TW390111B - Power conversion device and heat-pipe cooler therefor - Google Patents

Power conversion device and heat-pipe cooler therefor Download PDF

Info

Publication number
TW390111B
TW390111B TW087116350A TW87116350A TW390111B TW 390111 B TW390111 B TW 390111B TW 087116350 A TW087116350 A TW 087116350A TW 87116350 A TW87116350 A TW 87116350A TW 390111 B TW390111 B TW 390111B
Authority
TW
Taiwan
Prior art keywords
heat pipe
power conversion
heat
conversion device
pipe cooler
Prior art date
Application number
TW087116350A
Other languages
English (en)
Chinese (zh)
Inventor
Nobuhiro Takahashi
Original Assignee
Toshiba Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp filed Critical Toshiba Corp
Application granted granted Critical
Publication of TW390111B publication Critical patent/TW390111B/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/433—Auxiliary members in containers characterised by their shape, e.g. pistons
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/467—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing gases, e.g. air
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Inverter Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Rectifiers (AREA)
TW087116350A 1997-10-27 1998-10-01 Power conversion device and heat-pipe cooler therefor TW390111B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP29367397A JP3642548B2 (ja) 1997-10-27 1997-10-27 電力変換装置

Publications (1)

Publication Number Publication Date
TW390111B true TW390111B (en) 2000-05-11

Family

ID=17797763

Family Applications (1)

Application Number Title Priority Date Filing Date
TW087116350A TW390111B (en) 1997-10-27 1998-10-01 Power conversion device and heat-pipe cooler therefor

Country Status (6)

Country Link
JP (1) JP3642548B2 (ja)
KR (1) KR100443446B1 (ja)
CN (3) CN100550358C (ja)
BR (1) BR9804506B1 (ja)
HK (1) HK1018160A1 (ja)
TW (1) TW390111B (ja)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4643611B2 (ja) * 2007-05-21 2011-03-02 東芝三菱電機産業システム株式会社 電力変換装置
JP2011258761A (ja) * 2010-06-09 2011-12-22 Mitsubishi Electric Corp 電子機器の放熱構造および車載用電子機器
CN103907184B (zh) * 2011-11-30 2016-08-31 富士电机株式会社 电力转换装置
CN105226038B (zh) * 2015-09-10 2018-09-07 江苏省电力公司金湖县供电公司 一种带有导热管的散热装置
CN117693175B (zh) * 2024-02-04 2024-04-16 长安绿电科技有限公司 一种锂电池快速充电装置

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2341097A1 (de) * 1973-08-14 1975-02-27 Siemens Ag Kuehlanordnung fuer flache halbleiterbauelemente, insbesondere fuer scheibenzellen-thyristoren
JPS6060579U (ja) * 1983-09-27 1985-04-26 松下冷機株式会社 放熱装置
JPS6268298U (ja) * 1985-10-18 1987-04-28
JPS62293655A (ja) * 1986-06-12 1987-12-21 Furukawa Electric Co Ltd:The 半導体用ヒ−トパイプ冷却器およびその製造方法
JPH04256397A (ja) * 1991-02-08 1992-09-11 Toshiba Corp ヒートパイプ式半導体スタック
JPH0539380U (ja) * 1991-03-19 1993-05-28 西川ゴム工業株式会社 騒音の発生を抑えるカーテン吊り具
JPH0536897U (ja) * 1991-10-11 1993-05-18 古河電気工業株式会社 ヒートパイプ式放熱装置
JPH05322461A (ja) * 1992-05-19 1993-12-07 Furukawa Electric Co Ltd:The 冷却ユニット用伝熱管
JPH06185883A (ja) * 1992-12-15 1994-07-08 Furukawa Electric Co Ltd:The 絶縁型ヒートパイプおよび冷却ユニット
JP3364758B2 (ja) * 1993-04-20 2003-01-08 アクトロニクス株式会社 平形発熱体用放熱器
CN1031911C (zh) * 1993-10-08 1996-05-29 亚克第股份有限公司 针形散热器及其制造方法
JPH07103675A (ja) * 1993-10-08 1995-04-18 Furukawa Electric Co Ltd:The ヒートパイプ式放熱器
JP3020790B2 (ja) * 1993-12-28 2000-03-15 株式会社日立製作所 ヒートパイプ式冷却装置とこれを用いた車両制御装置
JP3069236B2 (ja) * 1994-03-28 2000-07-24 三菱電機株式会社 半導体スタック
JPH08181262A (ja) * 1994-12-27 1996-07-12 Toshiba Corp ヒートシンク
JP3300566B2 (ja) * 1995-04-24 2002-07-08 株式会社東芝 パワーモジュール及び電力変換装置
JPH09215132A (ja) * 1996-02-05 1997-08-15 Meidensha Corp 受変電設備

Also Published As

Publication number Publication date
KR100443446B1 (ko) 2004-11-20
BR9804506A (pt) 1999-11-09
CN1215974A (zh) 1999-05-05
JP3642548B2 (ja) 2005-04-27
CN100550358C (zh) 2009-10-14
CN101150100A (zh) 2008-03-26
CN100387106C (zh) 2008-05-07
HK1018160A1 (en) 1999-12-10
KR19990037381A (ko) 1999-05-25
CN100550357C (zh) 2009-10-14
CN101150099A (zh) 2008-03-26
JPH11132678A (ja) 1999-05-21
BR9804506B1 (pt) 2011-02-08

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GD4A Issue of patent certificate for granted invention patent
MM4A Annulment or lapse of patent due to non-payment of fees