unit.

The substrate processing apparatus is installed in a clean room 10 as shown in FIG. The clean room 10 uses a HEPA filter (high efficiency part)
iculate air filter) A clean room in which air flows into the room from the entire surface of the ceiling constituted by 10b and flows out from the entire surface of the opposing floor. At the lower part of the clean room 10, a grating panel 10a, which is a steel or stainless steel scaly floor panel forming a free access space at the lower part, is installed. Grating panel 1
A large number of suction ports are opened at 0a. The air flow is generated by the blower 10c.

Next, the configuration of the drying promotion processing section 3 will be described. As shown in FIG. 3, the drying promotion processing section 3 mainly includes a substrate mounting table 21 on which a substrate is mounted, and an air supply device 30 that gently blows clean air to the substrate. The substrate mounting table 21 is a table for mounting a rectangular substrate W in a horizontal state, has a rectangular shape substantially the same as the size of the substrate W, and has a plurality of substrate support pins 21a provided on the upper surface. The air supply device 30 includes a HEPA filter 31, a blower (blower) 33, and a supply pipe (supply path) connecting the HEPA filter 31 and the blower 33.
32. HEPA filter 31
Is 99.000 for particles having a rated air volume and a particle size of 0.3 μm.
The air filter has a particle collection rate of 97% or more and an initial pressure loss of generally 300 Pa or less. Although the HEPA filter 31 is used here, an ULPA filter may be used if necessary. The blower is a blower that supplies air to the HEPA filter 31 and may be installed in the clean room 10 or may be installed outside the clean room 10 because the HEPA filter 31 is arranged immediately above the substrate W. . When the blower 33 is installed in a clean room, the clean air that has passed through the HEPA filter 10b in the clean room 10 can be sent to the HEPA filter 31, and the HEPA filter 31
It is also possible to omit the installation. However, if particles may be generated when the blower 33 is installed in the clean room 10, it is preferable that the blower 33 be installed outside the clean room 10. The air that has exited the blower 33 is heated by a heater 34 disposed between the blower 33 and the supply pipe 32. That is, the air supply device 30 includes the heater 3
Activating the HEPA filter 31
The temperature of the clean air blown out from can be adjusted.

The air supply device 30 blows air downward from the lower part of the HEPA filter 31 toward the substrate W, as indicated by the dashed line arrow in FIG. This air is clean air since it has passed through the HEPA filter 31. The flow velocity of the air near the surface of the substrate W is variable from 0.25 to 2.00 m / s,
Usually, it is set to 0.50 m / s. This flow rate is HEP
It is determined by the distance from the A filter 31 to the substrate W and the output of the blower.

(Substrate Processing) In this substrate processing apparatus, first, the substrate is carried from the loading section 1 to the spin coater section 2 by the intermittent transfer slider 7a, and the substrate is coated with a resist (coating liquid). The spin coater unit 2 includes a resist supply system, a spin motor, a cup, and the like, and forms a uniform resist film on a horizontally mounted substrate by dropping the resist on the substrate and rotating the substrate. The substrate on which the resist film has been formed is carried to the drying promotion processing unit 3 and dried to a certain extent. This process will be described later. Thereafter, the substrate is moved to the edge rinsing section 4. In the edge rinsing section 4, a process of removing the resist on the periphery of the substrate surface and on the end surface portion with a solvent is performed in order to prevent the resist film on the substrate end surface from being peeled off and generating dust. The substrate that has been subjected to each of the processes related to the resist coating is transferred from the mounting unit 5 to the baking unit 6 by a robot (not shown). Bake part 6
Then, a heat treatment is performed for the purpose of evaporating the residual solvent in the resist film on the substrate and enhancing the adhesion of the substrate. The baking unit 6 has a plurality of heating units and cooling units, and the substrates are carried in and out of these sequentially. The substrate subjected to the heating and cooling processing is carried out to the exposure machine 12.

Next, the substrate processing and features of the drying promotion processing section 3 will be described. Here, when the substrate W sent from the spin coater unit 2 is placed on the substrate mounting table 21, clean air is blown downward from the air supply device 30 toward the substrate W. This flow of clean air is HEP
The current is rectified by passing through the A filter 31. Since such rectified clean air hits the substrate W at a gentle speed, the resist on the surface of the substrate W dries while its surface shape is leveled.

If the substrate coated with the resist is heated immediately in the spin coater, problems such as drying of the substrate in a wavy surface state immediately after the application occur. In the device, spin coater 2
The drying promotion processing section 3 is provided between the baking section 6 and the drying section.
Then, the substrate is dried to some extent in the drying promotion processing section 3. For this reason, the above-described disadvantages that occur when the substrate is subjected to the heat treatment immediately after the application are suppressed. Also,
Since the clean air is blown to the substrate W, there is no fear that particles and the like adhere to the substrate W. Furthermore, since the clean air is applied to the substrate W at a predetermined flow rate, the solvent gas of the resist evaporated near the surface of the substrate W does not easily stay, and drying is promoted.

When the thickness of the substrate on which the resist is applied is reduced to a certain value or less, the fluidity of the resist is almost nil. Therefore, conventionally, in order to suppress the applied resist from flowing in the edge rinse portion, the resist coating is performed. Immediately after that, the substrate is placed under reduced pressure so that the film thickness is reduced to a certain value or less.
However, there is a problem in that the particles are entangled by the pressure reduction and adhere to the substrate. On the other hand, if the drying is performed without reducing the pressure, the processing liquid gas evaporated near the substrate surface stays, so that the evaporation is hindered and the processing time becomes longer. On the other hand, in the present substrate processing apparatus, drying in a short time is realized in the drying promotion processing unit 3 by blowing a solvent gas which tends to stay on the surface of the substrate W by downflow of air. Therefore, in the edge rinsing unit 4, the resist on the substrate W hardly flows, and the coated state of the resist is kept good even if the cleaning process near the end face of the substrate W is performed.

Further, in the drying promotion processing section 3, the air supply device 30 generates a flow of clean air at a predetermined speed or higher. Although it is possible to dry the substrate W using the downflow in the clean room 10 as it is, an air supply device 30 is separately provided here to dry the substrate W in a shorter time. Further, since the air supply device 30 is provided with the heater 34, the temperature of the cleaning air supplied to the substrate W in the spin coater unit 2 can be adjusted according to the type of the resist applied to the substrate W. Thereby, it is possible to optimize the drying state of the substrate W in the drying promotion processing unit 3.

[Second Embodiment] It is also possible to provide the air supply device 30 of the first embodiment with an air volume adjusting function and a humidity adjusting function. When the air supply device 30 is provided with an air volume adjustment function for adjusting the amount of cleaning air supplied to the substrate W, the spin coater unit 2 adjusts the air volume supplied to the substrate W according to the type of resist applied to the substrate W. This makes it possible to optimize the dry state of the substrate W. Specifically, in addition to adjusting the output of the blower 33, there is a method of providing a damper in the supply pipe 32 or adjusting the distance from the HEPA filter 31 to the substrate W.

When the air supply device 30 is provided with a humidity adjusting function for adjusting the humidity of the cleaning air supplied to the substrate W, the air is supplied to the substrate W in the spin coater 2 depending on the type of resist applied to the substrate W. The humidity of the cleaning air can be adjusted, and the dry state of the substrate W can be optimized. Specifically, there is a method of providing a dehumidifying device on the suction side or the blowing side of the blower 33.

[Third Embodiment] The air supply device 30 of the first embodiment may be equipped with a chemical adsorption filter. In this case, since the content of the solvent contained in the cleaning air impinging on the substrate W decreases, the drying can be performed in the drying promotion processing unit 3 in a shorter time. [Fourth Embodiment] In this embodiment, an air supply device 40 shown in FIG. 4 is used in place of the air supply device 30 of the first embodiment.

The air supply device 40 shown in FIG.
An A filter 41 and a blower 42 are provided. The HEPA filter 41 is disposed above the substrate W mounted on the substrate mounting table 21, and the blower 42
It is arranged above the PA filter 41. The HEPA filter 41 is an air filter similar to the HEPA filter 31, and the blower 42 is a blower similar to the blower 33. The air supply device 40 blows air downward from the lower part of the HEPA filter 41 toward the substrate W, as indicated by a dashed line arrow in FIG. This air is clean air that is the clean air that has flowed down from the HEPA filter 10b of the clean room 10 by the operation of the blower 42 and has further passed through the HEPA filter 41.

Here, in addition to the HEPA filter 41, a blower 42 is also arranged above the substrate W, and the HEPA above the substrate W in the clean room 10.
Clean air that has just left the filter 10b is HEPA
It can be blown out to the substrate W via the filter 41. [Fifth Embodiment] In this embodiment, an air supply device 50 shown in FIG. 5 is used instead of the air supply device 30 of the first embodiment.

The air supply device 50 shown in FIG.
A filter 51, blower not shown, and HEPA
A supply pipe 52 connecting the filter 51 and the blower,
And an upper cover 53. The HEPA filter 51 is an air filter similar to the HEPA filter 31, and the blower is a blower similar to the blower 33. As shown in FIG. 5, the upper cover 53 has a shape in which the internal horizontal area increases from the upper part to the lower part, and covers the substrate mounting table 21 and the substrate W from the upper part.

The air supply device 50 blows air downward from the lower part of the HEPA filter 51 toward the substrate W, as indicated by the dashed line arrow in FIG. At this time, the upper cover 53 guides the air flow downward so that the air blown downward toward the substrate W does not flow to the adjacent spin coater unit 2 or edge rinse unit 4. Therefore, here, the cleaning air supplied to the substrate W by the air supply device 50 flows to the adjacent spin coater unit 2 and edge rinse unit 4, and the flow adversely affects the processing in the spin coater unit 2 and edge rinse unit 4. Disappears.

[Sixth Embodiment] In this embodiment, an air supply device 50 shown in FIG. 6 is used instead of the air supply device 30 of the first embodiment, and
Is provided with a lower cover assembly 60. The air supply device 50 shown in FIG. 6 is the same as the air supply device 50 of the fifth embodiment. The lower cover assembly 60 includes a lower cover 63 and a perforated plate 61. The lower cover 63 has an upper portion that enters the space outside the substrate mounting table 21 and the substrate W and inside the lower portion of the upper cover 53. At the lower end of the lower cover 63, a perforated plate 61 in which a plurality of holes are formed is mounted. The perforated plate 61 allows the air flowing down inside the lower cover 63 to pass downward.

The air supply device 50 blows air downward from the lower part of the HEPA filter 51 toward the substrate W, as indicated by the dashed line arrow in FIG. At this time, the upper cover 53 guides the air flow downward so that the air blown downward toward the substrate W does not flow to the adjacent spin coater unit 2 or edge rinse unit 4. On the other hand, the lower cover 63 is
The air flow is controlled by the perforated plate 61 so that the air blown out to the substrate W from
From the lower cover assembly 60.

Here, since the lower cover assembly 60 for guiding the air flow downward is provided, the clean air supplied to the substrate W from the air supply device 50 is supplied to the substrate mounting table 2.
It is possible to avoid a phenomenon in which particles are attached to the surface of the substrate W by flying upward on the member 1 or the member supporting the substrate mounting table 21 or the like. In particular, when the driving portion of the substrate processing apparatus is disposed below the height level of the transport of the substrate W, the installation of the lower cover assembly 60 that can prevent the particles from flying up is effective. .

As shown in FIG. 6, the lower end of the upper cover 53 of the air supply device 50 covers the upper portion of the lower cover 63. The height position of the lower end of the upper cover 53 is lower than the height position of the upper end of the lower cover 63. For this reason, when the clean air flowing down from the air supply device 50 to the substrate W exits from the gap between the upper cover 53 and the lower cover 63 to the space outside the lower cover assembly 60, it flows downward. There is less danger that this flow will soar particles and the like.

[Seventh Embodiment] In this embodiment, an air supply device 70 shown in FIG. 7 is used instead of the air supply device 30 of the first embodiment, and
Is provided with a lower cover assembly 76. The air supply device 70 shown in FIG. 7 includes a HEPA filter 71, a blower (not shown), a supply pipe 72 connecting the HEPA filter 71 and the blower, and an upper cover 73. The HEPA filter 71 is an air filter similar to the HEPA filter 31, and the blower is a blower similar to the blower 33. As shown in FIG. 7, the upper cover 73 has a shape in which the internal horizontal area increases from the upper part to the lower part, and covers the substrate mounting table 21 and the substrate W from the upper part. The lower cover assembly 76 includes a lower cover 77 and a perforated plate 78. The shape of the upper end of the lower cover 77 corresponds to the shape of the lower end of the upper cover 73. Further, a seal ring (seal member) 75 that is sandwiched between the lower end surface of the upper cover 73 and the upper end surface of the lower cover 77 is mounted on the upper end surface of the lower cover 77. At the lower end of the lower cover 77, a perforated plate 78 in which a plurality of holes are formed is mounted. The perforated plate 78 allows the air flowing down inside the lower cover 77 to flow downward. The lower cover assembly 76 is fixed to the clean room 1 by a fixing member 79.
0 is fixed to the floor.

The air flowing downward through the perforated plate 78 is exhausted to the outside of the clean room 10 through an exhaust pipe (exhaust path) 78a. The HEPA filter 71 and the upper cover 73 of the air supply device 70
Can be moved vertically by a driving device (not shown).
That is, the HEPA filter 71 and the upper cover 73
Can move upward away from the substrate mounting table 21 and the lower cover assembly 76 from the state shown in FIG.

When the gap between the upper cover 73 and the lower cover 77 is sealed by the seal ring 75 as shown in FIG. 7, the air supply device 70 starts from below the HEPA filter 71 as indicated by the one-dot chain line in FIG. As shown by the arrow, air is blown downward toward the substrate W.
At this time, since the substrate W is covered by the upper cover 73 and the lower cover 77, and the gap is sealed by the seal ring 75, the air blown downward toward the substrate W is supplied to the adjacent spin coater 2 It does not flow to the edge rinse section 4 and is exhausted downward through the perforated plate 78.

As described above, the air supplied to the substrate W is prevented from leaking outside from the gap between the covers 73 and 77. This suppresses problems such as uneven drying and adhesion of particles to the substrate W during drying due to an airflow caused by suction of air from the surroundings into the internal space of the covers 73 and 77 where the substrate W is present. Further, it is possible to prevent air from flowing out to the adjacent spin coater section 2 and edge rinse section 4 and adversely affect resist coating processing and edge rinse processing.

Further, the drying promotion processing section 3 of the substrate processing apparatus
In the processing in the step (a), control is performed such that the amount of air blown out from the air supply device 70 to the substrate W is smaller than the amount of air exhausted through the exhaust pipe 78a. The substrate W is dried by setting the pressure in the space surrounded by the cover assembly 76 and the exhaust pipe 78a to a slightly negative pressure. By setting the periphery of the substrate W in a negative pressure state, the drying process is promoted.

Further, with the above control, the air supply device 70, the lower cover assembly 76, and the exhaust pipe 7
Control is performed so that the pressure in the space surrounded by 8a is substantially equal to the surrounding pressure immediately before the closed state of the space is released after the drying process of the substrate W is completed. This is performed by reducing the amount of air exhausted by the exhaust pipe 78a before releasing the sealed state of the space. By controlling in this way, it is possible to avoid entrapment of particles and adhesion of particles to the substrate when the space in the negative pressure state is suddenly opened to the surroundings.

[Eighth Embodiment] In the present embodiment, an air supply device 80 shown in FIG. 8 is used instead of the air supply device 30 of the first embodiment, and
Is provided with a lower cover assembly 86. As described below, in the seventh embodiment, the air supply device 7 is used.
0, the HEPA filter 71 and the upper cover 73 move vertically, whereas in the present embodiment, the lower cover assembly 8
6 and the substrate mounting table 21 move vertically.

The air supply device 80 shown in FIG.
A filter 81, blower not shown, and HEPA
A supply pipe 82 connecting the filter 81 and the blower,
And an upper cover 83. The HEPA filter 81 is an air filter similar to the HEPA filter 31, and the blower is a blower similar to the blower 33. As shown in FIG. 8, the upper cover 83 has a shape in which the internal horizontal area increases from the upper part to the lower part, and covers the substrate mounting table 21 and the substrate W from the upper part.
The lower cover assembly 86 includes the lower cover 87 and the perforated plate 8.
And 8. The shape of the upper end of the lower cover 87 corresponds to the shape of the lower end of the upper cover 83.
Further, a seal ring (seal member) 85 that is sandwiched between the lower end surface of the upper cover 83 and the upper end surface of the lower cover 87 is mounted on the upper end surface of the lower cover 87. At the lower end of the lower cover 87, a perforated plate 88 having a plurality of holes is mounted. The perforated plate 88 allows the air flowing down inside the lower cover 87 to flow downward. The lower cover assembly 86 and the substrate mounting table 21 are integrated so that they cannot move relative to each other.

The lower cover assembly 86 and the substrate mounting table 21 are fixed to the floor of the clean room 10 by an electric ball screw cylinder 89, and by operating the electric ball screw cylinder 89, the state shown in FIG. Moving upward, the seal ring 85 is held by the upper cover 83 and the lower cover 87. On the other hand, the height level of the air supply device 80 is fixed.

The air supply device 80 includes a seal ring 85
In the state where the gap between the upper cover 83 and the lower cover 87 is sealed, air is blown downward from the lower part of the HEPA filter 81 toward the substrate W. At this time, since the substrate W is covered by the upper cover 83 and the lower cover 87, and the gap is sealed by the seal ring 85, the air blown downward toward the substrate W is supplied to the adjacent spin coater unit 2. It does not flow to the edge rinse section 4 and is exhausted downward through the perforated plate 78.

As described above, the air supplied to the substrate W is prevented from leaking outside from the gap between the covers 83 and 87. This suppresses problems such as uneven drying and adhesion of particles to the substrate W during drying due to an airflow caused by suction of air from the surroundings into the internal space of the covers 83 and 87 where the substrate W is present.

[Ninth Embodiment] In the ninth embodiment, an air supply device 90 shown in FIG. 9 is used instead of the air supply device 30 of the first embodiment, and
Is provided with a lower cover assembly 95. Here, the lower cover assembly 95 and the substrate mounting table 21 move up and down.

The air supply device 90 shown in FIG.
A filter 91, blower 92, upper cover 93
It is composed of The HEPA filter 91 is disposed above the substrate W mounted on the substrate mounting table 21, and the blower 92 is disposed above the HEPA filter 91. HEPA filter 91 is HEPA filter 3
The blower 92 is an air filter similar to the blower 33. As shown in FIG. 9, the upper cover 93 has such a shape that the internal horizontal area increases from the upper part to the lower part, and the substrate mounting table 21 and the substrate W (shown by dotted lines in FIG. Stuff) from the top. The lower cover assembly 95 includes a lower cover 97 and a perforated plate 98. The lower cover 97 includes the lower cover assembly 95 and the substrate mounting table 21.
Is located above, the upper part thereof is
And enters the space outside the substrate W and inside the lower part of the upper cover 93. At the lower end of the lower cover 97, a perforated plate 98 having a plurality of holes is mounted. The perforated plate 98 allows the air flowing down inside the lower cover 97 to flow downward. Note that the lower cover assembly 95 and the substrate mounting table 21 are integrated so that they cannot move relative to each other.

The lower cover assembly 95 and the substrate mounting table 21 are fixed to the floor of the clean room 10 by an electric ball screw cylinder 99. When the electric ball screw cylinder 99 is operated, the lower cover assembly 95 and the substrate mounting table 21 are shown by solid lines in FIG. It moves upward from the state to the state shown by the dotted line in FIG. On the other hand, the height level of the air supply device 90 is fixed.

The air supply device 90 blows air downward from the lower part of the HEPA filter 91 toward the substrate W. At this time, the upper cover 93 guides the air flow downward so that the air blown downward toward the substrate W does not flow to the adjacent spin coater unit 2 or edge rinse unit 4. On the other hand, the air blown out from the air supply device 90 to the substrate W
The air flow is directed from the perforated plate 98 to below the lower cover assembly 95 so as not to soar from the lower portion of the lower cover assembly 95.

Here, as shown in FIG. 9, the substrate W and the air supply device 90 are relatively moved by the operation of the electric ball screw cylinder 99. Therefore, during the drying processing of the substrate W in the drying promotion processing unit 3, both W, 9
By approaching 0, the flow velocity of the air impinging on the substrate W can be ensured, and when the substrate W is carried in / out of the substrate mounting table 21, the two can be moved away from each other so as to avoid interference.

When the distance between the substrate W and the air supply device 90 is controlled by the electric ball screw cylinder 99, the flow rate of the cleaning air applied to the substrate W depends on the type of the resist applied to the substrate W in the spin coater 2. It is possible to change This makes it possible to perform an appropriate drying process of the resist on the substrate W according to the type of the resist. Furthermore, the flow rate of the cleaning air in the vicinity of the substrate W according to the degree of drying can be secured by relatively bringing the substrate W and the air supply device 90 closer to each other as the time progresses during the drying process. .

[Tenth Embodiment] In this embodiment, an air supply device 100 shown in FIG. 10 is used instead of the air supply device 30 of the first embodiment, and the lower cover assembly 105 Is provided. FIG.
The air supply device 100 shown in FIG.
01, blower 104, HEPA filter 101
And a blower 104, and a supply pipe 102 for connecting the blower 104 and the upper cover 103. Here, HEPA
The filter 101 is positioned above the substrate W to blow clean air from the vicinity of the substrate W toward the substrate W, and the supply pipe 102 is provided to
4 is disposed outside the clean room 10. HEPA
The filter 101 is an air filter similar to the HEPA filter 31, and the blower 104 is a blower similar to the blower 33. As shown in FIG. 10, the upper cover 103 has a shape in which the internal horizontal area increases from the top to the bottom, and covers the substrate W from the top. The lower cover assembly 105 includes the lower cover 107 and the perforated plate 10.
6 is comprised. The upper part of the lower cover 107 enters the space outside the substrate W and inside the lower part of the upper cover 103. At the lower end of the lower cover 107, a perforated plate 10 having a plurality of holes is formed.
6 is mounted. The perforated plate 106 allows the air that has flowed down inside the lower cover 107 to flow downward.

The air flowing downward through the perforated plate 106 is exhausted to the outside of the clean room 10 through the exhaust pipe 108. The exhaust pipe 108 incorporates an exhaust damper 109. Air supply device 1
00 blows air downward from the lower part of the HEPA filter 101 toward the substrate W. At this time, the upper cover 103 guides the air flow downward so that the air blown downward toward the substrate W does not flow to the adjacent spin coater unit 2 or edge rinse unit 4. On the other hand, the lower cover 107 guides the flow of the air from the perforated plate 106 to the exhaust pipe 108 so that the air blown from the air supply device 100 to the substrate W does not fly from below the substrate W.

Here, the air guided by the lower cover assembly 105 is exhausted out of the clean room 10 by the exhaust pipe 108. By doing so, adverse effects such as adverse effects on the spin coater unit 2 and the edge rinse unit 4 and soaring of particles are suppressed.
Here, the amount of air from the exhaust pipe 108 is adjusted by adjusting the opening of the exhaust damper 109, and the amount of clean air blown from the air supply device 100 is larger than the amount of air exhausted from the exhaust pipe 108. Control is performed. This keeps the space near the substrate W at a more positive pressure than the surroundings, and suppresses problems such as drying unevenness and particle adhesion to the substrate W during drying due to suction of air from the surroundings.

[Eleventh Embodiment] In the tenth embodiment, the air flowing downward through the perforated plate 106 of the lower cover assembly 105 is exhausted to the outside of the clean room 10 by the exhaust pipe 108. In this embodiment,
As shown in FIG. 11, the air flowing downward through the perforated plate 106 of the lower cover assembly 105 is discharged to the exhaust pipe 11.
By 0, the air is exhausted to the space below the grating panel 10a in the clean room 10.

Here, the air blown from the air supply device 100 to the substrate W is the grating panel 10a.
To the space below. The air introduced into this space joins the downflow of the clean room 10 without soaring because the downflow exists in the clean room 10. By arranging the exhaust pipe 110 in this way, the problem that particles fly up in the vicinity of the substrate W due to the cleaning air supplied to the substrate W can be suppressed.

[Twelfth Embodiment] In this embodiment, an air supply device 120 shown in FIG. 12 is used instead of the air supply device 30 of the first embodiment, and a lower cover assembly 125 Is provided. FIG.
The air supply device 120 shown in FIG. 1 includes a rectifying plate 121, a blower 124, a supply pipe 122 connecting the rectifying plate 121 and the blower 124, and an upper cover 123. The rectifying plate 121 is a steel or stainless steel panel having a large number of holes formed in a staggered lattice pattern, and rectifies the air blown to the substrate W. Blower 12
4 is H on the air discharge side of the blower similar to the blower 33.
The EPA filter 124a is attached. As shown in FIG. 12, the upper cover 123 is shaped so that the internal horizontal area increases from the upper part to the lower part.
The substrate W is covered from above. The lower cover assembly 125 includes a lower cover 127 and a perforated plate 126. The upper portion of the lower cover 127 enters the space outside the substrate W and inside the lower portion of the upper cover 123. At the lower end of the lower cover 127, a perforated plate 126 in which a plurality of holes are formed is mounted.
The perforated plate 126 allows the air flowing down inside the lower cover 127 to flow downward.

The air that has flowed downward through the perforated plate 126 is exhausted to the space below the grating panel 10a in the clean room 10 by the exhaust pipe 128. The exhaust pipe 128 has an exhaust damper 129.
Is incorporated. The air supply device 120 blows air downward from the lower part of the current plate 121 toward the substrate W.

Here, the HEPA filter 124a generates clean air, and the rectifying plate 121 is provided to make the dry state of the resist on the substrate W uniform. [Thirteenth Embodiment] In this embodiment, the HEPA filter 101 and the blower 104 in the tenth embodiment are described.
As shown in FIG. 13, a supply pipe 132 to which a discharge pipe 135 is connected is used instead of the supply pipe 102
Connects the HEPA filter 101 and the blower 104.

A discharge pipe 135 is connected to the supply pipe 132, and the other end of the discharge pipe 135 is connected to the clean room 1.
It is open to the atmosphere outside 0. These pipes 13
2 and 135 incorporate automatic control dampers (switching means) 132a and 135a, respectively, and the opening degree changes according to a command from a control computer (not shown).
Close the automatic control damper 132a and close the automatic control damper 1.
When 35a is opened, all the air discharged from the blower 104 is sent to the HEPA filter 101, and the opening degree of the automatic control damper 132a is increased to increase the automatic control damper 1
If the opening degree of 35 a is reduced, a part or all of the air discharged from the blower 104 is discharged to the atmosphere from the discharge pipe 135.

Here, the automatic control dampers 132a, 132
The blower 104 is controlled by controlling the opening of the blower 104a.
, The supply of clean air to the substrate W can be temporarily stopped or throttled. Therefore, it is not necessary to stop the operation of the blower 104 when the substrate W is transferred to the drying promotion processing unit 3 or when the substrate W is unloaded from the drying promotion processing unit 3. Can be adjusted.

[Fourteenth Embodiment] In the first embodiment, the drying promotion processing unit 3 is configured as shown in FIG. 3, but in the present embodiment, the drying promotion processing unit 3 is replaced with the drying promotion processing unit 3 shown in FIG.
The configuration shown in FIG. The drying promotion processing unit 3 mainly includes a substrate mounting table 21 on which a substrate is mounted, and a substrate mounting table 21.
Cover assembly 140 covering the periphery of the
1 and an electric ball screw cylinder 149 for moving the lower cover assembly 140 up and down. The substrate mounting table 21 is a table for mounting the substrate W in a horizontal state. The lower cover assembly 140 includes the lower cover 14.
7 and a perforated plate 148. The lower cover 147 is a tubular member that houses the substrate mounting table 21 inside. At the lower end of the lower cover 147, a perforated plate 148 having a plurality of holes is mounted. The perforated plate 148 allows the air that has flowed down inside the lower cover 147 to pass downward. The air that has flowed downward through the perforated plate 148 is allowed to extend and retract.
The air is exhausted outside the clean room through 48a. The lower cover assembly 140 and the substrate mounting table 21 are integrated so as not to move relative to each other.

The lower cover assembly 140 and the substrate mounting table 21 are fixed to the floor of the clean room 10 by an electric ball screw cylinder 149, and by operating the electric ball screw cylinder 149, FIG.
4 and moves upward from the state shown by the solid line to the state shown by the dotted line in FIG. Next, substrate processing and features of the drying promotion processing unit 3 of the present embodiment will be described.

Here, when the substrate W sent from the spin coater unit 2 is placed on the substrate mounting table 21, the transmission ball screw cylinder 149 is operated, and the substrate mounting table 2 is moved.
1 is raised from the position shown by the solid line in FIG. 14 to the position shown by the dotted line in FIG. Then, the HEPA filter 10b
The clean air that is blown downward from the substrate W hits the substrate W. The flow of this clean air is HEPA filter 10b
It is rectified by passing through. Since such rectified clean air hits the substrate W at a gentle speed, the resist on the surface of the substrate W applied by the spin coater 2 is dried while its surface shape is leveled. At this time, the lower cover 147
In order to prevent the air flowing under the substrate W from rising, the air flow from the perforated plate 148 to the exhaust pipe 14 is reduced.
8a.

In this case, as shown in FIG. 14, the substrate W is
The substrate W can be made to approach the A filter 10b, and at the time of the drying processing of the substrate W in the drying promotion processing section 3, the substrate W is brought close to the HEPA filter 10b to secure the flow velocity of the air impinging on the substrate W. Further, when loading / unloading the substrate W from / to the substrate mounting table 21, the substrate W is moved to its original position (the position indicated by the solid line in FIG. 14) so as to avoid interference.
Back to. As described above, in the present embodiment, the substrate W is dried using the downflow of the clean air from the HEPA filter 10b in the clean room as it is, and there is no need to separately provide an air supply device.

The flow velocity of the clean air blown down from the HEPA filter 10b of the clean room 10 and flowing down is 0.25 to 0.50 m / s near the outlet of the HEPA filter 10b. Therefore, the HEPA filter 1 is used to promote the drying of the substrate W.
It is desirable that the substrate W be as close as possible to 0b, and here the distance between them is as close as about 100 to 300 mm.

[Fifteenth Embodiment] In the fifteenth embodiment, the substrate mounting table 21 of the first embodiment shown in FIG.
The substrate mounting table 221 shown in FIG.

The substrate mounting table 221 shown in FIG. 15 has a disk shape sufficiently larger than the diagonal of the rectangular substrate W, and mounts the substrate W at the center of the substrate mounting surface 221b, which is the upper surface thereof. Are provided. When such a substrate mounting table 221 is used, the resist film formed on the substrate surface does not become uneven. That is, if the substrate mounting table is smaller than the size of the substrate W, for example, as shown in FIG. 16A, a weak turbulent flow F1 occurs in the center of the substrate,
At the periphery of the substrate, an airflow F2 from the inside to the outside of the substrate is generated. This air flow F2 tends to flow in almost one direction along the substrate surface, as shown in the enlarged plan view of FIG. 16B, and the resist film to be dried is so-called along the flow direction of the air flow. There is a possibility that wind ripples may be formed and become uneven. However, in the substrate mounting table 221 of this embodiment, the substrate W
A part of the clean air sent from the air supply device 30 stagnates over the entire upper surface of the device to generate a vortex-like weak turbulence (FIG.
5 (b)). Further, the irregularity of the turbulence generated there does not cause unevenness when the resist film formed on the substrate surface is dried.

In this embodiment, the substrate mounting table 22
Although the above-described constant outward airflow is generated in the peripheral portion of No. 1, it does not adversely affect the resist film on the substrate. In other words, the size of the substrate mounting table 221 may be such that the clean air impinging on the substrate W does not generate an outward flow on the substrate surface but generates an outward flow on the substrate mounting table. In the present embodiment, the distance from the substrate W to the outer edge of the substrate mounting table 221 is set to be about 3 to 5 cm as a size that can effectively suppress the occurrence of unevenness without unnecessarily increasing the size of the apparatus. ing. That is, in the present embodiment, the distance from the corner of the substrate W to the outer edge of the substrate mounting table 221 is formed to be about 3 to 5 cm.

Further, the shape of the substrate mounting table is not limited to the disk shape, and may be, for example, a substrate mounting table having a rectangular shape similar to the substrate W. Specifically, the outer edge of the substrate mounting table is Any size may be used as long as it protrudes outward by about 3 to 5 cm from each side of the substrate W. Sixteenth Embodiment In this embodiment, an air supply device 430 shown in FIG. 17 is used instead of the air supply device 30 shown in FIG. 3 of the first embodiment.

The air supply device 430 shown in FIG. 17 includes a HEPA filter 431 having a blowing area sufficiently larger than the area of the substrate W in order to obtain a sufficient air volume, and clean air from the HEPA filter 431 is supplied. Upper guide member (guide member) for guiding to the substrate W
432 are provided. This upper guide member 432 is the same as that shown in FIG.
As shown in FIG. 7, the upper portion has a horizontal area substantially equal to the blowout area of the HEPA filter 431, and the lower portion near the substrate position is narrowed so that the horizontal area is smaller than the upper portion and slightly larger than the substrate W. Shape. That is, the upper guide member 432 is
The cross section of the flow path of the clean air is configured to decrease toward the substrate W side. By providing the upper guide member 432, even when the HEPA filter 431 that blows clean air at a speed of, for example, 0.3 m / s can be used, the air volume can be increased, and the flow path near the substrate W can be increased. , A flow velocity of, for example, 1 m / s can be obtained. This allows the resist on the substrate to dry faster and better.

[0106]

According to the present invention, a drying acceleration processing step is provided between the coating processing step and the end face cleaning processing step before the baking processing step, and clean air is supplied to the substrate at a flow rate higher than a predetermined speed. The substrate is drying. For this reason, it is possible to suppress problems when the substrate is heated immediately after the application, and to dry the liquid applied to the substrate without using an expensive decompression chamber.

[Brief description of the drawings]

FIG. 1 is a schematic configuration diagram of a substrate processing apparatus according to an embodiment of the present invention.

FIG. 2 is a schematic diagram of a clean room.

FIG. 3 is a schematic diagram of a drying promotion processing unit.

FIG. 4 is a schematic diagram of a drying acceleration processing unit according to a fourth embodiment.

FIG. 5 is a schematic diagram of a drying promotion processing unit according to a fifth embodiment.

FIG. 6 is a schematic diagram of a drying promotion processing unit according to a sixth embodiment.

FIG. 7 is a schematic diagram of a drying promotion processing unit according to a seventh embodiment.

FIG. 8 is a schematic diagram of a drying promotion processing unit according to an eighth embodiment.

FIG. 9 is a schematic diagram of a drying promotion processing unit according to a ninth embodiment.

FIG. 10 is a schematic diagram of a drying promotion processing unit according to a tenth embodiment.

FIG. 11 is a schematic view of a drying promotion processing section according to an eleventh embodiment.

FIG. 12 is a schematic diagram of a drying promotion processing unit according to a twelfth embodiment.

FIG. 13 is a schematic diagram of a drying promotion processing unit according to a thirteenth embodiment.

FIG. 14 is a schematic diagram of a drying promotion processing unit according to a fourteenth embodiment.

FIG. 15 is a schematic diagram of a drying promotion processing unit according to a fifteenth embodiment.

FIG. 16 is a schematic diagram of a comparison of a drying promotion processing unit.

FIG. 17 is a schematic view of a drying promotion processing unit according to a sixteenth embodiment.

[Description of Signs] 2 Spin coater section (coating processing section) 3 Drying promotion processing section 4 Edge rinsing section (end face cleaning processing section) 6 Bake section (baking processing section) 10 Clean room 10a HEPA filter (ceiling section) 30, 40, 50 , 70, 80, 90, 100, 120
Air supply device 31, 41, 51, 71, 81, 91, 101, 124
a HEPA filter (air filter / air discharge port) 32, 52, 72, 82, 102, 122, 132
Supply piping (supply route) 33, 42, 92, 104, 124 Blower (blower) 53, 73, 83, 93, 103, 123 Upper cover 75, 85 Seal ring (seal member) 77, 87, 97, 107, 127 Lower cover 78a, 108, 110, 128 Exhaust pipe (exhaust path) 99 Electric ball screw cylinder (second drive unit) 109, 129 Exhaust damper 121 Rectifier plate (rectifier plate / air discharge port) 132a, 135a Automatic control damper (switching) Means) 135 Discharge pipe (discharge path) 149 Electric ball screw cylinder (first drive device) 221 Substrate mounting table 221b Substrate mounting surface 432 Upper guide member (guide member) W Substrate

Continued on the front page F term (reference) 3L113 AA01 AB02 AC08 AC25 AC45 AC46 AC50 AC51 AC52 AC54 AC55 AC56 AC57 AC63 AC67 AC74 AC76 AC77 AC83 BA34 CA08 CA09 CA11 CB23 CB24 CB27 CB28 CB34 DA05 DA06 DA10 DA13 DA19 DA24 5F046 JA04 JA22 KA07

Claims (31)

[Claims] 1. A substrate processing method for performing a series of processing on a substrate, comprising: a coating processing step of applying a coating liquid to the substrate; and a heating processing to the substrate coated with the coating liquid. A baking treatment step, a drying promotion treatment step provided between the coating treatment step and the baking treatment step, and supplying clean air at a flow rate of a predetermined speed or more to the substrate; the drying promotion treatment step and the baking An end face cleaning step of cleaning the vicinity of the end face of the substrate provided between the processing steps. 2. A substrate processing apparatus for performing a series of processing on a substrate, comprising: a coating processing section for coating a substrate with a coating liquid; A drying promotion processing unit that supplies clean air having a flow rate equal to or higher than a predetermined speed, a baking processing unit that performs a heating process on the substrate that has been processed in the drying promotion processing unit, and a process in the drying promotion processing unit. A substrate processing apparatus comprising: an edge cleaning section for cleaning the vicinity of an edge before subjecting a substrate to heat treatment in the baking section. 3. The substrate processing apparatus according to claim 2, wherein said drying promotion processing section has an air supply device for blowing clean air. 4. A substrate processing apparatus installed in a clean room for performing a series of processing on a substrate, in which clean air is caused to flow downward from a ceiling portion, wherein a coating liquid is applied to the substrate. A coating processing unit, and a first unit for bringing the substrate close to the ceiling of the clean room.
Having a driving device, by bringing the substrate close to the ceiling of the clean room, a drying promotion processing unit that supplies clean air at a flow rate of a predetermined speed or more to the substrate coated with the coating liquid in the coating processing unit, A substrate processing apparatus, comprising: a baking processing unit that performs a heating process on the substrate that has been processed in the drying promotion processing unit. 5. The apparatus according to claim 1, further comprising an edge cleaning section for cleaning the vicinity of an edge of the substrate which has been subjected to the processing in the drying acceleration processing section, before performing the heating processing in the baking processing section. 5. The substrate processing apparatus according to 4. 6. The substrate processing apparatus according to claim 2, wherein the drying promotion processing section has a substrate mounting table having a substrate mounting surface having an outer edge larger than the substrate over the entire circumference. . 7. The substrate processing apparatus according to claim 3, wherein said air supply device has an air filter. 8. The substrate processing apparatus according to claim 3, wherein the substrate is installed in a clean room, wherein the air supply device supplies clean air flowing in the clean room to the substrate. 9. The substrate processing apparatus according to claim 3, wherein the drying promotion processing unit further includes a second driving device that relatively moves the air supply device and the substrate. 10. The substrate processing apparatus according to claim 3, wherein said air supply device has a rectifying plate for rectifying the flow of clean air supplied to the substrate. 11. An air supply device, comprising: an air discharge port located above a substrate in the drying promotion processing section; a blower for generating an air flow; and a supply path connecting the air discharge port and the blower. 4. The substrate processing apparatus according to claim 3, comprising: 12. The apparatus according to claim 1, which is installed in a clean room.
The substrate processing apparatus according to claim 1, wherein the blower is disposed in a clean room. 13. The substrate processing apparatus according to claim 12, wherein the blower is located above a substrate in the drying promotion processing section. 14. The apparatus according to claim 1, which is installed in a clean room.
The substrate processing apparatus according to claim 1, wherein the blower is disposed outside a clean room. 15. The substrate according to claim 3, wherein the air supply device has an upper cover for guiding a flow of the clean air so that the clean air supplied to the substrate does not flow to an adjacent processing unit. Processing equipment. 16. The drying promotion processing unit further comprises a lower cover for guiding a flow of the clean air downward so that the clean air supplied from the air supply device to the substrate does not flow. A substrate processing apparatus according to claim 1. 17. The substrate processing apparatus according to claim 16, wherein said drying promotion processing unit further has an exhaust path for exhausting the clean air guided by said lower cover. 18. An exhaust path provided with an exhaust damper for adjusting an exhaust amount of clean air, wherein the air supply device has an exhaust amount larger than an exhaust amount of clean air exhausted from the exhaust path. 18. The substrate processing apparatus according to claim 17, wherein clean air is blown out. 19. An upper cover of the air supply device is formed so that a lower end thereof covers the lower cover.
19. The substrate processing apparatus according to claim 16, wherein a height position of the lower end is lower than a height position of an upper end of the lower cover. 20. A shape of a lower end of an upper cover of the air supply device and a shape of an upper end of the lower cover correspond to each other, and between a lower end of the upper cover of the air supply device and an upper end of the lower cover. The substrate processing apparatus according to claim 16, further comprising a seal member inserted. 21. The substrate processing apparatus according to claim 20, wherein the air supply device supplies the substrate with a smaller amount of clean air exhausted from the exhaust path. 22. The processing in the drying promotion processing section,
The pressure of a space surrounded by the air supply device, the lower cover, and the exhaust path is controlled to be substantially equal to the surrounding pressure before the sealing of the space is released.
The substrate processing apparatus according to claim 21. 23. The substrate processing apparatus according to claim 20, wherein one end of the exhaust path is connected to the lower cover and the other end is a lower space of the downflow clean room. A substrate processing apparatus that is open to the public. 24. The substrate processing apparatus according to claim 3, wherein said air supply device has an air volume adjusting function for adjusting an amount of cleaning air supplied to the substrate. 25. The air supply device has a temperature adjustment function for adjusting the temperature of cleaning air supplied to a substrate.
The substrate processing apparatus according to claim 3. 26. The air supply device has a humidity adjusting function for adjusting humidity of cleaning air supplied to a substrate.
The substrate processing apparatus according to claim 3. 27. The substrate processing apparatus according to claim 3, wherein said air supply device has a chemical adsorption filter for reducing a solvent content of cleaning air supplied to the substrate. 28. The substrate processing apparatus according to claim 3, wherein said drying promotion processing unit further includes a flow rate adjusting mechanism for changing a flow rate of the cleaning air supplied from the air supply device to the substrate near the substrate. apparatus. 29. The flow rate adjusting mechanism according to claim 2, wherein the air supply device and the substrate are relatively moved.
9. The substrate processing apparatus according to 8. 30. The air supply device according to claim 3, wherein the air supply device has a discharge path, a supply path through which clean air supplied to the substrate passes, and switching means for switching between the discharge path and the supply path. The substrate processing apparatus according to any one of the preceding claims. 31. The substrate processing apparatus according to claim 3, wherein the air supply device has a guide member configured such that a cross-sectional area of a flow path of the clean air decreases toward the substrate side.