TW407445B - Process for preparing printed-circuit board - Google Patents

Process for preparing printed-circuit board Download PDF

Info

Publication number
TW407445B
TW407445B TW087118609A TW87118609A TW407445B TW 407445 B TW407445 B TW 407445B TW 087118609 A TW087118609 A TW 087118609A TW 87118609 A TW87118609 A TW 87118609A TW 407445 B TW407445 B TW 407445B
Authority
TW
Taiwan
Prior art keywords
copper
printed
liquid
circuit board
electrodeposition coating
Prior art date
Application number
TW087118609A
Other languages
English (en)
Chinese (zh)
Inventor
Ryota Bando
Original Assignee
Kansai Paint Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kansai Paint Co Ltd filed Critical Kansai Paint Co Ltd
Application granted granted Critical
Publication of TW407445B publication Critical patent/TW407445B/zh

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0017—Etching of the substrate by chemical or physical means
    • H05K3/0023—Etching of the substrate by chemical or physical means by exposure and development of a photosensitive insulating layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
    • H05K3/188—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by direct electroplating

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Manufacturing Of Printed Wiring (AREA)
TW087118609A 1997-11-11 1998-11-09 Process for preparing printed-circuit board TW407445B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP9308675A JPH11145593A (ja) 1997-11-11 1997-11-11 プリント配線基板の製造方法

Publications (1)

Publication Number Publication Date
TW407445B true TW407445B (en) 2000-10-01

Family

ID=17983942

Family Applications (1)

Application Number Title Priority Date Filing Date
TW087118609A TW407445B (en) 1997-11-11 1998-11-09 Process for preparing printed-circuit board

Country Status (3)

Country Link
JP (1) JPH11145593A (ja)
KR (1) KR100282113B1 (ja)
TW (1) TW407445B (ja)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5087332B2 (ja) * 2007-07-12 2012-12-05 公益財団法人鉄道総合技術研究所 二液型接着剤塗布装置及びそれを用いた二液反応硬化型接着剤の塗布方法並びにアンカー部材の固定方法

Also Published As

Publication number Publication date
KR19990045154A (ko) 1999-06-25
JPH11145593A (ja) 1999-05-28
KR100282113B1 (ko) 2001-02-15

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GD4A Issue of patent certificate for granted invention patent
MM4A Annulment or lapse of patent due to non-payment of fees