TW398052B - Inspecting method and apparatus for repeated micro-miniature patterns - Google Patents
Inspecting method and apparatus for repeated micro-miniature patterns Download PDFInfo
- Publication number
- TW398052B TW398052B TW087112763A TW87112763A TW398052B TW 398052 B TW398052 B TW 398052B TW 087112763 A TW087112763 A TW 087112763A TW 87112763 A TW87112763 A TW 87112763A TW 398052 B TW398052 B TW 398052B
- Authority
- TW
- Taiwan
- Prior art keywords
- image
- foreign object
- inspected
- foreign
- scattered light
- Prior art date
Links
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
- G01N21/956—Inspecting patterns on the surface of objects
- G01N21/95607—Inspecting patterns on the surface of objects using a comparative method
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
- G01N21/9501—Semiconductor wafers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
- H01L22/10—Measuring as part of the manufacturing process
- H01L22/12—Measuring as part of the manufacturing process for structural parameters, e.g. thickness, line width, refractive index, temperature, warp, bond strength, defects, optical inspection, electrical measurement of structural dimensions, metallurgic measurement of diffusions
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/8806—Specially adapted optical and illumination features
- G01N2021/8822—Dark field detection
- G01N2021/8825—Separate detection of dark field and bright field
Landscapes
- Engineering & Computer Science (AREA)
- General Physics & Mathematics (AREA)
- Analytical Chemistry (AREA)
- Pathology (AREA)
- Immunology (AREA)
- Physics & Mathematics (AREA)
- Health & Medical Sciences (AREA)
- Manufacturing & Machinery (AREA)
- Chemical & Material Sciences (AREA)
- Life Sciences & Earth Sciences (AREA)
- Biochemistry (AREA)
- General Health & Medical Sciences (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP22583697A JP3938227B2 (ja) | 1997-08-07 | 1997-08-07 | 異物検査方法および装置 |
JP17960598A JP4052733B2 (ja) | 1998-06-11 | 1998-06-11 | パターン付きウエハの異物検査方法 |
Publications (1)
Publication Number | Publication Date |
---|---|
TW398052B true TW398052B (en) | 2000-07-11 |
Family
ID=26499403
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW087112763A TW398052B (en) | 1997-08-07 | 1998-08-03 | Inspecting method and apparatus for repeated micro-miniature patterns |
Country Status (2)
Country | Link |
---|---|
KR (1) | KR100564871B1 (ko) |
TW (1) | TW398052B (ko) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4591802B2 (ja) * | 2000-09-13 | 2010-12-01 | 株式会社ニコン | 表面検査装置および方法 |
Family Cites Families (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS62237305A (ja) * | 1986-04-08 | 1987-10-17 | Dainippon Printing Co Ltd | パタ−ン欠陥検査方法 |
JP3314440B2 (ja) * | 1993-02-26 | 2002-08-12 | 株式会社日立製作所 | 欠陥検査装置およびその方法 |
-
1998
- 1998-08-03 TW TW087112763A patent/TW398052B/zh not_active IP Right Cessation
- 1998-08-06 KR KR1019980031972A patent/KR100564871B1/ko not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
KR19990023403A (ko) | 1999-03-25 |
KR100564871B1 (ko) | 2006-05-25 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
GD4A | Issue of patent certificate for granted invention patent | ||
MM4A | Annulment or lapse of patent due to non-payment of fees |