TW413659B - Fillers for improved epoxy laminates - Google Patents

Fillers for improved epoxy laminates Download PDF

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Publication number
TW413659B
TW413659B TW86105054A TW86105054A TW413659B TW 413659 B TW413659 B TW 413659B TW 86105054 A TW86105054 A TW 86105054A TW 86105054 A TW86105054 A TW 86105054A TW 413659 B TW413659 B TW 413659B
Authority
TW
Taiwan
Prior art keywords
talc particles
talc
fillers
those
less
Prior art date
Application number
TW86105054A
Other languages
English (en)
Inventor
Aroon Vishwanath Tungare
Scott Harold Richgels
Jeffrey Robert Kamla
Peggy Mae Conn
Original Assignee
Isola Laminate Systems Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=24486319&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=TW413659(B) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by Isola Laminate Systems Corp filed Critical Isola Laminate Systems Corp
Application granted granted Critical
Publication of TW413659B publication Critical patent/TW413659B/zh

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/0373—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement containing additives, e.g. fillers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/34—Silicon-containing compounds
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0206—Materials
    • H05K2201/0209—Inorganic, non-metallic particles
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0206—Materials
    • H05K2201/0239—Coupling agent for particles
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/25—Web or sheet containing structurally defined element or component and including a second component containing structurally defined particles
    • Y10T428/258—Alkali metal or alkaline earth metal or compound thereof
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/25—Web or sheet containing structurally defined element or component and including a second component containing structurally defined particles
    • Y10T428/259—Silicic material
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31511—Of epoxy ether

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Laminated Bodies (AREA)
TW86105054A 1996-03-22 1997-04-18 Fillers for improved epoxy laminates TW413659B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US08/620,525 US6187852B1 (en) 1996-03-22 1996-03-22 Fillers for improved epoxy laminates

Publications (1)

Publication Number Publication Date
TW413659B true TW413659B (en) 2000-12-01

Family

ID=24486319

Family Applications (1)

Application Number Title Priority Date Filing Date
TW86105054A TW413659B (en) 1996-03-22 1997-04-18 Fillers for improved epoxy laminates

Country Status (7)

Country Link
US (2) US6187852B1 (zh)
EP (1) EP0864248B1 (zh)
AT (1) ATE300858T1 (zh)
AU (1) AU2540597A (zh)
DE (1) DE69733803T2 (zh)
TW (1) TW413659B (zh)
WO (1) WO1997035457A1 (zh)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7507471B1 (en) * 1995-10-10 2009-03-24 Isola Usa Corp Reducing dusting of epoxy laminates
US8105690B2 (en) * 1998-03-03 2012-01-31 Ppg Industries Ohio, Inc Fiber product coated with particles to adjust the friction of the coating and the interfilament bonding
CA2346111A1 (en) * 1998-10-13 2000-04-20 Ernest L. Lawton Glass fiber-reinforced prepregs, laminates, electronic circuit boards and methods for assembling a fabric
US20070111578A1 (en) * 2005-11-15 2007-05-17 Langon Alfred J Socket adapter mold
EP2053163A1 (en) * 2007-10-26 2009-04-29 SAPPI Netherlands Services B.V. Coating formulation for offset paper and paper coated therewith
CN101965507A (zh) * 2008-01-09 2011-02-02 陶氏环球技术公司 用于评估层压板机加工性能的设备和方法
CN101368077B (zh) * 2008-10-09 2011-11-30 腾辉电子（苏州）有限公司 一种环氧树脂胶液
US20120055704A1 (en) * 2010-09-06 2012-03-08 Taiwan Union Technology Corporation Epoxy resin blend
MY175088A (en) 2011-02-24 2020-06-05 Isola Usa Corp Ultrathin laminates
JP6710223B2 (ja) * 2015-01-29 2020-06-17 アイメリーズ タルク アメリカ，インコーポレーテッド ポリカーボネートフィラーとして使用されるように設計された鉱物、及びポリカーボネートを強化するのに前記鉱物を使用する方法
JP6672953B2 (ja) 2016-03-29 2020-03-25 味の素株式会社 樹脂シート

Family Cites Families (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USRE30843E (en) * 1971-05-10 1982-01-05 Epoxy tape
USRE34164E (en) * 1974-03-30 1993-01-19 Aluminum Company Of America Synthetic hydrotalcite
US4214026A (en) * 1978-08-24 1980-07-22 Asahi Kasei Kogyo Kabushiki Kaisha Sheet molding material
JPS55142645A (en) * 1979-04-24 1980-11-07 Shin Kobe Electric Machinery Laminated board
JPS57199643A (en) 1981-06-01 1982-12-07 Nikkan Ind Laminated board
JPS597044A (ja) 1982-07-05 1984-01-14 ニツカン工業株式会社 積層板
US4632798A (en) * 1983-07-27 1986-12-30 Celanese Corporation Encapsulation of electronic components with anisotropic thermoplastic polymers
JPS60203642A (ja) * 1984-03-28 1985-10-15 Shin Kobe Electric Mach Co Ltd コンポジツト積層板の製造法
US4719250A (en) * 1984-06-18 1988-01-12 Hoechst Celanese Corporation Encapsulation of electronic components
JPH0197633A (ja) 1987-10-09 1989-04-17 Sumitomo Bakelite Co Ltd 印刷回路用積層板の製造方法
JPH01222950A (ja) 1988-03-03 1989-09-06 Hitachi Chem Co Ltd 積層板
JPH02120330A (ja) 1988-10-28 1990-05-08 Shin Kobe Electric Mach Co Ltd 積層板の製造法
JPH02133440A (ja) 1988-11-15 1990-05-22 Matsushita Electric Works Ltd 電気用積層板の製造方法
US4960634A (en) 1990-03-14 1990-10-02 International Business Machines Corporation Epoxy composition of increased thermal conductivity and use thereof
US5264065A (en) 1990-06-08 1993-11-23 Amp-Akzo Corporation Printed circuits and base materials having low Z-axis thermal expansion
JPH0592438A (ja) * 1991-10-02 1993-04-16 Matsushita Electric Works Ltd 積層板の製造方法
JPH05138808A (ja) * 1991-11-16 1993-06-08 Toshiba Chem Corp 銅張積層板
US5362457A (en) * 1992-08-13 1994-11-08 Aluminum Company Of America Direct synthesis of anion substituted hydrotalcite
JPH0724955A (ja) * 1993-07-07 1995-01-27 Toshiba Chem Corp 銅張積層板
US5776424A (en) * 1994-04-29 1998-07-07 Aluminum Company Of America Two powder synthesis of hydrotalcite and hydrotalcite-like compounds with monovalen inorganic anions

Also Published As

Publication number Publication date
DE69733803T2 (de) 2006-06-08
US20010014705A1 (en) 2001-08-16
AU2540597A (en) 1997-10-10
US6187852B1 (en) 2001-02-13
ATE300858T1 (de) 2005-08-15
EP0864248B1 (en) 2005-07-27
EP0864248A1 (en) 1998-09-16
US6322885B2 (en) 2001-11-27
DE69733803D1 (de) 2005-09-01
WO1997035457A1 (en) 1997-09-25

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Legal Events

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GD4A Issue of patent certificate for granted invention patent
MK4A Expiration of patent term of an invention patent